Superconducting magnet cold head, heat conduction structure thereof and magnetic resonance imaging system
By setting a limiting portion on the thermal contact surface of the superconducting magnet cold head to fix the thermal conduction medium, the problems of insufficient deformation pressure of indium sheet and disengagement of indium wire in the prior art are solved, and efficient heat transfer and stable thermal conductivity are achieved.
Patent Information
- Application Number
- CN202420625740.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-03-27
AI Technical Summary
In the existing magnetic resonance imaging equipment, the thermal contact surface of the superconducting magnet cold head cannot withstand the pressure required for the deformation of the indium sheet, resulting in low thermal conductivity, and the indium wire is prone to fall off or displace during repeated thermal contact and disconnection.
A thermally conductive structure is designed, including a thermally conductive substrate and a thermally conductive medium, which is made of a solid plastic thermally conductive material, and a limiting portion is provided on the thermal contact surface to limit the vertical displacement of the thermally conductive medium. This structure secures the indium wire by slotting on the thermal contact surface, ensuring that it remains stable during thermal contact and disconnection.
After repeated separation and bonding, this thermally conductive structure maintains good thermal conductivity, avoids the problem of falling off or displaced indium wire and improves heat transfer efficiency.
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Figure CN222690454U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of magnetic resonance imaging equipment, and in particular relates to a superconducting magnet cold head and a heat-conducting structure thereof, and a magnetic resonance imaging system. Background Art
[0002] In MRI equipment, the main magnet is a very important component. Its function is to generate a magnetic field, and superconducting magnets are currently the most widely used main magnets. Superconducting magnets refer to electromagnets made of coils made of second-class superconductors with high transition temperatures and extremely high critical magnetic fields at low temperatures. Since superconducting magnets need to work properly at low temperatures, corresponding refrigeration equipment is required.
[0003] At present, most refrigeration equipment has heat exchange interfaces, but it is actually impossible to machine an absolutely smooth surface, so there is a large thermal contact resistance between the interfaces, which affects the heat transfer efficiency. Usually, thermal conductive materials such as thermal grease or indium are filled at the interface to speed up heat transfer, but some equipment needs to disconnect the thermal contact at the heat exchange interface to reduce cooling loss, so thermal grease is not suitable for this application scenario.
[0004] Indium is a metal material that is easily deformed under pressure. It has a higher thermal conductivity than most filling materials and can be used at low temperatures. It is a thermally conductive material widely used in low-temperature devices. In practical applications, indium wires or indium sheets are usually used to fix them at the heat exchange interface. Among them, the area of the indium sheet is much larger than that of the indium wire, so extremely high pressure is required to press the indium sheet to deform it to the point where the thermal interface is fully in contact. However, some devices, such as cold heads, cannot withstand the pressure required for the indium sheet to deform well.
[0005] Indium wire is easier to deform than indium sheet, but it is thin and soft, making it difficult to fix. When thermal contact is made, the pressure between the thermal interfaces is usually unevenly distributed, which can easily cause the indium wire to adhere locally and fall off when the thermal contact is disconnected; when thermal contact is restored, the indium wire will break or fold, which will affect the heat transfer efficiency. Therefore, it is necessary to design a fixation solution for indium wire. Utility Model Content
[0006] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a heat-conducting structure for a superconducting magnet cold head, which can maintain good heat-conducting performance after repeated separation and combination with other equipment or devices.
[0007] To achieve the above-mentioned purpose and other related purposes, the utility model provides a heat-conducting structure of a superconducting magnet cold head, comprising: a heat-conducting substrate, formed with at least one thermal contact surface, for exchanging heat with other equipment or devices; a heat-conducting medium, arranged on the thermal contact surface, the heat-conducting medium being made of a solid plastic heat-conducting material; a limiting portion is provided on the thermal contact surface, and the limiting portion is configured to limit the displacement of the heat-conducting medium in a vertical direction along the thermal contact surface; wherein, when the thermal contact surface is pressed by other equipment or devices, the heat-conducting medium can undergo plastic deformation within the limiting portion, and when the thermal contact surface is separated from other equipment or devices, the heat-conducting medium can remain within the limiting portion.
[0008] According to a specific embodiment of the utility model, the heat conducting medium is configured to be in a filament or strip shape.
