Drying device for silicon wafer processing
By designing a drying device for silicon wafer processing including electric push rods, hydraulic cylinders and drying components, the problem of residual moisture and stains on the surface of the silicon wafer cannot be removed, and a more efficient drying process and safer silicon wafer treatment are achieved.
Patent Information
- Application Number
- CN202421120895.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-22
- Publication Date
- 2025-03-25
- Estimated Expiration
- 2034-05-22
AI Technical Summary
During the existing silicon wafer processing, the residual water droplets and stains on the surface of the silicon wafer are not effectively removed, resulting in a reduced cleanliness and a low drying rate.
A drying device for silicon wafer processing is designed, including a workbench, a mobile seat, a hydraulic cylinder, a drying plate, an electric push rod and a drying assembly. The scraper is driven by an electric push rod to remove moisture and stains from the surface of the silicon wafer and accelerate the drying process using hydraulic cylinders and drying components such as blowers and heating wire trays.
It effectively improves the cleanliness and drying efficiency of the silicon wafer surface, avoids the risk of excessive temperature of the silicon wafer surface, and enhances the safety and practicality of drying.
Smart Images
Figure CN222670504U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a drying device for silicon wafer processing. Background Art
[0002] In the production of semiconductor devices, silicon wafers must be strictly cleaned to remove surface contaminants and prevent trace impurities from contaminating the silicon wafers. During the processing of silicon wafers, the surface of the silicon wafers needs to be dried after the conductive paste is printed.
[0003] After cleaning, the current silicon wafers are usually dried directly without scraping off the water droplets and stains remaining on the surface of the silicon wafers, which not only reduces the cleanliness of the silicon wafer surface, but also has a low drying rate and poor practicality. To this end, a drying device for silicon wafer processing is now proposed. Utility Model Content
[0004] The utility model aims to provide a drying device for silicon wafer processing, which solves the technical problems raised in the background technology.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a drying device for silicon wafer processing, comprising a workbench and a movable seat, the workbench is symmetrically provided with movable grooves, the bottom of the movable seat is symmetrically connected to a limiting block, the movable seat is slidably connected to the movable groove through the limiting block, the top of the movable seat is fixedly connected to a hydraulic cylinder, the top of the hydraulic cylinder is fixedly connected to a drying plate, the rear side wall of the drying plate is fixedly connected to an L-shaped bracket, the inner side wall of the L-shaped bracket is fixedly connected to an electric push rod, the output end of the electric push rod is fixedly connected to a scraper, the top of the workbench is fixedly connected to a fixed frame, the fixed frame is located on the outside of the drying plate, and a drying component is arranged on the fixed frame.
[0006] Preferably, the outer wall of the workbench is fixedly connected to motor 2, the output end of motor 2 is fixedly connected to screw rod 2, screw rod 2 passes through the workbench and is rotatably connected to the inner wall of the rear movable groove, the inner wall of the rear limit block is threadedly connected to the outer wall of screw rod 2, the inner wall of the front movable groove is fixedly connected to a sliding rod, and the inner wall of the front limit block is slidably connected to the outer wall of the sliding rod.
[0007] Preferably, a limiting groove is provided on the top of the fixing frame, a moving block is slidably connected to the inner wall of the limiting groove, a flow tube is fixedly connected to the top of the moving block, a motor 1 is fixedly connected to the rear side wall of the fixing frame, a screw rod 1 is fixedly connected to the output end of the motor 1, a front end of the screw rod 1 passes through the fixing frame and is rotatably connected to the inner wall of the limiting groove, and the outer wall of the screw rod 1 is threadedly connected to the inner wall of the limiting groove.
[0008] Preferably, the drying component includes an installation box and an exhaust hood, the installation box is fixedly connected to the rear side wall of the fixed frame, a blower is installed inside the installation box, the output end of the blower is fixedly connected to an air supply pipe, and the end of the air supply pipe away from the blower is connected to the flow pipe.
[0009] Preferably, both left and right ends of the flow pipe are fixedly connected with exhaust pipes, and the top of the fixing frame is symmetrically provided with strip grooves, and the two strip grooves are respectively located on the left and right sides of the limiting grooves, and the exhaust pipe passes through the strip grooves and is fixedly connected to the outer wall of the exhaust hood, and the exhaust hood is connected to the flow pipe through the exhaust pipe.
[0010] Preferably, a heating wire coil is fixedly connected to the inner wall of the exhaust hood.
