Silicon wafer carrying-out detection mechanism

Abstract

The utility model relates to the technical field of silicon wafer production, and discloses a silicon wafer take-out detection mechanism which comprises a mounting plate, one end of the upper surface of the mounting plate is provided with a mounting groove, the inner wall of the mounting groove is connected with a detection device, and the other end of the mounting plate is provided with a three-axis mechanical arm. A mounting block is fixedly connected to the output end of the three-axis mechanical arm, a limiting groove is formed in one end of the mounting block, a limiting block is slidably connected to the inner wall of the limiting groove, a first fixing plate is fixedly connected to the lower surface of the limiting block, and a vacuum suction cup is fixedly connected to the center of the lower surface of the first fixing plate. According to the utility model, when the detection equipment is started and the silicon wafer is detected to move past from the upper surface of the detection equipment, the detection equipment detects the silicon wafer, and when the unqualified silicon wafer is detected, the detection equipment controls the three-axis mechanical arm and the vacuum chuck to take down the unqualified silicon wafer, so that the effect of conveniently and automatically detecting the silicon wafer is achieved through the design.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer production, in particular to a silicon wafer take-out detection mechanism. Background Art

[0002] In the silicon wafer manufacturing process, the use of silicon wafer inspection systems can quickly and effectively eliminate defective silicon wafers with defects such as hidden cracks and micro cracks. Existing silicon wafer inspections mostly rely on manual inspections, which are inefficient. Utility Model Content

[0003] In order to make up for the above shortcomings, the utility model provides a silicon wafer carry-out detection mechanism, aiming to improve a silicon wafer carry-out detection mechanism. Under normal circumstances, a silicon wafer carry-out detection mechanism mostly relies on manual detection.

[0004] In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a silicon wafer take-out detection mechanism, comprising a mounting plate, a mounting groove is provided at one end of the upper surface of the mounting plate, the inner wall of the mounting groove is connected to a detection device, a three-axis robotic arm is provided at the other end of the mounting plate, the output end of the three-axis robotic arm is fixedly connected to a mounting block, a limiting groove is provided at one end of the mounting block, the inner wall of the limiting groove is slidably connected to the limiting block, the lower surface of the limiting block is fixedly connected to a first fixing plate, and a vacuum suction cup is fixedly connected at the center of the lower surface of the first fixing plate.

[0005] As a further description of the above technical solution:

[0006] A first connecting plate is fixedly connected to the outer wall of the detection device, first screw holes are provided on both sides of the lower surface of the first connecting plate, and first screws are threadedly connected to the inner walls of the first screw holes.

[0007] As a further description of the above technical solution:

[0008] Second screw holes are provided on both sides of the mounting block, and second screws are threadedly connected to inner walls of the second screw holes.

[0009] As a further description of the above technical solution:

[0010] Baffles are fixedly connected to both sides of the mounting plate.

[0011] As a further description of the above technical solution:

[0012] A second fixing plate is fixedly connected to one side of the baffle.

[0013] As a further description of the above technical solution:

[0014] The first screw hole passes through the mounting plate.

[0015] As a further description of the above technical solution:

[0016] A second connecting plate is fixedly connected to the lower surface of one end of the mounting plate.

[0017] As a further description of the above technical solution:

[0018] The limiting block and the limiting groove are in T-shape.

[0019] The utility model has the following beneficial effects:

[0020] 1. In the utility model, the detection device is started, and when the detection silicon wafer moves over the detection device, the detection device detects the silicon wafer. When an unqualified silicon wafer is detected, the detection device controls the three-axis mechanical arm and the vacuum suction cup to remove the unqualified silicon wafer. This design achieves the effect of convenient automatic detection of silicon wafers.

[0021] 2. In the utility model, the second screw is taken out from the second screw hole by rotating the second screw, and then the limiting block is taken out from the limiting groove by pulling the first fixing plate. This design achieves the effect of convenient replacement of the vacuum suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a front view of a silicon wafer take-out detection mechanism proposed by the utility model;

[0023] Figure 2 This is a three-dimensional structural schematic diagram of a silicon wafer take-out detection mechanism proposed by the utility model;

[0024] Figure 3 This is a disassembled diagram of a silicon wafer carry-out detection mechanism proposed by the utility model.

