Liquid drainage mechanism for silicon wafer thinning machine

Abstract

The utility model provides a liquid discharge mechanism for a silicon wafer thinning machine, and relates to the technical field of semiconductor silicon wafers, a liquid discharge port is arranged at the middle position in a bottom plate of the thinning machine, a mounting plate is arranged at the middle position of one end of the bottom plate of the thinning machine, and a cleaning mechanism is arranged at the outer sides of a liquid discharge pipe and a connecting plate; the cleaning mechanism is arranged on the outer side of the liquid discharging pipe and the outer side of the connecting plate, and the cleaning plate can be driven to rotate on the outer side of the liquid discharging pipe and the outer side of the connecting plate through cooperation of a rotating ring, the cleaning plate, a cleaning brush, a transmission gear ring, a connecting rod, a mounting base, a servo motor, a driving gear, a limiting rail and a limiting block of the cleaning mechanism; and then a cleaning brush is used for cleaning a liquid discharging pipe and a connecting plate, so that a first liquid discharging hole and a second liquid discharging hole are not prone to being blocked in the using process, the effect of the first liquid discharging hole and the second liquid discharging hole is better in the using process, and the practicability of the liquid discharging mechanism in the using process is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor silicon slices, in particular to a liquid discharge mechanism for a silicon slice thinning machine. Background Art

[0002] With the development of economy and the continuous improvement of science and technology, my country's semiconductor industry has developed very rapidly. Silicon wafers are used more and more in the semiconductor industry. Silicon wafers need to be processed by thinning machines during production and processing. Thinning machines need to use drainage mechanisms for drainage when in use.

[0003] For example, application number CN220312788U discloses a "drainage device for silicon wafer thinning equipment" and specifically discloses: a mounting seat, the mounting seat is detachably connected to a drainage port arranged at the bottom of the silicon wafer thinning equipment, the top of the mounting seat is fixedly connected to a convex drainage pipe, the top of the drainage pipe is fixedly connected to a cover plate, and a plurality of drainage holes are arranged on the cover plate and the drainage pipe. However, in the above technology, when in use, when the drainage hole is blocked, it is inconvenient to clean the drainage hole, which makes the drainage mechanism less effective during use, thereby reducing the practicability of the drainage mechanism during use. Therefore, the utility model proposes a drainage mechanism for a silicon wafer thinning machine to solve the above problems. Utility Model Content

[0004] In view of the above problems, the utility model proposes a drainage mechanism for a silicon wafer thinning machine, which solves the problem that after the drainage hole is blocked, it is inconvenient to clean the drainage hole, which makes the drainage mechanism less effective when used, thereby reducing the practicality of the drainage mechanism when used.

[0005] To achieve the purpose of the utility model, the utility model is implemented through the following technical solutions: a drainage mechanism for a silicon wafer thinning machine, comprising a thinning machine bottom plate and a drainage port, a drainage port is opened at the middle position inside the thinning machine bottom plate, a mounting plate is installed at the middle position of one end of the thinning machine bottom plate, fixing pins are installed at the four corners of the mounting plate, a drainage pipe is installed at the top of the mounting plate, a first drainage hole is opened on the inner wall of the drainage pipe, a connecting plate is installed at the top of the drainage pipe, a second drainage hole is opened inside the connecting plate, and a cleaning mechanism is arranged on the outer side of the drainage pipe and the connecting plate.

[0006] A further improvement is that the cleaning mechanism includes a rotating ring, a cleaning plate, a cleaning brush and a transmission structure, the rotating ring is arranged above the mounting plate, the cleaning plate is fixedly mounted on the inner wall of the rotating ring, and the cleaning brush is mounted on the inner side of the cleaning plate.

[0007] A further improvement is that the transmission structure includes a transmission gear ring, a connecting rod, a mounting seat, a servo motor, a driving gear and a limiting structure, the transmission gear ring is installed on the outer side wall of the rotating ring, a connecting rod is installed on the top of the mounting plate, a mounting seat is installed on the top of the connecting rod, a driving gear is installed on the inner side of the mounting seat, the transmission gear ring and the driving gear are meshed with each other, a servo motor is installed on the bottom end of the mounting seat, and the output end of the servo motor is connected to one end of the driving gear.

[0008] A further improvement is that the limiting structure includes a limiting rail and a limiting block, the limiting rail is installed on the top of the mounting plate, the limiting blocks are symmetrically arranged inside the limiting rail, and the top of the limiting block is connected to the bottom end of the rotating ring.

[0009] A further improvement is that the inner diameter of the limit rail is larger than the outer diameter of the limit block, and a sliding structure is formed between the limit rail and the limit block.

