Liquid level sensor
By using a combination of heating parts and heat conducting parts in the liquid level sensor, the problem of sensor failure under freezing conditions is solved, the effect of thawing in a frozen environment is achieved, and the convenience of use is improved.
Patent Information
- Application Number
- CN202421493586.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-26
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-26
AI Technical Summary
The existing water level sensor fails under freezing conditions and cannot accurately detect liquid level in frozen samples, resulting in the sampling bottle being unable to thaw and remove, which is inconvenient to use.
A liquid level sensor is designed, using a combination of heating element and thermal conductor, which generates heat through the heating element and transfers it to the substrate through the thermal conductor to ensure that the sensor can be thawed in a frozen environment.
The normal operation of the sensor in a frozen environment is achieved, the sensor failure caused by freezing and the inability to thaw and remove the sampling bottle, and the convenience of use is improved.
Smart Images
Figure CN222689231U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of sensors, and more specifically, to a liquid level sensor. Background Art
[0002] In water sampling applications, it is often necessary to directly input the sampled samples into the freezer for freezing and freezing to extend the storage time of the samples. In order to prevent the sampled water from overflowing the sampling bottle, a water level sensor needs to be placed at the bottle mouth, and sampling will automatically stop when the liquid reaches the bottle mouth. However, existing water level sensors, whether mechanical or photoelectric, have a common problem. Since they stop only when the liquid level is reached, and the sample expands after freezing, the sensor will eventually freeze together with the sample. This creates the problem that the sample bottle can only be taken out after thawing. At the same time, due to freezing, if the existing sensor is not thawed and continued to be used, it will fail due to freezing. It is very troublesome to use. Utility Model Content
[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a liquid level sensor that can be used under freezing conditions.
[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:
[0005] The utility model discloses a liquid level sensor, comprising a substrate. The substrate is provided with a heating element, a heat conducting element, a first probe and a second probe. The heating element is connected to the heat conducting element, and the heat conducting element is connected to the first probe and the second probe.
[0006] Furthermore, the heating element is placed between the first probe and the second probe.
[0007] Furthermore, the substrate includes a first surface and a second surface, and the heat conducting member is disposed on at least one of the first surface and the second surface.
[0008] Furthermore, the heating elements are provided in plurality and are arranged equidistantly.
[0009] Furthermore, the substrate includes a triangular area, the triangular area includes a first side and a second side, the first probe at least partially extends along the first side, and the second probe at least partially extends along the second side.
[0010] Furthermore, the substrate is a PCB board, the heating element is a resistor, and the heat conducting element is a copper cladding layer.
[0011] The beneficial effects of the utility model are:
[0012] The heat is generated by the heating element and transferred to the first surface and the second surface of the substrate through the heat conducting element, so that the sensor as a whole can be thawed and the sensor can be used in a freezing environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 Schematic diagram of the structure of the first surface in this embodiment;
[0014] Figure 2 It is a structural schematic diagram of the second side in this embodiment;
[0015] Reference numerals: substrate 100, via hole 101, triangular area 110, first side 111, second side 112, first probe 200, second probe 210, heating element 300, heat conducting element 400, DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0017] See also Figure 1 , Figure 2 A liquid level sensor includes a substrate 100, on which a heating element 300, a heat conducting element 400, a first probe 200 and a second probe 210 are arranged. The substrate 100 is a PCB board, the heating element 300 is a resistor mounted on the substrate 100, the heat conducting element 400 is a copper-clad surface, and the first probe 200 and the second probe 210 are metal probes arranged on the substrate 100.
[0018] The bottom of the substrate 100 is a triangular structure and forms a triangular area 110, so that the sensor can be easily inserted into the bottle mouth. The triangular area 110 includes a first side 111 and a second side 112, and the first side 111 and the second side 112 intersect to form the tip of the triangular area 110. The first probe 200 is arranged along the first side 111, and the second probe 210 is arranged along the second side 112, so that the first probe 200 and the second probe 210 are close to each other at the tip of the triangular area 110, so that the first probe 200 and the second probe 210 can ensure the consistency of the position, and reduce the influence caused by the position difference between the first probe 200 and the second probe 210 due to the tilted placement of the sensor.
[0019] The heating element 300 is located between the first probe 200 and the second probe 210, so that the heating element 300 is located at the center of the sensor. At the same time, a plurality of heating elements 300 are arranged equidistantly to ensure the heat generation. The heating element 300 generates heat after being powered on, so that the frozen sensor is thawed and the sensor can be used normally. At the same time, the substrate 100 includes a first surface and a second surface, and the first surface and the second surface are both provided with a heat conducting element 400, and the heat conducting elements 400 on the first surface and the second surface are connected through vias on the substrate 100.
[0020] The sensor is placed at the mouth of the sampling bottle. The first probe 200 and the second probe 210 use the liquid impedance sensing principle. When the liquid level rises and the first probe 200 and the second probe 210 are connected through the liquid, the impedance between the first probe 200 and the second probe 210 will change, thereby detecting that the liquid level has reached the position of the sensor.
[0021] The heating element 300, the first probe 200, and the second probe 210 are installed on the first surface. When the sensor is frozen, the heat of the heating element 300 is transferred through the heat conducting element 400 on the first surface to thaw the first surface, and is also transferred to the second surface through the heat conducting element 400 on the second surface to thaw the second surface, so that the sensor can be smoothly taken out of the bottle mouth of the sampling bottle, so that the sensor can be used normally.
[0022] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.
Claims
1. A liquid level sensor, characterized in that: The invention comprises a substrate (100), wherein the substrate (100) is provided with a heating element (300), a heat conducting element (400), a first probe (200) and a second probe (210), wherein the heating element (300) is connected to the heat conducting element (400), and the heat conducting element (400) is connected to the first probe (200) and the second probe (210).
2. A liquid level sensor according to claim 1, characterized in that: The heating element (300) is disposed between the first probe (200) and the second probe (210).
3. A liquid level sensor according to claim 1, characterized in that: The substrate (100) comprises a first surface and a second surface, and the heat conducting element (400) is disposed on at least one of the first surface and the second surface.
4. A liquid level sensor according to claim 1, characterized in that: The heating elements (300) are provided in plurality and arranged at equal intervals.
5. A liquid level sensor according to claim 1, characterized in that: The substrate (100) comprises a triangular area (110), the triangular area (110) comprises a first side (111) and a second side (112), the first probe (200) at least partially extends along the first side (111), and the second probe (210) at least partially extends along the second side (112).
6. A liquid level sensor according to claim 5, characterized in that: The substrate (100) is a PCB board, the heating element (300) is a resistor, and the heat-conducting element (400) is a copper-clad layer.