Probe fixing assembly and tester

Abstract

The embodiment of the utility model provides a probe fixing assembly and a tester. The probe fixing assembly comprises a probe, a probe arm and a gas pipeline; the probe arm comprises a probe arm fixing end used for being fixed with the probe, at least part of the gas pipeline is fixed with the probe arm in the extending direction of the probe arm, the gas pipeline comprises a first end and a second end, the first end of the gas pipeline is provided with a gas nozzle, and the second end of the gas pipeline is provided with a gas nozzle. The gas nozzle is arranged close to the fixed end of the probe arm, and the second end of the gas pipeline is provided with a gas connector used for being connected with a gas pump. Thus, through the above structure, stable protective gas (such as nitrogen) can be provided for the test area through the gas nozzle, the problem of probe tip oxidation caused by probe tip discharge in the semiconductor chip test process is further avoided, the reliability of the test result is ensured, and the test efficiency and the product yield of the semiconductor chip are effectively improved.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor device testing, and in particular to a probe fixing assembly and a tester. Background Art

[0002] Wafer is the basic material for manufacturing semiconductor chips, usually referring to the original form of silicon semiconductor chips. In the manufacturing process of semiconductor devices, wafer testing is a key step, the purpose of which is to identify and eliminate defective products generated in the manufacturing process before packaging. Wafer testing involves using probes to contact the test contacts on the wafer, applying a predetermined electrical signal from the tester to the wafer and collecting the response signal of the wafer to evaluate its electrical parameter performance. The probe is a device used by the tester to contact the wafer, and the quality of the probe will directly affect the test results. Due to the thin tip of the probe, the electrical signal voltage applied by the tester can easily produce discharge at the tip of the probe, which will cause oxidation of the probe surface, damage the physical and electrical properties of the probe, affect subsequent test results, and reduce the test efficiency and product yield of semiconductor chips. Utility Model Content

[0003] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a probe fixing assembly, including:

[0004] Probe;

[0005] A probe arm, the probe arm comprising a probe arm fixing end for fixing with the probe;

[0006] A gas pipeline, wherein the gas pipeline is at least partially fixed to the probe arm along the extension direction of the probe arm, the gas pipeline includes a first end and a second end, the first end of the gas pipeline is provided with a gas nozzle, the gas nozzle is arranged close to the fixed end of the probe arm, and the second end of the gas pipeline is provided with a gas connector for connecting to an air pump.

[0007] In a possible implementation, the needle includes a probe testing portion and a probe fixing portion, and the probe fixing portion is connected to the probe testing portion;

[0008] The probe comprises a probe testing part and a probe fixing part, and the probe fixing part is connected to the probe testing part;

[0009] The probe arm fixing end includes a first through hole for passing the probe fixing part, and a second through hole and a fixing member for fixing the probe fixing part located in the first through hole.

[0010] The first through hole is connected to the second through hole, and an opening direction of the first through hole intersects with an opening direction of the second through hole;

[0011] The fixing member fixes the probe fixing portion located in the first through hole through the second through hole.

[0012] In a possible implementation, a thread is provided on the wall of the second through hole, and the fixing member and the second through hole are matched with the thread to fix the probe fixing part located in the first through hole;

[0013] The probe fixing member is a screw.

[0014] In a possible implementation, the gas nozzle is disposed close to the probe, and the distance between the gas nozzle and the tip of the probe testing part is 1 / 3 to 2 / 3 of the length of the probe testing part.

[0015] In a possible implementation manner, a jetting direction of the gas nozzle is parallel to an extending direction of the probe testing portion.

[0016] In a possible implementation, the probe fixing assembly further includes an adhesive fixing member, and the gas pipeline is attached to the probe arm through the adhesive fixing member.

[0017] In a possible implementation, the probe arm is a conductive probe arm, and the probe arm provides a test electrical signal for the probe;

[0018] The probe arm comprises a metal conductive arm and an insulating layer covering the surface of the metal conductive arm;

[0019] The first through hole passes through the metal conductive arm, and the inner wall of the first through hole is a conductive metal.

[0020] In a possible implementation manner, the shape of the probe arm includes an L shape.

[0021] Another object of the present application is to provide a tester, which includes an air pump and a plurality of the probe fixing assemblies provided by the present application, wherein the air pump is connected to the gas connecting head in the probe fixing assembly to provide gas to the gas nozzle.

[0022] In a possible implementation, the probe arm is a conductive probe wall, the probe arm also includes a signal providing end for providing an electrical signal, and the tester also includes a power supply, the power supply is connected to the signal providing end, and provides a test electrical signal to the probe through the probe arm.

