High-temperature-resistant surface-mounted solid-state capacitor

Abstract

The utility model discloses a high-temperature-resistant surface-mounted solid-state capacitor, which belongs to the technical field of solid-state capacitors and comprises a base, the upper surface of the base is fixedly connected with a solid-state capacitor body, the inner wall of the base and the bottom surface of the solid-state capacitor body are jointly and fixedly connected with two surface-mounted electrode plates, and a functional shell is arranged above the base. According to the high-temperature-resistant surface-mounted solid-state capacitor, through mutual cooperation of the base, the solid-state capacitor body, the surface-mounted electrode plate, the functional shell, the expansion shell, the cooling fan, the controller, the temperature sensor, the semiconductor chilling plate, the cooling fins and the conductive electrode plate, after the surface-mounted electrode plate is electrically connected with an external circuit, the solid-state capacitor body can exert the capacitance function of the solid-state capacitor body; and the controller and the temperature sensor can be electrified and activated through butt joint of the conductive electrode plate and the patch electrode plate, so that when the temperature sensor monitors that the temperature of the solid-state capacitor body is higher than a set range of the controller, the controller can automatically control the semiconductor chilling plate to be electrified and the bottom surface starts to refrigerate.

Description

Technical Field

[0001] The present application belongs to the technical field of solid-state capacitors, and in particular, relates to a high-temperature resistant chip-type solid-state capacitor. Background Art

[0002] Solid-state capacitors are capacitors that use solid electrolytes. Because of their high stability, long life, low impedance, good high-frequency characteristics and small size, solid-state capacitors play an important role in modern electronic technology and are widely used in electronic products, industrial control equipment, automotive electronic systems and other fields.

[0003] The utility model with the existing authorization announcement number CN216902561U discloses a chip capacitor, which improves the convenience of chip capacitor installation and welding, as well as the safety performance of the chip capacitor by setting a boss on the base of the chip capacitor and setting an explosion-proof gasket in the bottom interlayer of the packaging metal shell.

[0004] Although the above technical solution improves the convenience of chip capacitor installation and welding and the safety performance of chip capacitors, the above technical solution lacks a high-temperature heat dissipation structure, which causes the capacitor to operate for a long time in a high-temperature environment, which will reduce the capacitor performance and stability, shorten the capacitor life, and even cause failures.

[0005] To this end, we propose a high temperature resistant chip solid capacitor to solve the above problems. Utility Model Content

[0006] The purpose of this application is to solve the problem in the prior art that long-term operation of capacitors in high-temperature environments will reduce capacitor performance and stability, shorten capacitor life and even cause failures, and to propose a high-temperature resistant chip-type solid-state capacitor.

[0007] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0008] A high-temperature resistant patch-type solid-state capacitor comprises a base, the upper surface of the base is fixedly connected to a solid-state capacitor body, the inner wall of the base and the bottom surface of the solid-state capacitor body are jointly fixedly connected to two patch electrode sheets, a functional shell is arranged above the base, the upper surface of the functional shell is fixedly connected to an extension shell, the inner wall of the extension shell is fixedly connected to a heat dissipation fan, the inner wall of the functional shell is respectively fixedly connected to a controller, a temperature sensor, a semiconductor cooling sheet and two conductive electrode sheets, and the upper surface of the semiconductor cooling sheet is fixedly connected to a heat dissipation fin.

[0009] Preferably, the bottom surface of the functional shell contacts the upper surface of the base, the back surface of the temperature sensor contacts the front surface of the solid-state capacitor, the bottom surface of the semiconductor refrigeration sheet contacts the upper surface of the solid-state capacitor, the bottom surface of each of the conductive electrode sheets contacts the upper surface of the patch electrode sheet, the heat dissipation fan, the temperature sensor, the semiconductor refrigeration sheet and the two conductive electrode sheets are electrically connected to the controller through wires, and two groups of fastening bolts are arranged inside the functional shell, and the bottom end of each group of the fastening bolts passes through the functional shell and the base in sequence and extends to the inside of the base, and the outer surface of each group of the fastening bolts is threadedly connected to the inner wall of the functional shell and the inner wall of the base, respectively.

