Refrigeration equipment and cooling clothes

Abstract

The utility model discloses refrigeration equipment and cooling clothes. A semiconductor refrigeration assembly comprises a semiconductor refrigerator, a first heat exchanger and a second heat exchanger. The semiconductor cooler is provided with a first end face and a second end face which are opposite to each other, the inner end face of the first heat exchanger is connected with the first end face in a welded or pasted mode, and the inner end face of the second heat exchanger is connected with the second end face in a welded or pasted mode. The first heat exchanger and the second heat exchanger are each provided with a heat exchange channel. And the first heat exchanger and the second heat exchanger are asymmetrically arranged relative to the semiconductor cooler. According to the semiconductor refrigeration assembly, the refrigeration equipment and the cooling clothes, the problem that in the prior art, a semiconductor refrigeration system is low in refrigeration efficiency can be effectively solved, and meanwhile the semiconductor refrigeration assembly, the refrigeration equipment and the cooling clothes have the advantages of being reasonable in structural arrangement and high in refrigeration efficiency.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor refrigeration, in particular to a semiconductor refrigeration component, refrigeration equipment and cooling clothing. Background Art

[0002] Semiconductor refrigeration uses the thermoelectric effect of materials, with semiconductor refrigerators as the core refrigeration components. By connecting cold-end and hot-end heat exchangers at the cold and hot ends of the semiconductor refrigerator to form a refrigeration system, the heat exchange between the hot-end heat exchanger and the ambient space and the cold-end heat exchanger to the load are realized. By adjusting the working voltage or current of the semiconductor refrigerator, the cooling capacity output by the semiconductor refrigerator can be controlled, which brings great convenience to users.

[0003] Compared with existing refrigeration systems, semiconductor refrigeration systems are significantly smaller and more portable, providing a more suitable application scenario for semiconductor refrigeration technology to regulate temperature in small spaces. Therefore, they are often used in outdoor scenarios where loads need to be cooled and cooled. Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the equipment, the overall structure of the equipment is generally being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the equipment is also compressed, resulting in a problem of low refrigeration efficiency. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor refrigeration component, refrigeration equipment and cooling clothing, which can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time have the advantages of reasonable structural setting and high refrigeration efficiency.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] A semiconductor refrigeration assembly comprises a semiconductor refrigerator, a first heat exchanger, and a second heat exchanger;

[0007] The semiconductor refrigerator is provided with a first end face and a second end face opposite to each other, the inner end face of the first heat exchanger is connected to the first end face by welding or gluing, the inner end face of the second heat exchanger is connected to the second end face by welding or gluing, and the first heat exchanger and the second heat exchanger are both provided with a heat exchange channel;

[0008] The first heat exchanger and the second heat exchanger are asymmetrically arranged with respect to the semiconductor refrigerator.

[0009] Preferably, it further comprises a stress equalizing plate; the stress equalizing plate is attached to the outer end surface of the first heat exchanger and / or the second heat exchanger.

[0010] Preferably, the stress equalization plate is made of copper.

[0011] Preferably, the stress equalization plate has a thickness of 0.1 to 0.5 mm.

[0012] Preferably, the heat exchange channel is formed by repeatedly folding a heat conducting plate, and the heat conducting plate is made of either copper or aluminum.

[0013] Preferably, the first end surface of the semiconductor refrigerator is a cold end surface, and the second end surface of the semiconductor refrigerator is a hot end surface;

[0014] The width of the heat exchange channel of the first heat exchanger is m, the width of the heat exchange channel of the second heat exchanger is n, and m>n.

[0015] Preferably, the first end surface of the semiconductor refrigerator is a cold end surface, and the second end surface of the semiconductor refrigerator is a hot end surface;

[0016] The length of the heat exchange channel of the first heat exchanger is H, the length of the heat exchange channel of the second heat exchanger is h, and H<h.

[0017] A refrigeration device using the semiconductor refrigeration component;

[0018] It also includes a heat exchange fan and a shell, wherein the semiconductor refrigeration component and the heat exchange fan are both installed inside the shell, and the outlet of the heat exchange fan is arranged toward the air inlet end of the heat exchange channel;

[0019] The shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the first end face of the semiconductor refrigerator is a cold end face, and the second end face of the semiconductor refrigerator is a hot end face; and the inlet of the heat exchange fan is arranged close to the air inlet, the first heat exchanger is arranged close to the cooling outlet, and the second heat exchanger is arranged close to the heat dissipation outlet.

