Wafer edge searching device

Abstract

The utility model discloses a wafer edge searching device, which comprises a camera, a gap detection sensor, a wafer and a sucker, the camera is positioned above one side of the wafer, the gap detection sensor is positioned above the other side of the wafer, and the wafer is positioned right above the sucker. According to the utility model, high-reliability wafer gap detection can be realized, the orientation accuracy of the wafer in the preparation process is optimized, and the problems of poor product and inaccurate edge finding caused by position errors of the wafer gap when other damaged gaps exist at the edge of the wafer, which may cause that a pattern cannot be transferred according to an expected position, circuit pattern dislocation, and the like are reduced. And the performance and the yield of the device are seriously influenced.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer edge finding device. Background Art

[0002] Traditional optical or mechanical edge-finding technologies may not be able to accurately identify the actual effective edge of the wafer, especially when there is a notch or damage on the edge of the wafer. The positioning system may lock on the notch rather than the complete effective edge of the wafer, resulting in position deviations during subsequent processing, testing or packaging.

[0003] As the size of semiconductor processes continues to shrink, the requirements for wafer positioning accuracy are becoming increasingly higher. Traditional edge-finding methods are inaccurate when there are other damaged gaps on the edge of the wafer. Inaccurate wafer edge-finding may lead to serious errors in subsequent processes, thereby affecting the chip yield. Inaccurate edge-finding may cause the pattern to fail to transfer to the expected position, causing circuit pattern misalignment, seriously affecting device performance and yield.

[0004] Therefore, how to provide a wafer edge finding device is a problem that those skilled in the art need to solve urgently. Utility Model Content

[0005] One purpose of the utility model is to propose a wafer edge finding device, which can achieve highly reliable wafer notch detection, optimize the orientation accuracy of the wafer during the preparation process, and reduce product defects caused by wafer notch position errors when other damaged notches exist on the wafer edge. Inaccurate edge finding may cause the pattern to fail to be transferred to the expected position, causing circuit pattern misalignment, seriously affecting device performance and yield rate.

[0006] According to an embodiment of the utility model, a wafer edge-finding device includes a camera, a notch detection sensor, a wafer and a suction cup, wherein the camera is located above one side of the wafer, the notch detection sensor is located above the other side of the wafer, and the wafer is located directly above the suction cup.

[0007] Further, the bottom of the notch detection sensor is installed on one side of the workbench, and the bottom of the suction cup is installed on the other side of the workbench.

[0008] Furthermore, a notch is provided at an edge of the wafer.

[0009] Furthermore, a fixed mark is provided on a side of the edge surface of the wafer opposite to the notch.

[0010] Furthermore, the camera is located at the edge of the wafer.

[0011] Furthermore, the notch detection sensor is located at the edge of the wafer.

[0012] The beneficial effects of the utility model are:

[0013] The utility model can realize highly reliable wafer notch detection, optimize the orientation accuracy of the wafer during the preparation process, and reduce product defects caused by wafer notch position errors when other damaged notches exist on the wafer edge. Inaccurate edge finding may cause the pattern to fail to be transferred to the expected position, causing circuit pattern misalignment, seriously affecting device performance and yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0015] Figure 1 This is a schematic structural diagram of a wafer edge finding device proposed by the utility model;

[0016] Figure 2 The utility model is a schematic structural diagram of a wafer edge-finding device.

[0017] In the figure: 1. Camera; 2. Notch detection sensor; 3. Wafer; 4. Suction cup; 5. Notch; 6. Fixed mark. DETAILED DESCRIPTION

[0018] Now the utility model is further described in detail with reference to the accompanying drawings. These drawings are simplified schematic diagrams, which only illustrate the basic structure of the utility model in a schematic manner, and therefore only show the components related to the utility model.

[0019] Please refer to Figure 1 to Figure 2 The utility model provides a wafer edge finding device, including a camera 1, a notch detection sensor 2, a wafer 3 and a suction cup 4, wherein the camera 1 is located above one side of the wafer 3, and the camera 1 is used to capture a fixed mark 6 in all directions; the notch detection sensor 2 is located above the other side of the wafer 3, and the notch detection sensor 2 is used to detect a notch 5 of the wafer 3; the wafer 3 is located directly above the suction cup 4, and the suction cup 4 is used to adsorb and support the wafer 3.

[0020] The bottom of the notch detection sensor 2 is installed on one side of the workbench, and the bottom of the suction cup 4 is installed on the other side of the workbench. The notch detection sensor 2 and the suction cup 4 are both installed on the same workbench to form an integrated device.

[0021] A notch 5 is provided at one edge of the wafer 3 , and a fixed mark 6 is provided on a side of the edge surface of the wafer 3 opposite to the notch 5 .

[0022] The camera 1 is located at the edge of the wafer 3 , and the notch detection sensor 2 is located at the edge of the wafer 3 . The camera 1 can be connected to an external support device or installed on a workbench through a connecting plate.

[0023] Furthermore, the wafer 3 is placed on the suction cup 4 through the clamping device, and the suction cup 4 works to adsorb the back side of the wafer 3 so that the wafer 3 can be fixed on the suction cup 4. The suction cup 4 can be rotated through the turntable to drive the wafer 3 to rotate, so that the notch detection sensor 2 and the suction cup 4 can detect the edge of the wafer 3.

[0024] A plurality of marks which are fixed and concentrated relative to the notch 5 of the wafer 3 are selected on the wafer 3 , and the camera 1 is installed above the area of ​​the fixed marks 6 .

[0025] When the notch detection sensor 2 detects the notch 5 of the wafer 3 , the correct notch 5 of the wafer 3 is detected, and all the set fixed marks 6 can be detected in the picture taken by the camera 1 .

[0026] When the notch detection sensor 2 detects other damaged notches 5, the camera 1 cannot detect all the fixed marks 6 in the picture taken.

[0027] To avoid the situation where there is a notch 5 or damage on the edge of the wafer 3, the positioning system may lock on the notch 5 instead of the complete effective edge of the wafer 3, resulting in position deviation in subsequent processing, testing or packaging. Inaccurate edge finding of the wafer 3 may cause serious errors in subsequent processes, thereby affecting the chip yield. Inaccurate edge finding may cause the pattern to fail to transfer to the expected position, causing circuit pattern misalignment, seriously affecting the performance and yield of the device.

[0028] The above are only preferred specific implementation methods of the utility model, but the protection scope of the utility model is not limited to this. Any technician familiar with the technical field within the technical scope disclosed by the utility model, who makes equivalent replacements or changes based on the technical scheme and utility model concept of the utility model, should be covered by the protection scope of the utility model.

Claims

1. A wafer edge finding device, characterized in that: The invention comprises a camera (1), a notch detection sensor (2), a wafer (3) and a suction cup (4), wherein the camera (1) is located above one side of the wafer (3), the notch detection sensor (2) is located above the other side of the wafer (3), and the wafer (3) is located directly above the suction cup (4).

2. The wafer edge finding device according to claim 1, characterized in that: The bottom of the notch detection sensor (2) is installed on one side of the workbench, and the bottom of the suction cup (4) is installed on the other side of the workbench.

3. The wafer edge finding device according to claim 1, characterized in that: A notch (5) is provided at one edge of the wafer (3).

4. The wafer edge finding device according to claim 3, characterized in that: A fixing mark (6) is provided on the side of the edge surface of the wafer (3) opposite to the notch (5).

5. The wafer edge finding device according to claim 1, characterized in that: The camera (1) is located at the edge of the wafer (3).

6. The wafer edge finding device according to claim 1, characterized in that: The notch detection sensor (2) is located at the edge of the wafer (3).

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