[0009] According to a specific embodiment of the utility model, the limiting portion is configured as a groove, the groove is arranged along a preset direction or path, and the heat conducting medium is embedded in the groove and fixed.
[0010] According to a specific embodiment of the utility model, the groove is arranged along the direction in which the heat conducting medium is embedded, and at least one portion below the position where the heat conducting medium is tangent to the groove has a groove width greater than the groove width at the position where the heat conducting medium is tangent to the groove.
[0011] According to a specific embodiment of the utility model, the groove is configured as a dovetail groove.
[0012] According to a specific embodiment of the utility model, the depth of the dovetail groove is 20%-30% of the diameter of the heat-conducting medium, the bottom width matches the diameter of the heat-conducting medium, and the dovetail angle is 50-75 degrees.
[0013] According to a specific embodiment of the utility model, the limiting portion includes one or more grooves, and the plurality of grooves are evenly distributed with equal distances.
[0014] According to a specific embodiment of the utility model, the heat-conducting medium is made of indium, and the heat-conducting substrate is made of aluminum or copper.
[0015] A superconducting magnet cold head comprises the above-mentioned heat-conducting structure and a cold head; wherein the heat-conducting mechanism is connected to a thermal coupling piece of the cold head.
[0016] A magnetic resonance imaging system comprises the superconducting magnet cold head mentioned above.
[0017] The utility model provides a heat-conducting structure that can be used in a superconducting magnet cold head of a magnetic resonance imaging system to reduce contact thermal resistance and improve heat exchange efficiency. The above-mentioned heat-conducting structure can fix the indium wire on the thermal contact surface in the form of slots, and can ensure that the indium wire maintains the correct distribution position and will not fall off or shift when the thermal contact surface is repeatedly contacted and disconnected, so as to meet the working requirements of the superconducting magnet cold head. At the same time, the fixing steps of the indium wire are simple and do not rely on any auxiliary equipment or tools. The indium wire only needs to be pressed into the groove of the thermal contact surface, and can be reused.
[0018] With the shortage of liquid helium resources and the increase in costs, getting rid of dependence on liquid helium is an inevitable trend, and conduction cooling magnets that do not require liquid helium will be the mainstream product in the future. Indium wire is usually used in conduction cooling magnets and other refrigeration devices to reduce contact thermal resistance. The heat-conducting structure provided by the utility model still maintains good thermal conductivity after repeated separation and combination with other equipment or devices, providing certain technical support for the future development of conduction cooling magnets and other refrigeration devices, as well as the design of indium wire. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional schematic diagram of a specific embodiment of an indium wire fixing solution in the prior art;
[0020] Figure 2 It is a three-dimensional schematic diagram of another specific embodiment of the indium wire fixing solution in the prior art;
[0021] Figure 3 A three-dimensional schematic diagram of a specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0022] Figure 4 A schematic plan view of a specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0023] Figure 5 A side schematic diagram of a specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0024] Figure 6 A three-dimensional schematic diagram of another specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0025] Figure 7 A schematic plan view of another specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0026] Figure 8 A three-dimensional schematic diagram of another specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0027] Fig. 9 A schematic plan view of another specific embodiment of a heat-conducting structure of a superconducting magnet cold head provided by the utility model;
[0028] Fig.10 It is a side view schematic diagram of various different styles of the limiting part in the heat conduction structure of the superconducting magnet cold head provided by the utility model;
[0029] Fig.11 The present invention is a schematic structural diagram of a specific embodiment of a superconducting magnet cold head provided by the present invention. DETAILED DESCRIPTION
[0030] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.
[0031] It should be noted that the illustrations provided in the following embodiments are only used to schematically illustrate the basic concept of the present invention, and thus the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.
[0032] First of all, it should be explained that in order to enable people in this technical field to better understand the present application scheme, the technical background of this application is explained accordingly.
[0033] For details, please see Figure 1 , 2 As shown in the figure, the existing indium wire fixing solution is usually to evenly place the indium wire on a flat thermal contact surface, and bend the two ends of the indium wire to the side and fix it with tape. However, in actual applications, due to the soft texture of the indium wire, the indium wire is easy to slide on the smooth thermal contact surface during the fixing process, so it cannot be kept in the corresponding position, and it is also difficult to achieve uniform distribution.
