Thermal fatigue testing device for nano-silver paste

Abstract

The utility model relates to the field of electronic device detection, and particularly discloses a nano silver paste thermal fatigue testing device, which comprises a shearing mechanism and a mounting rack, the shearing mechanism comprises an upper shearing frame and a lower shearing frame, the upper surface of the upper shearing frame and the upper surface of the lower shearing frame are provided with limiting insertion holes, the limiting insertion holes are internally provided with limiting pins, and the limiting pins are inserted into the limiting insertion holes. A sliding guide block is mounted on the lower surface of the lower shearing frame, a pressure gauge is mounted in the mounting rack, a threaded mounting hole is formed in the side, close to the shearing mechanism, of the mounting rack, and a pressure nail is mounted on the side, located in the threaded mounting hole, of the pressure gauge. After torsion is applied to the force application crank, the extrusion screw rod is controlled to push the whole lower shearing frame, the shearing effect generated between the upper shearing frame and the lower shearing frame is used for shearing nano-silver paste sintered between a substrate and a chip, and therefore the applied acting force is displayed on the pressure gauge through the acting force applied to the pressure nail, and experimental data are obtained.

Description

Technical Field

[0001] The utility model relates to the field of electronic device detection, in particular to a nano silver paste thermal fatigue testing device. Background Art

[0002] With the rapid development of electronic science and technology, electronic components are developing towards high power and miniaturization. In the field of packaging, with the rise of power semiconductors, especially the emergence of third-generation semiconductor materials such as SiC and GaN, power devices have the characteristics of high breakdown voltage, high saturation carrier mobility, high thermal stability, high thermal conductivity and high temperature service occasions. Therefore, low-temperature connection, high-temperature service, excellent thermal fatigue resistance, high electrical conductivity and moderate cost are required for packaging materials. Traditional tin-based eutectic solder has a lower interconnection temperature, but it is difficult to serve at higher temperatures and it is difficult to meet the requirements. Nano silver paste materials can be sintered at lower temperatures due to their size effect and have higher reliability at high temperatures. Therefore, they are widely used in the packaging of electronic devices.

[0003] However, fatigue tests on electrical components encapsulated with nano-silver paste mostly require testing their shear strength, and the thickness of the electrical components is too small to be conveniently applied with shear force tests. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a nano silver paste thermal fatigue testing device, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical scheme: a nano silver paste thermal fatigue testing device, comprising a shearing mechanism and a mounting frame, the shearing mechanism comprising: an upper shearing frame and a lower shearing frame, the upper surfaces of the upper shearing frame and the lower shearing frame are provided with limit insertion holes, the limit insertion holes are provided with limit pins, the lower surface of the lower shearing frame is provided with a sliding guide block, the mounting frame is provided with a pressure gauge, a threaded mounting hole is provided on a side of the mounting frame close to the shearing mechanism, and a pressure nail is provided on one side of the pressure gauge located inside the threaded mounting hole.

[0006] As a further solution of the utility model: an operating platform is arranged below the shearing mechanism and the mounting frame, a movable slide groove is opened on the upper surface of the operating platform below the sliding guide block, and one side of the shearing mechanism is located above the operating platform.

[0007] As a further solution of the utility model: a force bin is installed above the operating platform on a side away from the mounting frame, a force crank is installed on the outside of the force bin, an extrusion screw is installed through the inside of the force bin, a second bevel gear is arranged on the outside of the extrusion screw, and a first bevel gear is installed on one end of the force crank on one side of the second bevel gear.

[0008] As a further solution of the utility model: the lower shear frame is slidably connected to the movable slide groove through the sliding guide block.

[0009] As a further solution of the utility model: the inner diameter and outer diameter of the upper shear frame and the lower shear frame are the same.

[0010] As a further solution of the utility model: the limit pin is engaged with the limit socket.

[0011] As a further solution of the present invention: the mounting frame and the force application bin are both fixedly connected to the operating platform.

[0012] As a further solution of the present invention: the first bevel gear is meshed and connected with the second bevel gear, and the extrusion screw is meshed and connected with the second bevel gear.

[0013] Compared with the prior art, the beneficial effects of the utility model are:

[0014] After applying torque to the force crank, the extrusion screw is controlled to push the lower shear frame as a whole. The shearing action generated between the upper shear frame and the lower shear frame shears the nano silver paste sintered between the substrate and the chip, thereby using the force applied to the pressure pin to display the applied force on the pressure gauge to obtain experimental data.

[0015] After the upper shear frame and the lower shear frame are docked together by inserting the limit pin into the limit hole, the shear force can be easily applied by placing the substrate of the interconnection structure in the lower shear frame and the chip in the upper shear frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the structure of a nano silver paste thermal fatigue testing device;

[0017] Figure 2 This is an exploded view of the shear mechanism in a nano silver paste thermal fatigue test device;

[0018] Figure 3 An exploded view of a mounting frame in a nano silver paste thermal fatigue test device;

[0019] Figure 4 This is a schematic diagram of the internal structure of a force-applying chamber in a nano silver paste thermal fatigue testing device;

[0020] Figure 5 This is a top view of the operating platform in a nano silver paste thermal fatigue testing device.

