Die bonder with stable operation of chip ejector pin

Abstract

The utility model discloses a die bonder with stable operation of chip thimbles, which relates to the technical field of die bonders and comprises a protective box, a workbench and a positioning table, the workbench is arranged in the middle of the protective box, and two groups of parallel transverse linear guide rails are symmetrically fixed at the top of the workbench. And the upper side of the transverse linear guide rail is connected with two groups of forward linear guide rails through magnet block rails. According to the die bonder with the stable operation of the chip ejector pin, the transmission motor is started to drive the screw rod and the magnet mechanism to be in threaded transmission, so that the magnet mechanism upwards pushes the mounting sleeve and the ejector pin body upwards jacks a substrate chip, and the transmission motor and the screw rod are matched to ensure that the ejector pin assembly has a stable and accurate lifting operation effect; when the ejector pin assembly ejects the wafer, the wafer can be stabilized, so that the die bonding mechanism can conveniently carry out wafer suction and grabbing operation, and the die bonding machine is ensured to have the operation effect that the ejector pin stably ejects the chip.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding machines, in particular to a crystal bonding machine with stably operated chip ejector pins. Background Art

[0002] The die bonder is a device used to achieve high-speed, high-precision, fully automatic placement of components. It is the most critical and complex equipment in the entire SMT production. The ejector pins of the die bonder mainly play the role of fixing and supporting components during the placement process, ensuring that the components can be accurately placed at the designated position on the PCB.

[0003] When the die bonder is in use, it needs to use the ejector assembly to push the wafer assembly of the chip. The conventional die bonder uses the cylinder to push the ejector assembly to eject the wafer assembly, which will produce a sudden push. This kind of ejection is relatively cumbersome and will affect the operation stability of the ejector when the vibration is too large. Therefore, we propose a die bonder with stable operation of the chip ejector. Utility Model Content

[0004] The utility model aims to provide a die bonding machine with stably operated chip ejector pins, so as to solve the problems raised by the above-mentioned background technology.

[0005] To achieve the above purpose, the utility model provides the following technical solutions: a die bonding machine with stable chip ejector pin operation, comprising a protection box, a workbench and a positioning table,

[0006] A workbench is provided in the middle of the protection box, and two sets of parallel transverse linear guides are symmetrically fixed on the top of the workbench. The upper sides of the transverse linear guides are connected to two sets of forward linear guides through magnet block tracks. The tops of the forward linear guides are slidably connected to moving seats, and the two sets of moving seats are respectively installed with a glue-dispensing mechanism and a crystal-fixing mechanism on the sides close to each other;

[0007] A positioning table is also provided on the upper side of the workbench, a wafer box is installed on the upper side of the positioning table, and a vertically intersecting track No. 1 and track No. 2 are provided on the lower side of the positioning table. Sliding modules are installed on the bottom of the positioning table and the bottom of track No. 1, and the positioning table is slidably connected to track No. 1 through the sliding module, and track No. 1 is slidably connected to track No. 2 through the sliding module.

[0008] Preferably, a rotating motor is embedded in the middle of the workbench, a transmission motor is installed on the side of the rotating motor through a bracket, the output end of the transmission motor is connected to a screw rod through a coupling, and the outer side of the screw rod is threadedly connected to a magnet mechanism.

[0009] Preferably, a rotating frame is installed at the top output end of the rotating motor, mounting sleeves are connected to both sides of the rotating frame, a thimble body is installed on the top of the mounting sleeve, and the thimble body includes two thimbles of different sizes, a No. 1 thimble and a No. 2 thimble.

[0010] Preferably, a material box is provided on one side of the outer wall of the protective box, and the material box is used to store a material tray for loading substrates. A support platform is fixed on the lower side of the material box, and the support platform is installed with a lifting frame on the surface of the protective box. A material pushing rack is installed on the side of the material box.

[0011] Preferably, an overview camera is installed on one side of the movable seat close to the dispensing mechanism and the crystal bonding mechanism, and a correction camera is installed on one side of the positioning platform close to the wafer box.