[0034] Even if the indium wire is fixed to the thermal contact surface according to the above method, it can only meet the basic requirement that the two thermal contact surfaces are in contact with each other and not disconnected. However, if the two thermal contact surfaces need to be disconnected after being fully in contact and then re-contacted, it is impossible to completely fix the indium wire only by using tape. The indium wire may fall off or shift, causing the indium wire to stack, which in turn affects the thermal conductivity when the thermal contact surfaces re-contact.
[0035] In addition, indium sheets can also be used to replace indium wires in the above application scenarios, and indium sheets are easier to fix than indium wires. Even if the thermal contact surface loses contact and falls off or shifts, stacking will not occur, thereby affecting the thermal conductivity. However, since the area of the indium sheet is much larger than that of the indium wire, extremely high pressure is required to act on the indium sheet so that the thermal contact surfaces on both sides of the indium sheet can fully contact. Not all equipment or devices can meet this requirement, and excessive pressure may damage parts in the equipment or device.
[0036] Based on the above technical difficulties, the present application proposes a solution that can be used to fix the indium wire so that the thermal conductive structure can maintain good thermal conductivity after repeated separation and combination with other equipment or devices.
[0037] Example 1
[0038] See also Figure 3-10 As shown, a heat-conducting structure of a superconducting magnet cold head includes: a heat-conducting base 10 and a heat-conducting medium 20, wherein the heat-conducting base 10 is formed with at least one thermal contact surface 11 for exchanging heat with the thermal contact surface of other equipment or devices, and the heat-conducting medium 20 is fixedly arranged on the thermal contact surface 11.
[0039] It should be noted that the heat-conducting medium needs to be made of at least a solid and plastic heat-conducting material, that is, it can be deformed under the action of force so that the two thermal contact surfaces can be fully in contact after the heat-conducting medium is deformed. For example, graphene, copper, etc. can be used, and in the present embodiment, indium is used as a preferred embodiment to illustrate this scheme. At the same time, the thermal contact surface 11 of the heat-conducting substrate 10 can be set according to actual needs, and the number of settings is not limited. Accordingly, a heat-conducting medium 20 needs to be fixedly arranged on each thermal contact surface 11 to promote the acceleration of heat exchange efficiency. Without departing from the spirit of the utility model, the modifications and embellishments made to the embodiments of the utility model by those skilled in the art still fall within the scope of the patent application of the utility model.
[0040] Specifically, a limiting portion 111 is provided on the thermal contact surface 11, which can limit the displacement of the heat-conducting medium 20 in the vertical direction along the thermal contact surface 11. When the thermal contact surface of other equipment or devices is pressed against the thermal contact surface 11 of the thermally conductive substrate 10, even if the heat-conducting medium 20 undergoes plastic deformation and adheres to the thermal contact surface of other equipment or devices, it can be prevented from falling off the thermal contact surface 11 of the thermally conductive substrate 10. Similarly, the position of the heat-conducting medium 20 on the thermal contact surface 11 of the thermally conductive substrate 10 can be prevented from changing, so as to enable thermal contact with other equipment or devices to be reestablished.
[0041] It is understandable that even when two seemingly smooth interfaces are fitted together, they cannot be completely in full contact due to the influence of other factors such as the inclination of the interface, the degree of concavity, etc. Therefore, when the two thermal contact surfaces are directly fitted together, the heat exchange efficiency is relatively low due to the influence of the contact area. Usually, thermal grease is filled between the two thermal contact surfaces to make them fully in contact. However, in this embodiment, since the two thermal contact surfaces need to be repeatedly separated and fitted together, thermal grease is not suitable for this application scenario. Accordingly, the two thermal contact surfaces are fully in contact by deformation of the thermal wire or the thermal conductive sheet.
[0042] Therefore, the limiting portion 111 is provided on the thermal contact surface 11 to fix the heat conducting medium 20. When the thermal contact surface 11 is pressed by other equipment or devices, the heat conducting medium 20 can be plastically deformed in the limiting portion 111, so as to be fixed in the limiting portion 111, and will not fall off from the thermal contact surface 11 when the thermal contact surface 11 is separated from other equipment or devices, so as to re-establish thermal contact.
