Wafer back light reflectivity measuring device

Abstract

The utility model relates to a wafer back light reflectivity measuring device, and relates to the technical field of wafer processing. The device comprises a machine body, the machine body is further provided with a detection mechanism, the detection mechanism comprises a reflectivity detection piece and a control piece, the machine body is further provided with a conveying belt, the conveying belt is located under the reflectivity detection piece, and the detection mechanism further comprises a position detection piece. The position detection part is used for detecting whether a wafer on the conveying belt is located under the reflectivity detection part or not, the position detection part and the conveying belt are both controlled by the control part, and the control part is used for controlling opening and closing of the conveying belt based on data detected by the position detection part. The wafer detection device has the advantages that the wafer can be directly conveyed to the conveying belt, the accuracy of the position of the wafer is guaranteed through the position detection piece, manual wafer replacement is replaced, the time for replacing the to-be-detected wafer is shortened, and the wafer detection efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer processing technology, and in particular to a device for measuring the light reflectivity of the back side of a wafer. Background Art

[0002] With the continuous development of social economy and the increasing level of science and technology, my country's semiconductor industry is also booming. Wafers (i.e. wafers) are silicon chips used to make silicon semiconductor circuits, and their original material is silicon. As a carrier for producing integrated circuits (ICs), wafers can realize data processing, storage, transmission and other functions by manufacturing electronic devices and circuits on themselves, and play an important role in the semiconductor industry.

[0003] There is a device for measuring the light reflectivity of the back side of a wafer in the prior art, which includes a placement table and a detection mechanism. The top of the placement table is also extended upward with a heightening frame, and the heightening frame is connected to the placement table. The detection mechanism includes a detection component and a control component. The detection component is arranged on the heightening frame, and is used to detect the light reflectivity of the back side of the wafer, and transmit the detected data to the control component. The control component is used to receive the data detected by the detection component, and calculate the actual light reflectivity based on the data. When in use, the relevant personnel place the wafer to be tested on the placement table, and it is located directly below the detection part of the detection component. Then the detection component detects the light reflectivity of the wafer, and the control component receives the data detected by the detection component, and calculates the actual light reflectivity based on the data.

[0004] Regarding the above-mentioned related technologies, since the existing technology requires relevant personnel to manually place the wafer to be inspected on the placement table before the wafer can be inspected, and after the previous wafer is inspected, the relevant personnel still need to place the next wafer on the placement table and adjust the position of the wafer, which greatly increases the time required to replace the wafer to be inspected, thereby reducing the efficiency of inspection, so it needs to be improved. Utility Model Content

[0005] In order to improve the efficiency of wafer detection, the present application provides a wafer backside light reflectivity measurement device.

[0006] The present application provides a wafer backside light reflectivity measurement device, which adopts the following technical solution:

[0007] A wafer backside light reflectivity measuring device comprises a body, a detection mechanism is also arranged on the body, the detection mechanism comprises a reflectivity detection element and a control element, a conveyor belt is also arranged on the body, the conveyor belt is located directly below the reflectivity detection element, the detection mechanism also comprises a position detection element, the position detection element is used to detect whether the wafer on the conveyor belt is located directly below the reflectivity detection element, the position detection element and the conveyor belt are both controlled by the control element, and the control element is used to control the opening and closing of the conveyor belt based on data detected by the position detection element.

[0008] By adopting the above technical scheme, compared with the prior art, which requires relevant personnel to manually place and replace wafers, the present application, through the setting of the conveyor belt and the position detection device, can directly pass the produced wafers to the conveyor belt in the process of producing wafers, and then the position detection device detects the position of the wafer to be detected on the conveyor belt. When the wafer to be detected is located at a predetermined detection position, the control device controls the conveyor belt to stop, and turns on the reflectivity detection device to detect the light reflectivity of the back of the wafer. After the detection is completed, the control device controls the conveyor belt to open and transfers the detected wafer to the subsequent process, replacing the manual replacement of wafers, effectively reducing the time for replacing the wafers to be detected, thereby increasing the efficiency of wafer detection, and also facilitating the operation of relevant personnel.