[0021] In the figure: 1. operating platform; 2. shearing mechanism; 3. mounting frame; 4. pressure gauge; 5. force bin; 6. extrusion screw; 7. force crank; 101. moving slide; 201. upper shearing frame; 202. lower shearing frame; 203. sliding guide block; 204. limit pin; 205. limit socket; 301. threaded mounting hole; 401. pressure nail; 701. first bevel gear; 702. second bevel gear. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1-5 As shown, this embodiment provides a nano silver paste thermal fatigue testing device, including a shearing mechanism 2 and a mounting frame 3. The shearing mechanism 2 includes: an upper shear frame 201 and a lower shear frame 202. The inner diameter and outer diameter of the upper shear frame 201 and the lower shear frame 202 are the same. A limit hole 205 is provided on the upper surface of the upper shear frame 201 and the lower shear frame 202. A limit pin 204 is arranged inside the limit hole 205. The limit pin 204 is engaged with the limit hole 205. A sliding guide block 203 is installed on the lower surface of the lower shear frame 202. A pressure gauge 4 is installed inside the mounting frame 3. A threaded mounting hole 301 is provided on the side of the mounting frame 3 close to the shearing mechanism 2, and a pressure nail 401 is installed on one side of the pressure gauge 4 located inside the threaded mounting hole 301.

[0024] like Figure 2-5 As shown, in this embodiment, an operating platform 1 is arranged below the shearing mechanism 2 and the mounting frame 3, a movable slide groove 101 is opened on the upper surface of the operating platform 1 below the sliding guide block 203, and the lower shear frame 202 is slidably connected to the movable slide groove 101 through the sliding guide block 203, one side of the shearing mechanism 2 is located above the operating platform 1, and a force bin 5 is installed above the operating platform 1 on the side away from the mounting frame 3, the mounting frame 3 and the force bin 5 are both fixedly connected to the operating platform 1, a force crank 7 is installed on the outer side of the force bin 5, an extrusion screw 6 is installed through the inside of the force bin 5, a second bevel gear 702 is arranged on the outer side of the extrusion screw 6, the first bevel gear 701 is meshed with the second bevel gear 702, one end of the force crank 7 is located on one side of the second bevel gear 702 and is installed with the first bevel gear 701, and the extrusion screw 6 is meshed with the second bevel gear 702.

[0025] The working principle of the utility model is as follows: when in use, the substrate and the chip are interconnected through the array sintering layer to form an interconnection structure, and the upper shear frame 201 and the lower shear frame 202 are integrally connected by inserting the limit pin 204 into the limit insertion hole 205 as a whole. After that, the interconnection structure is placed in the interior of the shear mechanism 2 as a whole, and the substrate is integrally corresponding to the interior of the lower shear frame 202, and the chip is corresponding to the interior of the upper shear frame 201. Then, the pressure nail 401 at the end of the pressure gauge 4 is integrally inserted into the interior of the threaded mounting hole 301 for meshing installation, and the pressure nail 401 is corresponding to the outer side of the upper shear frame 201. Then, after applying torque to the force crank 7, the first The bevel gear 701 and the second bevel gear 702 mesh and rotate, controlling the extrusion screw 6 to mesh inside the second bevel gear 702 and move toward the position of the shear mechanism 2. After the end of the extrusion screw 6 is controlled to contact the side surface of the lower shear frame 202, the limiting socket 205 is pulled out as a whole, and then the torque is continued to be applied to the force crank 7 to control the extrusion screw 6 to push the lower shear frame 202 as a whole. The shearing action generated between the upper shear frame 201 and the lower shear frame 202 shears the nano silver paste sintered between the substrate and the chip, thereby using the force applied to the pressure pin 401 to display the applied force on the pressure gauge 4 to obtain experimental data.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or apparatus that includes a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or apparatus.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A nano silver paste thermal fatigue testing device, comprising a shearing mechanism (2) and a mounting frame (3), characterized in that: The shearing mechanism (2) comprises: an upper shearing frame (201) and a lower shearing frame (202); the upper surfaces of the upper shearing frame (201) and the lower shearing frame (202) are provided with limit insertion holes (205); the limit insertion holes (205) are provided with limit pins (204); the lower surface of the lower shearing frame (202) is provided with a sliding guide block (203); the interior of the mounting frame (3) is provided with a pressure gauge (4); a threaded mounting hole (301) is provided on a side of the mounting frame (3) close to the shearing mechanism (2); and a pressure nail (401) is provided on one side of the pressure gauge (4) located inside the threaded mounting hole (301).

2. A nano silver paste thermal fatigue testing device according to claim 1, characterized in that: An operating platform (1) is provided below the shearing mechanism (2) and the mounting frame (3); a movable slide groove (101) is provided on the upper surface of the operating platform (1) below the sliding guide block (203); and one side of the shearing mechanism (2) is located above the operating platform (1).

3. The nano silver paste thermal fatigue testing device according to claim 2, characterized in that: A force applying bin (5) is installed above the operating platform (1) on a side away from the mounting frame (3); a force applying crank (7) is installed on the outside of the force applying bin (5); an extrusion screw (6) is installed through the inside of the force applying bin (5); a second bevel gear (702) is arranged on the outside of the extrusion screw (6); and a first bevel gear (701) is installed on one end of the force applying crank (7) located on one side of the second bevel gear (702).

4. The nano silver paste thermal fatigue testing device according to claim 2, characterized in that: The lower shear frame (202) is slidably connected to the movable slide groove (101) via the sliding guide block (203).

5. The nano silver paste thermal fatigue testing device according to claim 1, characterized in that: The inner diameter and outer diameter of the upper shear frame (201) and the lower shear frame (202) are the same.

6. The nano silver paste thermal fatigue testing device according to claim 1, characterized in that: The limiting pin (204) is engaged with the limiting insertion hole (205).

7. The nano silver paste thermal fatigue testing device according to claim 3, characterized in that: The mounting frame (3) and the force application bin (5) are both fixedly connected to the operating platform (1).

8. The nano silver paste thermal fatigue testing device according to claim 3, characterized in that: The first bevel gear (701) is meshingly connected to the second bevel gear (702), and the extrusion screw (6) is meshingly connected to the second bevel gear (702).

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