Wafer pre-alignment device

Abstract

The utility model discloses a wafer pre-alignment device, which comprises a rack, a first supporting piece, a first driving assembly, a second supporting piece, a second driving assembly, an adsorption mechanism, a third driving assembly, a sensing system and a controller, and is characterized in that the sensing system comprises a first sensing assembly, a second sensing assembly and a third sensing assembly; the first sensing assembly is used for detecting the distance between the first sensing assembly and the first light receiving part, the second sensing assembly is used for detecting the distance between the second sensing assembly and the second light receiving part, and the third sensing assembly is used for detecting edge information of a wafer. According to the utility model, through cooperation of the first sensing assembly, the second sensing assembly and the third sensing assembly, circle center positioning and notch orientation of the wafer can be realized by using multiple groups of sensing assemblies, and the pre-alignment device has the advantages of high pre-alignment precision and high pre-alignment efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing equipment, in particular to a wafer pre-alignment device. Background Art

[0002] Since the field of view of the lithography machine is very small, the wafer must be pre-aligned before it is transferred to the lithography machine for exposure, so that the mark of the wafer transferred to the exposure table is within the field of view of the lithography machine. The wafer pre-alignment device is used to pre-align the wafer. The pre-alignment process generally makes the center of the wafer (center) within a certain range, and the notch of the wafer stays at a specified angle, that is, it includes two main processes: center positioning and notch orientation. At present, the wafer pre-alignment device only uses a set of sensor components to realize the center positioning and notch orientation of the wafer, which has the disadvantages of low pre-alignment accuracy and low pre-alignment efficiency. Utility Model Content

[0003] The utility model aims to provide a wafer pre-alignment device, which can realize the center positioning and notch orientation of the wafer by using multiple sets of sensor components, and has the advantages of high pre-alignment accuracy and high pre-alignment efficiency.

[0004] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0005] A wafer pre-alignment device, comprising:

[0006] frame;

[0007] A first support member is disposed on the frame, wherein the first support member is slidably connected to the frame, and the sliding direction is a first direction;

[0008] A first driving assembly, used for driving the first supporting member to move along the first direction;

[0009] A second support member is disposed on the first support member, the second support member is slidably connected to the first support member, and the sliding direction of the second support member is a second direction;

[0010] A second driving assembly, used for driving the second supporting member to move along the second direction;

[0011] The adsorption mechanism comprises an adsorption plate and a support seat, wherein the support seat is arranged on the second support member, a negative pressure cavity is arranged in the support seat, the adsorption plate is rotatably connected to the support seat, and a negative pressure hole communicating with the negative pressure cavity is arranged on the adsorption plate;

[0012] A third driving assembly, used for driving the adsorption plate to rotate on the supporting seat;

[0013] The sensing system comprises a first sensing component, a second sensing component and a third sensing component, wherein the first sensing component is arranged on the supporting seat, a first light receiving element adapted to the first sensing component is arranged on the frame, the first sensing component is used to detect the distance between the first sensing component and the first light receiving element, a line between the first sensing component and the first light receiving element is parallel to the first direction, the second sensing component is arranged on the supporting seat, a second light receiving element adapted to the second sensing component is arranged on the frame, a line between the second sensing component and the second light receiving element is parallel to the second direction, the second sensing component is used to detect the distance between the second light receiving element, and the third sensing component is arranged on the frame and located at one side of the adsorption mechanism, and is used to detect edge information of a wafer;

[0014] The controller is configured to control the first driving component, the second driving component, and the third driving component to adjust the position and orientation of the wafer based on the data information collected by the first sensing component, the second sensing component, and the third sensing component.

[0015] Preferably, the first direction and the second direction are perpendicular to each other.

[0016] Preferably, a line connecting the first sensor assembly and the center of the support base and a line connecting the second sensor assembly and the center of the support base form an angle of 90°.

[0017] Preferably, the first sensing component includes a first transmitting unit and a first receiving unit, and the first receiving unit is used to receive the light beam that is emitted by the first transmitting unit and then reflected by the first light receiving element.

