Circuit board cover film pressing mechanism

Abstract

The utility model provides a circuit board cover film pressing mechanism. The circuit board covering film pressing mechanism comprises an operation box and a supporting frame arranged below the operation box. The placing seat is arranged on the supporting frame; the hydraulic cylinder is arranged on the inner wall of the top of the operation box, and a pressing plate is arranged on an output shaft of the hydraulic cylinder; the two heating plates are respectively arranged on the placing seat and the pressing plate; and the two placing boxes are both arranged on the supporting frame. According to the circuit board cover film pressing mechanism provided by the utility model, the circuit board and the cover film can be quickly pressed, and a worker does not need to continuously operate and place the circuit board and the cover film, so that the workload of the worker is reduced, and meanwhile, the pressing efficiency is also improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a circuit board covering film pressing mechanism. Background Art

[0002] Circuit board, also known as PCB, is one of the important components of the electronics industry. It is the support of electronic components or the provider of circuit connections for electronic components. Because it is made using electronic printing technology, it is called a "printed" circuit board.

[0003] In the process of processing the circuit board, it is necessary to set a corresponding covering film on the outside of the circuit board. In the process of processing the circuit board and the covering film, a corresponding pressing mechanism is needed to operate. After searching, the patent document with the authorization announcement number: CN219577390U discloses a circuit board covering film pressing mechanism. When pressing the circuit board and the covering film, the operator needs to constantly place the circuit board and the covering film, which increases the work intensity of the staff and also reduces the efficiency of pressing.

[0004] Therefore, it is necessary to provide a new circuit board cover film pressing mechanism to solve the above technical problems. Utility Model Content

[0005] In order to solve the technical problem of low lamination efficiency of a circuit board and a cover film mentioned in the background technology, the utility model provides a circuit board cover film lamination mechanism.

[0006] The circuit board covering film pressing mechanism provided by the utility model comprises: an operating box and a support frame arranged below the operating box; a placement seat, the placement seat is arranged on the support frame; a hydraulic cylinder, the hydraulic cylinder is arranged on the top inner wall of the operating box, and a pressing plate is arranged on the output shaft of the hydraulic cylinder; two heating plates, the two heating plates are respectively arranged on the placement seat and the pressing plate; two placement boxes, the two placement boxes are both arranged on the support frame; a first telescopic rod, the first telescopic rod is arranged in the operating box, and an adsorption plate adsorption mechanism is arranged on the output shaft of the first telescopic rod, the adsorption mechanism is arranged on the operating box and the adsorption plate, and the adsorption mechanism is used to adsorb the circuit boards and covering films respectively placed in the two placement boxes; a moving mechanism, the moving mechanism is arranged on the operating box, and the moving mechanism is used to move the circuit boards or covering films adsorbed by the adsorption mechanism.

[0007] Preferably, the adsorption mechanism includes a connecting pipe, a plurality of suction cups, a hose and a negative pressure pump, the connecting pipe is arranged in the adsorption plate, the plurality of suction cups are arranged on the adsorption plate, and the plurality of suction cups are connected to the connecting pipe, the hose is arranged on the operating box, and the hose is connected to the connecting pipe, and the negative pressure pump is arranged on one side outer wall of the operating box, and the negative pressure pump is connected to the hose.

[0008] Preferably, the moving mechanism includes a screw rod, a driving motor and a mounting block, the screw rod is rotatably mounted on the top of the operating box, the driving motor is arranged on the top inner wall of the operating box, the output shaft of the driving motor is fixedly connected to one end of the screw rod, the mounting block is threadedly sleeved on the screw rod, and the mounting block is fixedly connected to the first telescopic rod, a limit rod is fixedly mounted on the operating box, and the limit rod and the mounting block are slidably connected.

[0009] Preferably, the support frame is provided with an adjustment mechanism for adjusting the use position of the placement seat, the adjustment mechanism includes a servo motor, a mounting groove, a threaded rod and a support block, the servo motor is arranged on the support frame, the mounting groove is opened on the support frame, the threaded rod is rotatably installed in the mounting groove, and one end of the threaded rod is fixedly connected to the output shaft of the servo motor, the support block is threadedly sleeved on the threaded rod, and the support block is fixedly connected to the bottom of the placement seat.

[0010] Preferably, the mounting groove and the support block are both rectangular in shape, and the support block and the inner wall of the mounting groove are slidably connected, and a ball bearing is embedded in the bottom of the support block.

