Flexible printed circuit (FPC) structure capable of preventing tin connection

Abstract

The embodiment of the utility model belongs to the technical field of FPC. The utility model also relates to an FPC structure preventing tin connection, which comprises an FPC main body, the FPC main body is provided with a plurality of FPC pad main bodies and a plurality of first isolation through holes, the plurality of first isolation through holes and the plurality of FPC pad main bodies are arranged alternately, and the first isolation through holes are used for isolation of soldering tin between two adjacent FPC pad main bodies. Through the arrangement of the plurality of first isolation through holes, the possibility that the soldering tin is adsorbed to the FPC bonding pad main body beside from one FPC bonding pad main body is effectively blocked by utilizing the isolation effect of the first isolation through holes, through the method, the occurrence rate of soldering tin connection can be remarkably reduced, the electrical performance of the FPC and the reliability of a product are improved, and meanwhile, the production efficiency is improved. The method is simple and easy to implement, does not need to greatly change existing production equipment, and has relatively high practicability and economical efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of FPC, and more specifically to an FPC structure for preventing bridging. Background Art

[0002] In the manufacturing process of flexible printed circuits (FPCs), the pad spacing between connector pins is a critical design parameter. As the miniaturization and integration of electronic products continue to strengthen, higher requirements are placed on the density and spacing of components on FPCs. However, this highly integrated design often leads to a reduction in the spacing between pads, which poses a great challenge to the subsequent welding process.

[0003] During the welding process, the amount and distribution of solder paste play a decisive role in the welding quality. Metal PAD has excellent solder adsorption characteristics, which can effectively adsorb solder during welding to form stable welding points. However, this adsorption characteristic also brings a problem that cannot be ignored - solder bridging. When the amount of solder paste is not properly controlled, especially when the pad spacing is too close, the solder can easily be adsorbed from one pin to the adjacent pin, forming solder bridging or short circuit, which not only affects the electrical performance of the FPC, but may also cause the function failure of the entire product, increasing the cost of production and maintenance. Therefore, we have made improvements to this and proposed an FPC structure that prevents bridging.

[0004] For example, the Chinese patent (application number CN117615568A) discloses the production process of smart wearable FPC to prevent bridging. Its specification discloses: The emergence of smart wearable products has made smart wearable FPC have the characteristics of miniaturized components and high-density assembly. Its surface mounting process faces smaller component gaps and smaller pad spacing, which makes its soldering process more challenging, among which the bridging problem is particularly prominent. Among them, engineers have conducted a lot of experimental work on the optimization of soldering process parameters and more suitable soldering materials when the smart wearable FPC has a smaller pad spacing, and have achieved certain results. However, whether it is manual, semi-automatic or fully automatic soldering process, it is still not possible to avoid the bridging problem. The soldering process includes multiple production processes. When bridging problems are inevitable, current technology makes it difficult to detect bridging problems in earlier production processes. Often, bridging products are selected through AOI inspection after soldering is completed. This results in bridging problems occurring in the pre-soldering process but not being detected, causing them to enter the subsequent process, resulting in a waste of production costs. The error rate of AOI inspection after soldering may even lead to the failure to detect some smart wearable FPC products with bridging problems before they flow into the customer end, seriously affecting the yield of smart wearable products. Utility Model Content

[0005] The technical problem to be solved by the embodiments of the present invention is that when the amount of solder paste is improperly controlled, especially when the distance between the pads is too close, the solder can be easily adsorbed from one pin to the adjacent pin, causing solder bridging or short circuit.

[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0007] An FPC structure for preventing solder bridging comprises: an FPC body, on which a plurality of FPC pad bodies and a plurality of first isolation through holes are arranged, the plurality of first isolation through holes and the plurality of FPC pad bodies are alternately arranged, and the first isolation through holes are used for isolating solder between two adjacent FPC pad bodies.

[0008] As an improved manner of the utility model, the first isolation through hole is opened through the FPC body, and the first isolation through hole is located in the non-routing area of ​​the FPC pad body.

[0009] As an improved manner of the utility model, an FPC connector female seat is arranged on the FPC body, and the FPC connector female seat has a plurality of connector pins, and the plurality of connector pins are respectively welded to a plurality of FPC pad bodies.

[0010] As an improved manner of the present invention, a reinforcing portion is provided on a side of the FPC body away from the FPC connector socket, and the reinforcing portion is used to reinforce the area of ​​the FPC body close to the FPC connector socket.

