Motor controller heat dissipation mechanism and motor controller

Abstract

The utility model relates to the field of motor controllers, in particular to a heat dissipation mechanism of a motor controller and the motor controller. The heat dissipation mechanism of the motor controller comprises a controller shell; the shell water channel is formed in the controller shell and is in contact with at least two side surfaces, the upper surface and the lower surface of the capacitor shell; when the shell water channel is filled with the cooling liquid, heat dissipation of the capacitor shell is achieved, and heat dissipation of the power semiconductor device is achieved by inserting the needle type structure on the power semiconductor device into the cooling liquid. According to the utility model, the bus capacitor and the power module can be cooled simultaneously, and the integration degree is high.

Description

Technical Field

[0001] The utility model relates to the field of motor controllers, in particular to a motor controller heat dissipation mechanism and a motor controller. Background Art

[0002] With the rapid development of the new energy vehicle market, the electric drive system has become its core component. The motor controller is a key component of the electric drive system, and its performance and reliability play a decisive role in the operation of the entire vehicle. However, during the operation of the motor controller, a large amount of heat will be generated due to energy conversion and transmission. If the heat cannot be dissipated in a timely and effective manner, the performance of the motor controller will be reduced or even fail, which will seriously hinder the development of new energy vehicles.

[0003] At present, the motor controllers of new energy vehicles generally use traditional heat dissipation methods such as heat sinks, fans, and water cooling. The heat sink is limited by the heat dissipation area and shape, and the heat dissipation effect is limited; although fan heat dissipation can reduce the temperature, it is easy to generate noise and vibration at high speeds; although water cooling has a good heat dissipation effect, it requires a complex piping system and coolant, which increases the complexity of the system and maintenance costs.

[0004] In the motor controller of new energy vehicles, bus capacitors and IGBT power modules are two core components, and their heat dissipation is particularly critical. Bus capacitors will be converted into heat energy during the charging and discharging process, affecting the electrical and mechanical properties of the capacitors; IGBT power modules will generate a lot of heat under long-term operation and frequent switching, increasing the probability of failure, affecting the motor output performance and the reliability of the vehicle drive system.

[0005] In order to improve the heat dissipation effect of core components, various methods have been adopted in the prior art, such as increasing the volume of capacitors, applying thermal grease or attaching thermal insulation sheets between bus capacitors and IGBT power modules, and using liquid cooling (placing bus capacitors and IGBT power modules in liquid). However, these methods either increase the volume of the controller or increase the complexity and cost of the system, and the improvement in heat dissipation effect is not significant. Therefore, developing an efficient, simple and economical heat dissipation solution is of great significance to improving the performance and reliability of new energy vehicle motor controllers. Summary of the invention

[0006] The embodiment of the utility model provides a motor controller heat dissipation mechanism and a motor controller to solve the problems existing in the related technologies, and can dissipate heat for the bus capacitor and the power module at the same time, and also optimizes the cooling medium to achieve the best cooling effect; and the degree of integration is high, the heat dissipation effect is good, the production cost is low, and after-sales maintenance is convenient. The technical solution is as follows:

[0007] In a first aspect, an embodiment of the utility model provides a motor controller heat dissipation mechanism, comprising:

[0008] Controller housing;

[0009] A housing water channel, wherein the housing water channel is enclosed by a capacitor housing and a controller housing;

[0010] When the shell water channel is filled with coolant, it contacts at least two side surfaces, the upper surface and the lower surface of the capacitor shell to achieve heat dissipation of the capacitor shell, and the needle structure on the power semiconductor device is inserted into the coolant to achieve heat dissipation of the power semiconductor device.

[0011] Optionally, a first sealing ring is provided between the capacitor housing and the power semiconductor device, and the first sealing ring is used to prevent the coolant in the housing water channel from leaking into the capacitor housing.

[0012] Optionally, there are two power semiconductor devices, which are respectively disposed on the upper surface and the lower surface of the capacitor housing, and the two power semiconductor devices are sealed and connected to the capacitor housing through the first sealing ring.

