Stripping jig and substrate stripping equipment

Abstract

The utility model provides a stripping jig and substrate stripping equipment, and relates to the technical field of stripping. The stripping jig comprises an adsorption outer frame and an adsorption plate, the adsorption outer frame comprises a frame, a groove is defined by the inner side of the frame, the adsorption plate is arranged in the groove, a plurality of vent holes are formed in the adsorption plate, and the vent holes are evenly distributed in the adsorption plate. The vent holes are used for adsorbing the surface of a to-be-stripped piece, and the frame is attached to the side of the to-be-stripped piece. The problem of product structure damage in the separation process can be solved.

Description

Technical Field

[0001] The present application relates to the field of stripping technology, and in particular to a stripping jig and a substrate stripping device. Background Art

[0002] LLO (Laser Lift-off) uses laser energy to decompose the GaN buffer layer at the GaN / sapphire interface, thereby separating the LED epitaxial wafer from the sapphire substrate. After laser separation, tools are needed to peel off the substrate. However, the peeling tools in related technologies are prone to damage the Micro-LED structure during the peeling process. Utility Model Content

[0003] The purpose of the present application is to provide a stripping jig and a substrate stripping device.

[0004] The technical solutions adopted in this application are as follows:

[0005] In a first aspect, an embodiment of the present application provides a peeling jig, comprising:

[0006] An adsorption outer frame, wherein the adsorption outer frame comprises a frame, and the inner side of the frame is enclosed to form a groove;

[0007] An adsorption plate, wherein the adsorption plate is arranged in the groove, and the adsorption plate is provided with ventilation holes, wherein a plurality of ventilation holes are provided, and the plurality of ventilation holes are evenly distributed on the adsorption plate, and the ventilation holes are used to adsorb the surface of the piece to be peeled off, and the frame is fitted with the side of the piece to be peeled off.

[0008] In one of the embodiments of the first aspect, the adsorption outer frame further includes a substrate, the frame is disposed on a side of the substrate, and the frame and the substrate are combined to form the groove.

[0009] In one embodiment of the first aspect, a ventilation gap is provided between the adsorption plate and the substrate.

[0010] In one of the embodiments of the first aspect, an air suction port is provided on a side of the adsorption outer frame facing away from the adsorption plate, and the air suction port is communicated with the ventilation gap.

[0011] In one of the embodiments of the first aspect, the substrate is provided with a step structure, and the adsorption plate is installed on a side of the step structure away from the substrate to form the ventilation gap.

[0012] In one embodiment of the first aspect, the adsorption plate is detachably connected to the step structure.

[0013] In one embodiment of the first aspect, the thickness of the adsorption plate is smaller than the depth of the groove.

[0014] In a second aspect, an embodiment of the present application further provides a substrate stripping device, comprising the stripping jig described in any of the above embodiments.

[0015] In one of the embodiments of the second aspect, the substrate peeling device further includes a pulling member, and the pulling member is disposed on a side of the adsorption outer frame away from the adsorption plate.

[0016] In one embodiment of the second aspect, the substrate stripping device further comprises an air pipe, one end of the air pipe is connected to the adsorption outer frame, and one end of the air pipe away from the adsorption outer frame is connected to an external vacuum system.

[0017] Compared with the related art, the beneficial effect of the present application is as follows: the present application provides a stripping jig and a substrate stripping device, which can be used in a substrate stripping process. The stripping jig includes an adsorption outer frame and an adsorption plate, the adsorption outer frame includes a frame, the adsorption plate is arranged on the adsorption outer frame, the frame is fitted with the side of the piece to be stripped, and the adsorption plate adsorbs the surface of the piece to be stripped. In this way, after the substrate is separated by laser, the outer side of the substrate is embedded in the adsorption outer frame, the frame is fitted with the side of the substrate to limit the side of the substrate, and at the same time, the adsorption plate sucks the edge of the substrate to keep the substrate and the adsorption outer frame fixed, and by pulling and applying force to the adsorption outer frame, the substrate as a whole follows the movement of the adsorption outer frame to separate the substrate from the light-emitting layer. The stripping jig provided by the present application, by setting a plurality of evenly distributed vents on the adsorption plate, and vacuuming the substrate through the vents, the sapphire substrate is subjected to uniform force during separation, so as to improve the problem of product structure damage during the separation process. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 A schematic diagram of the structure of a Micro-LED chip in some embodiments of the present application is shown;