[0011] As an improved manner of the utility model, the reinforcing portion is an FPC reinforcing plate, and the FPC reinforcing plate is fixedly connected to a surface of the FPC body away from the FPC connector socket.

[0012] As an improved manner of the utility model, a plurality of second isolation through holes are formed through the FPC reinforcing plate, and positions of the plurality of second isolation through holes correspond to positions of the plurality of first isolation through holes.

[0013] As an improved manner of the present invention, the FPC body has a bending area, and the bending area is used for bending the FPC body.

[0014] As an improved manner of the utility model, the FPC body includes an FPC base layer, both sides of the FPC base layer are provided with FPC copper foil layers, and the sides of the two FPC copper foil layers away from each other are provided with FPC covering layers.

[0015] As an improved manner of the utility model, a window is opened on one of the FPC covering layers, and an isolation layer is coated on the FPC copper foil layer corresponding to the window.

[0016] As an improvement of the present invention, the position of the window corresponds to the position of the bending zone.

[0017] Compared with the prior art, the embodiments of the present invention mainly have the following beneficial effects:

[0018] In order to solve the problem in the prior art that when the amount of solder paste is improperly controlled, especially when the spacing between pads is too close, the solder is easily absorbed from one pin to the adjacent pin, forming a solder bridging or short circuit, the present application sets up a plurality of first isolation through holes, utilizes the isolation effect of the first isolation through holes, and effectively blocks the possibility of solder being absorbed from one FPC pad body to the adjacent FPC pad body. Through this method, the incidence of solder bridging can be significantly reduced, and the electrical performance of the FPC and the reliability of the product can be improved. At the same time, the method is simple and easy to implement, does not require major changes to existing production equipment, and has high practicality and economy. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of the FPC structure for preventing tin bridging provided in this application;

[0020] Figure 2 The FPC structure for preventing tin bridging provided by the present application Figure 1 The enlarged structural diagram at A in the middle;

[0021] Figure 3 The FPC structure for preventing tin bridging provided by the present application Figure 1 Exploded diagram of

[0022] Figure 4 A stacking diagram of an FPC body of an FPC structure for preventing solder bridging provided in the present application.

[0023] Indicated in the figure:

[0024] 1. FPC body; 1001. FPC covering layer; 1002. FPC copper foil layer; 1003. FPC base layer; 1004. window; 1005. isolation layer; 101. FPC pad body; 102. first isolation through hole; 2. FPC connector socket; 201. connector pin; 3. FPC reinforcement plate; 301. second isolation through hole. DETAILED DESCRIPTION

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs; the terms used in the specification of the application herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. Reference to "embodiments" herein means that specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of this phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0026] As recorded in the background technology, during the welding process, the amount and distribution of solder paste play a decisive role in the welding quality. Due to its excellent solder adsorption characteristics, the metal PAD can effectively adsorb solder during welding to form stable welding points. However, this adsorption characteristic also brings a problem that cannot be ignored - solder bridging. When the amount of solder paste is not properly controlled, especially when the pad spacing is too close, the solder can easily be adsorbed from one pin to the adjacent pin, forming a solder bridge or short circuit. This not only affects the electrical performance of the FPC, but may also cause the entire product to fail, increasing the cost of production and maintenance.

[0027] In order to solve this technical problem, the utility model provides an FPC structure for preventing bridging.

[0028] Specifically, please refer to Figure 1-Figure 3 , the FPC structure to prevent bridging includes:

[0029] The FPC body 1 is provided with a plurality of FPC pad bodies 101 and a plurality of first isolation through holes 102 . The plurality of first isolation through holes 102 and the plurality of FPC pad bodies 101 are alternately arranged, and the first isolation through holes 102 are used to isolate the solder between two adjacent FPC pad bodies 101 .

[0030] The FPC structure for preventing solder bridging provided by the utility model, by setting a plurality of first isolation through holes 102, utilizes the isolation effect of the first isolation through holes 102, and effectively blocks the possibility of solder being adsorbed from one FPC pad body 101 to the adjacent FPC pad body 101. Through this method, the incidence of solder bridging can be significantly reduced, and the electrical performance of the FPC and the reliability of the product can be improved. At the same time, the method is simple and easy to implement, does not require major changes to existing production equipment, and has high practicality and economy.

[0031] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the accompanying drawings.