[0020] Preferably, the heat exchange fan is a centrifugal fan, and the air inlet is located on the side wall of the shell.

[0021] Preferably, the heat exchange fan is an axial flow fan, and the air inlet is located at the bottom of the housing.

[0022] A cooling suit using the above refrigeration device;

[0023] It also includes a body structure, the refrigeration device is installed on the body structure, and the air inlet and the refrigeration outlet are both located inside the body structure, and the heat dissipation outlet is located outside the body structure.

[0024] The technical solution provided by the embodiment of the utility model may have the following beneficial effects:

[0025] 1. A welding or pasting joint structure is adopted between the semiconductor refrigerator and the heat exchangers at both ends, which ensures the effective connection between the semiconductor refrigerator and the heat exchanger, thereby ensuring that the cold and heat generated in the semiconductor refrigerator can be directly and effectively output, avoiding the loss of cold and heat in the mechanical connection structure, solving the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and having the advantages of reasonable structural setting and high refrigeration efficiency.

[0026] 2. The first heat exchanger and the second heat exchanger are designed to have an asymmetric structure, which can ensure that there is a difference in heat exchange between the two heat exchangers, so that the heat generated by the hot end of the semiconductor refrigerator is greater than the cooling capacity generated by the cold end.

[0027] 3. A stress equalizing plate is added to the outer end surface of the first heat exchanger and / or the second heat exchanger to integrate the two ends of the heat exchanger, reduce its influence on the local stress of the semiconductor refrigerator, and make the internal stress of the semiconductor refrigerator more uniform when working, and the working stability and reliability are higher; in addition, the heat exchange area of ​​the heat exchanger is increased, which is beneficial to increase the heat exchange capacity of the cold and hot ends of the semiconductor refrigerator, and improve the cooling capacity and cooling efficiency of the air-cooled cooling system; finally, the stress equalizing plate has a gathering effect on the airflow passing through the heat exchange channel, which is more conducive to the effective heat exchange of the heat exchanger. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is an exploded view of a semiconductor refrigeration component of the utility model.

[0029] Figure 2 It is a structural schematic diagram of an embodiment of a semiconductor refrigeration component of the utility model.

[0030] Figure 3 It is a structural schematic diagram of another embodiment of a semiconductor refrigeration component of the utility model.

[0031] Figure 4 The utility model is an exploded diagram of a refrigeration device.

[0032] Figure 5 It is a cross-sectional view of a first embodiment of a refrigeration device of the utility model.

[0033] Figure 6 It is a cross-sectional view of a second embodiment of a refrigeration device of the utility model.

[0034] Figure 7 It is a cross-sectional view of a third embodiment of a refrigeration device of the utility model.

[0035] Among them: semiconductor refrigerator 1, first heat exchanger 2, heat exchange channel 201, second heat exchanger 3, stress equalization plate 4, heat exchange fan 5, housing 6, air inlet 61, cooling outlet 62, heat dissipation outlet 63. DETAILED DESCRIPTION

[0036] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0037] The present technical solution provides a semiconductor refrigeration component, including a semiconductor refrigerator 1, a first heat exchanger 2, and a second heat exchanger 3; the semiconductor refrigerator 1 is provided with a first end face and a second end face relative to each other, the inner end face of the first heat exchanger 2 is welded or glued to the first end face, the inner end face of the second heat exchanger 3 is welded or glued to the second end face, and the first heat exchanger 2 and the second heat exchanger 3 are both provided with a heat exchange channel 201.

[0038] The first heat exchanger 2 and the second heat exchanger 3 are asymmetrically arranged with respect to the semiconductor refrigerator 1 .

[0039] Since semiconductor refrigeration systems are commonly used outdoors, in order to improve the overall portability of the device, the overall structure of the device is generally developing towards a trend of being further optimized and reduced in size. However, as the structure is compressed, the refrigeration effect of the device is also compressed, resulting in a problem of low refrigeration efficiency. Based on this, this technical solution proposes a semiconductor refrigeration component, such as Figure 1-3 As shown, it can effectively solve the problem of low refrigeration efficiency of semiconductor refrigeration systems in the prior art, and at the same time has the advantages of reasonable structural setting and high refrigeration efficiency.