[0010] Preferably, two gaskets are sleeved on the outer surface of each group of the fastening bolts, and the bottom surface of each gasket is in contact with the upper surface of the functional shell.

[0011] Preferably, the outer surface of the functional shell is provided with a plurality of identical heat dissipation openings, and the outer surface of the extended shell is provided with a plurality of identical air inlets.

[0012] Preferably, an anti-skid cover is fixedly connected to the outer surface of the expansion shell, and a plurality of identical anti-skid protrusions are fixedly connected to the outer surface of the anti-skid cover.

[0013] Preferably, a heat insulating sleeve is fixedly connected to the inner wall of the functional shell, and the inner wall of the heat insulating sleeve is in contact with the outer surface of the heat dissipating fins.

[0014] In summary, the technical effects and advantages of this application are:

[0015] Through the mutual cooperation of the base, solid-state capacitor, patch electrode sheet, functional shell, expansion shell, heat sink fan, controller, temperature sensor, semiconductor cooling sheet, heat sink fins and conductive electrode sheet, the solid-state capacitor can play its capacitance function after the patch electrode sheet is electrically connected to the external circuit, and the docking of the conductive electrode sheet with the patch electrode sheet can enable the controller and the temperature sensor to be energized and activated, and then when the temperature sensor detects that the temperature of the solid-state capacitor is higher than the setting range of the controller, the controller can automatically control the semiconductor cooling sheet to be energized and the bottom surface to start cooling, and then the heat sink fins quickly dissipate the heat from the upper surface of the semiconductor cooling sheet and the energized heat sink quickly takes away the heat until the temperature sensor again detects that the temperature of the solid-state capacitor has returned to the setting range of the controller, thereby providing intelligent high-temperature heat dissipation for the solid-state capacitor and preventing the performance and stability of the solid-state capacitor from decreasing or even shortening its life or causing failures, thereby avoiding the problem that the capacitor will reduce its performance and stability, reduce its life or even cause failures due to the lack of high-temperature heat dissipation structure when running for a long time in a high-temperature environment. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a three-dimensional overall structural diagram of the high temperature resistant chip type solid capacitor of the utility model;

[0017] Figure 2 It is a three-dimensional structural diagram of the functional shell of the utility model;

[0018] Figure 3 It is a schematic diagram of the structure of the base of the utility model cut into three dimensions;

[0019] Figure 4 It is a schematic diagram of the three-dimensional structure of the functional shell of the utility model when viewed from the side and cut away;

[0020] Figure 5 It is a three-dimensional structural schematic diagram of the expansion shell of the utility model.

[0021] In the figure: 1. base; 2. solid-state capacitor; 3. patch electrode sheet; 4. functional shell; 5. expansion shell; 6. cooling fan; 7. controller; 8. temperature sensor; 9. semiconductor refrigeration sheet; 10. cooling fins; 11. conductive electrode sheet; 12. fastening bolts; 13. gasket; 14. heat dissipation port; 15. air inlet; 16. anti-slip cover; 17. anti-slip boss; 18. thermal insulation cover. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0023] Reference Figure 1-5 A high temperature resistant patch type solid capacitor comprises a base 1, the upper surface of the base 1 is fixedly connected with a solid capacitor body 2, the inner wall of the base 1 and the bottom surface of the solid capacitor body 2 are fixedly connected with two patch electrode sheets 3, a functional shell 4 is arranged above the base 1, the bottom surface of the functional shell 4 is in contact with the upper surface of the base 1, two groups of fastening bolts 12 are arranged inside the functional shell 4, the bottom end of each group of fastening bolts 12 penetrates the functional shell 4 and the base 1 in sequence and extends to the inside of the base 1, the outer surface of each group of fastening bolts 12 is respectively threadedly connected with the inner wall of the functional shell 4 and the inner wall of the base 1, and the fastening bolts 12 can be respectively threadedly connected with the inner wall of the base 1 and the inner wall of the functional shell 4, thereby facilitating the fastening and docking of the base 1 and the functional shell 4.