[0020] Figure 2 The schematic diagram of substrate peeling in the related art is shown Figure 1 ;

[0021] Figure 3 The schematic diagram of the Micro-LED chip structure after the substrate is peeled off in the related art is shown Figure 1 ;

[0022] Figure 4The schematic diagram of substrate peeling in the related art is shown Figure 2 ;

[0023] Figure 5 The schematic diagram of the Micro-LED chip structure after the substrate is peeled off in the related art is shown Figure 2 ;

[0024] Figure 6 A schematic diagram of the structure of a substrate peeling device in some embodiments of the present application is shown;

[0025] Figure 7 The structure of the adsorption frame in some embodiments of the present application is shown Figure 1 ;

[0026] Figure 8 A schematic diagram of the structure of an adsorption plate in some embodiments of the present application is shown;

[0027] Fig. 9 The structure of the adsorption frame in some embodiments of the present application is shown Figure 2 ;

[0028] Fig.10 A schematic diagram of a substrate peeling structure in some embodiments of the present application is shown;

[0029] Fig.11 A schematic diagram of the structure of the Micro-LED chip after peeling in some embodiments of the present application is shown.

[0030] Description of main component symbols:

[0031] 1000-substrate stripping equipment;

[0032] 100-peeling jig; 110-adsorption outer frame; 111-substrate; 112-frame; 113-groove; 114-step structure; 115-air extraction port; 116-ventilation gap; 120-adsorption plate; 121-ventilation hole;

[0033] 200-Micro-LED chip; 210-substrate; 220-light-emitting layer; 230-bonding layer;

[0034] 300-Pulling parts;

[0035] 400 - trachea;

[0036] 500-thrust machine;

[0037] 600-Blade. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0041] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0043] like Figure 1As shown, the Micro-LED chip 200 is composed of a plurality of layer structures, including a substrate 210, a light-emitting layer 220, and a bonding layer 230 from top to bottom. When the Micro-LED chip 200 is improved, the top sapphire substrate 210 needs to be peeled off. In the related art, the peeling method of the substrate 210 is to form a weak connection between the substrate 210 and the light-emitting layer 220 after laser peeling of the substrate 210, and then separate the substrate 210 from the light-emitting layer 220 by a tool.

[0044] Combination Figure 2 and Figure 3 As shown, in a related art method for stripping the substrate 210, a thruster 500 is used to apply a lateral thrust from one side of the substrate 210 to push the substrate 210 away from the light-emitting layer 220. However, during the pushing process, the bonding layer 230 at the bottom is easily misaligned during the pushing process, such as multiple bonding layers 230 being piled together, thereby causing short circuit and open circuit failures, affecting product yield.

[0045] Combination Figure 4 and Figure 5 As shown, in another related art method for peeling off the substrate 210, a blade 600 is used to peel off the substrate 210 from a corner of the substrate 210, so as to peel off the substrate 210 and the light-emitting layer 220. However, during the peeling process, the light-emitting layer 220 is easily broken or damaged due to uneven force, and the product peeling yield is low.

[0046] To this end, the embodiments of the present application provide a stripping jig 100 and a substrate 210 stripping device, which can be used to strip the sapphire substrate 210 of the Micro-LED chip 200. The stripping jig 100 and the substrate 210 stripping device provided in the present application have uniform separation force, which can improve the product structure damage problem during the separation process.

[0047] Combination Figure 6 and Fig.10 As shown, the embodiment of the present application provides a peeling jig 100, which includes an adsorption outer frame 110 and an adsorption plate 120. The adsorption outer frame 110 includes a frame 112, and the inner side of the frame 112 is enclosed to form a groove 113; the adsorption plate 120 is arranged in the groove 113, and the adsorption plate 120 is provided with a vent 121, and the vent 121 is provided with a plurality of vents, and the plurality of vents 121 are evenly distributed on the adsorption plate 120, and the vent 121 is used to adsorb the surface of the piece to be peeled, and the frame 112 is in contact with the side of the piece to be peeled.