[0023] Based on any of the above aspects, the probe fixing assembly and tester provided in the embodiments of the present application can provide a stable protective gas (such as nitrogen) to the test area through a gas nozzle, thereby avoiding the problem of probe tip oxidation caused by discharge at the probe tip during semiconductor chip testing, ensuring the reliability of the test results, and effectively improving the testing efficiency and product yield of semiconductor chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 One of the schematic diagrams of the probe fixing assembly provided in this embodiment;

[0026] Figure 2 A second schematic diagram of the probe fixing assembly provided in this embodiment;

[0027] Figure 3 for Figure 2 The structural details at the dotted circle in the middle;

[0028] Figure 4 The third schematic diagram of the probe fixing assembly provided in this embodiment;

[0029] Figure 5 A fourth schematic diagram of the probe fixing assembly provided in this embodiment;

[0030] Figure 6 A fifth schematic diagram of the probe fixing assembly provided in this embodiment;

[0031] Figure 7 A sixth schematic diagram of the probe fixing assembly provided in this embodiment;

[0032] Figure 8 The edge provided by this embodiment Figure 7 A schematic diagram of a section cut at the AA cutting line is shown;

[0033] Fig. 9 A schematic diagram of a tester provided in this embodiment.

[0034] Icons: 10-probe fixing assembly, 100-probe, 1001-probe fixing part, 1002-probe testing part, 110-probe arm, 110A-metal conductive arm, 110B-probe arm insulating layer, 1101-probe arm fixing end, 1102-signal providing end, 1101A-first through hole, 1101B-second through hole, 120-gas pipeline, 1201-gas nozzle, 1202-gas connecting head, 130-fixing part, 140-adhesive fixing part, 20-tester, 200-air pump, 210-power supply. DETAILED DESCRIPTION

[0035] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0036] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0037] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0038] In the description of this application, it should be noted that the terms "upper", "lower", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the application is usually placed when in use, which is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on this application. In addition, the terms "first", "second", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0039] It should be noted that, in the absence of conflict, different features in the embodiments of the present application may be combined with each other.

[0040] In order to solve the technical problems mentioned in the above background technology, the inventor innovatively designed the following technical solution, and the specific implementation solution of this application will be described in detail below with reference to the accompanying drawings. Figure 1 , Figure 1A schematic diagram of a probe fixing assembly 10 provided in this embodiment, the probe fixing assembly 10 includes a probe 100, a probe arm 110 and a gas pipeline 120. In this embodiment, the probe arm 110 includes a probe arm fixing end 1101, and the probe arm fixing end 1101 is used to fix the probe 100, wherein the probe 100 is used to contact the test contact on the wafer. The probe fixing assembly 10 fixes the probe 100 through the probe arm fixing end 1101 to facilitate the subsequent testing of semiconductor chips.

[0041] Please see again Figure 1 , the gas pipeline 120 is fixed to the probe arm 110 at least partially along the extension direction of the probe arm 110, the gas pipeline 120 includes a first end and a second end, the first end of the gas pipeline 120 is provided with a gas nozzle 1201, and the gas nozzle 1201 is arranged close to the fixed end 1101 of the probe arm, the purpose of which is to ensure that during the test, the protective gas sprayed by the gas nozzle 1201 can fully act on the peripheral area of ​​the probe 100, and protect the probe 100 from reacting with oxygen in the peripheral area during the test to cause oxidation of the probe 100 surface. It is worth noting that the gas nozzle 1201 may include but is not limited to a solid cone gas atomizing nozzle, a guide nozzle, etc. The second end of the gas pipeline 120 is also provided with a gas connector 1202, and the gas connector 1202 is used to connect an air pump. During the wafer test process, the air pump switch can be turned on first, and the protective gas is sprayed by the gas nozzle 1201 through the gas pipeline 120 to act on the test area where the probe is located. It is worth noting that the gas connector 1202 may include, but is not limited to, an internal thread connector, a snap-on connector, and the like.

[0042] For further information, please refer to Figure 2 The probe 100 includes a probe fixing part 1001 and a probe testing part 1002 , wherein the probe fixing part 1001 is connected to the probe testing part 1002 , wherein the probe tip refers to an end of the probe testing part 1002 away from the probe fixing part 1001 .

[0043] Please refer to Figure 3 , Figure 3 Example Figure 2The structural details diagram at the dotted circle in the middle, in order to fix the probe 100 on the probe arm 110, the probe arm fixing end 1101 includes a first through hole 1101A for passing the probe fixing part 1001, and a second through hole 1101B and a fixing member 130 for fixing the probe fixing part 1001 located in the first through hole 1101A, the first through hole 1101A is connected to the second through hole 1101B, the opening direction of the first through hole 1101A intersects with the opening direction of the second through hole 1101B, and the fixing member 130 fixes the probe fixing part 1001 located in the first through hole 1101A through the second through hole 1101B.