[0009] Preferably, a plurality of positioning frames are provided on the machine body, and the plurality of positioning frames are respectively located on both sides of the conveyor belt along its width direction, and all of the positioning frames are located on the same side of the reflectivity detection element along the length direction of the conveyor belt, and one end of each of the positioning frames close to the reflectivity detection element is inclined toward the other side of the conveyor belt along its width direction.

[0010] By adopting the above technical solution, the positioning frame is set up so that the positioning frame can abut against the end of the wafer through its own side wall during the conveying process of the conveyor belt, so that the wafer can slide relative to the positioning frame and approach the middle position of the conveyor belt along its own width direction. Finally, under the action of the positioning frames on both sides, the wafer is located in the middle position of the conveyor belt along its own width direction, thereby realizing the positioning of the wafer, ensuring the position of the wafer, reducing the probability of the wafer shifting, and ensuring the detection effect of the wafer.

[0011] Preferably, one end of each of the positioning frames away from the reflectivity detection element is rotatably connected to the machine body, and a driving mechanism is further provided on the machine body, and the driving mechanism is used to drive each of the positioning frames to rotate.

[0012] By adopting the above-mentioned technical solution, the driving mechanism is set up so that the driving mechanism can drive the positioning frame to rotate, thereby adjusting the size of the space between the positioning frames on both sides of the conveyor belt, thereby changing the size of the space for the wafer to pass through, so as to accommodate wafers of different sizes, effectively increasing the scope of application and practicality of the present application.

[0013] Preferably, the driving mechanism includes a driving assembly, a sliding frame and a plurality of transmission frames. The sliding frame is slidably connected to the machine body, the sliding direction of the sliding frame is the length direction of the conveyor belt, the transmission frame corresponds to the positioning frame one by one, one end of each of the transmission frames is rotatably connected to the sliding frame, and the other end passes through the corresponding positioning frame and is slidably connected to the corresponding positioning frame, and the driving assembly is used to drive the sliding frame to slide along its own sliding direction.

[0014] By adopting the above technical solution and specifically arranging the driving mechanism, the driving assembly can slide by driving the sliding frame, so that the sliding frame drives each transmission frame to move, so that each transmission frame drives the corresponding positioning frame to rotate, thereby driving each positioning frame; and the existence of the sliding frame and the transmission frame makes the rotation directions of the positioning frames on both sides of the conveyor belt along its own width direction opposite, so that the space between the relative positioning frames close to one end of the reflectivity detection element is still located in the middle position of the conveyor belt along its own width direction, thereby ensuring the positioning effect after the positioning frame is rotated.

[0015] Preferably, the driving assembly includes a driving member and a transmission screw, the transmission screw is rotatably connected to the machine body, the axial direction of the transmission screw is the length direction of the conveyor belt, one end of the transmission screw passes through the sliding frame and is threadedly connected to the sliding frame, and the driving member is used to drive the transmission screw to rotate.

[0016] By adopting the above technical solution and the specific setting of the driving assembly, the transmission screw can rotate under the drive of the driving member, so that the transmission screw drives the sliding frame to slide, thereby driving the sliding frame; at the same time, the existence of the transmission screw also enables relevant personnel to control the number of rotations of the transmission screw through the driving member, thereby accurately controlling the sliding amount of the sliding frame, and further realizing accurate control of the rotation angle of the positioning frame.

[0017] Preferably, an elastic pad is provided on a side wall of each positioning frame away from the reflectivity detection element.

[0018] By adopting the above technical solution and setting the elastic member, the positioning frame can contact the end of the wafer through the elastic pad, thereby reducing the probability of the wafer being damaged due to direct contact between the end of the wafer and the positioning frame, thereby protecting the wafer.

[0019] Preferably, an adjustment frame and an adjustment component are also provided on the body, the adjustment frame is slidably connected to the body, the sliding direction of the adjustment frame is the height direction of the body, the adjustment component is used to drive the adjustment frame to slide along its own sliding direction, and the reflectivity detection component is installed on the adjustment frame.

[0020] By adopting the above-mentioned technical solution, the setting of the adjustment frame and the adjustment component enables relevant personnel to control the lifting and lowering of the adjustment frame through the adjustment component, thereby controlling the height of the reflectivity detection component on the adjustment frame, and realizing the adjustment of the height of the reflectivity detection component to adapt to wafers of various specifications, thereby increasing the scope of application and practicality of the present application.

