Circuit board welding quality detection device

Abstract

The utility model relates to a circuit board welding quality detection device, and relates to the field of circuit board processing technology, the circuit board welding quality detection device comprises a rack, the rack comprises a detection cabin, and the detection cabin is internally provided with a working platform, an intensifier and an X-ray tube; the console is fixedly arranged on the rack and is used for inputting a starting signal; the thickness detection module is fixedly installed on the inner side wall of the detection bin, the end of the thickness detection module is in signal connection with the signal input end of the console, and the thickness detection module is used for receiving the starting signal, detecting the thickness of the circuit board and outputting a circuit board thickness signal; the signal processing module is in signal connection with the signal output end of the thickness detection module and is used for receiving the thickness signal of the circuit board and outputting a light intensity control signal; and the X-ray sensing module is arranged in the detection bin, is opposite to the X-ray tube, is in signal connection with the signal output end of the console, and is used for receiving the starting signal, detecting the X-ray and outputting a detection control signal. The X-ray intensity emitted by the X-ray tube can be automatically adjusted according to the thickness of the circuit board.

Description

Technical Field

[0001] The present application relates to the field of circuit board processing technology, and in particular to a circuit board welding quality detection device. Background Art

[0002] The names of circuit boards include ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, ultra-thin circuit boards and printed circuit boards, etc. There are many SMT solder joints on the circuit boards. In order to ensure the normal operation of the circuit boards, quality inspection of the circuit board solder joints is required.

[0003] In the prior art, X-ray inspection equipment is often used to inspect solder joints on circuit boards. Common X-ray inspection equipment mainly includes a rack, a working platform is fixedly installed in the inspection cabin inside the rack, and X-ray tube intensifiers, industrial cameras, etc. are installed above and below the working platform, which can be adjusted to rise and fall. A control console and a display are set outside the rack. When inspecting the circuit board, the operator can first open the sealing door on the rack and place the circuit board to be tested on the working platform. During the inspection process, the X-rays emitted by the X-ray tube pass through the workbench and the circuit board and are projected onto the intensifier. The intensifier converts the received X-rays into black and white images, which are then transmitted to the display through the industrial camera. Through the perspective image of the circuit board displayed on the display, the operator can intuitively analyze the solder joints on the circuit board.

[0004] However, X-rays have different penetration rates on circuit boards of different thicknesses. In order to obtain a better contrast image effect, operators often need to control the high-voltage power supply control box through the console to adjust the emission intensity of the X-ray tube. This operation is inconvenient and needs to be improved. Utility Model Content

[0005] In order to automatically adjust the intensity of X-rays emitted by an X-ray tube and improve the convenience of operators in performing welding inspection on circuit boards, the present application provides a circuit board welding quality inspection device.

[0006] The present application provides a circuit board welding quality detection device that adopts the following technical solution:

[0007] A circuit board welding quality detection device comprises a frame, wherein the frame comprises a detection chamber, wherein a working platform, an intensifier and an X-ray tube are installed in the detection chamber; and:

[0008] A control console, fixedly mounted on the frame, for inputting a start signal;

[0009] A thickness detection module, fixedly mounted on the inner wall of the detection chamber, with a signal input terminal connected to a signal input terminal of the console, for receiving the start signal and detecting the thickness of the circuit board, and outputting a circuit board thickness signal;

[0010] A signal processing module, whose signal input terminal is signal-connected to the signal output terminal of the thickness detection module, and is used to receive the circuit board thickness signal and output a light intensity control signal;

[0011] An X-ray sensing module is arranged in the detection chamber, opposite to the X-ray tube, and has a signal input end connected to a signal output end of the console, for receiving the start signal, detecting X-rays, and outputting a detection control signal;

[0012] The signal output end of the signal processing module is signal-connected to the signal input end of the high-voltage power supply control box, and the high-voltage power supply control box receives the light intensity control signal and controls the X-ray tube to emit light;

[0013] The signal input end of the industrial camera and the intensifier is connected to the signal output end of the X-ray sensing module, and the industrial camera and the intensifier receive the detection control signal and operate.