[0024] The upper surface of the functional shell 4 is fixedly connected to the expansion shell 5, and the outer surface of each group of fastening bolts 12 is sleeved with two gaskets 13, and the bottom surface of each gasket 13 is in contact with the upper surface of the functional shell 4. By providing the gasket 13, it can be padded between the functional shell 4 and the fastening bolts 12 to increase the contact area between the two, thereby increasing the fastening effect of the fastening bolts 12.

[0025] The inner wall of the extension shell 5 is fixedly connected with a heat dissipation fan 6, the outer surface of the functional shell 4 is provided with a plurality of identical heat dissipation ports 14, and the outer surface of the extension shell 5 is provided with a plurality of identical air inlets 15. By providing the heat dissipation ports 14, the heat dissipation effect of the functional shell 4 on the solid-state capacitor 2 can be increased. By providing the air inlet 15, it is convenient for gas to enter the interior of the extension shell 5 and cooperate with the heat dissipation fan 6 to quickly dissipate the heat of the lower structure.

[0026] The inner wall of the functional shell 4 is respectively fixedly connected with a controller 7, a temperature sensor 8, a semiconductor cooling sheet 9 and two conductive electrode sheets 11, the back of the temperature sensor 8 is in contact with the front of the solid-state capacitor 2, the bottom of the semiconductor cooling sheet 9 is in contact with the upper surface of the solid-state capacitor 2, the bottom of each conductive electrode sheet 11 is in contact with the upper surface of the patch electrode sheet 3, the heat dissipation fan 6, the temperature sensor 8, the semiconductor cooling sheet 9 and the two conductive electrode sheets 11 are all electrically connected to the controller 7 through wires, the outer surface of the extended shell 5 is fixedly connected with an anti-slip sleeve 16, the outer surface of the anti-slip sleeve 16 is fixedly connected with a plurality of identical anti-slip bosses 17, by providing the anti-slip bosses 17, the friction force of the outer surface of the anti-slip sleeve 16 can be increased, by providing the anti-slip sleeve 16 and the anti-slip bosses 17, the friction force of the outer surface of the extended shell 5 can be increased together, so that it is convenient to separate the functional shell 4 and the base 1 after pinching the extended shell 5 by hand.

[0027] The upper surface of the semiconductor refrigeration sheet 9 is fixedly connected with the heat dissipation fins 10, and the inner wall of the functional shell 4 is fixedly connected with the heat insulation sleeve 18. The inner wall of the heat insulation sleeve 18 is in contact with the outer surface of the heat dissipation fins 10. By providing the heat insulation sleeve 18, it can itself adopt materials with good heat insulation and heat resistance such as ceramic fiber and aerogel, which can prevent the heat from the upper surface of the semiconductor refrigeration sheet 9 conducted by the heat dissipation fins 10 from causing high-temperature damage to the functional shell 4.