[0048] Exemplarily, the adsorption frame 110 can be made of a material plate with a certain strength, such as a metal plate, a plastic plate or a bakelite plate. During the peeling operation, one side of the bonding layer 230 of the Micro-LED chip 200 is fixed by a fixture, and the side of the substrate 210 facing away from the light-emitting layer 220 is placed in the adsorption frame 110, and the adsorption plate 120 is adapted to the size of the substrate 210 so that the frame 112 fits the side of the substrate 210. The side of the substrate 210 is restricted by the frame 112 to ensure that the force on the surrounding side of the substrate 210 is uniform, and the problem of cracking of the light-emitting layer 220 or the gallium nitride layer connected to the substrate 210 during the peeling process is improved.

[0049] The adsorption plate 120 has an adsorption and fixing function. When the adsorption plate 120 is placed in the adsorption outer frame 110, the substrate 210 is placed on one side surface of the adsorption outer frame 110 and is fixed by the adsorption plate 120. Therefore, after the stripping jig 100 adsorbs the substrate 210, when the stripping jig 100 is pulled away from the Micro-LED chip 200, the substrate 210 is separated from the light-emitting layer 220 by force, so that the substrate 210 is completely stripped, thereby improving the product yield.

[0050] Combined Figure 8 As shown, in this embodiment, the surface of the substrate 210 is adsorbed by vacuum adsorption. After the substrate 210 is placed in the groove 113, the surface of the substrate 210 is attached to the adsorption plate 120 and is adsorbed and fixed by the vent 121 during the vacuuming process of the vacuum system.

[0051] The number of vents 121 can affect the adsorption effect of the adsorption plate 120. The more vents 121 there are, the more adsorption sites there are on the adsorption plate 120, the stronger the adsorption effect on the substrate 210 is, and the more uniform the force is, so that during the peeling process, the peeling effect on the substrate 210 is better.

[0052] In this embodiment, the plurality of vent holes 121 are distributed in a matrix, so that each part of the substrate 210 is uniformly adsorbed, thereby further improving the uniform force on the substrate 210 and ensuring the stripping yield.

[0053] Specifically, the number of the vents 121 can be 20, 30, 40, 50, 100, 200, etc., which can be selected according to the size of the adsorption plate 120 and the required adsorption strength.

[0054] Combination Figure 7 and Fig. 9 As shown, in some embodiments, the adsorption frame 110 further includes a substrate 111 , a frame 112 is disposed on the side of the substrate 111 , and the frame 112 and the substrate 111 are combined to form a groove 113 , and the groove 113 is used to place the adsorption plate 120 .

[0055] Exemplarily, the substrate 111 and the frame 112 can form an integrated structure, that is, a flat plate can be selected, and a groove 113 structure is hollowed out on one side of the flat plate. The groove 113 structure is the groove 113 for placing the adsorption plate 120, and the surrounding side wall of the groove 113 is the frame 112 structure.

[0056] In other embodiments, the base plate 111 and the frame 112 may be separately arranged, that is, the base plate 111 may be a flat plate, and the frame 112 structure is vertically arranged on its side to enclose and form the groove 113. The frame 112 and the base plate 111 may be connected by welding, clamping, bolt locking, etc.

[0057] like Figure 6 As shown, in some embodiments, a ventilation gap 116 is provided between the adsorption plate 120 and the substrate 111 .

[0058] Exemplarily, a ventilation gap 116 is formed between the adsorption plate 120 and the substrate 111, and the vent holes 121 are connected to the ventilation gap 116, so that during vacuum adsorption, each vent hole 121 has a common ventilation gap 116, so that only one evacuation port is needed to realize the adsorption function of all vent holes 121.

[0059] like Figure 6 As shown, in some embodiments, a suction port 115 is provided on a side of the adsorption outer frame 110 facing away from the adsorption plate 120 , and the suction port 115 is connected to the ventilation gap 116 .

[0060] Exemplarily, a suction port 115 is provided on the side of the substrate 111 facing away from the adsorption plate 120, and is connected to the vacuum system through the suction hole. The suction port 115 is connected to the ventilation gap 116. When vacuuming, the suction port 115 sequentially passes through the ventilation hole 121 and the ventilation gap 116 to extract the air between the adsorption plate 120 and the substrate 111, so that the substrate 210 is adsorbed and fixed by the ventilation hole 121.

[0061] Combination Figure 6 and Fig. 9 As shown, in some embodiments, the substrate 111 is provided with a step structure 114 , and the adsorption plate 120 is installed on a side of the step structure 114 facing away from the substrate 111 to form a ventilation gap 116 .