[0011] Preferably, the placement seat is provided with a pushing mechanism for pushing the circuit board and the covering film after being pressed on the placement seat, the pushing mechanism includes a second telescopic rod and a pushing plate, the second telescopic rod is arranged on one side of the placement seat, and the pushing plate is fixedly mounted on the output shaft of the second telescopic rod.

[0012] Preferably, a conveying mechanism is provided on the support frame, positioning rings are provided on the operation box and the first telescopic rod, the positioning rings are connected to the hose, a transparent observation door is provided on the operation box, and a controller is provided on one side of the operation box.

[0013] Compared with the related art, the circuit board cover film pressing mechanism provided by the utility model has the following beneficial effects:

[0014] The utility model provides a circuit board covering film pressing mechanism:

[0015] 1. The operation box facilitates the pressing of the circuit board and the covering film. With the cooperation of the placement seat, the hydraulic cylinder, the pressing plate and the heating plate, the circuit board and the covering film can be quickly pressed. The heating plate can improve the pressing effect. The circuit board and the covering film can be adsorbed and fixed by the adsorption mechanism, so as to facilitate the clamping and fixing of the circuit board and the covering film. With the cooperation of the moving mechanism and the first telescopic rod, the adsorbed circuit board and the covering film can be conveniently placed on the placement seat, so that the staff does not need to constantly operate and place the circuit board and the covering film, which reduces the workload of the staff and also improves the pressing efficiency;

[0016] 2. The use position of the placement seat can be adjusted through the adjustment mechanism, so that the circuit board and the covering film placed on the placement seat can be moved to the bottom of the pressing plate, so as to facilitate the pressing operation of the circuit board and the covering film. The rectangular setting of the mounting groove and the support block can make the mounting groove limit the support block, so that the threaded rod can stably drive the support block to move. The pushing mechanism can facilitate the pressing of the circuit board and the covering film onto the conveying mechanism. The conveying mechanism can facilitate the moving and conveying of the pressed circuit board. The positioning ring can position the hose, and the controller facilitates the control operation. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of the main structure of a preferred embodiment of the circuit board cover film pressing mechanism provided by the utility model;

[0018] Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model;

[0019] Figure 3 for Figure 2 An enlarged structural diagram of part A shown in FIG.

[0020] Figure 4 for Figure 2 An enlarged schematic diagram of the structure of part B shown in FIG.

[0021] Figure 5 It is a schematic diagram of the assembly of the adsorption plate and the suction cup in the utility model.

[0022] Numbers in the figure: 1. operation box; 2. placement seat; 3. hydraulic cylinder; 4. pressure plate; 5. heating plate; 6. placement box; 7. first telescopic rod; 8. adsorption plate; 9. connecting pipe; 10. suction cup; 11. hose; 12. negative pressure pump; 13. screw rod; 14. drive motor; 15. mounting block; 16. servo motor; 17. mounting groove; 18. threaded rod; 19. support block; 20. second telescopic rod; 21. push plate; 22. conveying mechanism. DETAILED DESCRIPTION

[0023] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0024] Please refer to Figure 1-Figure 5 ,in, Figure 1 A schematic diagram of the main structure of a preferred embodiment of the circuit board cover film pressing mechanism provided by the utility model; Figure 2 It is a front view cross-sectional structural schematic diagram of the utility model; Figure 3 for Figure 2 An enlarged structural diagram of part A shown in FIG. Figure 4 for Figure 2 An enlarged schematic diagram of the structure of part B shown in FIG. Figure 5 It is a schematic diagram of the assembly of the adsorption plate and the suction cup in the utility model.

