Sheet turning mechanism

Abstract

The utility model relates to a piece turning mechanism which comprises a plurality of piece turning devices, each piece turning device comprises a frame body, a plurality of piece turning assemblies, a driving shaft and a motor, the two ends of each driving shaft are respectively connected with the frame body in a rotating mode, the motor is installed at one end of the frame body, the driving end of the motor is connected with the driving shaft, and the piece turning assemblies are arranged on the driving shafts in a sleeved mode at intervals. The sheet turning assembly comprises two turning discs and a fixing assembly, the fixing assembly is fixedly connected with the driving shaft, and the two turning discs are arranged on the fixing assembly in a sleeving mode at intervals and fixedly connected with the fixing assembly. The overturning disc comprises a plurality of detachable fan blade assemblies arranged in the circumferential direction of the fixing assembly, containing grooves for containing silicon wafers are formed between the adjacent fan blade assemblies, each fan blade assembly comprises a first fan blade and a second fan blade, the shape of the second fan blade is the same as that of the first fan blade, the second fan blade is larger than that of the first fan blade, and the second fan blade is connected with the first fan blade. The sheet turning mechanism is long in service life, and meanwhile, the replacement cost is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of photovoltaics, in particular to a film turning mechanism. Background Art

[0002] The flipping mechanism includes two flipping discs, a driving mechanism and a driving shaft. The two flipping discs are symmetrically provided with a plurality of receiving slots. The silicon wafer feeding mechanism sequentially transfers the silicon wafers to the receiving slots of the two flipping discs. The driving mechanism drives the driving shaft to rotate according to a certain rule to flip multiple silicon wafers from one side to the other. The flipping discs in the prior art are usually integrally injection molded. Since multiple silicon wafers need to be flipped for a long time, the flipping discs are easily deformed, so the entire flipping disc needs to be replaced. Therefore, the flipping mechanism has a short service life and also increases the replacement cost. Utility Model Content

[0003] Based on this, a flap turning mechanism is provided, which has a long service life and reduces the replacement cost.

[0004] A film flipping mechanism comprises a plurality of film flipping devices, wherein the film flipping devices comprise a frame, a plurality of film flipping assemblies, a driving shaft and a motor, wherein both ends of the driving shaft are rotatably connected to the frame, the motor is mounted at one end of the frame, the driving end of the motor is connected to the driving shaft, a plurality of film flipping assemblies are sleeved on the driving shaft at intervals, and adjacent film flipping assemblies are spaced apart by the distance of a silicon wafer.

[0005] The flipping assembly includes two flipping discs and a fixed assembly, the fixed assembly is fixedly connected to the driving shaft, the two flipping discs are sleeved on the fixed assembly at intervals and fixedly connected to the fixed assembly, and the spacing between the flipping discs is less than the length of a silicon wafer.

[0006] The flip disk includes a plurality of detachable fan blade assemblies arranged along the circumference of the fixed assembly, and a receiving groove for accommodating silicon wafers is formed between adjacent fan blade assemblies. The fan blade assembly includes a No. 1 fan blade and a No. 2 fan blade. The No. 2 fan blade has the same shape as the No. 1 fan blade and is larger than the No. 1 fan blade. The No. 2 fan blade is connected to the No. 1 fan blade.

[0007] The flipping device of the above-mentioned flipping mechanism is composed of a frame, a plurality of flipping assemblies, a drive shaft and a motor. A plurality of accommodating slots for accommodating silicon wafers are arranged in the flipping assembly. The motor drives the drive shaft to drive the plurality of flipping assemblies to rotate. The flipping assembly cooperates with the silicon wafer loading mechanism to flip the silicon wafer from one side to the other side, and cooperates with the silicon wafer unloading mechanism to transfer the silicon wafer to other mechanisms. The flipping disk of the flipping assembly is composed of a plurality of detachable fan blade assemblies. When flipping multiple silicon wafers for a long time, it is not easy to cause the flipping disk to deform, which greatly improves the service life of the equipment. After long-term use, if deformation occurs, the fan blade assembly can also be replaced separately, which greatly reduces the replacement cost of the equipment.

