A weldability testing mechanism and method

Abstract

The present invention discloses a solderability testing mechanism, comprising: a test table, a soldering trough and a solder pot located on the test table, a liquid level sensor and a solder height sensor located on the side of the solder pot; the liquid level sensor is used to measure the liquid level of the solder pot, and the solder height sensor is used to measure the height of the position to be soldered in the workpiece; a mobile module located above the test table, the mobile module being provided with a fixed clamp for clamping the workpiece; and a controller communicatively connected to the liquid level sensor, the solder height sensor, and the mobile module. The present invention provides a solderability testing mechanism and method that can accurately control the depth of tin immersion in a workpiece, thereby standardizing solderability testing standards and improving the accuracy of solderability testing.

Description

Technical Field

[0001] The present invention relates to the field of immersion tin soldering, and in particular to a solderability testing mechanism and method. Background Art

[0002] Welding is a process of metal bonding. To achieve good welding results, the metal materials to be welded must be weldable. With the full promotion of lead-free welding technology in the company, higher requirements are placed on the weldability of components.

[0003] Currently, common component solderability testing methods include wetting force testing and visual inspection. Due to the stringent requirements for testing equipment and the lengthy testing time, wetting force testing is not suitable for large-scale component incoming inspection. Currently, component inspection relies solely on visual inspection. However, the lack of clear specifications and corresponding tooling leads to inconsistent angles and depths when components are immersed in the solder pot, resulting in large solderability test errors and low detection rates. Summary of the Invention

[0004] The present invention aims to solve, at least to a certain extent, one of the problems in the related art. To this end, the present invention aims to provide a solderability testing mechanism and method that can accurately control the tin immersion depth of a workpiece, thereby unifying solderability testing standards and improving the accuracy of solderability testing.

[0005] In order to achieve the above objectives, the present application adopts the following technical solution: a weldability testing mechanism, comprising:

[0006] Test bench,

[0007] The flux tank and tin pot are located on the test table.

[0008] A liquid level sensor and a welding height sensor are located on the side of the tin pot; the liquid level sensor is used to measure the liquid level of the tin pot, and the welding height sensor is used to measure the height of the position to be welded in the workpiece;

[0009] A movable module located above the test table, wherein the movable module is provided with a fixing clamp for clamping a workpiece;

[0010] The controller is communicatively connected with the liquid level sensor, the welding height sensor and the mobile module respectively.

[0011] Furthermore, the welding height sensor is located between the tin pot and the flux tank.

[0012] Furthermore, the movable module includes a movable guide rail and a fixed clip located on the movable guide rail, the fixed clip can slide along the movable guide rail, the extension direction of the movable guide rail is a first direction, and the first direction refers to the direction of the center line connecting the tin furnace and the flux tank.

[0013] Furthermore, the fixing clamp is connected to the movable guide rail via a fixing rod, and the fixing rod can drive the fixing clamp to move toward or away from the tin furnace.

[0014] Furthermore, a connecting rod is provided on the side of the tin furnace, which is parallel to the test table. The front end of the connecting rod is connected to a tin scraper. The lower surface of the tin scraper is located below the liquid level of the tin furnace, and the upper surface is located above the liquid level of the tin furnace.

[0015] Furthermore, the rear end of the connecting rod is connected to a driving module, and the driving module can drive the connecting rod and the tin scraper to slide on the liquid surface of the tin furnace.

[0016] Furthermore, the driving module is located on a side of the tin furnace away from the flux tank, and the driving module includes a driving guide rail and a connecting member located on the driving guide rail, and the connecting member can slide along the driving guide rail. The extension direction of the driving guide rail is the second direction, and the second direction refers to the direction in the test table that is perpendicular to the center line connecting the tin furnace and the flux tank.

[0017] Furthermore, the test table is located in a test frame, and a control panel is provided on the side of the test frame.