[0018] Preferably, the second sensing component includes a second transmitting unit and a second receiving unit, and the second receiving unit is used to receive the light beam that is emitted by the second transmitting unit and then reflected by the second light receiving element.

[0019] Preferably, the first transmitting unit is a ToF sensor.

[0020] Preferably, the second transmitting unit is a ToF sensor.

[0021] Preferably, a seal is provided between the adsorption plate and the support seat.

[0022] Preferably, the third driving assembly includes a gear ring, a driving gear, and a third driving motor, the gear ring is coaxially arranged outside the adsorption plate, the driving gear is connected to the output shaft of the third driving motor, and the driving gear is meshed with the gear ring.

[0023] Compared with the prior art, the above technical solution has the following beneficial technical effects: the third sensing component detects the depth information and / or image information of the wafer as a whole, and sends the identified information to the controller, the controller calculates the distance that the wafer needs to move in the first direction and the distance that the wafer needs to move in the second direction, so as to adjust the center position of the wafer using the first drive component and the second drive component, and the controller calculates the angle that the notch of the wafer needs to rotate, so as to adjust the orientation of the notch of the wafer using the third drive component. After the calculation is completed, the controller controls the first drive component, the second drive component, and the third drive component to work simultaneously or separately to achieve the center positioning and notch orientation of the wafer. Wherein, in the process of center positioning, the first drive component and / or the second drive component respectively control the wafer to move in the first direction and / or the second direction, and in the process of movement, the first sensor component and / or the second sensor component detects the adjusted distance in real time, thereby improving the accuracy and efficiency of pre-alignment. During the adjustment process, the third sensor component performs synchronous real-time detection to determine whether the wafer is adjusted according to the preset adjustment method, and after the adjustment work is completed, the third sensor component can also detect the center position and notch orientation of the wafer to determine whether the center position and notch orientation of the wafer meet the process requirements. In summary, through the cooperation of the first sensor component, the second sensor component and the third sensor component, the center positioning and notch orientation of the wafer are achieved, which has the advantages of high pre-alignment accuracy and high efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only embodiments of the utility model. For those skilled in the art, other drawings can be obtained based on the provided drawings without paying any creative work.

[0025] Figure 1 It is a schematic diagram of the structure of a wafer pre-alignment device.

[0026] Figure 2 It is a schematic diagram of the structure of the first drive component.

[0027] Figure 3 It is a schematic diagram of the structure of the second drive component.

[0028] Figure 4 It is a structural schematic diagram showing the adsorption mechanism.

[0029] Figure 5 It is a cross-sectional view showing the adsorption mechanism.

[0030] Figure 6 It is a schematic diagram showing a mobile port.

[0031] Figure 7 is a schematic diagram embodying a first sensor component and a second sensor component.

[0032] Description of reference numerals: 101, bottom plate; 102, support rod; 103, top plate; 1031, moving port; 104, first light receiving element; 105, second light receiving element; 2, first support member; 301, first drive motor; 302, first feed screw; 303, first feed block; 4, second support member; 501, second drive motor; 502, second feed screw; 503, second feed block; 601, adsorption Disk; 6011, negative pressure groove; 6012, negative pressure hole; 6013, mounting protrusion; 602, support seat; 6021, negative pressure chamber; 6022, ventilation pipe; 6023, mounting ring groove; 603, rotating bearing; 604, sealing element; 701, gear ring; 702, driving gear; 703, third driving motor; 801, first sensor assembly; 802, second sensor assembly; 803, third sensor assembly. DETAILED DESCRIPTION

[0033] The utility model discloses a wafer pre-alignment device, which can realize the center positioning and notch orientation of the wafer by using multiple groups of sensor components, and has the advantages of high pre-alignment accuracy and high pre-alignment efficiency.

[0034] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0035] In this embodiment, refer to Figure 1 The wafer pre-alignment device of the utility model includes a frame, a first support member 2, a first driving component, a second support member 4, a second driving component, an adsorption mechanism, a third driving component, a sensor system, and a controller.