[0032] It should be noted that, in the absence of conflict, the embodiments of the present invention and the features and technical solutions in the embodiments may be combined with each other.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0034] Embodiment 1 of the FPC structure for preventing tin bridging of the utility model

[0035] Please refer to Figure 1-Figure 3 The utility model discloses an FPC structure for preventing solder bridging, comprising: an FPC body 1, on which are arranged a plurality of FPC pad bodies 101 and a plurality of first isolating through holes 102, wherein the plurality of first isolating through holes 102 and the plurality of FPC pad bodies 101 are alternately arranged, and the first isolating through holes 102 are used for isolating the solder between two adjacent FPC pad bodies 101, and by setting a plurality of first isolating through holes 102, the isolation effect of the first isolating through holes 102 is utilized, and the possibility of solder being adsorbed from one FPC pad body 101 to the adjacent FPC pad body 101 is effectively blocked, and by this method, the incidence of solder bridging can be significantly reduced, and the electrical performance of the FPC and the reliability of the product can be improved, and at the same time, the method is simple and easy to implement, does not require major changes to the existing production equipment, and has high practicality and economy.

[0036] Further, such as Figure 1-Figure 3 As shown, the first isolation through hole 102 is opened through the FPC body 1 and is located in the non-routing area of ​​the FPC pad body 101 . This arrangement ensures that the opening of the first isolation through hole 102 does not affect the routing of the FPC body 1 .

[0037] Further, such as Figure 1-Figure 3 As shown, an FPC connector socket 2 is provided on the FPC body 1, and the FPC connector socket 2 has a plurality of connector pins 201, and the plurality of connector pins 201 are respectively welded to a plurality of FPC pad bodies 101. The opening of the first isolation through hole 102 can reduce the situation where the solder is adsorbed from one FPC pad body 101 to another 101, thereby reducing the situation where the solder connects two adjacent connector pins 201 together, thereby reducing the situation of solder bridging.

[0038] Embodiment 2 of the FPC structure for preventing tin bridging according to the utility model

[0039] The utility model further prevents the FPC structure from bridging tin, such as Figure 1-Figure 3 As shown, a reinforcement portion is provided on the side of the FPC body 1 away from the FPC connector female seat 2, and the reinforcement portion is used to strengthen the area of ​​the FPC body 1 close to the FPC connector female seat 2, thereby facilitating the plugging and unplugging of the FPC connector female seat 2 and the connector male seat.

[0040] Further, such as Figure 1-Figure 3 As shown, the reinforcement part is an FPC reinforcement plate 3, which is fixedly connected to the side of the FPC body 1 away from the FPC connector socket 2. The FPC reinforcement plate 3 can provide additional support and reinforcement for the FPC body 1, thereby increasing the overall mechanical strength and stability of the FPC body 1, which is particularly important for the connector area, because the connector is a key part of the circuit board connecting to external devices or components, and needs to withstand greater physical pressure and stress;

[0041] The presence of the FPC reinforcement plate 3 helps to reduce damage and failure of the FPC body 1 caused by factors such as bending, twisting or vibration during long-term use, and can prevent the FPC body 1 from excessive deformation or breakage at a specific position, thereby extending the service life of the circuit board; the FPC reinforcement plate 3 is rigid and can form a stable support structure on the FPC body 1 to help maintain the shape stability of the FPC body 1.

[0042] Further, such as Figure 3 As shown, a plurality of second isolation through holes 301 are opened through the FPC reinforcement plate 3, and the positions of the plurality of second isolation through holes 301 respectively correspond to the positions of the plurality of first isolation through holes 102. The setting of the second isolation through holes 301 can prevent the FPC reinforcement plate 3 from affecting the discharge of solder from the first isolation through holes 102, and the second isolation through holes 301 can also be used as exhaust when the FPC reinforcement plate 3 is attached to the FPC body 1, so as to prevent patch bubbles from being generated due to uneven pressure at the joint of the FPC reinforcement plate 3 and the FPC body 1.

[0043] Furthermore, the FPC body 1 has a bending area for bending the FPC body 1. The bending area gives the FPC body 1 a high degree of flexibility and bendability, which enables the FPC body 1 to adapt to various complex spatial layouts and installation environments, especially in situations where space is limited or frequent bending is required, the bending area is particularly important.

