Chip packaging wire welding equipment

Abstract

The utility model relates to the technical field of chips, and discloses chip packaging and wire welding equipment, which comprises a working table, a placing seat for placing a chip is arranged at the side part of the working table, a clamping mechanism for clamping the chip is arranged on the surface of the placing seat, and a driving mechanism for driving the clamping mechanism is arranged at the side part of the clamping mechanism. The driving mechanism and the clamping mechanism are synchronously matched for use, through the arrangement of the driving mechanism, an air cylinder is started to drive a driving plate and a gear and a rack in the driving plate to move forwards in a meshing transmission mode, a chip body is clamped, the air cylinder is driven again to conduct clamping and fixing, and the integrity of a chip can be effectively protected through accurate clamping and fixing; and the chip is prevented from being damaged or damaged due to improper clamping, so that the effects of improving the production quality and the yield are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of chips, in particular to a chip packaging wire bonding device. Background Art

[0002] Chip packaging wire bonding equipment is one of the key equipment used in the semiconductor chip packaging process. It is mainly responsible for connecting the internal circuit of the chip to the external leads or connectors to ensure that the signal and power can be transmitted effectively. These equipment usually include wire bonding machines, soldering equipment, and wire bonding hot presses. The working principle of wire bonding equipment involves accurately connecting fine wires (usually metal wires) to the pins or circuit nodes of the chip through hot pressing or ultrasonic welding technology to ensure reliable electrical connections and stable performance. These equipment require not only precise control and operation technology, but also a high degree of automation and precision to cope with complex packaging designs and micro-scale welding requirements. In the semiconductor industry, the performance and stability of wire bonding equipment directly affect the quality and production efficiency of the chip. Therefore, various parameters need to be strictly controlled during process design and operation to ensure the quality and reliability of each chip package.

[0003] At present, before manually welding wires to chips for packaging, the chip body needs to be clamped. As the chip is a fragile material, insufficient or uneven clamping force may cause the chip to move or offset during the welding process, which may affect the accuracy and stability of the welding. Therefore, it does not meet the existing needs. We have proposed a chip packaging wire bonding equipment. Utility Model Content

[0004] The utility model provides a chip packaging wire bonding device, which can effectively protect the integrity of the chip and avoid chip damage or breakage caused by improper clamping, thereby improving the production quality and yield rate. It solves the problem mentioned in the above background technology that before manually performing wire bonding packaging on the chip, the chip body needs to be clamped. The chip is a fragile material, and insufficient or uneven clamping force may cause the chip to move or offset during the welding process, which may affect the accuracy and stability of welding.

[0005] The utility model provides the following technical solution: a chip packaging wire bonding device, comprising a workbench, a placement seat for placing chips is installed on the side of the workbench, a clamping mechanism for clamping the chip is installed on the surface of the placement seat, a driving mechanism for driving the clamping mechanism is arranged on the side of the clamping mechanism, and the driving mechanism is used synchronously with the clamping mechanism.

[0006] As an optional solution for a chip packaging wire bonding device described in the utility model, a baffle is installed on the side of the workbench, and a device hole is opened on the side of the baffle. There are several device holes, and the several device holes are distributed on the side of the baffle.

[0007] As an optional solution of a chip packaging wire bonding device described in the utility model, wherein: two placement seats are provided, and the driving mechanism and the clamping mechanism are jointly provided between the two placement seats.

[0008] As an optional solution for a chip packaging wire bonding device described in the utility model, a mounting block is provided on the side of the placement seat, a cylinder is installed on the side of the mounting block, the output shaft of the cylinder passes through the side of the mounting block, and the output shaft of the cylinder is connected to the side of the driving mechanism.

[0009] As an optional solution for a chip packaging wire bonding device described in the utility model, a fixed block is connected between the two placement seats, the output shaft of the cylinder is inserted into the side of the fixed block, the driving mechanism includes a rack and a gear, two racks are provided, the two racks are connected to the side of the fixed block, and the gear is meshed between the two racks.

[0010] As an optional solution for a chip packaging wire bonding device described in the utility model, wherein: a driving plate is connected to the side of the gear, a rotating shaft is connected between the driving plate and the gear, the driving plate is connected to the side of the output shaft of the cylinder, and the driving plate is connected to the side of the clamping mechanism.

[0011] As an optional solution for a chip packaging wire bonding device described in the utility model, wherein: a first clamping plate and a second clamping plate are installed at the end of the placement seat, the first clamping plate is connected to the side of the placement seat, the second clamping plate is slidably connected to the side of the placement seat, the first clamping plate and the second clamping plate are respectively provided with mounting grooves on the sides, the clamping mechanism is arranged inside the mounting groove, and the other end of the driving plate is connected to the side of the second clamping plate.

[0012] As an optional solution for a chip packaging wire bonding device described in the utility model, wherein: the clamping mechanism includes a clamping panel and a telescopic column, a telescopic column is connected between the mounting groove and the clamping panel, a spring is sleeved on the outer side of the telescopic column, a piston cavity is opened on the side of the mounting groove, a sliding rod is arranged inside the telescopic column, a piston plate is connected to the bottom of the sliding rod, and the piston plate slides in cooperation with the piston cavity.