[0036] See also Figure 1 In this embodiment, the frame includes a bottom plate 101, a support rod 102, and a top plate 103. The bottom plate 101 is installed on the ground or other working planes by bolts, the support rod 102 is fixedly connected to the bottom plate 101, the top plate 103 is located above the bottom plate 101, the top plate 103 and the bottom plate 101 are parallel to each other, the support rod 102 is fixedly connected between the top plate 103 and the bottom plate 101, and a plurality of support rods 102 are connected between the top plate 103 and the bottom plate 101.

[0037] See also Figure 1In this embodiment, the first support member 2 is plate-shaped and is disposed on the frame. Specifically, the first support member 2 is disposed between the bottom plate 101 and the top plate 103, and the first support member 2 is disposed parallel to the bottom plate 101. A sliding assembly (not shown in the figure) is provided between the first support member 2 and the bottom plate 101, so that the first support member 2 is slidably connected to the bottom plate 101, and the sliding direction is a first direction.

[0038] See also Figure 1 In this embodiment, a plurality of sliding assemblies are provided between the bottom plate 101 and the first support member 2. The sliding assemblies include sliding blocks and sliding guide rails. The sliding blocks are connected to a side of the first support member 2 facing the bottom plate 101. The sliding guide rails are connected to a side of the bottom plate 101 facing the first support member 2. The sliding blocks and the sliding guide rails are slidably matched. In other embodiments, the sliding blocks may be connected to the bottom plate 101, and the sliding guide rails may be connected to the first support member 2.

[0039] See also Figure 1 and Figure 2 In this embodiment, the first driving assembly is used to drive the first support member 2 to move along the first direction. The first driving assembly includes a first driving motor 301, a first feed screw 302, and a first feed block 303. The first driving motor 301 is connected to the base plate 101, and the first feed screw 302 is coaxially connected to the output shaft of the first driving motor 301, and the axial direction of the first feed screw 302 is parallel to the first direction. The first feed block 303 is fixedly connected to the side of the first support member 2 facing the base plate 101, and a feed through hole is provided on the first feed block 303, and the axial direction of the feed through hole is parallel to the first direction. The first feed screw 302 passes through the feed through hole, and an internal thread is provided on the inner side wall of the feed through hole, and the first feed screw 302 and the feed through hole are threadedly matched.

[0040] After the first drive motor 301 is started, it drives the first feed screw 302 to rotate, and the first feed screw 302 and the first feed block 303 are threadedly engaged, so that the first support member 2 moves in the first direction. At the same time, the direction of movement can be controlled by the forward and reverse rotation of the first drive motor 301.

[0041] See also Figure 1 In this embodiment, the second support member 4 is plate-shaped, and the second support member 4 is disposed on the first support member 2, and the second support member 4 is located between the first support member 2 and the top plate 103. A sliding assembly (not shown in the figure) is provided between the second support member 4 and the first support member 2, so that the second support member 4 is slidably connected to the first support member 2, and the sliding direction of the second support member 4 is the second direction.

[0042] See also Figure 1In this embodiment, a plurality of sliding assemblies are provided between the first support member 2 and the second support member 4. The sliding assemblies include sliding blocks and sliding guide rails. The sliding blocks are connected to a side of the first support member 2 facing the second support member 4. The sliding guide rails are connected to a side of the second support member 4 facing the first support member 2. The sliding blocks and the sliding guide rails are slidably matched. In other embodiments, the sliding blocks may be connected to the second support member 4, and the sliding guide rails may be connected to the first support member 2.

[0043] See also Figure 1 and Figure 3 In this embodiment, the second drive assembly is used to drive the second support member 4 to move along the second direction. The second drive assembly includes a second drive motor 501, a second feed screw 502, and a second feed block 503. The second drive motor 501 is connected to the first support member 2, and the second feed screw 502 is coaxially connected to the output shaft of the second drive motor 501, and the axial direction of the second feed screw 502 is parallel to the second direction. The second feed block 503 is fixedly connected to the side of the second support member 4 facing the first support member 2, and a through hole is provided on the second feed block 503, and the axial direction of the through hole is parallel to the second direction. The second feed screw 502 passes through the through hole, and an internal thread is provided on the inner side wall of the through hole, and the second feed screw 502 is threadedly matched with the through hole.