[0018] A method for solderability testing, comprising:

[0019] S1: Fix the workpiece in a fixing clamp; wherein the position to be welded in the workpiece is located below the fixing clamp;

[0020] S2: The fixed clamp drives the workpiece into the flux tank and then moves it out;

[0021] S3: The fixing clamp drives the workpiece to move above the welding height sensor. The welding height sensor measures the height of the welding position in the fixing clamp; the liquid level sensor measures the liquid level of the tin pot.

[0022] S4: The fixing clamp drives the workpiece to move above the tin pot. The controller controls the fixing clamp to drive the workpiece to be welded to descend to the tin pot for tin immersion according to the height of the position to be welded and the liquid level of the tin pot.

[0023] S5: The fixing clamp drives the workpiece out of the tin furnace and observes the tinning situation at the position to be welded.

[0024] Furthermore, in step S4, the height to which the fixed clamp drives the workpiece to descend is h=a-b+d, wherein a is the height of the position to be welded measured by the welding height sensor, b is the liquid level height of the tin pot measured by the liquid level sensor, and d is the tin immersion depth of the position to be welded; and the heights of the frames measured by the welding height sensor and the liquid level sensor are both based on the upper surface of the test table.

[0025] The above-mentioned technical solution provided by the embodiment of the present application has the following advantages compared with the prior art: the present application adds a liquid level sensor and a welding height sensor to the test table; wherein, the liquid level sensor is used to measure the liquid level of the tin furnace, and the welding height sensor is used to measure the height of the position to be welded in the workpiece; the fixed clamp can move along the movable module. After the tin immersion depth is determined, the controller can determine the lowering height of the workpiece driven by the fixed clamp through the liquid level and the height of the position to be welded, and can accurately control the tin immersion depth of the workpiece, so that the solderability test standards are unified and the accuracy of the solderability test is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0027] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0028] In the attached figure:

[0029] Figure 1 Schematic diagram of the overall structure of the solderability test mechanism in this application;

[0030] Figure 2 It is a front view of the solderability test mechanism in this application;

[0031] Figure 3 A top view of the test table in this application;

[0032] Figure numbers: 1. Fixing clamp; 2. Moving guide rail; 3. Liquid level sensor; 4. Welding height sensor; 5. Soldering tank; 6. Tin scraper; 7. Tin pot; 8. Driving guide rail; 9. Test frame; 10. Control panel. DETAILED DESCRIPTION

[0033] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific embodiments of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "back", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings and are constructed and operated in specific directions. They are only for the convenience of describing the technical solution and do not indicate that the mechanisms or components referred to must have specific directions. Therefore, they should not be understood as limiting the present invention.

[0034] It should also be noted that, unless otherwise clearly specified and limited, terms such as "installed", "connected", "connected", "fixed", and "set" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intervening elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", "third", etc. may explicitly or implicitly include one or more of such features. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0035] In the following description, specific details such as particular system structures and techniques are provided for purposes of illustration, not limitation, to facilitate a thorough understanding of the embodiments of the present invention. However, it will be apparent to those skilled in the art that the present invention may be practiced in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.

[0036] Please see the attached Figure 1-3 , the present application provides a weldability testing mechanism, comprising:

[0037] Test bench,

[0038] The soldering tank 5 and the tin pot 7 are located on the test table.

[0039] The liquid level sensor 3 and the welding height sensor 4 are located on the side of the tin pot 7; the liquid level sensor 3 is used to measure the liquid level of the tin pot 7, and the welding height sensor 4 is used to measure the height of the position to be welded in the workpiece;

[0040] A movable module is located above the test table, and a fixed clamp 1 for clamping a workpiece is provided in the movable module; the movable module can drive the fixed clamp 1 to move;

[0041] The controller is communicatively connected with the liquid level sensor, the welding height sensor and the mobile module respectively.