[0013] The utility model has the following beneficial effects:

[0014] 1. The chip packaging wire bonding equipment, through the setting of the driving mechanism, starts the cylinder to drive the driving plate and the gear and rack inside the driving plate to mesh and transmit forward, clamp the chip body, and drive the cylinder again to clamp and fix it. Through precise clamping and fixing, the integrity of the chip can be effectively protected to avoid chip damage or breakage caused by improper clamping, thereby improving the production quality and yield rate. It solves the problem that the chip body needs to be clamped before manual wire bonding packaging of the chip. As a fragile material, the chip may move or shift during the welding process due to insufficient or uneven clamping force, which may affect the accuracy and stability of welding.

[0015] 2. The chip packaging wire bonding equipment adopts the setting of the clamping mechanism. The clamping mechanism cooperates with the driving mechanism to clamp the chip body inside the installation groove. The chip body squeezes the telescopic column and the sliding rod inside the telescopic column. At the same time, the sliding rod drives the piston plate to slide inside the piston cavity. Through the cooperation of the sliding rod and the piston plate, the damage of the chip caused by sudden squeezing during the clamping process can be avoided, thereby protecting the integrity and performance of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0017] Figure 2 It is a schematic diagram of the cross-section structure of the installation groove of the utility model.

[0018] Figure 3 It is a schematic diagram of the telescopic column structure of the utility model.

[0019] Figure 4 It is a schematic diagram of the driving mechanism structure of the utility model.

[0020] In the figure: 110, workbench; 111, baffle; 112, installation hole; 120, placement seat; 121, mounting block; 122, cylinder; 123, fixing block; 124, first clamping plate; 125, second clamping plate; 130, clamping mechanism; 131, clamping panel; 132, telescopic column; 133, spring; 140, driving mechanism; 141, rack; 142, gear; 143, driving plate; 144, rotating shaft; 150, mounting groove; 152, sliding rod; 153, piston plate; 154, piston chamber. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] Embodiment 1: This embodiment is intended to solve the problem that the chip body needs to be clamped before the chip is manually wired. As the chip is a fragile material, insufficient or uneven clamping force may cause the chip to move or offset during the welding process, which may affect the accuracy and stability of welding. Please refer to Figure 1-4 A chip packaging wire bonding device includes a workbench 110, a placement seat 120 for placing a chip is installed on the side of the workbench 110, a clamping mechanism 130 for clamping the chip is installed on the surface of the placement seat 120, and a driving mechanism 140 for driving the clamping mechanism 130 is arranged on the side of the clamping mechanism 130, and the driving mechanism 140 and the clamping mechanism 130 are used synchronously.

[0023] A baffle 111 is installed on the side of the workbench 110, and a device hole 112 is opened on the side of the baffle 111. There are a plurality of device holes 112, which are distributed on the side of the baffle 111. Two placement seats 120 are provided, and the driving mechanism 140 and the clamping mechanism 130 are jointly arranged between the two placement seats 120.

[0024] A mounting block 121 is provided on the side of the placement seat 120, and a cylinder 122 is installed on the side of the mounting block 121. The output shaft of the cylinder 122 is inserted through the side of the mounting block 121, and the output shaft of the cylinder 122 is connected to the side of the driving mechanism 140. A fixing block 123 is connected between the two placement seats 120, and the output shaft of the cylinder 122 is inserted through the side of the fixing block 123. The driving mechanism 140 includes a rack 141 and a gear 142. Two racks 141 are provided, and the two racks 141 are connected to the side of the fixing block 123, and the gear 142 is meshed between the two racks 141.

[0025] A driving plate 143 is connected to the side of the gear 142 , a rotating shaft 144 is connected between the driving plate 143 and the gear 142 , the driving plate 143 is connected to the side of the output shaft of the cylinder 122 , and the driving plate 143 is connected to the side of the clamping mechanism 130 .

[0026] In this embodiment: through the setting of the driving mechanism 140, the cylinder 122 is started to drive the driving plate 143 and the gear 142 inside the driving plate 143 to mesh with the rack 141 and transmit forward, so as to engage the chip body, and then drive the cylinder 122 again to clamp and fix it. Through precise clamping and fixing, the integrity of the chip can be effectively protected, and damage or breakage of the chip caused by improper clamping can be avoided, thereby improving the production quality and yield rate. The problem of needing to clamp the chip body before manually welding the chip for wire packaging is solved. As a fragile material, the chip may move or offset during the welding process due to insufficient or uneven clamping force, which may affect the accuracy and stability of welding.