[0044] After the second drive motor 501 is started, it drives the second feed screw 502 to rotate, and the second feed screw 502 and the second feed block 503 are threadedly engaged, so that the second support member 4 moves in the second direction. At the same time, the direction of movement can be controlled by the forward and reverse rotation of the second drive motor 501.

[0045] See also Figure 4 In this embodiment, the first direction and the second direction are perpendicular to each other. A moving opening 1031 is provided on the top plate 103, the length direction of the moving opening 1031 is parallel to the first direction, and the width direction of the moving opening 1031 is parallel to the second direction.

[0046] See also Figure 5 and Figure 6 In this embodiment, the adsorption mechanism includes an adsorption plate 601 and a support seat 602. The support seat 602 is connected to the second support member 4. The adsorption plate 601 is arranged in the moving port 1031. The diameter of the adsorption plate 601 is smaller than the distance in the length direction of the moving port 1031 and smaller than the distance in the width direction of the moving port 1031.

[0047] See also Figure 5 and Figure 6In this embodiment, a negative pressure chamber 6021 is provided in the support seat 602, and a vent pipe 6022 is connected to the side wall of the support seat 602, and the vent pipe 6022 is communicated with the negative pressure chamber 6021. A negative pressure groove 6011 is provided on the side of the adsorption plate 601 facing the support seat 602, and a negative pressure hole 6012 communicating with the negative pressure groove 6011 is provided on the side of the adsorption plate 601 away from the support seat 602, and there are a plurality of negative pressure holes 6012. When the adsorption plate 601 is connected to the support seat 602, the negative pressure groove 6011 is docked with the negative pressure chamber 6021, so that the negative pressure hole 6012 is communicated with the negative pressure chamber 6021. The side of the adsorption plate 601 away from the support seat 602 is higher than the side of the top plate 103 away from the bottom plate 101.

[0048] See also Figure 5 and Figure 6 In the present embodiment, a mounting groove 6023 is provided on the side of the support seat 602 facing the adsorption plate 601, and a rotating bearing 603 is provided in the mounting groove 6023. The inner side wall of the rotating bearing 603 is fitted to the inner wall of the mounting groove 6023 close to the center of the support seat 602, and there is a mounting gap between the outer side wall of the rotating bearing 603 and the inner wall of the mounting groove 6023 away from the center of the support seat 602. A mounting protrusion 6013 is provided on the side of the adsorption plate 601 facing the support seat 602. The mounting protrusion 6013 is annular and is inserted into the mounting gap so that the inner side wall of the mounting protrusion 6013 is connected to the outer wall of the rotating bearing 603, so that the adsorption plate 601 is rotatably connected to the support seat 602.

[0049] See also Figure 5 and Figure 6 In order to improve the airtightness between the adsorption disk 601 and the support seat 602, in the present embodiment, a seal 604 is provided between the adsorption disk 601 and the support seat 602. The seal 604 is an annular sealing ring. A first annular sealing groove is provided on the side of the adsorption disk 601 facing the support seat 602, and a second annular sealing groove is provided on the side of the support seat 602 facing the adsorption disk 601. The seal 604 is pressed between the first sealing groove and the second sealing groove.

[0050] See also Figure 5 and Figure 6 In this embodiment, the third driving component is used to drive the adsorption plate 601 to rotate on the support seat 602. The third driving component includes a gear ring 701, a driving gear 702, and a third driving motor 703. The third driving motor 703 is connected to the outer wall of the support seat 602. The gear ring 701 is coaxially sleeved outside the adsorption plate 601. The driving gear 702 is connected to the output shaft of the third driving motor 703, and the driving gear 702 is meshed with the gear ring 701.

[0051] See also Figure 1 and Figure 5 In this embodiment, the sensing system includes a first sensing component 801, a second sensing component 802, and a third sensing component 803. The first sensing component 801 is used to detect the position of the wafer in the first direction, the second sensing component 802 is used to detect the position of the wafer in the second direction, and the third sensing component 803 is used to detect the position and edge information of the entire wafer.

[0052] See also Figure 1 and Figure 7 In this embodiment, the first sensor component 801 is arranged on the support base 602, and the frame is provided with a first light receiving element 104 adapted to the first sensor component 801. The first sensor component 801 is used to detect the distance between the first light receiving element 104, and the connection line between the first sensor component 801 and the first light receiving element 104 is parallel to the first direction.