[0011] Preferably, a discharge trough is provided on the workbench, and the discharge trough is located at the front side of the drying plate. A collecting box is fixedly connected to the bottom of the workbench, and the collecting box is located outside the discharge trough.
[0012] Compared with the related art, the drying device for silicon wafer processing provided by the utility model has the following beneficial effects:
[0013] 1. Before drying, place the silicon wafer on the drying plate, and push the scraper forward by controlling the electric push rod to remove moisture and stains on the surface of the silicon wafer. This not only improves the cleanliness of the silicon wafer surface, but also can scrape off the residual moisture on the silicon wafer surface before drying the silicon wafer through the drying component, thereby improving the drying efficiency. The drying plate can be pushed upward by the hydraulic cylinder, making it convenient to make the drying plate closer to the drying component and speeding up the drying process.
[0014] 2. During drying, start the blower, transmit the airflow to the flow pipe through the air supply pipe, and then discharge the airflow in the flow pipe to the exhaust hood through the exhaust pipe, blow air towards the silicon wafer through the exhaust hood, and energize the electric heating wire coil to form a hot blowing effect to accelerate the drying rate of the silicon wafer. Start the motor to drive the moving block to slide back and forth along the limit groove, drive the flow pipe to move back and forth, so that the exhaust hood can blow air evenly towards the silicon wafer, which can effectively prevent the exhaust hood from blowing hot air at a certain part of the silicon wafer, causing the surface temperature of the silicon wafer to be too high and damaged, thereby improving the safety of silicon wafer drying. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 It is a schematic diagram of the structure of the utility model;
[0016] Figure 2 It is a right side view of the utility model;
[0017] Figure 3 It is a top view of the utility model;
[0018] Figure 4 It is a schematic diagram of the structure of the position limiting member of the utility model;
[0019] Figure 5 For the utility model Figure 1 Enlarged view of point A in the middle;
[0020] Figure 6 It is a schematic diagram of the structure of the exhaust hood of the utility model.
[0021] In the figure: 1. workbench; 2. fixed frame; 3. limit groove; 4. strip groove; 5. moving block; 6. flow pipe; 7. exhaust pipe; 8. motor 1; 9. screw rod 1; 10. air supply pipe; 11. installation box; 12. exhaust hood; 13. movable groove; 14. motor 2; 15. screw rod 2; 16. limit block; 17. moving seat; 18. hydraulic cylinder; 19. drying plate; 20. L-shaped bracket; 21. electric push rod; 22. scraper; 23. discharge chute; 24. slide rod; 25. collection box; 26. electric heating wire coil. DETAILED DESCRIPTION
[0022] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments; based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.
[0023] Embodiment 1:
[0024] See also Figure 1-Figure 4 The utility model provides a technical solution: a drying device for silicon wafer processing, comprising a workbench 1 and a movable seat 17, wherein the workbench 1 is symmetrically provided with movable grooves 13, the bottom of the movable seat 17 is symmetrically connected with a limiting block 16, the movable seat 17 is slidably connected with the movable groove 13 through the limiting block 16, the top of the movable seat 17 is fixedly connected with a hydraulic cylinder 18, the top of the hydraulic cylinder 18 is fixedly connected with a drying plate 19, the rear side wall of the drying plate 19 is fixedly connected with an L-shaped bracket 20, the inner side wall of the L-shaped bracket 20 is fixedly connected with an electric push rod 21, and the electric push rod 2 The output end of the workbench 1 is fixedly connected with a scraper 22, and a cleaning cotton for cleaning the surface of the silicon wafer is installed at the bottom of the scraper 22. A discharge groove 23 is provided on the workbench 1, and the discharge groove 23 is located on the front side of the drying plate 19. The bottom of the workbench 1 is fixedly connected with a collecting box 25, and the collecting box 25 is located outside the discharge groove 23. When cleaning the surface of the silicon wafer, the cleaning cotton at the bottom of the scraper 22 can push the stains and dust remaining on the surface of the silicon wafer into the discharge groove 23, and discharge them into the collecting box 25 through the discharge groove 23 for collection, which is conducive to unified processing later;
[0025] The outer wall of the workbench 1 is fixedly connected with a motor 2 14, and the output end of the motor 2 14 is fixedly connected with a screw rod 2 15, which penetrates the workbench 1 and is rotatably connected with the inner wall of the rear movable groove 13, the inner wall of the rear limit block 16 is threadedly connected with the outer wall of the screw rod 2 15, and the inner wall of the front movable groove 13 is fixedly connected with a slide bar 24, and the inner wall of the front limit block 16 is slidably connected with the outer wall of the slide bar 24. The motor 2 14 is started to drive the screw rod 2 15 to rotate, and when the screw rod 2 15 rotates, the rear limit block 16 is driven to slide left and right along the rear movable groove 13, thereby driving the movable seat 17 to move left and right;
[0026] In this embodiment, the drying plate 19 is moved to the bottom of the fixed frame 2 by controlling the operation of the motor 2 14. Before drying, the silicon wafer is placed on the drying plate 19, and the scraper 22 is pushed forward by operating the electric push rod 21 to remove moisture and stains on the surface of the silicon wafer. This not only improves the cleanliness of the surface of the silicon wafer, but also can scrape off the residual moisture on the surface of the silicon wafer before the silicon wafer is dried by the drying component, thereby improving the drying efficiency. The drying plate 19 can be pushed upward by the hydraulic cylinder 18, so that the drying plate 19 is closer to the drying component and the drying process is accelerated.