[0014] By adopting the above technical solution, during the actual production and processing process, when the operator needs to perform welding quality inspection on the circuit board, the circuit board to be tested can be placed on the working platform surface in the inspection chamber in advance, and after closing the sealing door, the operator inputs the start signal through the console; the thickness detection module receives the start signal and detects the thickness of the circuit board and outputs the circuit board thickness signal, the signal processing module calculates the required X-ray intensity according to the circuit board thickness value measured by the thickness detection module, and controls the X-ray tube to emit X-rays of a given intensity by controlling the high-voltage power supply control box, which can achieve the technical effect of automatically detecting the thickness of the circuit board and automatically adjusting the intensity of the X-ray emitted by the X-ray tube, effectively improving the convenience of the operator to use the X-ray detection equipment. While the X-ray tube emits X-rays, the X-ray sensing module controls the operation of the industrial camera and the intensifier, collects the scanned image of the circuit board and transmits it to the display on the console outside the rack, and the operator can visually observe the solder joints of the circuit board through the display.

[0015] Preferably, the working platform is slidably connected to two loading plates, and the tops of the two loading plates are provided with placement grooves for placing the side edges of the circuit board;

[0016] The thickness detection module comprises:

[0017] The infrared distance measuring sensor can be adjusted and installed on any of the carrier boards, with the sensing end arranged toward the top of the side of the circuit board, and is used to detect the distance between the infrared distance measuring sensor itself and the top of the circuit board and output a sensing distance signal;

[0018] The first single chip microcomputer has a signal input terminal connected to a signal output terminal of the infrared distance measuring sensor, and is used to receive the sensing distance signal and output the circuit board thickness signal.

[0019] By adopting the above technical solution, the distance between the top surface of the circuit board and the infrared distance sensor itself can be measured by the infrared distance sensor installed on the carrier. Since the distance between the infrared distance sensor itself and the bottom of the placement slot on the carrier is a known value, the actual thickness of the circuit board can be calculated by the first single-chip microcomputer, thereby achieving the technical effect of automatically detecting the thickness of the circuit board. In addition, by setting the placement slot, the convenience of the operator in placing the circuit board can be improved. The two carriers are slidably arranged on the working platform, so that the carrier can be suitable for placing circuit boards of different sizes.

[0020] Preferably, the infrared ranging sensor is fixedly connected to a mounting seat, and the bottom of the mounting seat is fixedly connected to a plug-in portion;

[0021] A plurality of slots matched with the plug-in parts are respectively provided on the side walls opposite to each other of the two loading plates.

[0022] By adopting the above technical solution, the slots can realize the technical effect of detachable installation between the mounting base and the carrier plate, and the setting of multiple slots can facilitate the operator to adjust the installation position of the infrared ranging sensor according to the electronic components on the circuit board. In the actual test process, the operator adjusts the mounting base and the installation position of the infrared ranging sensor according to the position of the components on the circuit board to avoid the electronic components on the circuit board, ensure the accuracy of the infrared ranging sensor detection results, and ensure the accuracy of the circuit board thickness detection.

[0023] Preferably, an extension portion is extended inwardly from the inner groove wall of the slot, and two spring sheets are fixedly connected to the plug-in portion. The two spring sheets are located on both sides of the mounting seat, and the two spring sheets are tightly pressed between the extension portion and the plug-in portion.

[0024] By adopting the above technical solution, the extension part is limited to the top of the plug-in block. Combined with the spring piece on the top of the plug-in block, the stability of the installation between the plug-in block and the slot can be effectively improved, thereby ensuring the accuracy of the detection results of the infrared ranging sensor.

[0025] Preferably, the bottoms of the two loading plates are respectively fixedly connected with sliding blocks, and the working platform is provided with two sliding grooves adapted to the sliding blocks.