[0053] See also Figure 1 and Figure 7 In this embodiment, the first sensing component 801 includes a first transmitting unit and a first receiving unit, wherein the first transmitting unit is a ToF (Time of Flight) sensor. The first receiving unit is used to receive the light beam reflected after the first transmitting unit transmits to the first light receiving element 104. When setting, the first light receiving element 104 is fixed on the frame, and the length of the first light receiving element 104 is greater than the moving distance of the adsorption mechanism in the second direction, so that the first light receiving element 104 is always located within the detection range of the first transmitting unit during the movement of the support seat 602 along the first direction and / or the second direction.

[0054] When working, the first reflecting unit emits a light beam, which is reflected when reaching the first light receiving element 104. The reflected light beam is received by the first receiving unit, and the distance between the first sensing component 801 and the first light receiving element 104 is calculated by the time it takes for the light beam to return, thereby indirectly calculating the distance the wafer is adjusted in the first direction.

[0055] See also Figure 1 and Figure 7 It should be noted that the first sensor component 801 also includes a circuit board, and the first transmitting unit and the first receiving unit are electrically connected to the circuit board respectively. The connection between the first transmitting unit, the first receiving unit and the circuit board and the signal conversion principle belong to the prior art and are not described here. When working, the circuit board can provide current to the first transmitting unit, and the first transmitting unit converts the current into an optical signal after being stimulated. The optical signal is received by the first receiving unit after reflection. At this time, the circuit board can convert the optical signal into an electrical signal to realize the conversion of the optical signal into point cloud data with depth information.

[0056] See also Figure 1 and Figure 7 In this embodiment, the second sensor component 802 is arranged on the support base 602, and the frame is provided with a second light receiving element 105 adapted to the second sensor component 802. The connecting line between the second sensor component 802 and the second light receiving element 105 is parallel to the second direction, and the second sensor component 802 is used to detect the distance between itself and the second light receiving element 105.

[0057] See also Figure 1 and Figure 7 In this embodiment, the second sensing component 802 includes a second transmitting unit and a second receiving unit, wherein the second transmitting unit is a ToF sensor. The second receiving unit is used to receive the light beam reflected after the second transmitting unit transmits to the second light receiving element 105. When setting, the second light receiving element 105 is fixed on the frame, and the length of the second light receiving element 105 is greater than the moving distance of the adsorption mechanism in the first direction, so that the second light receiving element 105 is always located within the detection range of the second transmitting unit during the movement of the support seat 602 along the first direction and / or the second direction.

[0058] When working, the second reflecting unit emits a light beam, which is reflected when reaching the second light receiving element 105. The reflected light beam is received by the second receiving unit, and the distance between the second sensing component 802 and the second light receiving element 105 is calculated by the time it takes for the light beam to return, thereby indirectly calculating the distance the wafer is adjusted in the second direction.

[0059] See also Figure 1 and Figure 7 It should be noted that the second sensor component 802 also includes a circuit board, and the second transmitting unit and the second receiving unit are electrically connected to the circuit board respectively. The connection between the second transmitting unit, the second receiving unit and the circuit board and the signal conversion principle belong to the prior art and are not described here. When working, the circuit board can provide current to the second transmitting unit, and the second transmitting unit converts the current into an optical signal after being stimulated. The optical signal is received by the second receiving unit after being reflected. At this time, the circuit board can convert the optical signal into an electrical signal to realize the conversion of the optical signal into point cloud data with depth information.

[0060] See also Figure 1 and Figure 7 In this embodiment, the line connecting the first sensor assembly 801 and the center of the support base 602 and the line connecting the second sensor assembly 802 and the center of the support base 602 have an angle A, and the angle A is 90°. After such an arrangement, the relative position of the first sensor assembly 801 and the second sensor assembly 802 can be ensured, thereby improving the detection accuracy.