[0012] Preferably, two groups of straight rails and one group of rack rails are installed in parallel on the upper side of the workbench close to the material storage box, and the upper side of the straight rails is slidably connected to the front conveying platform and the rear conveying platform.

[0013] Preferably, a movable motor is installed on the side of the front conveying platform and the rear conveying platform, and a gear plate is installed at the bottom output end of the movable motor, and the gear plate is meshed with a rack.

[0014] Preferably, two groups of fixed suction cups are installed on the upper sides of the front conveying platform and the rear conveying platform, conveyors are provided on the upper sides of the front conveying platform and the rear conveying platform, and arch seats are installed on the lower sides of the conveyors.

[0015] Preferably, an inner cavity is opened in the middle of the rear conveying platform, and a mounting seat is provided in the inner cavity, the conveyor located above the front conveying platform is installed with the front conveying platform through the arched seat at the bottom, and the conveyor located above the rear conveying platform is plugged with the inner cavity of the rear conveying platform through the arched seat at the bottom, and sliding sleeves are fixed on both sides of the inner wall of the arched seat.

[0016] Preferably, a driving motor is mounted on the bottom of the mounting seat by screws, guide rails connected to the sliding sleeve are mounted on both sides of the driving motor, two sets of pulleys are mounted on one side of the driving motor, and one of the pulleys is fixed to the output end of the driving motor, and toothed belts are mounted on the outer sides of the two pulleys;

[0017] A clamping seat is installed on one side of the toothed belt, and one end of the clamping seat away from the toothed belt is fixed to an arched seat inserted in the inner cavity of the rear conveying platform.

[0018] Compared with the prior art, the beneficial effects of the utility model are:

[0019] 1. The chip ejector pin of the die bonding machine operates stably. The drive motor is started to drive the lead screw and the magnet mechanism to transmit the thread, so that the magnet mechanism pushes the mounting sleeve upward and the ejector body lifts the substrate chip upward. The cooperation between the drive motor and the lead screw ensures that the ejector pin assembly has a stable and precise lifting and lowering operation. When the ejector pin assembly ejects the wafer, the wafer can be stabilized, which facilitates the crystal bonding mechanism to suck and grab the wafer, ensuring that the die bonding machine has the operation effect of ejecting the chip stably with the ejector pin;

[0020] 2. The die bonding machine with stable chip ejector pin operation starts the driving motor to drive the two sets of pulleys to rotate forward and reverse, so that the toothed belts on the outer sides of the two sets of pulleys run forward and reverse, and the toothed belts drive the clamping seat to push and pull the arch seat up and down, so that the arch seat slides up and down along the guide rail on the side of the driving motor through the inner sliding sleeve, and then the arch seat moves up and down along the inner cavity of the rear conveyor table, so that the arch seat can fine-tune the lifting and lowering of the conveyor on the rear conveyor table, which is convenient for driving the support tray to fine-tune the displacement in height, and realizes the positioning adjustment of the substrate containing components. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0022] Figure 2 It is a three-dimensional structural schematic diagram of the workbench of the utility model;

[0023] Figure 3 This is a schematic diagram of the three-dimensional structure of the workbench of the utility model after the viewing angle is changed;

[0024] Figure 4 It is a three-dimensional structural schematic diagram of the positioning platform of the utility model;

[0025] Figure 5 This is a schematic diagram of the structure of the stereoscopic platform after the viewing angle of the positioning platform of the utility model is changed;

[0026] Figure 6 This is a schematic diagram of the main cutaway structure of the positioning platform of the utility model;

[0027] Figure 7 This is a schematic diagram of the three-dimensional explosion structure of the utility model;

[0028] Figure 8 It is a three-dimensional structural schematic diagram of the front conveying platform and the rear conveying platform of the utility model;

[0029] Fig. 9 It is a schematic diagram of the three-dimensional exploded structure of the front conveying platform and the rear conveying platform of the utility model;

[0030] Fig.10 It is a schematic diagram of the three-dimensional cutaway structure of the rear conveying platform of the utility model.