[0008] In one of the embodiments, a detachable wear-resistant disk is provided on the opposite side of the two flip disks of the flap mechanism, the wear-resistant disk is sleeved on the fixed component, and the outer edge of the wear-resistant disk is close to the accommodating groove.

[0009] In one of the embodiments, the flip disk of the flap mechanism includes two semicircular flip disks, and the wear-resistant disk includes two semicircular wear-resistant disks.

[0010] In one embodiment, the fixing assembly of the flip mechanism includes two fixing parts, which include two semicircular protrusions and a semicircular cylinder. A groove for accommodating a drive shaft is provided in the semicircular cylinder. The two semicircular protrusions are installed on the semicircular cylinder at intervals. The interval between the semicircular protrusions is less than the length of a silicon wafer. Fixing holes fixedly connected to the drive shaft are provided at both ends of the semicircular cylinder. The semicircular flip disk is sleeved on the semicircular cylinder between the semicircular protrusions and the fixing holes and is connected to the semicircular protrusions. The semicircular wear-resistant disk is sleeved on the semicircular protrusions and is connected to the semicircular flip disk.

[0011] In one of the embodiments, the wear-resistant disk of the flap mechanism is made of POM material.

[0012] In one of the embodiments, a trigger component is disposed at one end of the driving shaft of the flap mechanism, and a photoelectric sensor is disposed on one side of the frame close to the trigger component. The photoelectric sensor cooperates with the trigger component to control the motor to return to the reference point.

[0013] The beneficial effects of this application are:

[0014] The present application provides a flapping mechanism, the flapping device of which is composed of a frame, a plurality of flapping assemblies, a drive shaft and a motor. A plurality of accommodating slots for accommodating silicon wafers are arranged in the flapping assembly. The motor drives the drive shaft to drive the plurality of flapping assemblies to rotate. The flapping assembly cooperates with the silicon wafer loading mechanism to flip the silicon wafer from one side to the other side, and cooperates with the silicon wafer unloading mechanism to transfer the silicon wafer to other mechanisms. The flipping disk of the flapping assembly is composed of a plurality of detachable fan blade assemblies. When the flipping operation of multiple silicon wafers is performed for a long time, it is not easy to cause the flipping disk to deform, which greatly improves the service life of the equipment. After long-term use, if deformation occurs, the fan blade assembly can also be replaced separately, which greatly reduces the replacement cost of the equipment.

[0015] A wear-resistant disc is also provided in the flipping mechanism. Due to long-term use, the silicon wafer inserted into the receiving slot will cause wear to the receiving slot. This setting can reduce the wear of the silicon wafer on the receiving slot, and only the wear-resistant disc needs to be replaced separately in the later stage. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1A schematic diagram of a flap mechanism according to an embodiment of the present application;

[0017] Figure 2 A schematic diagram of a flipping device of a flipping mechanism according to an embodiment of the present application;

[0018] Figure 3 A schematic diagram of a flap assembly of a flap mechanism according to an embodiment of the present application from one perspective;

[0019] Figure 4 A schematic diagram of a flap assembly of a flap mechanism according to an embodiment of the present application from another perspective;

[0020] Figure 5 A schematic diagram of a flip disk, a wear-resistant disk and a fixing assembly of a flap mechanism according to an embodiment of the present application;

[0021] Figure 6 A schematic diagram of a flip disk of a flap mechanism according to an embodiment of the present application;

[0022] Figure 7 A schematic diagram of a fixing assembly of a flap mechanism according to an embodiment of the present application;

[0023] in:

[0024] 1. flap device; 11. frame; 12. flap assembly; 13. drive shaft; 14. motor; 121. flip disk; 122. fixing assembly; 123. wear-resistant disk; 100. fan blade assembly; 101. receiving groove; 102. semicircular flip disk; 103. semicircular wear-resistant disk; 104. fixing component; 001. fan blade No. 1; 002. fan blade No. 2; 003. semicircular protrusion; 004. semicircular cylinder; 005. groove; 006. fixing hole; 131. trigger component; 111. photoelectric sensor. DETAILED DESCRIPTION

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below with reference to the accompanying drawings.