[0040] Specifically, Figure 1 As shown, the semiconductor refrigeration assembly proposed in this scheme includes a first heat exchanger 2, a semiconductor refrigerator 1, and a second heat exchanger 3 connected in sequence. It should be noted that the semiconductor refrigerator 1 of this scheme is made using the Peltier effect, which refers to the phenomenon that when a direct current passes through a galvanic couple composed of two semiconductor materials, one end of the galvanic couple absorbs heat and the other end releases heat; in other words, the semiconductor refrigerator 1 is made of two semiconductor materials to form a hot end and a cold end, the cold end continuously absorbs heat to achieve cooling, and the hot end continuously releases heat to achieve heat dissipation.

[0041] Furthermore, compared with the mechanical connection structure of the prior art, since the semiconductor refrigerator 1 and the first heat exchanger 2 and the second heat exchanger 3 of this scheme adopt a welding or pasting connection structure, the effective connection between the semiconductor refrigerator 1 and the heat exchanger is ensured, thereby ensuring that the cold and heat generated in the semiconductor refrigerator 1 can be directly and effectively output, avoiding the loss of cold and heat in the mechanical connection structure, solving the problem of low refrigeration efficiency of the semiconductor refrigeration system in the prior art, and having the advantages of reasonable structural setting and high refrigeration efficiency.

[0042] Furthermore, the omission of the mechanical connection structure is also beneficial to reduce the risk of thermal short circuit between the cold end and the hot end of the semiconductor refrigerator 1 caused by the mechanical connection structure, improve the cooling capacity and conversion efficiency of the semiconductor refrigeration component, and at the same time improve the consistency and stability of product quality.

[0043] It should be noted that the welding connection in this scheme refers to the fact that the semiconductor refrigerator 1 and the first heat exchanger 2 and the second heat exchanger 3 can be welded with conventional solder to form an integrated semiconductor refrigeration component, while the adhesive connection refers to the fact that the semiconductor refrigerator 1 and the first heat exchanger 2 and the second heat exchanger 3 can be cured with conventional thermal conductive adhesive to form an integrated semiconductor refrigeration component.

[0044] In addition, for semiconductor refrigerators, the cooling capacity Q c , heat production Q h And electrical input power P i Satisfy Q h =Q c +P i =(1+1 / cop)Q c , where cop is the cooling coefficient, i.e. cop = Q c / P i Since the conversion efficiency of semiconductor refrigeration is relatively low, assuming cop = 0.5, then Q h =3Q c , that is, the cop value decreases as the temperature difference between the hot and cold ends of the refrigerator increases, and vice versa. It can be seen that the heat transfer capacity Q of the hot end of the semiconductor refrigerator h Much higher than the cold end heat transfer Q c .

[0045] Therefore, in order to ensure that there is a difference in heat exchange between the first heat exchanger 2 and the second heat exchanger 3, so as to meet the requirement that the heat generated at the hot end of the semiconductor refrigerator 1 is greater than the cold end, the present solution also designs the first heat exchanger 2 and the second heat exchanger 3 into an asymmetric structure. When the heat exchange of the first heat exchanger 2 is greater than that of the second heat exchanger 3, the current input direction of the semiconductor refrigerator 1 can be adjusted so that the first end face is the hot end face; and when the heat exchange of the first heat exchanger 2 is less than that of the second heat exchanger 3, the current input direction of the semiconductor refrigerator 1 can be adjusted so that the second end face is the hot end face, so as to meet the cooling demand of the semiconductor refrigeration component.

[0046] In one embodiment, the asymmetric heat exchanger structure in this solution is as follows Figure 2 As shown: the first end face of the semiconductor refrigerator 1 is a cold end face, and the second end face of the semiconductor refrigerator 1 is a hot end face.

[0047] The width of the heat exchange channel 201 of the first heat exchanger 2 is m, the width of the heat exchange channel 201 of the second heat exchanger 3 is n, and m>n. Preferably, m:n=3:2.

[0048] In another embodiment, the asymmetric heat exchanger structure in this solution is as follows Figure 3 As shown: the first end face of the semiconductor refrigerator 1 is a cold end face, and the second end face of the semiconductor refrigerator 1 is a hot end face.

[0049] The length of the heat exchange channel 201 of the first heat exchanger 2 is H, the length of the heat exchange channel 201 of the second heat exchanger 3 is h, and H<h. Preferably, H:h=4:5.

[0050] To further explain, a stress equalization plate 4 is also included; the stress equalization plate 4 is attached to the outer end surface of the first heat exchanger 2 and / or the second heat exchanger 3 .