[0028] The working principle of the utility model is: when in use, the functional shell 4 and the base 1 are fastened and connected with the fastening bolts 12 and the gaskets 13. At this time, the back of the temperature sensor 8 is in contact with the front of the solid-state capacitor 2, the conductive electrode sheet 11 is in contact with the upper surface of the patch electrode sheet 3 to form an electrical path, and the cooling surface of the bottom surface of the semiconductor refrigeration sheet 9 is in contact with the upper surface of the solid-state capacitor 2. Then, the solid-state capacitor 2 is connected to the corresponding circuit with the help of the patch electrode sheet 3. When the solid-state capacitor 2 starts to work, the temperature sensor 8 also starts to monitor the temperature of the solid-state capacitor 2 because of the electrical conduction between the conductive electrode sheet 11 and the patch electrode sheet 3. When the temperature sensor 8 monitors that the temperature of the solid-state capacitor 2 is higher than the temperature range set by the controller 7, the controller 7 will automatically control the semiconductor refrigeration sheet 9 to start. The electricity is turned on and the bottom surface begins to cool. The contact between the cooling surface of the semiconductor cooling plate 9 and the solid-state capacitor 2 can make the temperature of the solid-state capacitor 2 drop rapidly. During this period, the heat is quickly conducted away by the heat dissipation fins 10 on the heating surface of the upper surface of the semiconductor cooling plate 9. The controller 7 also controls the heat dissipation fan 6 to quickly dissipate the heat of the heat dissipation fins 10 until the temperature sensor 8 detects that the temperature of the solid-state capacitor 2 returns to the temperature range set by the controller 7. The cooling of the bottom surface of the semiconductor cooling plate 9 and the heat dissipation of the heat dissipation fan 6 can be stopped. In this way, the solid-state capacitor 2 can be intelligently cooled at high temperature. The design of the entire high-temperature resistant chip-type solid-state capacitor effectively solves the problem that the lack of a high-temperature heat dissipation structure causes the capacitor to run for a long time in a high-temperature environment, which will reduce the capacitor performance and stability, shorten the capacitor life, and even cause failures.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0031] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A high temperature resistant chip solid capacitor, comprising a base (1), characterized in that: The upper surface of the base (1) is fixedly connected to a solid capacitor (2); the inner wall of the base (1) and the bottom surface of the solid capacitor (2) are jointly fixedly connected to two patch electrode sheets (3); a functional shell (4) is arranged above the base (1); the upper surface of the functional shell (4) is fixedly connected to an extension shell (5); the inner wall of the extension shell (5) is fixedly connected to a heat dissipation fan (6); the inner wall of the functional shell (4) is respectively fixedly connected to a controller (7), a temperature sensor (8), a semiconductor cooling sheet (9) and two conductive electrode sheets (11); and the upper surface of the semiconductor cooling sheet (9) is fixedly connected to a heat dissipation fin (10).

2. A high temperature resistant chip solid capacitor according to claim 1, characterized in that: The bottom surface of the functional shell (4) contacts the top surface of the base (1), the back surface of the temperature sensor (8) contacts the front surface of the solid capacitor (2), the bottom surface of the semiconductor cooling sheet (9) contacts the top surface of the solid capacitor (2), the bottom surface of each conductive electrode sheet (11) contacts the top surface of the patch electrode sheet (3), the heat dissipation fan (6), the temperature sensor (8), the semiconductor cooling sheet (9) and the two conductive electrode sheets (11) are electrically connected to the controller (7) through wires, two groups of fastening bolts (12) are arranged inside the functional shell (4), the bottom end of each group of fastening bolts (12) passes through the functional shell (4) and the base (1) in sequence and extends to the inside of the base (1), and the outer surface of each group of fastening bolts (12) is threadedly connected to the inner wall of the functional shell (4) and the inner wall of the base (1), respectively.

3. A high temperature resistant chip solid capacitor according to claim 2, characterized in that: Two gaskets (13) are sleeved on the outer surface of each group of the fastening bolts (12), and the bottom surface of each gasket (13) is in contact with the upper surface of the functional shell (4).

4. The high temperature resistant chip solid capacitor according to claim 1, characterized in that: The outer surface of the functional shell (4) is provided with a plurality of identical heat dissipation openings (14), and the outer surface of the expansion shell (5) is provided with a plurality of identical air inlets (15).

5. The high temperature resistant chip solid capacitor according to claim 1, characterized in that: The outer surface of the expansion shell (5) is fixedly connected to an anti-skid sleeve (16), and the outer surface of the anti-skid sleeve (16) is fixedly connected to a plurality of identical anti-skid convex columns (17).

6. The high temperature resistant chip solid capacitor according to claim 1, characterized in that: The inner wall of the functional shell (4) is fixedly connected with a heat insulation sleeve (18), and the inner wall of the heat insulation sleeve (18) is in contact with the outer surface of the heat dissipation fin (10).

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