[0013] Optionally, the first sealing ring is fastened to the power semiconductor device and the capacitor housing by fasteners.

[0014] Optionally, the shell water channel has a water inlet and a water outlet, and the water inlet and the water outlet both have a second sealing ring, and the second sealing ring is used to prevent the coolant from leaking from the water inlet or the water outlet;

[0015] And / or, the busbar capacitor is placed in the capacitor housing, and heat dissipation material is filled between the busbar capacitor and the capacitor housing.

[0016] Optionally, the coolant is driven to flow in the housing water channel by a pressure pump.

[0017] Optionally, the coolant is a 50% ethylene glycol type coolant.

[0018] Optionally, the needle structure comprises at least one group of copper needles, and the group of copper needles is used to be inserted into the coolant to contact to achieve cooling.

[0019] The embodiment of the utility model further discloses a motor controller, comprising the above-mentioned motor controller heat dissipation mechanism, wherein the motor controller heat dissipation mechanism is used to dissipate heat for the motor controller.

[0020] The advantages or beneficial effects of the above technical solution include at least:

[0021] (1) Volume reduction due to high integration. By achieving heat dissipation for the bus capacitor, control module, and drive module in a heat sink structure, the degree of integration inside the motor controller is significantly improved. Compared with the previous generation of products, the volume of the controller in the embodiment of the utility model can be reduced by more than 20%, thereby reducing the space occupied by the overall device, providing more layout space for other components or functions, and facilitating the installation and transportation of the device.

[0022] (2) Performance and cost optimization brought by liquid cooling technology. The embodiment of the utility model abandons the traditional method of natural heat dissipation by installing a thermal pad between the bottom of the bus capacitor and the controller housing, and innovatively adopts liquid cooling technology. Liquid cooling not only significantly improves the heat dissipation effect and ensures the stable operation of the motor controller in a high temperature environment, but also greatly reduces the volume of the bus capacitor by optimizing the heat dissipation design, thereby reducing material costs and production costs.

[0023] (3) Simplification and efficiency improvement of the assembly process. The busbar capacitor, control module and drive module can be integrated into the capacitor housing, which simplifies and optimizes the process during the production and assembly process. The drive module and control module can be installed in sequence, and then the entire assembly can be placed in the controller housing, reducing the assembly steps and complexity. This design not only improves the efficiency of the assembly process, but also reduces the error rate, ensuring the quality and reliability of the product.

[0024] In summary, the heat dissipation structure of the motor controller provided by the embodiment of the utility model has a high degree of integration, optimized heat dissipation performance and a simplified assembly process, which brings significant improvements and benefits to the design and production of the motor controller.

[0025] The above summary is for the purpose of description only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments and features described above, further aspects, embodiments and features of the utility model will be readily apparent by reference to the accompanying drawings and the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments according to the utility model and should not be regarded as limiting the scope of the utility model.

[0027] Figure 1 is a schematic block diagram of a motor controller in an embodiment of the utility model;

[0028] Figure 2 It is a cross-sectional view of the heat dissipation mechanism of the motor controller in the embodiment of the utility model;

[0029] Figure 3 It is the installation diagram of the water inlet and the water outlet in the embodiment of the utility model;

[0030] Figure 4 It is a schematic diagram of the assembly of the motor controller in the embodiment of the utility model;

[0031] Figure 5 It is an exploded diagram of the motor controller in the embodiment of the utility model. DETAILED DESCRIPTION

[0032] In the following, only some exemplary embodiments are briefly described. As those skilled in the art will appreciate, the described embodiments may be modified in various ways without departing from the spirit or scope of the present invention. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0033] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples, unless they are contradictory.