[0061] See also Figure 1In this embodiment, a mounting frame protruding from the top plate 103 is provided on the frame, and the third sensor assembly 803 is provided on the mounting frame. The third sensor assembly 803 is located on one side of the adsorption mechanism, and the transmitting end and / or the receiving end of the third sensor assembly 803 is provided above the adsorption plate 601. The third sensor is used to detect the edge information of the wafer. Since the third sensor assembly 803 is provided above the adsorption plate 601, when the wafer is placed on the adsorption plate 601, the entire wafer is located within the detection range of the third sensor assembly 803. Therefore, the third sensor assembly 803 can identify the edge information of the wafer as a whole.

[0062] The third sensing component 803 includes at least one of the following examples:

[0063] Example 1: The third sensor component 803 includes a third transmitting unit and a third receiving unit, and the third transmitting unit is a ToF sensor. The third receiving unit is used to receive the light beam reflected after the third transmitting unit transmits to the wafer. The depth information of the wafer is collected by the cooperation of the third transmitting unit and the third receiving unit, so as to realize the collection of the edge information of the wafer.

[0064] It should be noted that the third sensing component 803 in this example also includes a circuit board, and the third transmitting unit and the third receiving unit are electrically connected to the circuit board respectively. The connection between the third transmitting unit, the third receiving unit and the circuit board and the signal conversion principle belong to the prior art and are not described here. When working, the circuit board can provide current to the third transmitting unit, and the third transmitting unit converts the current into an optical signal after being stimulated. The optical signal is received by the third receiving unit after being reflected. At this time, the circuit board can convert the optical signal into an electrical signal to realize the conversion of the optical signal into point cloud data with depth information.

[0065] Example 2: The third sensing component 803 is an AI (Artificial Intelligence) camera, which directly obtains the image information of the wafer through the AI ​​camera, thereby realizing the collection of the wafer edge information.

[0066] Example 3: The third sensor component 803 is a binocular vision sensor, which obtains the depth information and image information of the wafer through the binocular vision sensor, thereby realizing the collection of wafer edge information. Specifically, the principle of measuring depth information by the binocular vision sensor is similar to that of the human eye. By calculating the parallax of the same object in space imaged by two cameras, the distance of the object from the camera can be calculated.

[0067] It should be noted that the third sensor component 803 in this example also includes a circuit board, and the binocular vision sensor is electrically connected to the circuit board. The connection between the binocular vision sensor and the circuit board and the calculation principle for obtaining depth information belong to the prior art and are not described in detail here. When working, the circuit board can calculate the image information collected by the binocular vision sensor to obtain the depth information of the wafer.

[0068] In this embodiment, the first sensing component 801, the second sensing component 802, and the third sensing component 803 are electrically connected to the controller, respectively, and the first driving component, the second driving component, and the third driving component are electrically connected to the controller, respectively. The controller (not shown in the figure) is configured to control the first driving component, the second driving component, and the third driving component to adjust the position and orientation of the wafer based on the data information and / or image information collected by the first sensing component 801, the second sensing component 802, and the third sensing component 803.

[0069] The working principle of the wafer pre-alignment device of the utility model is as follows:

[0070] The wafer to be pre-aligned is placed on the adsorption plate 601 by using a robotic arm, and the negative pressure chamber 6021 is in a negative pressure state at this time, so as to adsorb the wafer on the adsorption plate 601. Then, the third sensing component 803 detects the depth information and / or image information of the wafer as a whole, and sends the identified information to the controller, and the controller calculates the distance that the wafer needs to move in the first direction and the distance that needs to move in the second direction, so as to adjust the center position of the wafer by using the first drive component and the second drive component, and the controller calculates the angle that the notch of the wafer needs to rotate, so as to adjust the direction of the notch of the wafer by using the third drive component. After the calculation is completed, the controller controls the first drive component, the second drive component, and the third drive component to work simultaneously or separately to realize the two processes of center positioning and notch orientation of the wafer.

[0071] During the process of positioning the center of the circle, the first driving component and / or the second driving component respectively control the wafer to move in the first direction and / or the second direction. During the movement, the first sensing component 801 and / or the second sensing component 802 detects the adjusted distance in real time, thereby improving the accuracy and efficiency of pre-alignment.