[0027] Embodiment 2:
[0028] See also Figure 1-Figure 6 As shown, on the basis of the first embodiment, the utility model provides a technical solution: a limiting groove 3 is provided on the top of the fixed frame 2, a moving block 5 is slidably connected to the inner wall of the limiting groove 3, a flow pipe 6 is fixedly connected to the top of the moving block 5, a motor 8 is fixedly connected to the rear side wall of the fixed frame 2, a screw rod 9 is fixedly connected to the output end of the motor 8, the front end of the screw rod 9 passes through the fixed frame 2 and is rotatably connected to the inner wall of the limiting groove 3, and the outer wall of the screw rod 9 is threadedly connected to the inner wall of the limiting groove 3;
[0029] A fixing frame 2 is fixedly connected to the top of the workbench 1. The fixing frame 2 is located outside the drying plate 19. A drying assembly is arranged on the fixing frame 2. The drying assembly includes a mounting box 11 and an exhaust hood 12. The mounting box 11 is fixedly connected to the rear side wall of the fixing frame 2. A blower is installed inside the mounting box 11. An air supply pipe 10 is fixedly connected to the output end of the blower. One end of the air supply pipe 10 away from the blower is connected to the throughflow pipe 6.
[0030] The left and right ends of the flow pipe 6 are fixedly connected with exhaust pipes 7. The top of the fixed frame 2 is symmetrically provided with strip grooves 4. The two strip grooves 4 are respectively located on the left and right sides of the limiting groove 3. The exhaust pipe 7 passes through the strip grooves 4 and is fixedly connected to the outer wall of the exhaust hood 12. The exhaust hood 12 is connected to the flow pipe 6 through the exhaust pipe 7. The inner wall of the exhaust hood 12 is fixedly connected with an electric heating wire coil 26.
[0031] In the present embodiment, during drying, the blower is started, and the airflow is transmitted to the flow pipe 6 through the air supply pipe 10, and then the airflow in the flow pipe 6 is discharged to the exhaust hood 12 through the exhaust pipe 7, and the silicon wafer is blown through the exhaust hood 12, and the electric heating wire coil 26 is energized to form a hot blowing effect, thereby accelerating the drying rate of the silicon wafer, and the screw rod 9 is driven to rotate by starting the motor 8. When the screw rod 9 rotates, the moving block 5 is driven to slide back and forth along the limit groove 3, driving the flow pipe 6 to move back and forth, so that the exhaust hood 12 can blow air evenly at the silicon wafer, which can effectively prevent the exhaust hood 12 from blowing hot air at a certain part of the silicon wafer, causing the surface temperature of the silicon wafer to be too high and damaged, thereby improving the safety of silicon wafer drying.