[0026] By adopting the above technical solution, the slider and the slide groove extend into the slide groove, which can achieve the technical effect of sliding connection between the carrier plate and the working platform, making it convenient for the operator to adjust the position of the carrier plate according to the size of the circuit board.

[0027] Preferably, the signal processing module includes a second single-chip microcomputer, a signal input terminal of the second single-chip microcomputer is signal-connected to a signal output terminal of the infrared ranging sensor, and a signal output terminal of the second single-chip microcomputer is signal-connected to a signal input terminal of a high-voltage power supply control box.

[0028] By adopting the above technical solution, the second single-chip microcomputer can automatically calculate the thickness of the circuit board and output a circuit board thickness signal.

[0029] Preferably, the X-ray sensing module comprises:

[0030] An X-ray sensor is fixedly mounted on the mounting base, mounted above the circuit board, and has a signal input terminal connected to a signal output terminal of the console, for receiving the start signal, detecting X-rays passing through the circuit board, and outputting an X-ray sensing signal;

[0031] The third single chip microcomputer has a signal input terminal signal-connected to the signal output terminal of the X-ray sensor, and is used to receive the X-ray sensing signal and output the detection control signal.

[0032] By adopting the above technical solution, when the thickness detection module completes the detection and the X-ray tube emits X-rays, the X-ray sensor senses the X-rays penetrating the circuit board and sends out an X-ray sensing signal. The third single-chip microcomputer recognizes the X-ray sensing signal and controls the operation of the industrial camera and the enhancer, thereby achieving the technical effect of automatically sensing the operating status of the X-ray tube and automatically starting the industrial camera and the enhancer.

[0033] In summary, the circuit board welding quality detection device of the present application includes at least one of the following beneficial technical effects:

[0034] 1. Through the coordination and use of the infrared distance measuring sensor, the first single-chip microcomputer and the second single-chip microcomputer, the thickness of the circuit board can be automatically detected before the circuit board is subjected to X-ray penetration detection, and a circuit board thickness signal can be output. The second single-chip microcomputer can calculate the required X-ray intensity according to the circuit board thickness value measured by the thickness detection module, and control the X-ray tube to emit X-rays of a given intensity by controlling the high-voltage power supply control box, thereby achieving the technical effect of automatically detecting the thickness of the circuit board and automatically adjusting the intensity of the X-rays emitted by the X-ray tube, and effectively improving the convenience of operators in using the X-ray detection equipment;

[0035] 2. Through the matching and use of the slots on the carrier board and the plug-in blocks at the bottom of the mounting seat, the operator can adjust the position of the infrared distance sensor according to the position of the electronic components on the circuit board to ensure the detection effect of the infrared distance sensor;

[0036] 3. Through the coordination and use between the X-ray sensor and the third single-chip microcomputer, the operating status of the X-ray tube can be automatically sensed, and the industrial camera and intensifier can be automatically controlled to start. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of a detection device.

[0038] Figure 2 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of a working platform.

[0039] Figure 3 It is a schematic diagram of an embodiment of the present application for illustrating the overall structure of the mounting base.

[0040] Figure 4 It is a schematic diagram of an embodiment of the present application for demonstrating internal signal transmission of a detection device.

[0041] Explanation of the reference numerals: 1. Frame; 11. Detection chamber; 2. Work platform; 21. Slide; 3. Intensifier; 4. X-ray tube; 5. Thickness detection module; 51. Infrared ranging sensor; 52. Mounting seat; 521. Plug-in portion; 522. Shrapnel; 6. Loading plate; 61. Placement slot; 62. Slot; 63. Extension portion; 64. Slider; 7. X-ray sensor; 8. Circuit board. DETAILED DESCRIPTION

[0042] The following is combined with Figure 1-3 This application is described in further detail.

[0043] Example

[0044] The present application embodiment discloses a circuit board welding quality detection device. Figure 1 and Figure 4 It mainly includes a frame 1, which includes a detection chamber 11, in which a working platform 2, an intensifier 3 and an X-ray tube 4 are installed.