[0043] Furthermore, since the heat conducting sheet has a relatively large pressure to deform, the heat conducting medium is preferably arranged in a wire or strip shape on the thermal contact surface 11. The limiting portion 111 is correspondingly arranged as a groove so that the heat conducting wire or heat conducting strip can be embedded and fixed therein. In a specific embodiment, the groove can be arranged along a preset path or direction, such as Figure 4 , 7 9, it can be adjusted according to the number of heat-conducting wires or strips and the shape of the thermal contact surface 11. For example, if the heat-conducting wire or strip is a whole, the path of the groove can be as follows: Fig. 9 When there are multiple heat-conducting wires or strips, the number of grooves can be set one by one, and the path of the grooves can be set according to the shape of the thermal contact surface 11. Figure 4 or Figure 7 There are no excessive restrictions on the direction, shape, size, and number of the grooves, and the design can be based on the layout plan with the best heat exchange efficiency. For example, the heat-conducting medium 20 can be evenly distributed at equal distances, and after the heat-conducting medium 20 is deformed, the heat-conducting substrate 10 and other equipment or devices can be in full contact to accelerate heat exchange.
[0044] It can be understood here that the groove needs to be able to fix the heat-conducting medium 20 therein, so the opening of the groove needs to be relatively small, so that the heat-conducting medium 20 can be prevented from slipping out of the opening after being directly embedded in the groove, or the deformed part of the heat-conducting medium 20 can be relatively fixed after it is deformed and embedded in the groove. Therefore, no matter which of the above situations, the groove must at least meet the requirement that along the direction in which the heat-conducting medium 20 is embedded, there is at least one groove width greater than the groove width at the tangent position of the heat-conducting medium 20 and the groove, so as to fix the heat-conducting medium 20 on the thermal contact surface 11. For details, please refer to Figure 5 As shown, the heat conductive wire or strip is placed on the groove, and according to the depth of the groove, it can be directly pressed manually to fix it in the groove, or it can be simply fixed manually by pressing first, and then other equipment or devices act on the thermal contact surface 11 and apply pressure, so that the heat conductive wire or strip is deformed and completely fixed by the groove. Correspondingly, the groove is not limited to the above-mentioned style, for example Fig.10 The styles shown can all meet the target requirements of this application and no excessive restrictions are imposed on them.
[0045] It should be noted that, compared with the thermal conductive sheet, the texture of the thermal conductive wire is softer and the force required for deformation is smaller. Therefore, in this embodiment, it is preferred to arrange the thermal conductive wire or strip on the thermal contact surface. However, in actual applications, the shape of the thermal conductive medium is not limited to the above. Specifically, the shape in which the force is adapted to the actual application scenario can be selected according to the force requirements for deformation under different shapes, and the groove is correspondingly arranged according to the shape of the thermal conductive medium. For example, the thermal conductive medium can be set in a bead shape and evenly arranged on the thermal contact surface, and the limiting portion, i.e., the groove, can be adjusted to a concave hole corresponding to the bead shape, so that the thermal conductive medium can be embedded and fixed therein. Without departing from the spirit of the utility model, the modifications and embellishments made to the embodiments of the utility model by those skilled in the art still fall within the scope of the patent application of the utility model.
[0046] In this embodiment, the groove is preferably set as a dovetail groove. The processing technology of the dovetail groove is simple and cheap, and a variety of different styles of distribution density and paths can be achieved, and it is neat and beautiful. The inverted triangle structure of the dovetail groove can fix the thermal wire or strip well, thereby overcoming the adhesion of the thermal wire or strip after compression. Furthermore, the depth of the dovetail groove can preferably be set to 20% to 30% of the diameter of the thermal wire or strip, the bottom width is similar to the diameter or characteristic size of the thermal wire or strip, and the dovetail angle is 50 to 75 degrees. Without departing from the spirit of the utility model, the modifications and embellishments made to the embodiments of the utility model by those skilled in the art still fall within the scope of the patent application of the utility model.