[0026] like Figure 1 and Figure 2 As shown, an embodiment of the present application provides a flap mechanism, including a plurality of flap devices 1, the flap devices 1 include a frame 11, a plurality of flap assemblies 12, a drive shaft 13 and a motor 14, both ends of the drive shaft 13 are rotatably connected to the frame 11 respectively, the motor 14 is mounted at one end of the frame 11, the drive end of the motor 14 is connected to the drive shaft 13, a plurality of flap assemblies 12 are spaced apart on the drive shaft 13, and adjacent flap assemblies 12 are spaced apart by the distance of a silicon wafer.

[0027] like Figure 3As shown, the flipping assembly 12 includes two flipping disks 121 and a fixing assembly 122. The fixing assembly 122 is fixedly connected to the driving shaft 13. The two flipping disks 121 are spaced apart and sleeved on the fixing assembly 122 and fixedly connected to the fixing assembly 122. The spacing between the flipping disks 121 is less than the length of a silicon wafer.

[0028] like Figure 4 and Figure 6 As shown, the flip disk 121 includes a plurality of detachable fan blade assemblies 100 arranged circumferentially along the fixed assembly 122, and a receiving groove 101 for receiving silicon wafers is formed between adjacent fan blade assemblies 100. The fan blade assembly 100 includes a number of fan blades 001 and a number of fan blades 002. The number two fan blades 002 have the same shape as the number one fan blades 001 and are larger than the number one fan blades 001. The number two fan blades 002 are connected to the number one fan blades 001.

[0029] Specifically, the flipping device 1 of the flipping mechanism is composed of a frame 11, a plurality of flipping assemblies 12, a driving shaft 13 and a motor 14. The flipping assemblies 12 are spaced apart by a distance of a silicon wafer. The flipping assemblies 12 include two flipping discs 121 and a fixing assembly 122. The fixing assembly 122 is fixedly connected to the driving shaft 13 by screws. The two flipping discs 121 are parallelly spaced and installed on the fixing assembly 122, and are fixedly connected to the fixing assembly 122 by screws. The distance between the two flipping discs 121 is less than the length of the silicon wafer. The flipping disc 121 can be provided with 18 detachable blade assemblies 100 along the circumference, and a receiving groove 101 for receiving silicon wafers is formed between adjacent blade assemblies 100. The motor 14 drives the driving shaft 13 to drive the 6 groups of flipping assemblies 12 to rotate. The silicon wafer loading mechanism sequentially transfers the silicon wafers to the receiving groove 101 of the flipping assembly. The flipping assembly 12 rotates to flip the silicon wafer from one side to the other side, and then cooperates with the silicon wafer unloading mechanism to transfer the silicon wafer to other mechanisms. The detachable fan blade assembly 100 includes a No. 1 fan blade 001 and a No. 2 fan blade 002. The No. 2 fan blade 002 has the same shape as the No. 1 fan blade 001, and is larger than the No. 1 fan blade 001. When the silicon wafer extends into the receiving groove 101, the No. 2 fan blade 002 bears most of the weight of the silicon wafer.

[0030] In the above structure, by using a separate detachable blade assembly 100, when a plurality of silicon wafers are flipped over for a long time, the flip plate 121 is not easily deformed, which greatly improves the service life of the device. Since most of the weight of the silicon wafer is on the second blade 002, if it is deformed after long-term use, the second blade 002 can be replaced separately, which greatly reduces the replacement cost of the equipment.

[0031] like Figure 4 and Figure 5As shown, in one embodiment, a detachable wear-resistant disk 123 is provided on the opposite side of the two flip disks 121 of the flap mechanism, and the wear-resistant disk 123 is sleeved on the fixing assembly 122 , and the outer edge of the wear-resistant disk 123 is close to the accommodating groove 101 .

[0032] Specifically, the outer edge of the wear-resistant disk 123 is close to the receiving groove 101 , and when the silicon wafer extends into the receiving groove 101 , it collides with the wear-resistant disk 123 .