[0072] During the adjustment process, the third sensor component 803 performs synchronous real-time detection to determine whether the wafer is adjusted according to the preset adjustment method, and after the adjustment work is completed, the third sensor component 803 can also detect the center position and notch direction of the wafer to determine whether the center position and notch direction of the wafer meet the process requirements.

[0073] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the method disclosed in the embodiment, since it corresponds to the device disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the device part description.

[0074] The above is a detailed introduction to a wafer pre-alignment device provided by the utility model. This article uses specific examples to illustrate the principle and implementation method of the utility model. The description of the above embodiment is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for those skilled in the art, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A wafer pre-alignment device, characterized in that: include: frame; A first support member (2) is arranged on the frame, the first support member (2) is slidably connected to the frame, and the sliding direction is a first direction; A first driving assembly, used for driving the first supporting member (2) to move along the first direction; A second support member (4) is arranged on the first support member (2), the second support member (4) is slidably connected to the first support member (2), and the sliding direction of the second support member (4) is a second direction; A second driving assembly, used for driving the second supporting member (4) to move along the second direction; The adsorption mechanism comprises an adsorption plate (601) and a support seat (602), wherein the support seat (602) is arranged on the second support member (4), a negative pressure cavity (6021) is arranged in the support seat (602), the adsorption plate (601) is rotatably connected to the support seat (602), and a negative pressure hole (6012) communicating with the negative pressure cavity (6021) is arranged on the adsorption plate (601); a third driving assembly, used for driving the adsorption plate (601) to rotate on the supporting seat (602); A sensing system, comprising a first sensing component (801), a second sensing component (802), and a third sensing component (803), wherein the first sensing component (801) is arranged on the support seat (602), the frame is provided with a first light receiving element (104) adapted to the first sensing component (801), the first sensing component (801) is used to detect the distance between the first sensing component (801) and the first light receiving element (104), the line between the first sensing component (801) and the first light receiving element (104) is parallel to the first direction, The second sensor component (802) is arranged on the support seat (602), the frame is provided with a second light receiving element (105) adapted to the second sensor component (802), the connection line between the second sensor component (802) and the second light receiving element (105) is parallel to the second direction, the second sensor component (802) is used to detect the distance between the second sensor component (802) and the second light receiving element (105), and the third sensor component (803) is arranged on the frame and located on one side of the adsorption mechanism, and is used to detect edge information of the wafer; The controller is configured to control the first driving component, the second driving component, and the third driving component to adjust the position and orientation of the wafer based on the data information collected by the first sensing component (801), the second sensing component (802), and the third sensing component (803).

2. The wafer pre-alignment device according to claim 1, characterized in that: The first direction and the second direction are perpendicular to each other.

3. The wafer pre-alignment device according to claim 2, characterized in that: A line connecting the first sensor component (801) and the center of the support base (602) and a line connecting the second sensor component (802) and the center of the support base (602) have an angle A, and the angle A is 90°.

4. The wafer pre-alignment device according to claim 1, characterized in that: The first sensing component (801) comprises a first transmitting unit and a first receiving unit, wherein the first receiving unit is used to receive a light beam that is reflected after being emitted by the first transmitting unit to the first light receiving element (104).

5. The wafer pre-alignment device according to claim 1, characterized in that: The second sensing component (802) comprises a second transmitting unit and a second receiving unit, wherein the second receiving unit is used to receive the light beam that is reflected after being emitted by the second transmitting unit to the second light receiving element (105).

6. The wafer pre-alignment device according to claim 4, characterized in that: The first transmitting unit is a ToF sensor.

7. The wafer pre-alignment device according to claim 5, characterized in that: The second transmitting unit is a ToF sensor.

8. The wafer pre-alignment device according to claim 1, characterized in that: A sealing member (604) is provided between the adsorption disk (601) and the support seat (602).

9. The wafer pre-alignment device according to claim 1, characterized in that: The third driving assembly comprises a gear ring (701), a driving gear (702), and a third driving motor (703); the gear ring (701) is coaxially arranged outside the adsorption disk (601); the driving gear (702) is connected to the output shaft of the third driving motor (703); and the driving gear (702) is meshed with the gear ring (701).

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