[0042] The present application adds a liquid level sensor 3 and a welding height sensor 4 to the test table; wherein, the liquid level sensor 3 is used to measure the liquid level of the tin furnace 7, and the welding height sensor 4 is used to measure the height of the position to be welded in the workpiece; the fixed clamp 1 can move along the movable module. After the tin immersion depth is determined, the controller can determine the lowering height of the workpiece driven by the fixed clamp 1 through the liquid level and the height of the position to be welded, and can accurately control the tin immersion depth of the workpiece, so that the solderability test standards are unified and the accuracy of the solderability test is improved.

[0043] As a specific embodiment, in this application, the welding height sensor 4 is located between the tin furnace 7 and the flux tank 5. The workpiece needs to be immersed in the flux tank 5 before entering the tin furnace 7 for tin immersion. The welding height sensor 4 is used to measure the height of the position to be welded of the workpiece in the fixing clamp 1. It is set between the tin furnace 7 and the flux tank 5. The position to be welded in the workpiece can be measured after the workpiece is moved out of the flux tank 5 and before entering the tin furnace 7.

[0044] As a specific embodiment, the movable module in the present application includes a movable guide rail 2 and a fixed clamp 1 located on the movable guide rail 2. The fixed clamp 1 can slide along the movable guide rail 2. The extending direction of the movable guide rail 2 is a first direction, which refers to the direction of the center line connecting the tin pot 7 and the flux tank 5. The solderability test process is to first immerse the workpiece in the flux tank 5, then remove it and immerse it in the tin pot 7. Therefore, the fixed clamp 1 needs to drive the workpiece to move along the first direction.

[0045] The fixing clamp 1 is connected to the movable guide rail 2 through a fixing rod, and the fixing rod can drive the fixing clamp 1 to move toward or away from the tin furnace 7; while the fixing clamp 1 moves along the first direction, the fixing clamp 1 also needs to be able to drive the workpiece to rise and fall. Specifically, the fixing clamp 1 can be fixed in the fixing rod, and the fixing rod is located in the movable guide rail 2, and the fixing rod can drive the fixing clamp 1 to slide along the guide rail, and the fixing clamp 1 can rise and fall along the fixing rod, so that the fixing clamp 1 can not only move in the first direction along the guide rail, but also drive the workpiece to move up and down.

[0046] As a specific embodiment, a connecting rod is provided on the side of the tin pot 7, and the connecting rod is parallel to the test table. The front end of the connecting rod is connected to the tin scraper 6, and the lower surface of the tin scraper 6 extends into the interior of the tin pot 7. The tin scraper 6 is similar to a scraper, with its upper surface located above the liquid level of the tin pot 7 and its lower surface located below the liquid level of the tin pot 7. Tin solder, that is, a solid tin bar, is placed in the tin pot 7. When the tin bar is heated to about 260°C in the tin pot 7, the tin bar melts and becomes liquid. The tin molecules on the surface of the liquid will oxidize in contact with the air, and after a certain period of time, a layer of oxide film will form on the surface of the liquid. This film will affect the solderability test, so the oxide film must be scraped off by the tin scraper 6 to expose the tin liquid itself, and then normal tin dipping and testing can be performed.

[0047] The rear end of the connecting rod is connected to the driving module, which can drive the connecting rod and the scraper 6 to slide on the liquid surface of the tin pot 7. Since the scraper 6 needs to extend into the interior of the tin pot 7 and has a certain width in the vertical direction, it needs to be connected to the driving module through a connecting rod. The driving module drives the connecting rod and the scraper 6 to slide in the tin pot 7, so that the scraper 6 scrapes the oxide film on the surface of the liquid to the side of the tin pot 7, and then the oxide film is scooped out through a colander.

[0048] Specifically, the driving module is located on the side of the tin furnace 7 away from the flux tank 5. The driving module includes a driving guide rail 8 and a connecting member located on the driving guide rail 8. The connecting member can slide along the driving guide rail 8. The extension direction of the driving guide rail 8 is the second direction. The second direction refers to the direction in the test table that is perpendicular to the center line connecting the tin furnace 7 and the flux tank 5.