[0031] In the figure: 1, protective box; 2, workbench; 3, material storage box; 301, support platform; 302, lifting frame; 303, push rack; 4, straight rail; 401, gear rail; 402, front conveyor platform; 403, rear conveyor platform; 403a, mounting seat; 403b, arch seat; 403c, sliding sleeve; 403d, driving motor; 403e, guide rail; 403f, pulley; 403g, toothed belt; 403h, clamping seat; 404, mobile motor; 405, gear plate; 406, fixed suction cup; 407, conveyor; 5, support tray ; 6. Horizontal linear guide; 7. Forward linear guide; 701. Moving seat; 702. Glue dispensing mechanism; 703. Crystal bonding mechanism; 704. Overview camera; 8. Positioning table; 801. Wafer box; 802. Correction camera; 803. Track No. 1; 804. Sliding module; 805. Track No. 2; 9. Rotating motor; 901. Transmission motor; 902. Screw rod; 903. Magnet mechanism; 904. Rotating frame; 905. Mounting sleeve; 906. Ejector body; 906a. Ejector No. 1; 906b. Ejector No. 2. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0033] See also Figure 1-Figure 6 The utility model provides a technical solution: a die bonding machine with stable operation of chip ejector pins, comprising a protection box 1, a workbench 2 and a positioning table 8, a workbench 2 is arranged in the middle of the protection box 1, two sets of parallel transverse linear guide rails 6 are symmetrically fixed on the top of the workbench 2, two sets of forward linear guide rails 7 are connected to the upper side of the transverse linear guide rails 6 through magnet block tracks, the tops of the forward linear guide rails 7 are slidably connected with moving seats 701, and a glue dispensing mechanism 702 and a die bonding mechanism 703 are respectively installed on the sides of the two sets of moving seats 701 close to each other;

[0034] A positioning table 8 is also provided on the upper side of the workbench 2, and a wafer box 801 is installed on the upper side of the positioning table 8. A vertically intersecting track 803 and track 805 are provided on the lower side of the positioning table 8. A sliding module 804 is installed on the bottom of the positioning table 8 and the bottom of track 803. The positioning table 8 is slidably connected to the track 803 through the sliding module 804, and the track 803 is slidably connected to the track 805 through the sliding module 804.

[0035] See also Figure 5 and Figure 7A rotating motor 9 is embedded in the middle of the workbench 2, a transmission motor 901 is installed on the side of the rotating motor 9 through a bracket, an output end of the transmission motor 901 is connected to a screw rod 902 through a coupling, and a magnet mechanism 903 is threadedly connected to the outer side of the screw rod 902;

[0036] A rotating frame 904 is installed at the top output end of the rotating motor 9, and mounting sleeves 905 are connected to both sides of the rotating frame 904. A pin body 906 is installed on the top of the mounting sleeve 905, and the pin body 906 includes two pins 906a and 906b of different sizes. The magnet mechanism 903 and the mounting sleeve 905 constitute an electromagnet structure.

[0037] In specific implementation, after the wafer and substrate placed on the positioning table 8 have completed the chip mounting process, the transmission motor 901 is started to drive the screw rod 902 to rotate forward, so that the screw rod 902 and the middle part of the magnet mechanism 903 are threadedly driven, so that the upper end of the magnet mechanism 903 pushes the mounting sleeve 905, so that the magnet mechanism 903 and the mounting sleeve 905 are magnetically combined together, so that the mounting sleeve 905 drives the ejector body 906 to lift the substrate chip upward, which is the ejector operation state;

[0038] When the transmission motor 901 drives the screw rod 902 to reverse, the screw rod 902 and the middle part of the magnet mechanism 903 perform reverse thread transmission, so that the magnet mechanism 903 moves down along the matching vertical slideway. When the installation sleeve 905 is hung on the rotating frame 904, the magnet mechanism 903 and the installation sleeve 905 are separated from the electromagnetic attraction, which facilitates the reset of the magnet mechanism 903 and the ejector body 906. This is the recovery state of the ejector operation.