[0051] Due to the asymmetric heat exchanger structure, stress may be generated inside the semiconductor refrigerator 1 when the semiconductor refrigerator 1, the first heat exchanger 2, and the second heat exchanger 3 are integrated and welded together, resulting in different local stresses in the semiconductor refrigerator 1, affecting the working stability of the semiconductor refrigerator 1.

[0052] Therefore, in order to effectively solve this problem, the present scheme proposes a solution for balancing the internal stress, that is, a stress balancing plate 4 is added to the outer end surface of the first heat exchanger 2 and / or the second heat exchanger 3. The balancing plate has three functions: first, through the balancing plate, the two ends of the first heat exchanger 2 and the second heat exchanger 3 (one end is the substrate of the semiconductor refrigerator 1, and the other end is the stress balancing plate 4) are integrated, and the integration of the first heat exchanger 2 and the second heat exchanger 3 balances and reduces its influence on the local stress of the semiconductor refrigerator 1, so that the internal stress of the semiconductor refrigerator 1 is more uniform when working, and the working stability and reliability are higher; second, the heat exchange area of ​​the first heat exchanger 2 and the second heat exchanger 3 is increased, which is conducive to increasing the heat exchange of the cold and hot ends of the semiconductor refrigerator 1, and improving the cooling capacity and cooling efficiency of the air-cooled cooling system; third, the stress balancing plate 4 has a gathering effect on the airflow passing through the heat exchange channel 201, which is more conducive to the effective heat exchange of the first heat exchanger 2 and the second heat exchanger 3.

[0053] To further explain, the stress equalization plate 4 is made of copper.

[0054] As a preference of the above embodiment, the present solution preferably uses a copper plate as the stress equalization plate 4, which is easy to weld and has high strength.

[0055] To further explain, the thickness of the stress equalization plate 4 is 0.1-0.5 mm.

[0056] As a preferred embodiment of the above embodiment, the present solution optimizes the thickness of the stress equalization plate 4, which is beneficial to taking into account both the stress equalization effect and the structural volume.

[0057] To further explain, the heat exchange channel 201 is formed by repeatedly folding a heat conducting plate, and the material of the heat conducting plate is either copper or aluminum.

[0058] The first heat exchanger 2 and the second heat exchanger 3 formed by repeated folding have the characteristics of large contact area and good conduction, which can effectively improve the cooling / heating effect; and using copper or aluminum as the heat conductive material can further enhance the cooling / heating effect.

[0059] A refrigeration device uses the above-mentioned semiconductor refrigeration component, and also includes a heat exchange fan 5 and a shell 6. The semiconductor refrigeration component and the heat exchange fan 5 are both installed inside the shell 6, and the outlet of the heat exchange fan 5 is arranged toward the air inlet end of the heat exchange channel 201.

[0060] The shell 6 is provided with an air inlet 61, a cooling outlet 62 and a heat dissipation outlet 63; the first end face of the semiconductor refrigerator 1 is a cold end face, and the second end face of the semiconductor refrigerator 1 is a hot end face; and the inlet of the heat exchange fan 5 is arranged close to the air inlet 61, the first heat exchanger 2 is arranged close to the cooling outlet 62, and the second heat exchanger 3 is arranged close to the heat dissipation outlet 63.

[0061] The present application also provides a refrigeration device, such as Figure 4-7 As shown, it includes the semiconductor refrigeration component, heat exchange fan 5 and shell 6 mentioned in the above solution.

[0062] In order to improve the cooling effect of the semiconductor refrigerator 1, the semiconductor refrigeration system in the prior art generally has a cooling fan at the cooling end of the semiconductor refrigerator 1 and a heat dissipation fan at the heat dissipation end, so that the refrigeration system needs to be equipped with at least two fans; and in order to avoid the mutual influence of the cooling airflow and the heat dissipation airflow, the two fans are generally required to be separated, which is very unfavorable for the refrigeration system to develop in a smaller, more compact and more portable direction.

[0063] Therefore, in order to further reduce the volume of the semiconductor refrigeration system and make its structure smaller and more portable, the present invention provides a heat exchange fan 5 at the refrigeration inlet of the semiconductor refrigerator 1, which may be an axial flow fan or a centrifugal fan, which is not limited here.