[0045] And: a console, fixedly mounted on the frame 1, for inputting a start signal; a thickness detection module 5, fixedly mounted on the inner wall of the detection chamber 11, the signal input end of which is signal-connected with the signal input end of the console, for receiving a start signal and detecting the thickness of the circuit board 8, and outputting a thickness signal of the circuit board 8; a signal processing module, the signal input end of which is signal-connected with the signal output end of the thickness detection module 5, for receiving the thickness signal of the circuit board 8 and outputting a light intensity control signal; an X-ray sensing module, arranged in the detection chamber 11, opposite to the X-ray tube 4, the signal input end of which is signal-connected with the signal output end of the console, for receiving a start signal and detecting X-rays, and outputting a detection control signal;

[0046] The signal output end of the signal processing module is signal-connected to the signal input end of the high-voltage power supply control box, and the high-voltage power supply control box receives the light intensity control signal and controls the X-ray tube 4 to emit light.

[0047] The signal input end of the industrial camera and the intensifier 3 is connected to the signal output end of the X-ray sensing module, and the industrial camera and the intensifier 3 receive the detection control signal and operate.

[0048] During the actual production and processing process, when the operator needs to perform welding quality inspection on the circuit board 8, the circuit board 8 to be tested can be placed on the surface of the working platform 2 in the inspection chamber 11 in advance, and after closing the sealing door, the operator inputs a start signal through the console; the thickness detection module 5 receives the start signal and detects the thickness of the circuit board 8 and outputs the circuit board 8 thickness signal, the signal processing module calculates the required X-ray intensity according to the thickness value of the circuit board 8 measured by the thickness detection module 5, and controls the X-ray tube 4 to emit X-rays of a given intensity by controlling the high-voltage power supply control box, which can achieve the technical effect of automatically detecting the thickness of the circuit board 8 and automatically adjusting the intensity of the X-rays emitted by the X-ray tube 4, and effectively improves the convenience of the operator in using the X-ray detection equipment.

[0049] While the X-ray tube 4 emits X-rays, the X-ray sensing module controls the operation of the industrial camera and the intensifier 3, collects the scanned image of the circuit board 8 and transmits it to the display on the console outside the frame 1. The operator can visually observe the solder joints of the circuit board 8 through the display.

[0050] Reference Figure 1 and Figure 2 Two loading plates 6 are slidably connected to the working platform 2 , and the tops of the two loading plates 6 are provided with placement grooves 61 for placing the side edges of the circuit board 8 .

[0051] The thickness detection module 5 includes: an infrared ranging sensor 51, which can be adjusted and installed on any carrier plate 6, with the sensing end arranged toward the top of the side of the circuit board 8, for detecting the distance between the infrared ranging sensor 51 itself and the top of the circuit board 8 and outputting a sensing distance signal; a first single-chip microcomputer, whose signal input end is signal-connected to the signal output end of the infrared ranging sensor 51, for receiving the sensing distance signal and outputting a circuit board 8 thickness signal.

[0052] The distance between the top surface of the circuit board 8 and the infrared distance sensor 51 itself can be measured by the infrared distance sensor 51 installed on the carrier plate 6. Since the distance between the infrared distance sensor 51 itself and the bottom of the placement slot 61 on the carrier plate 6 is a known value, the actual thickness of the circuit board 8 can be calculated by the first single-chip microcomputer, thereby achieving the technical effect of automatically detecting the thickness of the circuit board 8. In addition, the convenience of placing the circuit board 8 by the operator can be improved by setting the placement slot 61. The two carrier plates 6 are slidably arranged on the working platform 2, so that the carrier plates 6 can be suitable for placing circuit boards 8 of different sizes.

[0053] Reference Figure 2 and Figure 3 The infrared distance measuring sensor 51 is fixedly connected to a mounting seat 52 , and a plug-in portion 521 is fixedly connected to the bottom of the mounting seat 52 ; and a plurality of slots 62 adapted to the plug-in portion 521 are respectively provided on the opposite side walls of the two loading plates 6 .