[0039] When the rotating motor 9 is started, the rotating frame 904 can be driven to rotate at an angle, which is convenient for switching between two ejector pins No. 1 906a and No. 2 906b of different sizes, thereby realizing the optional use of the ejector pin body 906. The cooperation of the transmission motor 901 and the screw rod 902 can ensure that the ejector pin assembly of the crystal bonding machine has a stable and precise lifting and lowering operation. The wafer can be stabilized when the ejector pin assembly ejects the wafer, which is convenient for the crystal bonding mechanism 703 to perform the crystal suction and grabbing operation.

[0040] See also Figure 2 and Figure 3 A material box 3 is provided on one side of the outer wall of the protection box 1. The material box 3 is used to store a material tray 5 for loading substrates. A support platform 301 is fixed on the lower side of the material box 3. The support platform 301 is installed with a lifting frame 302 on the surface of the protection box 1. A material pushing rack 303 is installed on the side of the material box 3.

[0041] During the specific implementation, the lifting frame 302 and the pushing frame 303 are driven by the motor to operate the screw rod, so that the lifting frame 302 and the pushing frame 303 have the ability to lift and lower as well as move forward and backward. When the lifting frame 302 drives the support platform 301 to drive the storage box 3 to move up and down, the position adjustment of the storage box 3 can be completed, so that when the storage box 3 is at different heights, the material tray 5 in the storage box 3 can be flush with the front conveying platform 402 on the workbench 2, which is convenient for feeding the material tray 5, and starting the pushing frame 303 can push the material tray 5 containing the component substrate to the front conveying platform 402.

[0042] See also Figure 2 An overview camera 704 is installed on one side of the moving seat 701 close to the dispensing mechanism 702 and the crystal bonding mechanism 703 , and a correction camera 802 is installed on one side of the positioning platform 8 close to the wafer box 801 .

[0043] During specific implementation, an overview camera 704 is installed on the two movable seats 701. When the two movable seats 701 follow the lateral linear guide 6 and the forward linear guide 7 to adjust their positions, the overview camera 704 can assist the glue dispensing mechanism 702 and the crystal bonding mechanism 703 to perform precise glue dispensing and crystal bonding operations. At the same time, the correction camera 802 can assist the positioning table 8 to follow the No. 1 track 803 and the No. 2 track 805 to adjust their positions, thereby ensuring that the positioning table 8 corrects the patch position.

[0044] See also Figure 2 , Figure 8 and Fig. 9 Two sets of straight rails 4 and a set of rack rails 401 are installed in parallel on the upper side of the workbench 2 near the storage box 3, and the upper side of the straight rails 4 is slidably connected with the front conveying platform 402 and the rear conveying platform 403; the sides of the front conveying platform 402 and the rear conveying platform 403 are both installed with moving motors 404, and the bottom output end of the moving motor 404 is installed with a gear plate 405, which is meshed with the rack rail 401.

[0045] In specific implementation, when the pushing rack 303 pushes the material tray 5 in the material storage box 3 onto the front conveying platform 402, and by starting the moving motor 404 to drive the gear plate 405 to engage with the rack rail 401, the front conveying platform 402 moves toward the rear conveying platform 403. When the two are in contact, the conveyor 407 on the front conveying platform 402 is started to send the material tray 5 to the conveyor 407 of the rear conveying platform 403, so as to facilitate feeding.

[0046] See also Figure 8 and Fig. 9Two groups of fixed suction cups 406 are installed on the upper sides of the front conveying platform 402 and the rear conveying platform 403, conveyors 407 are arranged on the upper sides of the front conveying platform 402 and the rear conveying platform 403, and arch seats 403b are installed on the lower sides of the conveyors 407. When the front conveying platform 402 and the rear conveying platform 403 are adjusted in position along the straight rail 4, the fixed suction cups 406 can be started to adsorb the supporting tray 5 to ensure the stability of feeding.