[0034] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0035] The present invention provides a heat dissipation mechanism for a motor controller, wherein the motor controller is generally a core component of a new energy vehicle and has high requirements for heat dissipation, such as Figure 1As shown, it is a schematic block diagram of a motor controller, including a power module 030, a current detection module 020, a filter module 010 and a filter module 040. Among them, the filter module 010 includes a three-phase magnetic ring, the filter module 2 includes a busbar magnetic ring and an EMC module, the current detection is used to sample the current value flowing through the AC copper bus, and the busbar magnetic ring in the filter module filters the AC copper bus and suppresses noise. The power modules that need heat dissipation include busbar capacitors and power semiconductor devices. The heat dissipation mechanism of the motor controller in the embodiment of the utility model is only used for the heat dissipation of the power module of the motor controller. Figure 1 As shown, the power module 030 includes the innermost bus capacitor, the laminated busbars on the bus capacitor, the capacitor housing, the power semiconductor device 1 and the power semiconductor device 2, and a control board or a drive board.

[0036] like Figure 2-5 As shown, it is a structural diagram of the heat dissipation mechanism of the motor controller provided by an embodiment of the utility model. When the cooling liquid 800 is filled in the housing water channel 103, the heat dissipation mechanism of the motor controller includes:

[0037] Controller housing 100;

[0038] A housing water channel 103, wherein the housing water channel 103 is enclosed by the capacitor housing 600 and the controller housing 100;

[0039] When the housing water channel 103 is filled with coolant 800, it contacts at least two side surfaces, the upper surface and the lower surface of the capacitor housing 600 to achieve heat dissipation of the capacitor housing 600, and the pin-type structure on the power semiconductor device (302, 402) is inserted into the coolant to achieve heat dissipation of the power semiconductor device (302, 402). Heat dissipation of the capacitor housing 600 is achieved.

[0040] The motor controller includes a capacitor housing 600 equipped with a bus capacitor 700 and a power semiconductor device (302, 402), wherein the capacitor housing 600 includes an upper surface, a lower surface and at least three side surfaces, such as Figure 2 As shown, the capacitor housing 600 is provided with water channels around it, and the depth of the water channels on the upper and lower sides can be 6 mm. The copper needles in the power semiconductor device 1 302 and the power semiconductor device 2 402 can be immersed in the housing water channel 103 to conduct the heat generated by the power semiconductor device to the coolant 800.

[0041] As an optional implementation, a first sealing ring 500 is provided between the capacitor housing 600 and the power semiconductor device (302, 402), and the first sealing ring 500 is used to prevent the coolant 800 in the housing water channel 103 from leaking into the capacitor housing 600.

[0042] As an optional embodiment, there are two power semiconductor devices, namely power semiconductor device 1 302 and power semiconductor device 2 402, which are respectively placed on the upper surface and lower surface of the capacitor housing 600, and the power semiconductor device 1 302 and the power semiconductor device 2 402 are sealed and connected to the capacitor housing 600 through the first sealing ring 500.

[0043] As an optional implementation, the first sealing ring 500 is fastened to the power semiconductor device (302, 402) and the capacitor housing 600 by fasteners such as bolts. Of course, those skilled in the art may also use other fastening methods to achieve this.

[0044] As an optional embodiment, the shell water channel 103 has a water inlet 101 and a water outlet 102 , and the water inlet 101 and the water outlet 102 both have a second sealing ring 200 , and the second sealing ring 200 is used to prevent the coolant 800 from leaking from the water inlet 101 or the water outlet 102 .

[0045] As an optional embodiment, the bus capacitor 700 is placed in the capacitor housing 600, and heat dissipation material is filled between the bus capacitor 700 and the capacitor housing 600, so that the heat generated by the bus capacitor 700 is conducted to the capacitor housing 600 through the heat dissipation material, and then cooled by the coolant 800 in the housing water channel 103.

[0046] As an optional implementation, the coolant 800 is driven by a pressure pump to flow in the housing water channel 103. That is, the pressure pump drives the coolant 800 to enter from the water inlet 101, and is discharged from the water outlet 102 after cooling the capacitor housing 600 and the power semiconductor devices (302, 402) of the bus capacitor 700.