[0027] Embodiment 2: This embodiment is intended to promote the solution to the problem of chip damage caused by chip squeezing. This embodiment is an improvement made on the basis of embodiment 1. For details, please refer to Figure 1-4 The end of the placement seat 120 is equipped with a first clamping plate 124 and a second clamping plate 125, the first clamping plate 124 is connected to the side of the placement seat 120, the first clamping plate 124 is fixedly connected to the side of the placement seat 120, the second clamping plate 125 is slidably connected to the side of the placement seat 120, the first clamping plate 124 and the second clamping plate 125 are respectively provided with mounting grooves 150, the side of the second clamping plate 125 is connected to a sliding block, the side of the placement seat 120 is connected to a sliding groove, the sliding block is slidably engaged with the sliding groove, the other end of the driving plate 143 is connected to the side of the second clamping plate 125 The second clamping plate 125 is connected to a connecting block at the bottom, the driving plate 143 is connected to the side of the connecting block, the clamping mechanism 130 is arranged inside the mounting groove 150, the clamping mechanism 130 includes a clamping panel 131 and a telescopic column 132, the telescopic column 132 is connected between the mounting groove 150 and the clamping panel 131, a spring 133 is sleeved on the outside of the telescopic column 132, a piston cavity 154 is opened on the side of the mounting groove 150, a sliding rod 152 is arranged inside the telescopic column 132, a piston plate 153 is connected to the bottom of the sliding rod 152, and the piston plate 153 and the piston cavity 154 are slidably matched.

[0028] In this embodiment: through the setting of the clamping mechanism 130, the clamping mechanism 130 cooperates with the driving mechanism 140 to clamp the chip body inside the installation groove 150, the chip body squeezes the telescopic column 132 and the sliding rod 152 inside the telescopic column 132, and at the same time the sliding rod 152 drives the piston plate 153 to slide and cooperate inside the piston cavity 154. Through the cooperation of the sliding rod 152 and the piston plate 153, damage to the chip caused by sudden squeezing during the clamping process can be avoided, thereby protecting the integrity and performance of the chip.

[0029] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0030] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A chip packaging wire bonding device, comprising a workbench (110), characterized in that: A placement seat (120) for placing a chip is installed on the side of the workbench (110); a clamping mechanism (130) for clamping the chip is installed on the surface of the placement seat (120); a driving mechanism (140) for driving the clamping mechanism (130) is arranged on the side of the clamping mechanism (130); the driving mechanism (140) and the clamping mechanism (130) are used synchronously.

2. The chip packaging wire bonding device according to claim 1, characterized in that: A baffle (111) is installed on the side of the workbench (110), and a device hole (112) is opened on the side of the baffle (111). A plurality of the device holes (112) are provided, and the plurality of the device holes (112) are distributed on the side of the baffle (111).

3. The chip packaging wire bonding equipment according to claim 1, characterized in that: Two placement seats (120) are provided, and the driving mechanism (140) and the clamping mechanism (130) are jointly provided between the two placement seats (120).

4. The chip packaging wire bonding equipment according to claim 1, characterized in that: A mounting block (121) is provided on the side of the placement seat (120), a cylinder (122) is installed on the side of the mounting block (121), an output shaft of the cylinder (122) penetrates the side of the mounting block (121), and the output shaft of the cylinder (122) is connected to the side of the driving mechanism (140).

5. The chip packaging wire bonding device according to claim 4, characterized in that: A fixed block (123) is connected between the two placement seats (120), and the output shaft of the cylinder (122) is inserted into the side of the fixed block (123). The driving mechanism (140) includes a rack (141) and a gear (142). Two racks (141) are provided, and the two racks (141) are connected to the side of the fixed block (123), and the gear (142) is meshed between the two racks (141).

6. The chip packaging wire bonding equipment according to claim 5, characterized in that: A driving plate (143) is connected to the side of the gear (142), a rotating shaft (144) is connected between the driving plate (143) and the gear (142), the driving plate (143) is connected to the side of the output shaft of the cylinder (122), and the driving plate (143) is connected to the side of the clamping mechanism (130).

7. The chip packaging wire bonding equipment according to claim 6, characterized in that: A first clamping plate (124) and a second clamping plate (125) are installed at the end of the placement seat (120), the first clamping plate (124) is connected to the side of the placement seat (120), and the second clamping plate (125) is slidably connected to the side of the placement seat (120), and the sides of the first clamping plate (124) and the second clamping plate (125) are respectively provided with mounting grooves (150), the clamping mechanism (130) is arranged inside the mounting groove (150), and the other end of the driving plate (143) is connected to the side of the second clamping plate (125).

8. The chip packaging wire bonding equipment according to claim 7, characterized in that: The clamping mechanism (130) comprises a clamping panel (131) and a telescopic column (132); a telescopic column (132) is connected between the mounting groove (150) and the clamping panel (131); a spring (133) is sleeved on the outer side of the telescopic column (132); a piston cavity (154) is opened on the side of the mounting groove (150); a sliding rod (152) is arranged inside the telescopic column (132); a piston plate (153) is connected to the bottom of the sliding rod (152); and the piston plate (153) is slidably matched with the piston cavity (154).

Images