[0032] Working principle: Before drying, put the silicon wafer on the drying plate 19, and push the scraper 22 forward by controlling the electric push rod 21 to remove the moisture and stains on the surface of the silicon wafer, which not only improves the cleanliness of the silicon wafer surface, but also can scrape off the residual moisture on the silicon wafer surface before drying the silicon wafer through the drying component, thereby improving the drying efficiency. The drying plate 19 can be pushed upward by the hydraulic cylinder 18, so that the drying plate 19 is closer to the drying component and the drying process is accelerated. When drying, start the blower and transmit the airflow to the ventilation through the air supply pipe 10. The airflow in the flow tube 6 is discharged to the exhaust hood 12 through the exhaust duct 7, and the silicon wafer is blown through the exhaust hood 12. By energizing the electric heating wire disc 26, a hot blowing effect is formed to accelerate the drying rate of the silicon wafer. The motor 8 is started to drive the screw rod 9 to rotate. When the screw rod 9 rotates, the moving block 5 is driven to slide back and forth along the limit groove 3, driving the flow tube 6 to move back and forth, so that the exhaust hood 12 can blow air evenly towards the silicon wafer, which can effectively prevent the exhaust hood 12 from blowing hot air at a certain place of the silicon wafer, causing the surface temperature of the silicon wafer to be too high and damaged.
[0033] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A drying device for silicon wafer processing, comprising a workbench (1) and a movable seat (17), characterized in that: The workbench (1) is symmetrically provided with movable grooves (13); the bottom of the movable seat (17) is symmetrically connected to a limit block (16); the movable seat (17) is slidably connected to the movable groove (13) via the limit block (16); the top of the movable seat (17) is fixedly connected to a hydraulic cylinder (18); the top of the hydraulic cylinder (18) is fixedly connected to a drying plate (19); the rear side wall of the drying plate (19) is fixedly connected to an L-shaped bracket (20); the inner side wall of the L-shaped bracket (20) is fixedly connected to an electric push rod (21); the output end of the electric push rod (21) is fixedly connected to a scraper (22); the top of the workbench (1) is fixedly connected to a fixed frame (2); the fixed frame (2) is located outside the drying plate (19); and a drying component is arranged on the fixed frame (2).
2. A drying device for silicon wafer processing according to claim 1, characterized in that: The outer wall of the workbench (1) is fixedly connected to a second motor (14), the output end of the second motor (14) is fixedly connected to a second screw rod (15), the second screw rod (15) passes through the workbench (1) and is rotatably connected to the inner wall of the rear movable groove (13), the inner wall of the rear limit block (16) is threadedly connected to the outer wall of the second screw rod (15), the inner wall of the front movable groove (13) is fixedly connected to a sliding rod (24), and the inner wall of the front limit block (16) is slidably connected to the outer wall of the sliding rod (24).
3. A drying device for silicon wafer processing according to claim 1, characterized in that: A limiting groove (3) is provided on the top of the fixing frame (2), a moving block (5) is slidably connected to the inner wall of the limiting groove (3), a flow pipe (6) is fixedly connected to the top of the moving block (5), a motor 1 (8) is fixedly connected to the rear side wall of the fixing frame (2), a screw rod 1 (9) is fixedly connected to the output end of the motor 1 (8), a front end of the screw rod 1 (9) passes through the fixing frame (2) and is rotatably connected to the inner wall of the limiting groove (3), and an outer wall of the screw rod 1 (9) is threadedly connected to the inner wall of the limiting groove (3).
4. A drying device for silicon wafer processing according to claim 1, characterized in that: The drying assembly comprises a mounting box (11) and an exhaust hood (12); the mounting box (11) is fixedly connected to the rear side wall of the fixing frame (2); a blower is installed inside the mounting box (11); an output end of the blower is fixedly connected to an air supply pipe (10); an end of the air supply pipe (10) away from the blower is connected to the flow pipe (6).
5. A drying device for silicon wafer processing according to claim 4, characterized in that: The left and right ends of the flow pipe (6) are fixedly connected to exhaust pipes (7); the top of the fixed frame (2) is symmetrically provided with strip grooves (4); the two strip grooves (4) are respectively located on the left and right sides of the limiting groove (3); the exhaust pipe (7) passes through the strip grooves (4) and is fixedly connected to the outer wall of the exhaust cover (12); the exhaust cover (12) is connected to the flow pipe (6) through the exhaust pipe (7).
6. A drying device for silicon wafer processing according to claim 4, characterized in that: The inner wall of the exhaust hood (12) is fixedly connected to a heating wire coil (26).
7. The drying device for silicon wafer processing according to claim 1, characterized in that: The workbench (1) is provided with a discharge trough (23), the discharge trough (23) being located at the front side of the drying plate (19), and the bottom of the workbench (1) is fixedly connected with a collection box (25), the collection box (25) being located at the outside of the discharge trough (23).