[0047] See also Figure 8-Figure 10 An inner cavity is provided in the middle of the rear conveying platform 403, and a mounting seat 403a is provided in the inner cavity. The conveyor 407 located above the front conveying platform 402 is mounted on the front conveying platform 402 through the arch seat 403b at the bottom. The conveyor 407 located above the rear conveying platform 403 is plugged into the inner cavity of the rear conveying platform 403 through the arch seat 403b at the bottom. Slide sleeves 403c are fixed on both sides of the inner wall of the arch seat 403b.

[0048] A driving motor 403d is installed on the bottom of the mounting seat 403a by screws, and guide rails 403e connected to the sliding sleeve 403c are installed on both sides of the driving motor 403d; two sets of pulleys 403f are installed on one side of the driving motor 403d, and one of the pulleys 403f is fixed to the output end of the driving motor 403d, and a toothed belt 403g is sleeved on the outer side of the two pulleys 403f; a clamping seat 403h is installed on one side of the toothed belt 403g, and the end of the clamping seat 403h away from the toothed belt 403g is fixed to the arched seat 403b inserted in the inner cavity of the rear conveying platform 403.

[0049] During specific implementation, the driving motor 403d is started to drive the two sets of pulleys 403f to rotate forward and reverse, so that the toothed belts 403g outside the two sets of pulleys 403f can run forward and reverse, so that the clamping seat 403h installed on the toothed belt 403g can push and pull the arch seat 403b up and down, so that the arch seat 403b slides up and down along the guide rail 403e on the side of the driving motor 403d through the inner sliding sleeve 403c, and then drives the arch seat 403b to move up and down along the inner cavity of the rear conveying platform 403, so that the arch seat 403b can fine-tune the lifting and lowering of the conveyor 407 on the rear conveying platform 403, which is convenient for driving the supporting tray 5 to perform fine-tuning of the height displacement, thereby realizing the positioning adjustment of the substrate containing components.

[0050] In summary, by arranging a protective box 1 on the outside of the workbench 2 and arranging an observation port on the outside of the protective box 1, it is convenient for the staff to observe the operation of the crystal bonding machine when the protective box 1 protects the workbench 2. When the tray 5 containing the component substrates is sent to the inside of the protective box 1, the two groups of movable seats 701 can be driven to reciprocate in the lateral and forward directions by starting the transverse linear guide 6 and the forward linear guide 7, so that the substrate can be glued by the glue dispensing head of the glue dispensing mechanism 702, and at the same time, the substrate and the wafer in the wafer box 801 can be sucked by the suction nozzle of the crystal bonding mechanism 703 and sent to the positioning table 8 for patch processing. The contents not described in detail in this description belong to the existing technology known to professional and technical personnel in this field.

[0051] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A die bonding machine with stable chip ejector pin operation, comprising a protection box (1), a workbench (2) and a positioning table (8), characterized in that: A workbench (2) is provided in the middle of the protection box (1), two groups of parallel transverse linear guide rails (6) are symmetrically fixed on the top of the workbench (2), the upper side of the transverse linear guide rails (6) is connected to two groups of forward linear guide rails (7) through magnet block tracks, the tops of the forward linear guide rails (7) are slidably connected to moving seats (701), and the two groups of moving seats (701) are respectively installed with a glue dispensing mechanism (702) and a crystal fixing mechanism (703) on the sides close to each other; A positioning platform (8) is also provided on the upper side of the workbench (2), a wafer box (801) is installed on the upper side of the positioning platform (8), and a vertically intersecting track No. 1 (803) and track No. 2 (805) are provided on the lower side of the positioning platform (8). A sliding module (804) is installed at the bottom of the positioning platform (8) and the bottom of the track No. 1 (803). The positioning platform (8) is slidably connected to the track No. 1 (803) through the sliding module (804), and the track No. 1 (803) is slidably connected to the track No. 2 (805) through the sliding module (804).