[0064] For the convenience of description, the first end face is described as the cold end face of the semiconductor refrigerator 1, that is, when the semiconductor refrigeration device of this scheme is working, air enters the interior of the refrigeration device from the air inlet 41, and the air is transported by the heat exchange fan 5. Since the outlet of the heat exchange fan 5 is arranged toward the air inlet end of the heat exchange channel 201 of the first heat exchanger 2 and the second heat exchanger 3, the air is separated into two heat exchange air flows at the outlet of the heat exchange fan 5:

[0065] As the first end face is cooled, since the first heat exchanger 2 is connected to the first end face and heat is conducted between the two, the cold energy generated by the first end face will be conducted to the first heat exchanger 2. When one of the heat exchange airflows enters the heat exchange channel of the first heat exchanger 2, it will carry the cold energy on the first heat exchanger 2, generate a refrigeration airflow, and be discharged from the refrigeration outlet 62 and delivered to the load connected to the refrigeration equipment.

[0066] As the second end surface generates heat, since the second heat exchanger 3 is connected to the second end surface and there is a heat conduction connection between the two, the heat generated by the second end surface will be conducted to the second heat exchanger 3. When another heat exchange airflow enters the heat exchange channel of the second heat exchanger 3, it will carry the heat on the second heat exchanger 3, generate a heat dissipation airflow, and be discharged from the refrigeration device from the heat dissipation outlet 63.

[0067] It should be noted that since the heat exchange fan 5 in this solution is arranged at the cooling inlet of the semiconductor refrigerator 1, its number and spatial arrangement will be more flexible than the fan arranged at the cooling outlet of the semiconductor refrigerator 1, and can be selected according to the actual application scenario of the semiconductor refrigeration system, such as based on a comprehensive consideration of the two perspectives of cooling capacity and volume.

[0068] Further, the heat exchange fan 5 is a centrifugal fan, and the air inlet 61 is located on the side wall of the housing 6. Figure 5 shown.

[0069] Further, the heat exchange fan 5 is an axial flow fan, and the air inlet 61 is located at the bottom of the housing 6. Figure 6 , 7 As shown, the axial flow fan can be set to be placed upright or tilted according to actual needs.

[0070] A cooling garment uses the above-mentioned refrigeration device and also includes a garment body structure, the refrigeration device is installed on the garment body structure, and the air inlet 61 and the refrigeration outlet 62 are both located inside the garment body structure, and the heat dissipation outlet 63 is located outside the garment body structure.

[0071] For people who work continuously in outdoor environments without air conditioning, especially in high temperature environments, such as police officers standing guard in hot summer weather, construction workers working under the scorching sun, or maintenance personnel performing related maintenance work outdoors at high altitudes, they often have to overcome various discomforts caused by high temperatures to continue working for a period of time. When working in high temperature conditions wearing ordinary clothes, people will sweat, and sweat will migrate to the surface of clothes through diffusion and transmission, and some heat will be taken away by sweat evaporation. However, the evaporation source provided by sweat evaporation is limited, so the heat taken away is also limited. Especially when working continuously for a period of time in a high temperature environment, ordinary clothes cannot achieve the effect of cooling within a certain period of time.

[0072] Therefore, in order to meet the needs of users, especially those working outdoors in high temperatures, the present application also provides a cooling garment, including the refrigeration device and garment body structure (not shown in the figure) mentioned in the above scheme, so that the refrigeration outlet 62 of the refrigeration device is facing the inside of the garment body structure, so that the cold air output through the refrigeration outlet 62 takes away part of the heat generated by the human body, thereby realizing continuous cycle refrigeration and cooling of the cooling garment, thereby improving the user experience.

[0073] In addition, in order to enhance the cooling effect of the semiconductor refrigeration equipment, in this case, the air inlet 61 and the cooling outlet 62 are preferably arranged inside the clothing body structure, so that the cooling airflow output from the cooling outlet 62 can re-enter the semiconductor refrigeration equipment through the air inlet 61, forming a circulating cold flow field, realizing the circulation of the cooling airflow in the single-side space of the refrigeration equipment, and being more conducive to improving the cooling effect of the local area.