[0062] Exemplarily, the step structure 114 may be a plurality of evenly distributed step blocks, or may be an integral structure distributed along the periphery of the substrate 111. There is a certain height difference between the step structure 114 and the substrate 111, so that after the adsorption plate 120 is installed on the step structure 114, a ventilation gap 116 for gas circulation is formed between the adsorption plate 120 and the substrate 111.

[0063] In some embodiments, the adsorption plate 120 is detachably connected to the step structure 114 , and the adsorption plate 120 is in contact with a side of the step structure 114 facing away from the substrate 111 .

[0064] Exemplarily, an adhesive layer may be provided on one side of the step structure 114 close to the adsorption plate 120, and the adsorption plate 120 may be fixed to the inner side of the adsorption outer frame 110 through the adhesive layer. After the adsorption plate 120 is installed on the step structure 114, its side is sealed and connected to the inner wall of the frame 112. For example, a sealing strip may be provided on the side of the adsorption plate 120, so that when the vent hole 121 contacts the substrate 210, the vent gap 116 is a sealed cavity, thereby increasing the adsorption strength of the adsorption plate 120 to the substrate 210.

[0065] In other embodiments, the adsorption plate 120 may also be fixed to the step structure 114 by bolt locking, clamping, etc.

[0066] In some embodiments, the thickness of the adsorption plate 120 is smaller than the depth of the groove 113 .

[0067] For example, since the depth of the groove 113 is greater than the thickness of the adsorption plate 120, when the adsorption plate 120 is installed in the groove 113, one end surface of the frame 112 of the principle substrate 111 is higher than the adsorption plate 120, thereby meeting the requirement that during the subsequent peeling process of the substrate 210, the substrate 210 can enter the groove 113 and the frame 112 covers the side of the substrate 210.

[0068] like Figure 5 As shown, an embodiment of the present application further provides a substrate stripping device 1000, comprising the stripping jig 100 in any of the above embodiments.

[0069] This embodiment has the stripping jig 100 in any of the above embodiments, and therefore has all the beneficial effects of the stripping jig 100 in any of the above embodiments, which will not be described in detail here.

[0070] In some embodiments, the substrate peeling device 1000 further includes a pulling member 300 , and the pulling member 300 is disposed on a side of the adsorption frame 110 facing away from the adsorption plate 120 .

[0071] For example, the pulling member 300 can be a metal rod, one end of which can be fixed to the substrate 111 by welding or bonding. After the substrate 210 is adsorbed and fixed by the adsorption plate 120, the pulling member 300 can be pulled away from the adsorption frame 110 away from the Micro-LED chip 200 by applying force to the pulling member 300, so as to separate the substrate 210 from the light-emitting layer 220.

[0072] The substrate 210 peeling device may further include a pulling device, a fixing fixture, etc. The pulling device may be connected to the pulling member 300 and apply a pulling force to the pulling member 300, without manual force to separate the substrate 210. The fixing fixture may limit the Micro-LED chip 200 from one side of the substrate 210, so that during the pulling process of the substrate 210, the other layer structures of the Micro-LED chip 200 remain fixed, so that the substrate 210 can be peeled off smoothly.

[0073] In some embodiments, the air suction port 115 is connected to an air pipe 400 , and one end of the air pipe 400 away from the air suction port 115 is connected to an external vacuum system.

[0074] Exemplarily, the air extraction port 115 is connected to the vacuum system through the air pipe 400 to achieve the vacuum operation. In addition, a control valve may be provided at the connection between the air extraction port 115 and the air pipe 400 to adjust the vacuum power, adjust the adsorption strength, or control the start and stop of the vacuum operation. The vacuum system may include a vacuum pump, a pipeline, a valve, etc., and the vacuum pump is used to vacuum the peeling jig 100 to adsorb and fix the substrate 210.

[0075] Combination Fig.10 and Fig.11 As shown, the operation process of the substrate peeling equipment 1000 is described.

[0076] Step 1: According to the design requirements, a Micro-LED chip 200 of a required size can be produced, such as a Micro-LED chip 200 with a size of 4 mm in length and 2 mm in width.

[0077] Step 2: Perform LLO (Laser Lift-off) on the Micro-LED chip 200. The laser energy can be adjusted according to actual conditions, such as 40%-80% of the initial laser energy, so that a weak connection is formed between the substrate 210 and the light-emitting layer 220.