[0047] In a specific embodiment, the heat conductive substrate 10 can be made of other heat conductive materials such as copper or aluminum. At the same time, dovetail grooves of different sizes can only be processed with milling cutters of corresponding specifications. High thermal conductivity metals such as pure copper or aluminum are usually easy to process. The process has very low wear on the milling cutter, which correspondingly extends the service life of the milling cutter and reduces the cost of the processing technology.
[0048] In summary, in this embodiment, the heat-conducting substrate 10 is grooved to fix the heat-conducting medium 20. Preferably, a corresponding dovetail groove is opened on the copper block to fix the indium wire on the thermal contact surface, and the fixing method can be directly fixed by manual pressing or directly pressed by other equipment or devices. The indium wire will be completely embedded in the dovetail groove after being squeezed with a large pressure. Although the indium wire adheres to another thermal contact surface after being pressed, the dovetail groove can also overcome this force well, and the indium wire can be fixed on the thermal contact surface of the copper block when the thermal contact is disconnected. After the thermal contact is restored, good thermal contact can be formed as before, thereby maintaining a high heat exchange efficiency. Even if the thermal contact surfaces are repeatedly separated and attached, the indium wire will not fall off and stack or shift, so there is no need to replace a new indium wire, which greatly improves the reliability of the thermal contact performance.
[0049] Example 2
[0050] See also Fig.11 As shown, this embodiment further provides a superconducting magnet cold head, comprising the heat-conducting structure 200 of the above embodiment and a cold head 100 for cooling, wherein the heat-conducting structure 200 is connected to the first stage and the second stage of the cold head.
[0051] It should be noted that Fig.11 The superconducting magnet cold head shown is only used as a preferred embodiment for reference. Other superconducting magnet cold heads with two thermal contact surfaces, or multiple thermal contact surfaces that need to be repeatedly separated and re-contacted can all adopt the thermal conductive structure 100 of the present application. Without departing from the spirit of the present invention, modifications and embellishments made to the embodiments of the present invention by those skilled in the art still fall within the scope of the patent application of the present invention.
[0052] Example 3
[0053] This embodiment also provides a magnetic resonance imaging system, comprising the superconducting magnet cold head in the above embodiment.
[0054] In summary, the utility model provides a heat-conducting structure that can be used in the superconducting magnet cold head of the magnetic resonance imaging system to reduce the contact thermal resistance and improve the heat exchange efficiency. The above-mentioned heat-conducting structure can fix the indium wire on the thermal contact surface in the form of slots, and can ensure that the indium wire maintains the correct distribution position and will not fall off or shift when the thermal contact surface is repeatedly contacted and disconnected, so as to meet the working requirements of the superconducting magnet cold head. At the same time, the fixing steps of the indium wire are simple and do not rely on any auxiliary equipment or tools. The indium wire only needs to be pressed into the groove of the thermal contact surface, and can be reused.
[0055] With the shortage of liquid helium resources and the increase in costs, getting rid of dependence on liquid helium is an inevitable trend, and conduction cooling magnets that do not require liquid helium will be the mainstream product in the future. Indium wire is usually used in conduction cooling magnets and other refrigeration devices to reduce contact thermal resistance. The heat-conducting structure provided by the utility model still maintains good thermal conductivity after repeated separation and combination with other equipment or devices, providing certain technical support for the future development of conduction cooling magnets and other refrigeration devices, as well as the design of indium wire.
[0056] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.
[0057] In the description herein, many specific details, such as examples of components and / or methods, are provided to provide a complete understanding of the embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more specific details or by other devices, systems, components, methods, components, materials, parts, etc. In other cases, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.
[0058] References throughout the specification to "one embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention, and not necessarily in all embodiments. Thus, various appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. In addition, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention described and illustrated herein may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.
[0059] It should also be understood that one or more of the elements shown in the figures may also be implemented in a more separate or more integrated manner, or even removed because they are inoperable in certain circumstances or provided because they may be useful depending on the application.
[0060] In addition, unless otherwise explicitly indicated, any marking arrows in the drawings should be regarded as exemplary only and not limiting. In addition, unless otherwise indicated, the term "or" used herein is generally intended to mean "and / or". In the case where the term is not clear because it is anticipated that the ability to separate or combine is provided, the combination of components or steps will also be regarded as indicated.