2. A die bonding machine with stable chip ejector pin operation according to claim 1, characterized in that: A rotating motor (9) is embedded in the middle of the workbench (2), a transmission motor (901) is installed on the side of the rotating motor (9) via a bracket, an output end of the transmission motor (901) is connected to a screw rod (902) via a coupling, and a magnet mechanism (903) is threadedly connected to the outer side of the screw rod (902).

3. A die bonding machine with stable chip ejector pin operation according to claim 2, characterized in that: A rotating frame (904) is installed at the top output end of the rotating motor (9), and mounting sleeves (905) are connected to both sides of the rotating frame (904). A thimble body (906) is installed on the top of the mounting sleeve (905), and the thimble body (906) includes a first thimble (906a) and a second thimble (906b) of different sizes.

4. The die bonding machine with stable chip ejector pin operation according to claim 1, characterized in that: A material box (3) is provided on one side of the outer wall of the protective box (1), and the material box (3) is used to store a material tray (5) for loading substrates. A support platform (301) is fixed on the lower side of the material box (3), and the support platform (301) is installed with a lifting frame (302) on the surface of the protective box (1). A material pushing frame (303) is installed on the side of the material box (3).

5. The die bonding machine with stable chip ejector pin operation according to claim 1, characterized in that: An overview camera (704) is installed on one side of the movable seat (701) close to the dispensing mechanism (702) and the crystal bonding mechanism (703), and a correction camera (802) is installed on one side of the positioning platform (8) close to the wafer box (801).

6. The die bonding machine with stable chip ejector pin operation according to claim 1, characterized in that: Two groups of straight rails (4) and a group of toothed rails (401) are installed in parallel on the upper side of the workbench (2) close to the material storage box (3); the upper side of the straight rails (4) is slidably connected to a front conveying platform (402) and a rear conveying platform (403).

7. The die bonding machine with stable chip ejector pin operation according to claim 6, characterized in that: A moving motor (404) is installed on the side of the front conveying platform (402) and the rear conveying platform (403), and a gear plate (405) is installed on the bottom output end of the moving motor (404), and the gear plate (405) is meshed with the rack (401).

8. The die bonding machine with stable chip ejector pin operation according to claim 7, characterized in that: Two groups of fixed suction cups (406) are installed on the upper sides of the front conveying platform (402) and the rear conveying platform (403), and conveyors (407) are arranged on the upper sides of the front conveying platform (402) and the rear conveying platform (403), and arch seats (403b) are installed on the lower sides of the conveyors (407).

9. The die bonding machine with stable chip ejector pin operation according to claim 8, characterized in that: An inner cavity is provided in the middle of the rear conveying platform (403), and a mounting seat (403a) is provided in the inner cavity; the conveyor (407) located above the front conveying platform (402) is mounted on the front conveying platform (402) via an arched seat (403b) at the bottom; the conveyor (407) located above the rear conveying platform (403) is plugged into the inner cavity of the rear conveying platform (403) via an arched seat (403b) at the bottom; and sliding sleeves (403c) are fixed on both sides of the inner wall of the arched seat (403b).

10. The die bonding machine with stable chip ejector pin operation according to claim 9, characterized in that: A driving motor (403d) is installed at the bottom of the mounting seat (403a) by means of screws, guide rails (403e) connected to the sliding sleeve (403c) are installed on both sides of the driving motor (403d), two sets of pulleys (403f) are installed on one side of the driving motor (403d), and one of the pulleys (403f) is fixed to the output end of the driving motor (403d), and toothed belts (403g) are provided on the outer sides of the two pulleys (403f); A clamping seat (403h) is installed on one side of the toothed belt (403g), and one end of the clamping seat (403h) away from the toothed belt (403g) is fixed to an arched seat (403b) inserted in the inner cavity of the rear conveying platform (403).

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