[0047] As an optional implementation, the coolant is a 50% ethylene glycol type coolant. Using a 50% ethylene glycol type coolant can improve cooling efficiency.

[0048] As an optional embodiment, the needle structure includes at least one group of copper needles, and the group of copper needles is used to be inserted into the coolant 800 to contact it to achieve cooling.

[0049] As an optional implementation, the shell water channel 103 includes at least one row of holes, so that the copper needle penetrates the coolant 800 .

[0050] As an optional implementation, the housing water channel 103 may be enclosed by the capacitor housing 600 and the controller housing 100 .

[0051] As an optional implementation, Figure 3As shown, after the controller housing 100 is die-cast, the adapter is connected to the controller housing 100 by friction stir welding to achieve the connection between the water inlet 101 and the water outlet 102 and the housing water channel 103.

[0052] The utility model also discloses a motor controller having a motor controller heat dissipation mechanism as described in any one of the above embodiments. Figure 4-5 As shown, the heat dissipation mechanism involved in the above embodiment can be assembled separately, and then placed in the controller housing 100 for installation after the assembly is completed.

[0053] The power semiconductor device 1 302 and the power semiconductor device 2 402 are respectively arranged on the driving board or the control board (301, 401). Through the connection mode of series or parallel connection, the motor drive controller can realize the following functions: a DC-DC conversion controller for boosting or reducing the voltage of DC power, a DC-AC conversion controller for converting DC power into AC power, and an AC-AC conversion controller for regulating the voltage and frequency of AC power, so as to meet the application requirements of various working conditions.

[0054] The above are only specific implementations of the utility model, but the protection scope of the utility model is not limited thereto. Any technician familiar with the technical field can easily think of various changes or substitutions within the technical scope disclosed by the utility model, which should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.

Claims

1. A heat dissipation mechanism for a motor controller, characterized in that: include: Controller housing; A housing water channel, wherein the housing water channel is enclosed by a capacitor housing and a controller housing; When the shell water channel is filled with coolant, it contacts at least two side surfaces, the upper surface and the lower surface of the capacitor shell to achieve heat dissipation of the capacitor shell, and the needle structure on the power semiconductor device is inserted into the coolant to achieve heat dissipation of the power semiconductor device.

2. The motor controller heat dissipation mechanism according to claim 1, characterized in that: A first sealing ring is arranged between the capacitor housing and the power semiconductor device, and the first sealing ring is used to prevent the coolant in the housing water channel from leaking into the capacitor housing.

3. The motor controller heat dissipation mechanism according to claim 2, characterized in that: There are two power semiconductor devices, which are respectively placed on the upper surface and the lower surface of the capacitor housing. The two power semiconductor devices are sealed and connected to the capacitor housing through the first sealing ring.

4. The motor controller heat dissipation mechanism according to claim 2 or 3, characterized in that: The first sealing ring is fastened to the power semiconductor device and the capacitor housing by fasteners.

5. The motor controller heat dissipation mechanism according to claim 1, characterized in that: The shell water channel has a water inlet and a water outlet, and the water inlet and the water outlet both have a second sealing ring, and the second sealing ring is used to prevent the coolant from leaking from the water inlet or the water outlet; And / or, the busbar capacitor is placed in the capacitor housing, and heat dissipation material is filled between the busbar capacitor and the capacitor housing.

6. The heat dissipation mechanism of the motor controller according to claim 1, characterized in that: The coolant is driven to flow in the housing water channel by a pressure pump.

7. The heat dissipation mechanism of the motor controller according to claim 6, characterized in that: The coolant is a 50% ethylene glycol type coolant.

8. The heat dissipation mechanism of the motor controller according to claim 1, characterized in that: The needle structure comprises at least one group of copper needles, and the group of copper needles is used to be inserted into the coolant to contact the coolant to achieve cooling.

9. A motor controller, characterized in that: It comprises a motor controller heat dissipation mechanism as described in any one of claims 1 to 8, wherein the motor controller heat dissipation mechanism is used to dissipate heat for the motor controller.

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