[0061] As used in the description herein and throughout the claims that follow, "a", "an", and "the" include plural references unless otherwise indicated. Likewise, as used in the description herein and throughout the claims that follow, the meaning of "in" includes "in" and "on" unless otherwise indicated.
[0062] The above description of the illustrated embodiments of the present invention (including that described in the Abstract of the Specification) is not intended to be an exhaustive list or to limit the present invention to the precise form disclosed herein. Although specific embodiments of the present invention and examples of the present invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention as will be recognized and understood by those skilled in the art. As noted, these modifications may be made to the present invention in accordance with the above description of the embodiments described in the present invention, and these modifications will be within the spirit and scope of the present invention.
[0063] Systems and methods have been generally described herein as details that are helpful for understanding the present invention. In addition, various specific details have been given to provide an overall understanding of the embodiments of the present invention. However, those skilled in the relevant art will recognize that the embodiments of the present invention can be practiced without one or more specific details, or practiced using other devices, systems, accessories, methods, components, materials, parts, etc. In other cases, well-known structures, materials, and / or operations are not specifically shown or described in detail to avoid confusion with various aspects of the embodiments of the present invention.
[0064] Thus, although the present invention has been described herein with reference to specific embodiments thereof, freedom of modification, various changes and substitutions are also within the above disclosure, and it should be understood that in some cases, some features of the present invention will be adopted without corresponding use of other features without departing from the scope and spirit of the proposed utility model. Therefore, many modifications can be made to adapt specific environments or materials to the essential scope and spirit of the present utility model. The present utility model is not intended to be limited to the specific terms used in the claims below and / or the specific embodiments disclosed as the best mode for carrying out the present utility model, but the present utility model will include any and all embodiments and equivalents falling within the scope of the appended claims. Therefore, the scope of the present utility model will be determined solely by the appended claims.
Claims
1. A thermal conductive structure of a superconducting magnet cold head, characterized in that: include: A heat-conducting substrate is formed with at least one thermal contact surface for exchanging heat with other equipment or devices; A heat-conducting medium is arranged on the thermal contact surface, and the heat-conducting medium is made of a solid plastic heat-conducting material; A limiting portion is provided on the thermal contact surface, and the limiting portion is configured to limit the displacement of the heat-conducting medium in a vertical direction along the thermal contact surface; Wherein, when the thermal contact surface is pressed by other equipment or devices, the heat-conducting medium can undergo plastic deformation in the limiting portion, and when the thermal contact surface is separated from other equipment or devices, the heat-conducting medium can remain in the limiting portion.
2. The heat-conducting structure of the superconducting magnet cold head according to claim 1, characterized in that: The heat conducting medium is configured to be in a filament or strip shape.
3. The heat-conducting structure of the superconducting magnet cold head according to claim 2, characterized in that: The limiting portion is configured as a groove, the groove is arranged along a preset direction or path, and the heat conducting medium is embedded in the groove and fixed.
4. The heat-conducting structure of the superconducting magnet cold head according to claim 3, characterized in that: The groove is arranged along the embedding direction of the heat conducting medium, and at least one groove width of the portion below the tangent position of the heat conducting medium and the groove is greater than the groove width of the tangent position of the heat conducting medium and the groove.
5. The heat-conducting structure of the superconducting magnet cold head according to claim 4, characterized in that: The groove is configured as a dovetail groove.
6. The heat-conducting structure of the superconducting magnet cold head according to claim 5, characterized in that: The depth of the dovetail groove is 20%-30% of the diameter of the heat-conducting medium, the bottom width matches the diameter of the heat-conducting medium, and the dovetail angle is 50-75 degrees.
7. The heat-conducting structure of a superconducting magnet cold head according to claim 3, characterized in that: The limiting portion includes one or more grooves, and the grooves are evenly distributed with equal distances.
8. The heat-conducting structure of a superconducting magnet cold head according to claim 1, characterized in that: The heat-conducting medium is made of indium, and the heat-conducting substrate is made of aluminum or copper.
9. A superconducting magnet cold head, characterized in that: A heat-conducting structure comprising any one of claims 1 to 8, and a cold head; Wherein, the heat-conducting structure is connected to the thermal coupling component of the cold head.
10. A magnetic resonance imaging system, characterized in that: The invention comprises the superconducting magnet cold head as claimed in claim 9 above.