[0025] The circuit board covering film pressing mechanism includes: an operation box 1 and a support frame arranged below the operation box 1; a placement seat 2, the placement seat 2 is arranged on the support frame; a hydraulic cylinder 3, the hydraulic cylinder 3 is arranged on the top inner wall of the operation box 1, and a pressing plate 4 is arranged on the output shaft of the hydraulic cylinder 3; two heating plates 5, the two heating plates 5 are respectively arranged on the placement seat 2 and the pressing plate 4; two placement boxes 6, the two placement boxes 6 are both arranged on the support frame; a first telescopic rod 7, the first telescopic rod 7 is arranged in the operation box 1, and an adsorption plate 8 adsorption mechanism is arranged on the output shaft of the first telescopic rod 7, the adsorption mechanism is arranged on the operation box 1 and the adsorption plate 8, and the adsorption mechanism is used to adsorb the circuit boards and covering films placed in the two placement boxes 6 respectively. ; Moving mechanism, the moving mechanism is arranged on the operation box 1, and the moving mechanism is used to move the circuit board or covering film adsorbed by the adsorption mechanism. The operation box 1 is used to facilitate the pressing operation of the circuit board and the covering film. With the cooperation of the placement seat 2, the hydraulic cylinder 3, the pressing plate 4 and the heating plate 5, the circuit board and the covering film can be quickly pressed. The heating plate 5 can improve the pressing effect. The circuit board and the covering film can be adsorbed and fixed by the adsorption mechanism, so as to facilitate the clamping and fixing of the circuit board and the covering film. With the cooperation of the moving mechanism and the first telescopic rod 7, it is convenient to place the adsorbed circuit board and covering film on the placement seat 2, so that the staff does not need to constantly operate and place the circuit board and the covering film, which reduces the workload of the staff and also improves the pressing efficiency.

[0026] The adsorption mechanism includes a connecting pipe 9, a plurality of suction cups 10, a hose 11 and a negative pressure pump 12. The connecting pipe 9 is arranged in the adsorption plate 8. The plurality of suction cups 10 are arranged on the adsorption plate 8, and the plurality of suction cups 10 are connected to the connecting pipe 9. The hose 11 is arranged on the operation box 1, and the hose 11 is connected to the connecting pipe 9. The negative pressure pump 12 is arranged on an outer wall of one side of the operation box 1, and the negative pressure pump 12 is connected to the hose 11. The circuit board and the covering film can be adsorbed and fixed by the adsorption mechanism, thereby facilitating the clamping and fixing of the circuit board and the covering film.

[0027] The moving mechanism includes a screw rod 13, a drive motor 14 and a mounting block 15. The screw rod 13 is rotatably mounted on the top of the operating box 1. The drive motor 14 is arranged on the top inner wall of the operating box 1. The output shaft of the drive motor 14 is fixedly connected to one end of the screw rod 13. The mounting block 15 is threadedly sleeved on the screw rod 13, and the mounting block 15 is fixedly connected to the first telescopic rod 7. A limit rod is fixedly installed on the operating box 1, and the limit rod and the mounting block 15 are slidably connected. The moving mechanism facilitates the placement of the adsorbed circuit board and covering film on the placement seat 2, so that the staff does not need to constantly operate and place the circuit board and covering film, which reduces the workload of the staff and also improves the pressing efficiency.

[0028] The support frame is provided with an adjustment mechanism for adjusting the use position of the placement seat 2, and the adjustment mechanism includes a servo motor 16, a mounting groove 17, a threaded rod 18 and a support block 19. The servo motor 16 is arranged on the support frame, and the mounting groove 17 is opened on the support frame. The threaded rod 18 is rotatably installed in the mounting groove 17, and one end of the threaded rod 18 is fixedly connected to the output shaft of the servo motor 16. The support block 19 is threadedly sleeved on the threaded rod 18, and the support block 19 is fixedly connected to the bottom of the placement seat 2. The use position of the placement seat 2 can be adjusted by the adjustment mechanism, so that the circuit board and the covering film placed on the placement seat 2 can be moved to the bottom of the pressing plate 4, so as to facilitate the pressing operation of the circuit board and the covering film.

[0029] The mounting groove 17 and the support block 19 are both rectangular in design, and the support block 19 is slidably connected to the inner wall of the mounting groove 17. A ball bearing is embedded at the bottom of the support block 19. Through the rectangular design of the mounting groove 17 and the support block 19, the mounting groove 17 can limit the support block 19, so that the threaded rod 18 can stably drive the support block 19 to move.

[0030] The placement seat 2 is provided with a pushing mechanism for pushing the circuit board and the covering film after being pressed by the placement seat 2. The pushing mechanism includes a second telescopic rod 20 and a pushing plate 21. The second telescopic rod 20 is arranged on one side of the placement seat 2. The pushing plate 21 is fixedly installed on the output shaft of the second telescopic rod 20. The pushing mechanism can conveniently push the pressed circuit board and the covering film to the conveying mechanism 22.