[0044] For example, in one possible implementation, please refer again to Figure 3 The opening direction of the first through hole 1101A can be arranged radially along the probe arm 110 (that is, the opening direction of the first through hole 1101A can be perpendicular to the extension direction of the probe arm 110), and the opening direction of the second through hole 1101B is arranged along the extension direction of the probe arm 110. The first through hole 1101A is connected to the second through hole 1101B, and the opening direction of the first through hole 1101A is perpendicular to the opening direction of the second through hole 1101B.

[0045] Exemplarily, a thread is disposed on the wall of the second through hole 1101B, and the fixing member 130 is aligned with the second through hole 1101B through threaded cooperation, thereby fixing the probe fixing portion 1001 in the first through hole 1101A.

[0046] It is worth noting that, in the present embodiment, the fixing member 130 can be a screw, and the internal thread depth of the hole wall of the second through hole 1101B and the specific depth and size of the external thread of the fixing member 130 are not limited in the present embodiment. It is only necessary that the internal thread depth of the hole wall of the second through hole 1101B is the same as or equivalent to the external thread depth of the fixing member 130, and the thread length of the hole wall of the second through hole 1101B matches the size of the fixing member to ensure that the probe 100 is reliably fixed on the probe arm 110.

[0047] Furthermore, in order to enable the protective gas sprayed by the gas nozzle 1201 to cover the probe testing part 1002 (probe tip) of the probe 100 to ensure the normal test results, in addition to setting the gas nozzle close to the fixed end 1101 of the probe arm, it is also necessary to adjust the distance between the gas nozzle 1201 and the probe testing part 1002 and the jet direction of the gas nozzle 1201.

[0048] In this embodiment, please refer to Figure 4, the gas nozzle 1201 is arranged close to the probe 100, and the distance d1 between the gas nozzle 1201 and the tip of the probe test part 1002 is 1 / 3 to 2 / 3 of the length d2 of the probe test part 1002. Exemplarily, the distance d1 is 1 / 3, 4 / 11, 2 / 5, 4 / 9, 1 / 2, 4 / 7 and 2 / 3 of the length d2 of the probe test part 1002. Preferably, the distance d1 between the gas nozzle 1201 and the tip of the probe test part 1002 is 1 / 2 of the length d2 of the probe test part.

[0049] For further information, please refer to Figure 5 In this embodiment, the jet direction of the gas nozzle is parallel to the extension direction of the probe testing part, as shown by the arrow direction in the figure. The protective gas action area sprayed by the gas nozzle 1201 can cover the tip of the probe testing part 1002 of the probe 100, thereby ensuring the normal progress of the test.

[0050] Furthermore, the probe fixing assembly 10 also includes an adhesive fixing member 140, please refer to Figure 6 The gas pipeline 120 is attached to the probe arm 110 through the adhesive fixing member 140. In the present embodiment, the adhesive fixing member can be made of a sticky material, such as instant glue, epoxy resin, polyurethane glue, etc.

[0051] Furthermore, the probe arm 110 is a conductive probe arm, and the probe arm 110 provides a test electrical signal for the probe 100. Figure 7 and Figure 8 , Figure 7 Example A schematic diagram of a probe fixing assembly provided in this application, Figure 8 Example Figure 7 As shown in the cross-sectional view at the AA section line, the probe arm 110 includes a metal conductive arm 110A and a probe arm insulating layer 110B covering the surface of the metal conductive arm 110A. In this embodiment, the first through hole 1101A passes through the metal conductive arm 110A, and the inner wall of the first through hole 1101A is a conductive metal. The test electrical signal is transmitted to the probe test part 1002 through the probe arm 110 through the first through hole 1101A. The probe test part 1002 contacts the wafer to be tested and collects the response signal of the device to be tested to evaluate its electrical parameter performance. It is worth noting that the material of the metal conductive arm 110A can be copper, and the material of the probe arm insulating layer 110B can be plastic, rubber, etc.

[0052] Furthermore, the shape of the probe arm 110 includes L-shape and Z-shape, but is not limited thereto.

[0053] The present application also provides a tester 20, please refer to Fig. 9 The tester includes an air pump 200 and any one of the aforementioned probe fixing components 10 , and the air pump 200 is connected to the gas connection head 1202 of the probe fixing component 10 to provide gas to the gas nozzle 1201 .