[0054] The slots 62 can achieve the technical effect of detachable installation between the mounting base 52 and the carrier plate 6, and the provision of multiple slots 62 can facilitate the operator to adjust the installation position of the infrared distance sensor 51 according to the electronic components on the circuit board 8. In the actual test process, the operator adjusts the installation position of the mounting base 52 and the infrared distance sensor 51 according to the position of the components on the circuit board 8 to avoid the electronic components on the circuit board 8, thereby ensuring the accuracy of the detection result of the infrared distance sensor 51 and the accuracy of the detection of the thickness value of the circuit board 8.

[0055] Reference Figure 2 An extension portion 63 is provided inwardly extending from the inner groove wall of the slot 62 , and two spring plates 522 are fixedly connected to the plug-in portion 521 . The two spring plates 522 are located on both sides of the mounting seat 52 , and the two spring plates 522 are tightly pressed between the extension portion 63 and the plug-in portion 521 .

[0056] The extension portion 63 is limited to the top of the plug block, and combined with the spring piece 522 on the top of the plug block, the installation stability between the plug block and the slot 62 can be effectively improved, thereby ensuring the accuracy of the detection result of the infrared ranging sensor 51.

[0057] Reference Figure 2The bottoms of the two loading plates 6 are respectively fixedly connected with sliders 64 , and the working platform 2 is provided with two slide grooves 21 adapted to the sliders 64 .

[0058] The slider 64 and the slide groove 21 extend into the slide groove 21 , which can achieve the technical effect of sliding connection between the carrier plate 6 and the working platform 2 , making it convenient for the operator to adjust the position of the carrier plate 6 according to the size of the circuit board 8 .

[0059] In the embodiment of the present application, the signal processing module adopts a second single-chip microcomputer, the signal input end of the second single-chip microcomputer is connected to the signal output end of the infrared ranging sensor 51, and the signal output end of the second single-chip microcomputer is connected to the signal input end of the high-voltage power supply control box. The second single-chip microcomputer can automatically calculate the thickness of the circuit board 8 and output the circuit board 8 thickness signal.

[0060] Reference Figure 2 The X-ray sensing module includes: an X-ray sensor 7, which is fixedly mounted on a mounting base 52 and mounted above a circuit board 8, and whose signal input end is signal-connected to a signal output end of the console, for receiving a start signal and detecting X-rays passing through the circuit board 8 and outputting an X-ray sensing signal; a third single-chip microcomputer, whose signal input end is signal-connected to a signal output end of the X-ray sensor 7, for receiving an X-ray sensing signal and outputting a detection control signal.

[0061] When the thickness detection module 5 completes the detection and the X-ray tube 4 emits X-rays, the X-ray sensor 7 senses the X-rays penetrating the circuit board 8 and sends out an X-ray sensing signal. The third single-chip microcomputer recognizes the X-ray sensing signal and controls the operation of the industrial camera and the enhancer 3, thereby achieving the technical effect of automatically sensing the operating status of the X-ray tube 4 and automatically starting the industrial camera and the enhancer 3.

[0062] The implementation principle of a circuit board welding quality detection device in an embodiment of the present application is as follows: by matching and using the infrared ranging sensor 51, the first single-chip microcomputer and the second single-chip microcomputer, the thickness of the circuit board 8 can be automatically detected before the X-ray penetration detection is performed on the circuit board 8, and a thickness signal of the circuit board 8 can be output; the second single-chip microcomputer can calculate the required X-ray intensity according to the thickness value of the circuit board 8 measured by the thickness detection module 5, and control the X-ray tube 4 to emit X-rays of a given intensity by controlling the high-voltage power supply control box, thereby achieving the technical effect of automatically detecting the thickness of the circuit board 8 and automatically adjusting the intensity of the X-rays emitted by the X-ray tube 4, and effectively improving the convenience of operators in using the X-ray detection equipment.