[0021] Preferably, a guide rod is further provided on the machine body, the axial direction of the guide rod is the sliding direction of the adjustment frame, and one end of the guide rod passes through the adjustment frame and is slidably connected to the adjustment frame.

[0022] By adopting the above technical solution, the guide rod is set so that the guide rod can guide the sliding of the adjustment frame, thereby effectively increasing the stability of the adjustment frame when sliding; at the same time, the existence of the guide rod can also effectively reduce the wear between the adjustment frame and the machine body, thereby further ensuring the stability of the adjustment frame when sliding.

[0023] In summary, the present application includes at least one of the following beneficial technical effects:

[0024] 1. The arrangement of the conveyor belt and the position detection element enables the produced wafers to be directly put on the conveyor belt in the process of producing wafers. The position of the wafer to be detected on the conveyor belt is detected by the position detection element to ensure the accuracy of the wafer position. The conveyor belt can also transfer the detected wafers to the subsequent process, replacing the manual replacement of wafers, effectively reducing the time for replacing the wafers to be detected, thereby increasing the efficiency of wafer detection and facilitating the operation of relevant personnel;

[0025] 2. The positioning frame is set so that during the conveying process of the conveyor belt, the positioning frame can abut against the end of the wafer through its side wall, so that the wafer slides to the middle position of the conveyor belt along its width direction, thereby realizing the positioning of the wafer, ensuring the position of the wafer, reducing the probability of wafer deviation, and ensuring the detection effect of the wafer;

[0026] 3. The setting of the adjustment frame and the adjustment component enables relevant personnel to control the lifting and lowering of the adjustment frame through the adjustment component, thereby controlling the height of the reflectivity detection component on the adjustment frame, and adjusting the height of the reflectivity detection component to adapt to wafers of various specifications, thereby increasing the scope of application and practicality of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1It is a schematic diagram of the overall device for measuring the light reflectivity of the back side of a wafer in an embodiment of the present application.

[0028] Figure 2 It is a schematic diagram of the structure of the reflectivity detection element in the embodiment of the present application.

[0029] Figure 3 It is a structural schematic diagram used to reflect the driving mechanism in the embodiment of the present application.

[0030] Explanation of the accompanying drawings: 1. Body; 2. Detection mechanism; 21. Reflectivity detection element; 211. Integrating sphere; 212. Laser; 213. Photoelectric detector; 22. Control element; 23. Position detection element; 3. Conveyor belt; 4. Adjustment frame; 5. Adjustment assembly; 51. Adjustment motor; 52. Adjustment screw; 53. Guide rod; 6. Positioning frame; 61. Elastic pad; 7. Driving mechanism; 71. Driving assembly; 711. Driving element; 712. Transmission screw; 72. Sliding frame; 73. Transmission frame. DETAILED DESCRIPTION

[0031] The following is combined with Figure 1-3 This application is described in further detail.

[0032] The present application embodiment discloses a device for measuring the light reflectivity of the back side of a wafer. Figure 1 and Figure 2 The wafer backside light reflectivity measuring device comprises a body 1, on which a detection mechanism 2 is also provided, and the detection mechanism 2 comprises a reflectivity detection element 21 and a control element 22. A conveyor belt 3 is also provided on the body 1, and the conveyor belt 3 is located directly below the reflectivity detection element 21. The detection mechanism 2 also comprises a position detection element 23, and the position detection element 23 is used to detect whether the wafer on the conveyor belt 3 is located directly below the reflectivity detection element 21. The position detection element 23 and the conveyor belt 3 are both controlled by the control element 22, and the control element 22 is used to control the opening and closing of the conveyor belt 3 based on the data detected by the position detection element 23.

[0033] Reference Figure 1 and Figure 2 The machine body 1 is also provided with an adjustment frame 4 and an adjustment assembly 5. One end of the adjustment frame 4 is embedded in the machine body 1 and is slidably connected to the machine body 1. The sliding direction of the adjustment frame 4 is the height direction of the machine body 1. The adjustment assembly 5 includes an adjustment motor 51 and an adjustment screw 52. In the embodiment of the present application, the adjustment motor 51 is a servo motor, and a brake device is also provided on the adjustment motor 51 to lock the output shaft of the adjustment motor 51 when the adjustment motor 51 stops rotating. The brake device is a prior art, so it is not described here.