[0049] Preferably, the connecting piece can also drive the connecting rod to move in the vertical direction. When the liquid level in the tin furnace 7 changes, the height of the scraper plate 6 also needs to change accordingly. The connecting piece drives the connecting rod to rise or fall in the vertical direction, which can ensure that the upper surface of the scraper plate 6 remains above the liquid level of the tin furnace 7 and the lower surface remains below the liquid level of the tin furnace 7, ensuring that it can completely scrape the oxide film on the surface of the tin liquid to one side of the tin furnace 7.

[0050] As a specific embodiment, the test table described in the present application is located in a test frame 9, and a control panel 10 is provided on the side of the test frame 9. The control panel 10 is provided with buttons for controlling the movement of the driving module and the moving module. The movement of the fixing clamp 1 and the tin scraper 6 can be controlled by the button.

[0051] A protective cover is also provided on the outside of the test frame 9 of the present application, which can be opened or closed. When the workpiece is fixed in the fixing clamp 1 or removed from the fixing clamp 1, the protective cover is opened; when the workpiece is undergoing weldability testing, the protective cover is closed to ensure that the test process is not affected by the external environment.

[0052] Please continue to refer to the attached Figure 1-3 , the present application also provides a method for solderability testing, specifically comprising:

[0053] S1: Fix the workpiece in the fixing clamp 1; wherein the position to be welded in the workpiece is located below the fixing clamp 1; the position to be welded can be a pin or a pad, etc.

[0054] S2: Fixing clamp 1 drives the workpiece into and out of flux tank 5. Fixing clamp 1 can be raised and lowered along a fixing rod, which can be moved left and right along movable guide rail 2. The fixing rod can then drive fixing clamp 1 to move left and right horizontally and up and down vertically. Fixing clamp 1 drives the workpiece to the top of flux tank 5 and then lowers it until it is immersed in flux tank 5. After the workpiece has been immersed for a set period of time, fixing clamp 1 drives the workpiece out of flux tank 5.

[0055] S3: The fixing clamp 1 moves the workpiece to the top of the welding height sensor 4, which measures the height of the position to be welded in the fixing clamp 1. Simultaneously, the liquid level sensor 3 measures the liquid level of the tin pot 7. Since the welding height sensor 4 is located between the soldering tank 5 and the tin pot 7, after the fixing clamp 1 moves the workpiece out of the soldering tank 5, the fixing clamp 1 drives the workpiece to continue moving toward a position close to the tin pot 7 until it reaches the top of the welding height sensor 4. At this time, the height of the position to be welded measured by the welding height sensor 4 is a, and the liquid level of the tin pot 7 measured by the liquid level sensor 3 is b. The above heights a and b are both measured with respect to the test table.

[0056] S4: The fixing clamp 1 drives the workpiece to move above the tin pot 7. The controller controls the fixing clamp to drive the workpiece to be welded to descend to the tin pot 7 for tin immersion according to the height of the position to be welded and the liquid level of the tin pot 7. Among them, the height to which the fixing clamp 1 drives the workpiece to descend is h=a-b+d, and d is the tin immersion depth of the position to be welded.

[0057] The tin immersion depth is generally 3-5mm, which refers to the depth of the welding position entering the tin liquid.

[0058] S5: The fixing clamp 1 drives the workpiece out of the tin furnace 7, and the tinning condition at the position to be welded is observed.

[0059] The present application can also set a liquid level sensor on the side of the flux tank 5 to measure the liquid level of the flux tank 5. In this way, when the workpiece is immersed in the flux tank 5 in step S2, the liquid level of the flux tank 5 can be measured first, and then the height of the position to be welded in the firmware clamp can be measured, and then the descending height of the fixing clamp 1 can be controlled in combination with the set depth of entering the flux tank 5. The specific control method is the same as the method for the workpiece to enter the tin furnace 7.