[0044] Embodiment 3 of the FPC structure for preventing tin bridging according to the utility model

[0045] The utility model further prevents the FPC structure from bridging tin, such as Figure 4As shown, the FPC body 1 includes an FPC base layer 1003, both sides of the FPC base layer 1003 are provided with FPC copper foil layers 1002, and the sides of the two FPC copper foil layers 1002 that are away from each other are provided with FPC covering layers 1001. The FPC base layer 1003 is the basic structure of the FPC body 1, and is usually made of flexible materials such as polyester film or polyimide; it provides support and flexibility for the entire FPC body 1, so that the FPC body 1 can maintain a stable shape and performance in various complex environments; the FPC base layer 1003 also plays an insulating role, isolating various parts in the FPC body 1 The FPC copper foil layer 1002 is the conductive part of the FPC body 1, which is used to form a conductive line in the circuit. It is usually made of rolled copper foil or electrolytic copper foil, and has good conductivity and ductility. After being processed by etching and other processes, the FPC copper foil layer 1002 forms a specific circuit pattern to achieve the connection and transmission functions of the circuit. The FPC copper foil layer 1002 plays a vital role in the FPC body 1, which determines the electrical properties and transmission efficiency of the circuit board; the FPC covering layer 1001 plays the role of insulation protection, and is usually made of dry film type or photosensitive developing type material.

[0046] Further, such as Figure 4 As shown, a window 1004 is provided on one of the FPC covering layers 1001, and an isolation layer 1005 is coated on the FPC copper foil layer 1002 corresponding to the window 1004. The setting of the window 1004 can facilitate the bending of the FPC body 1. The isolation layer 1005 is green ink, which can not only protect the corresponding FPC copper foil layer 1002, but also has the function of at least a bending zone, so that the staff can quickly confirm the bending zone of the FPC body 1.

[0047] Further, such as Figure 4 As shown, the position of the window 1004 corresponds to the position of the bending zone.

[0048] Obviously, the embodiments described above are only some embodiments of the utility model, rather than all embodiments. The preferred embodiments of the utility model are given in the accompanying drawings, but they do not limit the patent scope of the utility model. The utility model can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the utility model more thorough and comprehensive. Although the utility model is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to replace some of the technical features therein with equivalents. Any equivalent structure made using the contents of the utility model specification and the accompanying drawings, directly or indirectly used in other related technical fields, is also within the scope of patent protection of the utility model.

Claims

1. An FPC structure for preventing bridging, characterized in that: include: An FPC body (1), wherein a plurality of FPC pad bodies (101) and a plurality of first isolation through holes (102) are arranged on the FPC body (1), the plurality of first isolation through holes (102) and the plurality of FPC pad bodies (101) are arranged alternately with each other, and the first isolation through holes (102) are used for isolating solder between two adjacent FPC pad bodies (101).

2. The FPC structure for preventing bridging according to claim 1, characterized in that: The first isolation through hole (102) is opened through the FPC body (1), and the first isolation through hole (102) is located in a non-routing area of ​​the FPC pad body (101).

3. The FPC structure for preventing bridging according to claim 2, characterized in that: An FPC connector female seat (2) is provided on the FPC body (1), the FPC connector female seat (2) having a plurality of connector pins (201), and the plurality of connector pins (201) are respectively welded to a plurality of FPC pad bodies (101).

4. The FPC structure for preventing bridging according to claim 3, characterized in that: A reinforcement portion is provided on a side of the FPC body (1) away from the FPC connector female seat (2), and the reinforcement portion is used to reinforce the area of ​​the FPC body (1) close to the FPC connector female seat (2).

5. The FPC structure for preventing bridging according to claim 4, characterized in that: The reinforcing portion is an FPC reinforcing plate (3), and the FPC reinforcing plate (3) is fixedly connected to a surface of the FPC body (1) that is away from the FPC connector female seat (2).

6. The FPC structure for preventing bridging according to claim 5, characterized in that: The FPC reinforcing plate (3) is provided with a plurality of second isolation through holes (301), and the positions of the plurality of second isolation through holes (301) respectively correspond to the positions of the plurality of first isolation through holes (102).

7. The FPC structure for preventing bridging according to claim 6, characterized in that: The FPC body (1) has a bending area, and the bending area is used for the FPC body (1) to bend.

8. The FPC structure for preventing bridging according to claim 7, characterized in that: The FPC body (1) comprises an FPC base layer (1003), both sides of the FPC base layer (1003) are provided with FPC copper foil layers (1002), and the two FPC copper foil layers (1002) are provided with FPC covering layers (1001) on the sides away from each other.

9. The FPC structure for preventing bridging according to claim 8, characterized in that: A window (1004) is provided on one of the FPC cover layers (1001), and an isolation layer (1005) is coated on the FPC copper foil layer (1002) corresponding to the window (1004).

10. The FPC structure for preventing bridging according to claim 9, characterized in that: The position of the window (1004) corresponds to the position of the bending zone.

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