[0034] Reference Figure 1 and Figure 2The adjusting motor 51 is fixedly installed on the top of the machine body 1 by bolts, and the output shaft of the adjusting motor 51 is vertically arranged downward and fixedly connected to the top of the adjusting screw 52 through a coupling. Both ends of the adjusting screw 52 are rotatably connected to the machine body 1 through bearings, and the bottom end of the adjusting screw 52 extends downward, passes through the adjusting frame 4, and is threadedly connected to the adjusting frame 4. The setting of the adjusting screw 52 enables relevant personnel to accurately control the height of the adjusting frame 4.

[0035] Reference Figure 1 and Figure 2 The machine body 1 is also provided with a guide rod 53, which is arranged parallel to the adjusting screw rod 52, and both ends of the guide rod 53 are fixedly connected to the machine body 1. One end of the guide rod 53 passes through the adjusting frame 4 and is slidably connected to the adjusting frame 4, so that the guide rod 53 can guide the sliding of the adjusting frame 4.

[0036] Reference Figure 1 and Figure 2 The reflectivity detection element 21 includes an integrating sphere 211, a laser 212 and a photodetector 213. The integrating sphere 211 is fixedly mounted on the bottom end of the adjustment frame 4, and the window hole on the bottom end of the integrating sphere 211 is vertically downwardly arranged. The laser 212 and the photodetector 213 are both fixedly mounted on the surface of the top end of the integrating sphere 211. The angle between the axis of the laser 212 and the axis of the photodetector 213 is less than or equal to 5 degrees. In the embodiment of the present application, the angle is 5 degrees to reduce the probability of the reflected light of the wafer under test damaging the device.

[0037] Reference Figure 1 and Figure 2 In the embodiment of the present application, the laser 212 is configured as a laser diode, the photodetector 213 is a photodiode, the control unit 22 is a PLC controller, and the control unit 22 is fixedly mounted on the machine body 1. The laser 212 and the photodetector 213 are both electrically connected to the control unit 22. The laser 212 is used to emit laser light vertically downward. The emitted laser light passes through the integrating sphere 211 and directly hits the wafer directly below. The light reflected from the back of the wafer passes into the integrating sphere 211 and enters the photodetector 213 after multiple reflections in the integrating sphere 211.

[0038] Reference Figure 1 and Figure 2 The photodetector 213 is used to convert the received optical signal into an electrical signal and feed the electrical signal back to the control unit 22. The control unit 22 is used to receive the electrical signal and perform calculations based on the electrical signal and other data stored in the control unit 22 to calculate the light reflectivity of the back side of the wafer being inspected.

[0039] Reference Figure 1The conveyor belt 3 is installed on the machine body 1 and is located directly below the adjustment frame 4. The conveying direction of the conveyor belt 3 is the length direction of the machine body 1. The conveyor belt 3 is used to place and convey wafers. The motor driving the roller in the conveyor belt 3 is electrically connected to the control component 22. In the embodiment of the present application, the position detection component 23 is an infrared ranging sensor, and the position detection component 23 is electrically connected to the control component 22.

[0040] Reference Figure 1 and Figure 2 The position detection member 23 is fixedly mounted on the side of the machine body 1 along its width direction and away from the adjustment frame 4, and the extension line of the infrared ray used for detection by the position detection member 23 intersects with the extension line of the laser ray emitted by the laser 212. The position detection member 23 is used to detect the distance value between the infrared ray emitted by itself and the first contact object, and feed the distance value back to the control member 22.

[0041] Reference Figure 1 and Figure 2 , a preset value is pre-stored in the control component 22, which is the distance value between the position detection component 23 and the end of the wafer directly below the integrating sphere 211 on the conveyor belt 3. The control component 22 is used to compare the distance value detected by the position detection component 23 with the preset value. When the detected distance value is less than or equal to the preset value, the control component 22 determines that the wafer has reached a predetermined position. At this time, the control component 22 controls the motor on the conveyor belt 3 to stop, controls the position detection component 23 to stop detection, and controls the reflectivity detection component 21 to start detection. When the detection is completed, the control component 22 controls the reflectivity detection component 21 to stop detection, controls the position detection component 23 to start detection, and controls the conveyor belt 3 to continue to operate.