[0031] The support frame is provided with a conveying mechanism 22, and the operation box 1 and the first telescopic rod 7 are provided with positioning rings, the positioning rings are connected to the hose 11, and the operation box 1 is provided with a transparent observation door. A controller is provided on one side of the operation box 1. The conveying mechanism 22 is used to facilitate the movement and transportation of the pressed circuit board, the positioning ring can position the hose 11, and the controller facilitates the control operation.

[0032] It is worth noting that the circuits, electronic components and modules involved in the present utility model are all prior art and can be fully implemented by those skilled in the art. Needless to say, the content protected by the present utility model does not involve improvements to software and methods.

[0033] The working principle of the circuit board cover film pressing mechanism provided by the utility model is as follows:

[0034] This solution also has an electric control cabinet, which is installed on the equipment. When in use, each electrical device can be started and operated through the electric control cabinet. The power connection method of each electrical device is an existing mature technology, which is a well-known technology for people in this field and will not be described in detail here.

[0035] When in use, the controller is used to make corresponding operation settings, a certain amount of circuit boards and covering films are placed in the two placement boxes 6 respectively, the two heating plates 5 are started by the controller, and then the negative pressure pump 12 is started by the controller to form a negative pressure in the suction cup 10, and then the driving motor 14 is started by the controller to drive the screw rod 13 to rotate, and under the limiting effect of the limiting rod on the mounting block 15, the screw rod 13 drives the mounting block 15 to move, thereby driving the suction cup 10 to move to the top of the placement box 6 where the covering film is placed, and then the controller starts the first telescopic rod 7 to drive the suction cup 10 to move down and cover the top of the placement box 6 where the covering film is placed. The film is in contact with the placing seat 2, thereby adsorbing the covering film, and then the first telescopic rod 7 drives the adsorbed covering film to move up a certain distance. Similarly, the controller starts the driving motor 14 to drive the adsorbed covering film to move to the placing seat 2, and then the first telescopic rod 7 drives the adsorbed covering film to move down and contact the placing seat 2. Then the controller turns off the negative pressure pump 12, so that the circuit board is placed on the placing seat 2. At this time, the first telescopic rod 7 drives the suction cup 10 to move up, and then the controller starts the driving motor 14 to reverse and drive the suction cup 10 to move to the top of the placing box 6 where the circuit board is placed. Similarly, according to the above The step is to clamp and move the circuit board to be placed on the covering film placed on the placement seat 2, and then the covering film in the placement box 6 is clamped again according to the above steps, so that the covering film is placed on the circuit board on the placement seat 2, and then the controller starts the servo motor 16 to drive the threaded rod 18 to rotate, and under the limiting effect of the mounting groove 17 on the support block 19, the threaded rod 18 drives the support block 19 to move, and then drives the placement seat 2 to move to the bottom of the hydraulic cylinder 3, and then the controller starts the hydraulic cylinder 3 to drive the pressing plate 4 (a pressure sensor is provided on the pressing plate 4, which is convenient for the circuit board and the covering film The pressure applied by the film is monitored) and moves downward to press the circuit board and the covering film on the placement seat 2. After pressing, the controller starts the second telescopic rod 20 to drive the push plate 21 to move, thereby pushing the pressed circuit board on the placement seat 2 to the conveying mechanism 22, thereby conveying the pressed circuit board, and the operation can be repeated. The staff only needs to replenish the circuit boards and covering films in the placement box 6. During the whole operation process, the staff does not need to continuously place the circuit boards and covering films, which reduces the workload of the staff and also improves the pressing efficiency.

[0036] Compared with the related art, the circuit board cover film pressing mechanism provided by the utility model has the following beneficial effects:

[0037] The utility model provides a circuit board covering film pressing mechanism, which facilitates the pressing operation of the circuit board and the covering film through the operation box 1, and can quickly press the circuit board and the covering film under the cooperation of the placement seat 2, the hydraulic cylinder 3, the pressing plate 4 and the heating plate 5. The heating plate 5 can improve the pressing effect, and the circuit board and the covering film can be adsorbed and fixed by the adsorption mechanism, so as to facilitate the clamping and fixing of the circuit board and the covering film. Under the cooperation of the moving mechanism and the first telescopic rod 7, the adsorbed circuit board and the covering film can be conveniently placed on the placement seat 2, so that the staff does not need to constantly operate and place the circuit board and the covering film, which reduces the workload of the staff and also improves the pressing efficiency;

[0038] The use position of the placement seat 2 can be adjusted by the adjustment mechanism, so that the circuit board and the covering film placed on the placement seat 2 can be conveniently moved to the bottom of the pressing plate 4, so as to facilitate the pressing operation of the circuit board and the covering film. Through the rectangular setting of the mounting groove 17 and the support block 19, the mounting groove 17 can limit the support block 19, so that the threaded rod 18 can stably drive the support block 19 to move, and the pressed circuit board and the covering film can be conveniently pushed to the conveying mechanism 22 through the pushing mechanism. The conveying mechanism 22 can facilitate the movement and transportation of the pressed circuit board. The positioning ring can position the hose 11, and the controller can facilitate the control operation.