[0063] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A circuit board welding quality detection device, characterized in that: The invention comprises a frame (1), wherein the frame (1) comprises a detection chamber (11), and a working platform (2), an intensifier (3) and an X-ray tube (4) are installed in the detection chamber (11); as well as: A control console, fixedly mounted on the frame (1) and used for inputting a start signal; a thickness detection module (5), fixedly mounted on the inner wall of the detection chamber (11), having a signal input terminal connected to a signal input terminal of the control console, for receiving the start signal and detecting the thickness of the circuit board (8), and outputting a circuit board (8) thickness signal; A signal processing module, the signal input end of which is signal-connected to the signal output end of the thickness detection module (5), and is used to receive the thickness signal of the circuit board (8) and output a light intensity control signal; An X-ray sensing module is arranged in the detection chamber (11), opposite to the X-ray tube (4), and has a signal input end connected to a signal output end of the console, and is used to receive the start signal, detect X-rays, and output a detection control signal; The signal output end of the signal processing module is signal-connected to the signal input end of the high-voltage power supply control box, and the high-voltage power supply control box receives the light intensity control signal and controls the X-ray tube (4) to emit light; The signal input end of the industrial camera and the intensifier (3) is signal-connected to the signal output end of the X-ray sensing module, and the industrial camera and the intensifier (3) receive the detection control signal and operate.

2. A circuit board welding quality detection device according to claim 1, characterized in that: Two loading plates (6) are slidably connected to the working platform (2), and the tops of the two loading plates (6) are provided with placement grooves (61) for placing the side edges of the circuit board (8); The thickness detection module (5) comprises: An infrared distance measuring sensor (51) can be adjusted and installed on any of the loading plates (6), with the sensing end arranged toward the top of the side of the circuit board (8), and is used to detect the distance between the infrared distance measuring sensor (51) itself and the top of the circuit board (8) and output a sensing distance signal; The first single chip computer has a signal input end connected to a signal output end of the infrared distance measuring sensor (51) and is used to receive the sensing distance signal and output a circuit board (8) thickness signal.

3. A circuit board welding quality detection device according to claim 2, characterized in that: The infrared distance measuring sensor (51) is fixedly connected to a mounting seat (52), and a plug-in portion (521) is fixedly connected to the bottom of the mounting seat (52); A plurality of slots (62) adapted to the plug-in portions (521) are respectively provided on the opposite side walls of the two object carriers (6).

4. A circuit board welding quality detection device according to claim 3, characterized in that: An extension portion (63) is provided on the inner groove wall of the slot (62) extending inwardly, and two spring sheets (522) are fixedly connected to the plug-in portion (521). The two spring sheets (522) are located on both sides of the mounting seat (52), and the two spring sheets (522) are tightly pressed between the extension portion (63) and the plug-in portion (521).

5. A circuit board welding quality detection device according to claim 2, characterized in that: The bottoms of the two loading plates (6) are respectively fixedly connected with sliding blocks (64), and the working platform (2) is provided with two sliding grooves (21) adapted to the sliding blocks (64).

6. A circuit board welding quality detection device according to claim 2, characterized in that: The signal processing module comprises a second single-chip microcomputer, wherein a signal input terminal of the second single-chip microcomputer is signal-connected to a signal output terminal of the infrared distance measuring sensor (51), and a signal output terminal of the second single-chip microcomputer is signal-connected to a signal input terminal of a high-voltage power supply control box.

7. A circuit board welding quality detection device according to claim 4, characterized in that: The X-ray sensing module comprises: An X-ray sensor (7) is fixedly mounted on the mounting seat (52), mounted above the circuit board (8), and has a signal input end connected to a signal output end of the console, and is used to receive the start signal and detect X-rays that pass through the circuit board (8) and output an X-ray sensing signal; The third single chip computer has a signal input end signal-connected to a signal output end of the X-ray sensor (7) and is used to receive the X-ray sensing signal and output the detection control signal.

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