[0074] Since the semiconductor refrigeration device of the present scheme is worn by the user through the clothing structure, when the semiconductor refrigeration device is working, a small circulating cold flow field is formed on the side of its shell 6 close to the user's body surface. On the one hand, the refrigeration airflow output by the refrigeration outlet 62 can directly reach the user's body surface to achieve the purpose of rapid cooling. On the other hand, the refrigeration airflow output by the refrigeration outlet 62 can re-enter the semiconductor refrigeration device through the air inlet 61 to achieve the purpose of enhancing the refrigeration effect, thereby enabling the semiconductor refrigeration device of the present scheme to achieve the transformation into a "handheld small air conditioner".

[0075] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0076] Unless otherwise specifically stated, the relative arrangement, numerical expressions and numerical values ​​of the parts and steps described in these embodiments do not limit the scope of the utility model. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0077] In the description of the present utility model, it needs to be understood that the directions or positional relationships indicated by directional words such as "front, back, up, down, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom" are usually based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description. Unless otherwise specified, these directional words do not indicate or imply that the device or element referred to must have a specific direction or be constructed and operated in a specific direction, and therefore cannot be understood as limiting the scope of protection of the present utility model; the directional words "inside and outside" refer to the inside and outside relative to the contours of each component itself.

[0078] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0079] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. If not otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of the utility model.

[0080] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0081] The technical principle of the present invention is described above in combination with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the protection scope of the present invention in any way. Based on the explanations here, technicians in this field can think of other specific implementation methods of the present invention without creative work, and these methods will fall within the protection scope of the present invention.

Claims

1. A refrigeration device, characterized in that: It includes a semiconductor refrigeration component, a heat exchange fan and a shell, wherein the semiconductor refrigeration component and the heat exchange fan are both installed inside the shell; The semiconductor refrigeration assembly includes a semiconductor refrigerator, a first heat exchanger and a second heat exchanger; The semiconductor refrigerator is provided with a first end face and a second end face opposite to each other, the inner end face of the first heat exchanger is connected to the first end face by welding or gluing, the inner end face of the second heat exchanger is connected to the second end face by welding or gluing, and the first heat exchanger and the second heat exchanger are both provided with a heat exchange channel; The first heat exchanger and the second heat exchanger are asymmetrically arranged with respect to the semiconductor refrigerator; The outlet of the heat exchange fan is arranged toward the air inlet ends of the heat exchange channels of the first heat exchanger and the second heat exchanger, and the air is separated into two heat exchange air flows at the outlet of the heat exchange fan.

2. A refrigeration device according to claim 1, characterized in that: It also includes a stress equalization plate; the stress equalization plate is attached to the outer end surface of the first heat exchanger and / or the second heat exchanger.

3. A refrigeration device according to claim 2, characterized in that: The material of the stress equalization plate is copper, and the thickness of the stress equalization plate is 0.1-0.5 mm.

4. A refrigeration device according to claim 1, characterized in that: The heat exchange channel is formed by repeatedly folding a heat conducting plate, and the material of the heat conducting plate is either copper or aluminum.

5. A refrigeration device according to claim 1, characterized in that: The first end surface of the semiconductor refrigerator is a cold end surface, and the second end surface of the semiconductor refrigerator is a hot end surface; The width of the heat exchange channel of the first heat exchanger is m, the width of the heat exchange channel of the second heat exchanger is n, and m>n.

6. A refrigeration device according to claim 1, characterized in that: The first end surface of the semiconductor refrigerator is a cold end surface, and the second end surface of the semiconductor refrigerator is a hot end surface; The length of the heat exchange channel of the first heat exchanger is H, the length of the heat exchange channel of the second heat exchanger is h, and H<h.

7. A refrigeration device according to claim 1, characterized in that: The shell is provided with an air inlet, a cooling outlet and a heat dissipation outlet; the first end face of the semiconductor refrigerator is a cold end face, and the second end face of the semiconductor refrigerator is a hot end face; and the inlet of the heat exchange fan is arranged close to the air inlet, the first heat exchanger is arranged close to the cooling outlet, and the second heat exchanger is arranged close to the heat dissipation outlet.

8. A refrigeration device according to claim 7, characterized in that: The heat exchange fan is a centrifugal fan, and the air inlet is located on the side wall of the shell.

9. A refrigeration device according to claim 7, characterized in that: The heat exchange fan is an axial flow fan, and the air inlet is located at the bottom of the shell.

10. A cooling suit, characterized in that: Use of the refrigeration device according to any one of claims 1 to 9; It also includes a body structure, the refrigeration device is installed on the body structure, and the air inlet and the refrigeration outlet are both located inside the body structure, and the heat dissipation outlet is located outside the body structure.

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