[0078] Step 3: Make an adsorption plate 120 with a size that matches the Micro-LED chip 200. The size of the adsorption plate 120 can be 4 mm long*2 mm wide*0.2 mm thick. Ventilation holes 121 can be opened on the adsorption plate 120 as much as possible to improve adsorption uniformity.

[0079] Step 4: Make an adsorption frame 110. The size of the adsorption frame 110 needs to be slightly larger than the Micro-LED chip 200 and the adsorption plate 120 to accommodate the adsorption plate 120 and the substrate 210. The size of the adsorption frame 110 can be 4.05mm long*2.05mm wide*0.5mm thick. A groove 113 with a length of 4mm*width of 2mm and a thickness greater than 0.2mm can be set in the adsorption frame 110, and the side of the substrate 111 located at the groove 113 is further hollowed out to form a step structure 114, so that the adsorption plate 120 can be installed on the step structure 114.

[0080] It should be noted that the specific parameters of the above-mentioned Micro-LED chip 200, ventilation plate and adsorption frame 110 are only used as examples, and their specific values ​​can also be changed according to actual operating conditions.

[0081] Step 5: Connect the air outlet 115 of the adsorption outer frame 110 to the vacuum system through the air pipe 400.

[0082] Step 6: Fix the pulling member 300 on the side of the adsorption frame 110 away from the adsorption plate 120 .

[0083] Step 7: Fix the Micro-LED chip 200 that has passed the LLO and expose the substrate 210. The peeling fixture 100 is covered on the substrate 210. Through vacuum treatment, the adsorption plate 120 adsorbs and fixes the substrate 210. The frame 112 fits the peripheral side of the substrate 210. External force is applied to the pulling piece 300 to peel off the substrate 210.

[0084] In addition, it should be noted that the stripping jig 100 provided in the present application is not only used for the substrate 210 stripping process, but can also be used for quantum dot film or electronic component bonding processes. The quantum dot film or electronic component is adsorbed by the adsorption plate 120, and the size of the frame 112 is adapted to the chip size, and the adsorption outer frame 110 can be completely covered on the chip, so that the quantum dot film or electronic component is bonded to the chip.

[0085] In summary, the stripping jig 100 and substrate stripping device 1000 provided in the present application can make the separation force of the substrate 210 uniform during the stripping process of the substrate 210, improve the product structure damage problem during the separation process, and improve the product stripping yield. In addition, the overall structure of the stripping jig is simple, the manufacturing cost is low, and it can also be used in the process of quantum dot film or electronic component bonding.

[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0087] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A peeling jig, characterized in that: include: An adsorption outer frame, wherein the adsorption outer frame comprises a frame, and the inner side of the frame is enclosed to form a groove; An adsorption plate, wherein the adsorption plate is arranged in the groove, and the adsorption plate is provided with ventilation holes, wherein a plurality of ventilation holes are provided, and the plurality of ventilation holes are evenly distributed on the adsorption plate, and the ventilation holes are used to adsorb the surface of the piece to be peeled off, and the frame is fitted with the side of the piece to be peeled off.

2. The peeling jig according to claim 1, characterized in that: The adsorption outer frame also includes a substrate, the frame is arranged on the side of the substrate, and the frame and the substrate are surrounded to form the groove.

3. The peeling jig according to claim 2, characterized in that: A ventilation gap is provided between the adsorption plate and the substrate.

4. The peeling jig according to claim 3, characterized in that: An air suction port is provided on a side of the adsorption outer frame away from the adsorption plate, and the air suction port is communicated with the ventilation gap.

5. The peeling jig according to claim 3, characterized in that: The substrate is provided with a step structure, and the adsorption plate is installed on a side of the step structure away from the substrate to form the ventilation gap.

6. The peeling jig according to claim 5, characterized in that: The adsorption plate is detachably connected to the step structure.

7. The peeling jig according to claim 1, characterized in that: The thickness of the adsorption plate is smaller than the depth of the groove.

8. A substrate peeling device, characterized in that: A stripping jig according to any one of claims 1 to 7.

9. The substrate peeling device according to claim 8, characterized in that The substrate peeling device further comprises a pulling member, and the pulling member is arranged on a side of the adsorption outer frame away from the adsorption plate.

10. The substrate peeling device according to claim 8, characterized in that The substrate stripping device further comprises an air pipe, one end of which is connected to the adsorption outer frame, and one end of which is away from the adsorption outer frame is connected to an external vacuum system.

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