[0010] A further improvement is that the inner diameter of the drainage port is the same as the inner diameter of the drainage pipe, and the centers of the drainage port and the drainage pipe are on the same vertical line.

[0011] The beneficial effects of the utility model are as follows: by arranging a cleaning mechanism on the outer sides of the drainage pipe and the connecting plate, the cleaning plate, the cleaning brush, the transmission gear ring, the connecting rod, the mounting seat, the servo motor, the driving gear, the limit rail and the limit block of the cleaning mechanism can be used to drive the cleaning plate to rotate on the outer sides of the drainage pipe and the connecting plate, and then the drainage pipe and the connecting plate can be cleaned by the cleaning brush, so that the first drainage hole and the second drainage hole are not easily blocked when in use, so that the first drainage hole and the second drainage hole have better effects when in use, thereby greatly improving the practicality of the drainage mechanism when in use. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0013] Figure 2 This is a schematic diagram of the overall structure of the cleaning mechanism of the utility model;

[0014] Figure 3 It is a schematic diagram of the overall structure of the limiting structure of the utility model;

[0015] Figure 4 It is a schematic diagram of the overall structure of the transmission structure of the utility model.

[0016] Among them: 1. Thinning machine bottom plate; 2. Drain port; 3. Mounting plate; 4. Fixing pin; 5. Drain pipe; 6. First drain hole; 7. Connecting plate; 8. Second drain hole; 9. Rotating ring; 10. Cleaning plate; 11. Cleaning brush; 12. Transmission gear ring; 13. Connecting rod; 14. Mounting seat; 15. Servo motor; 16. Driving gear; 17. Limit rail; 18. Limit block. DETAILED DESCRIPTION

[0017] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with an embodiment. The embodiment is only used to explain the present invention and does not constitute a limitation on the protection scope of the present invention.

[0018] according to Figure 1 , 2 As shown in Figures 3 and 4, this embodiment proposes a drainage mechanism for a silicon wafer thinning machine, including a thinning machine base plate 1 and a drainage port 2, the drainage port 2 is opened at the middle position inside the thinning machine base plate 1, a mounting plate 3 is installed at the middle position of one end of the thinning machine base plate 1, fixing pins 4 are installed at the four corners of the mounting plate 3, a drainage pipe 5 is installed at the top of the mounting plate 3, a first drainage hole 6 is opened on the inner wall of the drainage pipe 5, a connecting plate 7 is installed at the top of the drainage pipe 5, a second drainage hole 8 is opened inside the connecting plate 7, and a cleaning mechanism is arranged on the outer sides of the drainage pipe 5 and the connecting plate 7.

[0019] The cleaning mechanism includes a rotating ring 9, a cleaning plate 10, a cleaning brush 11 and a transmission structure. The rotating ring 9 is arranged above the mounting plate 3. The cleaning plate 10 is fixedly mounted on the inner wall of the rotating ring 9. The cleaning brush 11 is mounted on the inner side of the cleaning plate 10. The transmission structure includes a transmission gear ring 12, a connecting rod 13, a mounting seat 14, a servo motor 15, a driving gear 16 and a limiting structure. The transmission gear ring 12 is mounted on the outer side wall of the rotating ring 9. The connecting rod 13 is mounted on the top of the mounting plate 3. The mounting seat 14 is mounted on the top of the connecting rod 13. The driving gear 16 is mounted on the inner side of the mounting seat 14. The transmission gear ring 12 and the driving gear 16 are meshed with each other. A servo motor 15 is installed at the bottom, and the output end of the servo motor 15 is connected to one end of the driving gear 16. When in use, the servo motor 15 is started to drive the mounting seat 14 to rotate. Since the transmission gear ring 12 and the mounting seat 14 are meshed with each other, the transmission gear ring 12 is used to drive the rotating ring 9 to rotate under the limit of the limit rail 17 and the limit block 18, and then the cleaning plate 10 is driven to rotate on the outside of the drain pipe 5 and the connecting plate 7. Therefore, the cleaning brush 11 is used to clean the first drainage hole 6 and the second drainage hole 8, so that the first drainage hole 6 and the second drainage hole 8 are not easy to be blocked during use, so the use effect of the first drainage hole 6 and the second drainage hole 8 is better, thereby greatly improving the practicality of the drainage mechanism during use.

[0020] The limiting structure includes a limiting rail 17 and a limiting block 18. The limiting rail 17 is installed on the top of the mounting plate 3. The limiting block 18 is symmetrically arranged inside the limiting rail 17. The top of the limiting block 18 is connected to the bottom end of the rotating ring 9. The inner diameter of the limiting rail 17 is larger than the outer diameter of the limiting block 18. A sliding structure is formed between the limiting rail 17 and the limiting block 18. When in use, the limiting rail 17 and the limiting block 18 cooperate with each other to limit the rotating ring 9 during rotation, so that the rotating ring 9 is more stable during rotation.