[0042] Reference Figure 1 , the machine body 1 is also provided with a plurality of positioning frames 6. In the embodiment of the present application, the number of positioning frames 6 is set to two, and they are respectively located on both sides of the conveyor belt 3 along its width direction. Each positioning frame 6 is located on the same side of the adjustment frame 4 along the length direction of the conveyor belt 3. The end of each positioning frame 6 close to the adjustment frame 4 is tilted toward the middle position of the conveyor belt 3 along its width direction, and the spacing between the ends of the two positioning frames 6 close to the adjustment frame 4 is just large enough for the wafer to pass through.

[0043] Reference Figure 1 and Figure 3 On the side wall of each positioning frame 6 away from the adjusting frame 4, an elastic pad 61 is provided. In the embodiment of the present application, the elastic pad 61 is made of rubber material and is fixedly connected to the corresponding adjusting frame 4 by gluing.

[0044] Reference Figure 1 and Figure 3During the process of conveying the wafer by the conveyor belt 3, the deviated wafer contacts the elastic pad 61 on the positioning frame 6. Since the positioning frame 6 is tilted, after contacting the elastic pad 61, the wafer will slide in the width direction of the conveyor belt 3 while being driven by the conveyor belt 3, so that the position of the wafer is adjusted in the width direction of the conveyor belt 3. When the wafer is located in the middle position of the conveyor belt 3 in the width direction, the wafer passes through the gap between the adjustment frames 4.

[0045] Reference Figure 1 and Figure 3 Each positioning frame 6 extends downward from one end of the adjusting frame 4 and extends into the machine body 1, and is rotatably connected to the machine body 1 through a bearing. A driving mechanism 7 is also provided in the machine body 1, and the driving mechanism 7 includes a driving assembly 71, a sliding frame 72 and a plurality of transmission frames 73, and the driving assembly 71 includes a driving member 711 and a transmission screw 712.

[0046] Reference Figure 1 and Figure 3 In the embodiment of the present application, the driving member 711 is configured as a servo motor, and the driving member 711 is fixedly installed in the machine body 1 by bolts. The driving member 711 is also provided with a brake device, so that the output shaft of the driving member 711 is locked when the driving member 711 stops rotating. The brake device is a prior art, so it will not be described here.

[0047] Reference Figure 1 and Figure 3 , the axial direction of the output shaft of the driving member 711 is the length direction of the machine body 1, and the output shaft of the driving member 711 is fixedly connected to one end of the transmission screw 712 through a coupling. Both ends of the transmission screw 712 are rotationally connected to the machine body 1 through bearings, and one end of the transmission screw 712 passes through the sliding frame 72 and is threadedly connected to the sliding frame 72. The sliding frame 72 is slidably connected to the machine body 1 through a slide rail, and the sliding direction of the sliding frame 72 is the length direction of the machine body 1.

[0048] Reference Figure 1 and Figure 3 The number of transmission frames 73 is set to two, and they are arranged one by one with the positioning frames 6. One end of each transmission frame 73 is rotatably connected to the sliding frame 72 through a pin shaft, and the other end of each transmission frame 73 passes through the corresponding positioning frame 6 and extends to one end in the body 1, and is slidably connected to the corresponding positioning frame 6.

[0049] Reference Figure 1 and Figure 3When the gap between the two positioning frames 6 near the adjustment frame 4 needs to be adjusted, the driving member 711 drives the transmission screw 712 to rotate, and the rotation of the transmission screw 712 drives the sliding frame 72 to slide. The sliding of the sliding frame 72 drives the two transmission frames 73 to move, so that the transmission frame 73 drives the corresponding positioning frame 6 to rotate. In this process, the transmission frame 73 slides relative to the positioning frame 6.