[0060] It is understandable that the above embodiments only express the preferred implementation modes of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the patent scope of the present invention. It should be pointed out that for ordinary technicians in this field, without departing from the concept of the present invention, the above technical features can be freely combined, and several deformations and improvements can be made, all of which fall within the scope of protection of the present invention. Therefore, all equivalent changes and modifications made to the scope of the claims of the present invention should fall within the scope of coverage of the claims of the present invention.

Claims

1. A solderability testing mechanism, characterized in that: include: Test bench, The flux tank and tin pot are located on the test table. A liquid level sensor and a welding height sensor are located on the side of the tin pot; the liquid level sensor is used to measure the liquid level of the tin pot, and the welding height sensor is used to measure the height of the position to be welded in the workpiece; A movable module located above the test table, wherein the movable module is provided with a fixing clamp for clamping a workpiece; The controller is respectively communicated with the liquid level sensor, the welding height sensor and the mobile module; the height h at which the fixed clamp drives the workpiece to descend is h=a-b+d, wherein a is the height of the position to be welded measured by the welding height sensor, b is the liquid level height of the tin pot measured by the liquid level sensor, and d is the tin immersion depth of the position to be welded; and the heights of the frames measured by the welding height sensor and the liquid level sensor are both based on the upper surface of the test table.

2. A solderability testing mechanism according to claim 1, characterized in that: The welding height sensor is located between the tin pot and the flux tank.

3. A solderability testing mechanism according to claim 2, characterized in that: The movable module includes a movable guide rail and a fixing clip located on the movable guide rail, the fixing clip can slide along the movable guide rail, the extension direction of the movable guide rail is a first direction, and the first direction refers to the direction of the center line connecting the tin furnace and the fluxing tank.

4. A solderability testing mechanism according to claim 1, characterized in that: The fixing clamp is connected to the movable guide rail via a fixing rod, and the fixing rod can drive the fixing clamp to move toward or away from the tin pot.

5. A solderability testing mechanism according to claim 1, characterized in that: A connecting rod is provided on the side of the tin furnace, and the connecting rod is parallel to the test table. The front end of the connecting rod is connected to a tin scraper. The lower surface of the tin scraper is located below the liquid level of the tin furnace, and the upper surface is located above the liquid level of the tin furnace.

6. A solderability testing mechanism according to claim 5, characterized in that: The rear end of the connecting rod is connected to the driving module, and the driving module can drive the connecting rod and the tin scraping plate to slide on the liquid surface of the tin furnace.

7. A solderability testing mechanism according to claim 6, characterized in that: The driving module is located on the side of the tin furnace away from the flux tank. The driving module includes a driving guide rail and a connecting member located on the driving guide rail. The connecting member can slide along the driving guide rail. The extension direction of the driving guide rail is the second direction. The second direction refers to the direction in the test table that is perpendicular to the line connecting the centers of the tin furnace and the flux tank.

8. A solderability testing mechanism according to claim 1, characterized in that: The test table is located in a test frame, and a control panel is provided on the side of the test frame.

9. A method for performing a solderability test using the solderability test mechanism according to any one of claims 1 to 8, characterized in that: include: S1: Fix the workpiece in a fixing clamp; wherein the position to be welded in the workpiece is located below the fixing clamp; S2: The fixed clamp drives the workpiece into the flux tank and then moves it out; S3: The fixing clamp drives the workpiece to move above the welding height sensor. The welding height sensor measures the height of the welding position in the fixing clamp; the liquid level sensor measures the liquid level of the tin pot. S4: The fixing clamp drives the workpiece to move above the tin pot. The controller controls the fixing clamp to drive the workpiece to be welded to descend to the tin pot for tinning according to the height of the position to be welded and the liquid level of the tin pot. S5: The fixing clamp drives the workpiece out of the tin furnace and observes the tinning situation at the position to be welded.

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