[0021] The inner diameter of the drainage port 2 is the same as the inner diameter of the drainage pipe 5, and the centers of the drainage port 2 and the drainage pipe 5 are on the same vertical line, so that the drainage effect of the thinning machine is better.

[0022] Working principle: the staff first uses the fixing pin 4 to fix the mounting plate 3 on the bottom plate 1 of the thinning machine to complete the convenient installation of the drain pipe 5, so that a sealing gasket is provided at the connection between the mounting plate 3 and the bottom plate 1 of the thinning machine, so that the connection between the mounting plate 3 and the bottom plate 1 of the thinning machine is not easy to leak. When the thinning machine is drained, the drainage can be carried out through the first drainage hole 6 and the second drainage hole 8. When the first drainage hole 6 and the second drainage hole 8 need to be cleaned, the servo motor 15 is started to drive the mounting seat 14 to rotate. Since the transmission gear ring 12 and the mounting seat 14 are meshed with each other, the transmission gear ring 12 is used to drive the rotating ring 9 to rotate under the limit of the limit rail 17 and the limit block 18, and then the cleaning plate 10 is driven to rotate on the outside of the drain pipe 5 and the connecting plate 7. Therefore, the cleaning brush 11 is used to clean the first drainage hole 6 and the second drainage hole 8, so that the first drainage hole 6 and the second drainage hole 8 are not easily blocked during use, so the use effect of the first drainage hole 6 and the second drainage hole 8 is better.

[0023] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only for explaining the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A liquid discharge mechanism for a silicon wafer thinning machine, comprising a thinning machine bottom plate (1) and a liquid discharge port (2), characterized in that: A drainage port (2) is provided at the middle position inside the thinning machine bottom plate (1); a mounting plate (3) is installed at the middle position of one end of the thinning machine bottom plate (1); fixing pins (4) are installed at the four corners of the mounting plate (3); a drainage pipe (5) is installed at the top end of the mounting plate (3); a first drainage hole (6) is provided on the inner wall of the drainage pipe (5); a connecting plate (7) is installed at the top end of the drainage pipe (5); a second drainage hole (8) is provided inside the connecting plate (7); and cleaning mechanisms are provided on the outer sides of the drainage pipe (5) and the connecting plate (7).

2. A liquid discharge mechanism for a silicon wafer thinning machine according to claim 1, characterized in that: The cleaning mechanism comprises a rotating ring (9), a cleaning plate (10), a cleaning brush (11) and a transmission structure; the rotating ring (9) is arranged above the mounting plate (3); the cleaning plate (10) is fixedly mounted on the inner wall of the rotating ring (9); and the cleaning brush (11) is mounted on the inner side of the cleaning plate (10).

3. A liquid discharge mechanism for a silicon wafer thinning machine according to claim 2, characterized in that: The transmission structure comprises a transmission gear ring (12), a connecting rod (13), a mounting seat (14), a servo motor (15), a driving gear (16) and a limiting structure. The transmission gear ring (12) is mounted on the outer side wall of the rotating ring (9). The top end of the mounting plate (3) is mounted with a connecting rod (13). The top end of the connecting rod (13) is mounted with a mounting seat (14). The inner side of the mounting seat (14) is mounted with a driving gear (16). The transmission gear ring (12) and the driving gear (16) are meshed with each other. The bottom end of the mounting seat (14) is mounted with a servo motor (15). The output end of the servo motor (15) is connected to one end of the driving gear (16).

4. A liquid discharge mechanism for a silicon wafer thinning machine according to claim 3, characterized in that: The limiting structure comprises a limiting rail (17) and a limiting block (18); the limiting rail (17) is mounted on the top end of the mounting plate (3); the limiting block (18) is symmetrically arranged inside the limiting rail (17); the top end of the limiting block (18) is connected to the bottom end of the rotating ring (9).

5. The liquid discharge mechanism for a silicon wafer thinning machine according to claim 4, characterized in that: The inner diameter of the limit rail (17) is greater than the outer diameter of the limit block (18), and a sliding structure is formed between the limit rail (17) and the limit block (18).

6. The liquid discharge mechanism for a silicon wafer thinning machine according to claim 1, characterized in that: The inner diameter of the liquid discharge port (2) is the same as the inner diameter of the liquid discharge pipe (5), and the centers of the liquid discharge port (2) and the liquid discharge pipe (5) are on the same vertical line.

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