[0054] Further, refer again to Fig. 9 , the probe arm 110 is a conductive probe arm, the probe arm 110 also includes a signal providing end 1102 for providing an electrical signal, the tester 20 also includes a power supply 210, the power supply 210 is connected to the signal providing end 1102, and provides a test electrical signal to the probe 100 through the probe arm 110. When the tester 20 is used for testing, the gas pump 200 is turned on before the test, and the gas is transmitted to the gas nozzle 1201 through the gas pipeline 120. At the same time, the probe test part 1002 of the probe arm 110 is used to contact the wafer to be tested, and the tester 20 sends a test electrical signal, which is transmitted to the probe test part 1001 through the probe arm 110, and receives the feedback signal of the wafer. During the whole process, the gas nozzle 1201 continuously sprays protective gas to act on the probe test part 1002 until the test is completed.

[0055] In summary, the probe fixing assembly and the tester provided in the embodiment of the present application, the probe fixing assembly 10 includes a probe 100, a probe arm 110, and a gas pipeline 120; the probe arm 110 includes a probe arm fixing end 1101 for fixing with the probe 100, the gas pipeline 120 is fixed with the probe arm 110 at least partially along the extension direction of the probe arm 110, the gas pipeline 120 includes a first end and a second end, the first end of the gas pipeline 120 is provided with a gas nozzle 1201, the gas nozzle 1201 is arranged close to the probe arm fixing end 1101, and the second end of the gas pipeline 120 is provided with a gas connector 1202 for connecting to an air pump. In this way, through the above structure, a stable protective gas (such as nitrogen) can be provided to the test area through the gas nozzle, thereby avoiding the problem of probe tip oxidation caused by probe tip discharge during semiconductor chip testing, ensuring the reliability of the test results, and effectively improving the test efficiency and product yield of semiconductor chips.

[0056] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A probe fixing assembly, characterized in that: The probe fixing assembly comprises: Probe; A probe arm, the probe arm comprising a probe arm fixing end for fixing with the probe; A gas pipeline, wherein the gas pipeline is at least partially fixed to the probe arm along the extension direction of the probe arm, the gas pipeline includes a first end and a second end, the first end of the gas pipeline is provided with a gas nozzle, the gas nozzle is arranged close to the fixed end of the probe arm, and the second end of the gas pipeline is provided with a gas connector for connecting to an air pump.

2. The probe fixing assembly according to claim 1, characterized in that: The probe comprises a probe testing part and a probe fixing part, and the probe fixing part is connected to the probe testing part; The probe arm fixing end includes a first through hole for passing the probe fixing part, and a second through hole and a fixing member for fixing the probe fixing part located in the first through hole. The first through hole is connected to the second through hole, and an opening direction of the first through hole intersects with an opening direction of the second through hole; The fixing member fixes the probe fixing portion located in the first through hole through the second through hole.

3. The probe fixing assembly according to claim 2, characterized in that: The wall of the second through hole is provided with threads, and the probe fixing member and the second through hole are matched with threads to fix the probe fixing part located in the first through hole; The probe fixing member is a screw.

4. The probe fixing assembly according to claim 2, characterized in that: The gas nozzle is arranged close to the probe, and the distance between the gas nozzle and the tip of the probe testing part is 1 / 3 to 2 / 3 of the length of the probe testing part.

5. The probe fixing assembly according to claim 2, characterized in that: The jetting direction of the gas nozzle is parallel to the extending direction of the probe testing part.

6. The probe fixing assembly according to claim 1, characterized in that: The probe fixing assembly also includes an adhesive fixing piece, and the gas pipeline is attached to the probe arm through the adhesive fixing piece.

7. The probe fixing assembly according to claim 2, characterized in that: The probe arm is a conductive probe arm, and the probe arm provides a test electrical signal for the probe; The probe arm comprises a metal conductive arm and an insulating layer covering the surface of the metal conductive arm; The first through hole passes through the metal conductive arm, and the inner wall of the first through hole is a conductive metal.

8. The probe fixing assembly according to claim 1, characterized in that: The shape of the probe arm includes an L-shape.

9. A tester, characterized in that: It comprises an air pump and the probe fixing assembly according to any one of claims 1 to 8, wherein the air pump is connected to the gas connecting head in the probe fixing assembly to provide gas for the gas nozzle.

10. The tester according to claim 9, characterized in that: The probe arm is a conductive probe wall, and the probe arm also includes a signal providing end that provides an electrical signal. The tester also includes a power supply, and the power supply is connected to the signal providing end to provide a test electrical signal to the probe through the probe arm.

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