[0025] Legend:

[0026] 1. Mounting plate; 2. Mounting slot; 3. Detection equipment; 4. First connecting plate; 5. First screw hole; 6. First screw; 7. Three-axis robotic arm; 8. Mounting block; 9. Limiting slot; 10. Limiting block; 11. First fixing plate; 12. Vacuum suction cup; 13. Second screw; 14. Baffle; 15. Second fixing plate; 16. Second connecting plate. DETAILED DESCRIPTION

[0027] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0028] Reference Figure 1-3 The utility model provides an embodiment: a silicon wafer carrying out detection mechanism, comprising a mounting plate 1, a mounting groove 2 is provided at one end of the upper surface of the mounting plate 1, a detection device 3 is connected to the inner wall of the mounting groove 2, a three-axis mechanical arm 7 is arranged at the other end of the mounting plate 1, a mounting block 8 is fixedly connected to the output end of the three-axis mechanical arm 7, a limiting groove 9 is provided at one end of the mounting block 8, a limiting block 10 is slidably connected to the inner wall of the limiting groove 9, a first fixing plate 11 is fixedly connected to the lower surface of the limiting block 10, a vacuum suction cup 12 is fixedly connected to the center of the lower surface of the first fixing plate 11, and a moving detection device 3 is moved. When the detection silicon wafer moves over the detection device 3, the detection device 3 detects the silicon wafer. If an unqualified silicon wafer is detected, the detection device 3 controls the three-axis mechanical arm 7 and the vacuum suction cup 12 to remove the unqualified silicon wafer. Through this design, the effect of convenient automatic detection of silicon wafers is achieved.

[0029] The outer wall of the detection device 3 is fixedly connected to the first connecting plate 4, and first screw holes 5 are opened on both sides of the lower surface of the first connecting plate 4, and the inner wall of the first screw hole 5 is threadedly connected to the first screw. Through this design, the effect of convenient installation of the detection device 3 is achieved, and second screw holes are opened on both sides of the mounting block 8, and the inner wall of the second screw hole is threadedly connected to the second screw 136. The second screw 136 is taken out from the second screw hole by rotating the second screw 136, and then the limit block 10 is taken out from the limit groove 9 by pulling the first fixed plate 11. Through this design, the effect of convenient replacement of the vacuum suction cup 12 is achieved, and baffles 14 are fixedly connected on both sides of the mounting plate 1, and one side of the baffle 14 is fixedly connected to the second fixing plate 15. Through this design, the effect of convenient installation of the mounting plate 1 of the cable is achieved, the first screw hole 5 passes through the mounting plate 1, and the lower surface of one end of the mounting plate 1 is fixedly connected to the second connecting plate 16, and the shape of the limit block 10 and the limit groove 9 is T-shaped.

[0030] Working principle: When the device needs to be used, first install the device on the production equipment, and then install the detection device 3 in the installation groove 2, and install the first screw into the first screw hole 5 by turning the first screw. At this time, the detection device 3 is installed on the mounting plate 1, and the detection device 3 is started. When the detection silicon wafer moves over the detection device 3, the detection device 3 detects the silicon wafer. If unqualified silicon wafers are detected, the detection device 3 controls the three-axis robot arm 7 and the vacuum suction cup 12 to remove the unqualified silicon wafers. At this time, the use of the device is completed.

[0031] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon wafer carry-out detection mechanism, comprising a mounting plate (1), characterized in that: A mounting groove (2) is provided at one end of the upper surface of the mounting plate (1), and a detection device (3) is connected to the inner wall of the mounting groove (2). A three-axis mechanical arm (7) is provided at the other end of the mounting plate (1), and a mounting block (8) is fixedly connected to the output end of the three-axis mechanical arm (7). A limiting groove (9) is provided at one end of the mounting block (8), and the inner wall of the limiting groove (9) is slidably connected to the limiting block (10). The lower surface of the limiting block (10) is fixedly connected to a first fixing plate (11), and a vacuum suction cup (12) is fixedly connected at the center of the lower surface of the first fixing plate (11).

2. A silicon wafer carry-out detection mechanism according to claim 1, characterized in that: The outer wall of the detection device (3) is fixedly connected to a first connecting plate (4), the lower surface of the first connecting plate (4) is provided with first screw holes (5) on both sides, and the inner wall of the first screw hole (5) is threadedly connected to a first screw (6).

3. The silicon wafer carry-out detection mechanism according to claim 1, characterized in that: Second screw holes are provided on both sides of the mounting block (8), and second screws (13) are threadedly connected to the inner walls of the second screw holes.

4. The silicon wafer carry-out detection mechanism according to claim 1, characterized in that: Baffles (14) are fixedly connected to both sides of the mounting plate (1).

5. The silicon wafer carry-out detection mechanism according to claim 4, characterized in that: A second fixing plate (15) is fixedly connected to one side of the baffle plate (14).

6. The silicon wafer carry-out detection mechanism according to claim 2, characterized in that: The first screw hole (5) passes through the mounting plate (1).

7. The silicon wafer carry-out detection mechanism according to claim 1, characterized in that: A second connecting plate (16) is fixedly connected to the lower surface of one end of the mounting plate (1).

8. The silicon wafer carry-out detection mechanism according to claim 1, characterized in that: The limiting block (10) and the limiting groove (9) are in a T-shape.

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