[0039] It should be noted that the equipment structure and drawings of the utility model mainly describe the principle of the utility model. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. However, on the premise that technical personnel in this field understand the principle of the above-mentioned utility model, they can clearly know the details of its power mechanism, power supply system and control system.

[0040] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A circuit board cover film pressing mechanism, characterized in that: include: An operating box and a support frame arranged below the operating box; A placement seat, the placement seat is arranged on the support frame; A hydraulic cylinder, wherein the hydraulic cylinder is arranged on the top inner wall of the operation box, and a pressure plate is arranged on the output shaft of the hydraulic cylinder; Two heating plates, the two heating plates are respectively arranged on the placement seat and the pressing plate; Two placement boxes, both of which are arranged on the support frame; A first telescopic rod, the first telescopic rod is arranged in the operation box, and an adsorption plate is arranged on the output shaft of the first telescopic rod An adsorption mechanism, the adsorption mechanism is arranged on the operation box and the adsorption plate, and the adsorption mechanism is used to adsorb the circuit board and the cover film respectively placed in the two placement boxes; A moving mechanism is arranged on the operation box, and is used to move the circuit board or the covering film adsorbed by the adsorption mechanism.

2. The circuit board cover film pressing mechanism according to claim 1, characterized in that: The adsorption mechanism includes a connecting pipe, multiple suction cups, a hose and a negative pressure pump. The connecting pipe is arranged in the adsorption plate, the multiple suction cups are arranged on the adsorption plate, and the multiple suction cups are connected to the connecting pipe. The hose is arranged on the operation box, and the hose is connected to the connecting pipe. The negative pressure pump is arranged on one side outer wall of the operation box, and the negative pressure pump is connected to the hose.

3. The circuit board cover film pressing mechanism according to claim 1, characterized in that: The moving mechanism includes a screw rod, a driving motor and a mounting block, the screw rod is rotatably mounted on the top of the operating box, the driving motor is arranged on the top inner wall of the operating box, the output shaft of the driving motor is fixedly connected to one end of the screw rod, the mounting block is threadedly sleeved on the screw rod, and the mounting block is fixedly connected to the first telescopic rod, a limiting rod is fixedly installed on the operating box, and the limiting rod is slidably connected to the mounting block.

4. The circuit board cover film pressing mechanism according to claim 1, characterized in that: The support frame is provided with an adjustment mechanism for adjusting the use position of the placement seat, and the adjustment mechanism includes a servo motor, a mounting groove, a threaded rod and a support block. The servo motor is arranged on the support frame, and the mounting groove is opened on the support frame. The threaded rod is rotatably installed in the mounting groove, and one end of the threaded rod is fixedly connected to the output shaft of the servo motor. The support block is threadedly sleeved on the threaded rod, and the support block is fixedly connected to the bottom of the placement seat.

5. The circuit board cover film pressing mechanism according to claim 4, characterized in that: The installation groove and the support block are both rectangular in shape, and the support block is slidably connected to the inner wall of the installation groove, and a ball bearing is embedded at the bottom of the support block.

6. The circuit board cover film pressing mechanism according to claim 1, characterized in that: The placement seat is provided with a pushing mechanism for pushing the circuit board and the covering film pressed by the placement seat, and the pushing mechanism includes a second telescopic rod and a pushing plate, the second telescopic rod is arranged at one side of the placement seat, and the pushing plate is fixedly mounted on the output shaft of the second telescopic rod.

7. The circuit board cover film pressing mechanism according to claim 2, characterized in that: The support frame is provided with a conveying mechanism, the operation box and the first telescopic rod are both provided with positioning rings, the positioning rings are connected to the hose, the operation box is provided with a transparent observation door, and a controller is provided on one side of the operation box.

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