[0050] The implementation principle of the device for measuring the light reflectivity of the back side of a wafer in the embodiment of the present application is as follows: when in use, the conveyor belt 3 conveys the wafer to be tested, and after being positioned by the positioning frame 6, the wafer moves to the position directly below the integrating sphere 211, and the conveyor belt 3 stops at this time. Then, the reflectivity detection component 21 detects the light reflectivity of the back side of the wafer, and feeds back the detected data to the control component 22. After the control component 22 calculates the specific light reflectivity, the detection is completed. At this time, the conveyor belt 3 starts to continue to convey, and conveys the wafer that has been tested to the next process.

[0051] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer backside light reflectivity measuring device, comprising a body (1), the body (1) further being provided with a detection mechanism (2), the detection mechanism (2) comprising a reflectivity detection element (21) and a control element (22), characterized in that: The machine body (1) is also provided with a conveyor belt (3), and the conveyor belt (3) is located directly below the reflectivity detection element (21). The detection mechanism (2) also includes a position detection element (23), and the position detection element (23) is used to detect whether the wafer on the conveyor belt (3) is located directly below the reflectivity detection element (21). The position detection element (23) and the conveyor belt (3) are both controlled by the control element (22), and the control element (22) is used to control the opening and closing of the conveyor belt (3) based on the data detected by the position detection element (23).

2. The device for measuring the light reflectivity of a wafer back surface according to claim 1, characterized in that: The machine body (1) is also provided with a plurality of positioning frames (6), which are respectively located on both sides of the conveyor belt (3) along its width direction, and are all located on the same side of the reflectivity detection element (21) along the length direction of the conveyor belt (3), and one end of each positioning frame (6) close to the reflectivity detection element (21) is inclined toward the other side of the conveyor belt (3) along its width direction.

3. The device for measuring the light reflectivity of a wafer back surface according to claim 2, characterized in that: One end of each positioning frame (6) away from the reflectivity detection element (21) is rotatably connected to the machine body (1), and a driving mechanism (7) is also provided on the machine body (1), and the driving mechanism (7) is used to drive each positioning frame (6) to rotate.

4. The device for measuring the light reflectivity of a wafer back surface according to claim 3, characterized in that: The driving mechanism (7) comprises a driving assembly (71), a sliding frame (72) and a plurality of transmission frames (73); the sliding frame (72) is slidably connected to the machine body (1); the sliding direction of the sliding frame (72) is the length direction of the conveyor belt (3); the transmission frames (73) correspond to the positioning frames (6) one by one; one end of each of the transmission frames (73) is rotatably connected to the sliding frame (72); the other end passes through the corresponding positioning frame (6) and is slidably connected to the corresponding positioning frame (6); the driving assembly (71) is used to drive the sliding frame (72) to slide along its own sliding direction.

5. The device for measuring the light reflectivity of a wafer back surface according to claim 4, characterized in that: The driving assembly (71) comprises a driving member (711) and a transmission screw (712); the transmission screw (712) is rotatably connected to the machine body (1); the axial direction of the transmission screw (712) is the length direction of the conveyor belt (3); one end of the transmission screw (712) passes through the sliding frame (72) and is threadedly connected to the sliding frame (72); the driving member (711) is used to drive the transmission screw (712) to rotate.

6. The wafer backside light reflectivity measuring device according to claim 2, characterized in that: An elastic pad (61) is provided on a side wall of each positioning frame (6) away from the reflectivity detection element (21).

7. The device for measuring the light reflectivity of a wafer back surface according to claim 1, characterized in that: The machine body (1) is also provided with an adjustment frame (4) and an adjustment assembly (5); the adjustment frame (4) is slidably connected to the machine body (1); the sliding direction of the adjustment frame (4) is the height direction of the machine body (1); the adjustment assembly (5) is used to drive the adjustment frame (4) to slide along its own sliding direction; and the reflectivity detection element (21) is mounted on the adjustment frame (4).

8. The device for measuring the light reflectivity of the back side of a wafer according to claim 7, characterized in that: The machine body (1) is also provided with a guide rod (53), the axial direction of the guide rod (53) being the sliding direction of the adjustment frame (4), and one end of the guide rod (53) passing through the adjustment frame (4) and being slidably connected to the adjustment frame (4).

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