[0033] The above structure, by providing the wear-resistant disc 123, generates friction between the silicon wafer and the wear-resistant disc 123, reduces the wear on the flip disc 121, and thus increases the service life of the flip disc 121. The wear-resistant disc 123 can be replaced separately, and the replacement cost of the equipment is also reduced.

[0034] like Figure 5 As shown, in one embodiment, the flip disc 121 of the flap mechanism includes two semicircular flip discs 102 , and the wear-resistant disc 123 includes two semicircular wear-resistant discs 103 .

[0035] According to the above arrangement, if deformation occurs after long-term use, the semicircular flip disc 102 or the semicircular wear-resistant disc 103 can be replaced separately, thereby reducing the replacement cost.

[0036] like Figure 7 As shown, in one embodiment, the fixing component 122 of the flip mechanism includes two fixing parts 104, the fixing part 104 includes two semicircular protrusions 003 and a semicircular cylinder 004, a groove 005 for accommodating the drive shaft 13 is arranged in the semicircular cylinder 004, the two semicircular protrusions 003 are installed on the semicircular cylinder 004 at intervals, the interval between the semicircular protrusions 003 is less than the length of a silicon wafer, and fixing holes 006 fixedly connected to the drive shaft 13 are arranged at both ends of the semicircular cylinder 004, the semicircular flip disk 102 is sleeved on the semicircular cylinder 004 between the semicircular protrusions 003 and the fixing holes 006, and is connected to the semicircular protrusions 003, and the semicircular wear-resistant disk 103 is sleeved on the semicircular protrusions 003, and is connected to the semicircular flip disk 102.

[0037] Specifically, the two semicircular cylinders 004 of the fixing assembly 122 are respectively wrapped around the drive shaft 13, and the bolt assembly passes through the fixing holes 006 of the drive shaft 13 and the two semicircular cylinders 004 to fix the two semicircular cylinders 004 and the drive shaft 13 together. Two semicircular protrusions 003 are arranged on the semicircular cylinder 004 at intervals. The semicircular flip disk 102 is sleeved on the semicircular cylinder 004 and is connected to the semicircular protrusion 003 by the bolt assembly. The semicircular wear-resistant disk 103 is sleeved on the semicircular protrusion 003 and is connected to the semicircular flip disk 102 by screws.

[0038] The above arrangement facilitates the fixed connection between the semicircular flip plate 102 and the semicircular protrusion 003 , and facilitates the fixed connection between the semicircular wear-resistant plate 103 and the semicircular flip plate 102 .

[0039] like Figure 3 As shown, in one embodiment, the wear-resistant disk 123 of the flap mechanism is made of POM material.

[0040] This material has high cost performance and good wear resistance.

[0041] like Figure 2 As shown, in one embodiment, a trigger component 131 is provided at one end of the driving shaft 13 of the flipping mechanism, and a photoelectric sensor 111 is provided on the side of the frame 11 close to the trigger component 131. The photoelectric sensor 111 cooperates with the trigger component 131 to control the motor to return to the reference point.

[0042] Specifically, when the device fails or is being debugged, the photoelectric sensor 111 cooperates with the trigger component 131 to send a signal to the motor to return to the reference point. This arrangement facilitates the motor to return to the reference point.

[0043] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the utility model patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A flap mechanism, characterized in that: The invention comprises a plurality of flipping devices (1), wherein the flipping devices (1) comprise a frame (11), a plurality of flipping assemblies (12), a driving shaft (13) and a motor (14), wherein both ends of the driving shaft (13) are respectively rotatably connected to the frame (11), the motor (14) is mounted on one end of the frame (11), the driving end of the motor (14) is connected to the driving shaft (13), a plurality of flipping assemblies (12) are sleeved on the driving shaft (13) at intervals, and the interval between adjacent flipping assemblies (12) is the distance of a silicon wafer. The flipping assembly (12) comprises two flipping discs (121) and a fixing assembly (122), wherein the fixing assembly (122) is fixedly connected to the driving shaft (13), the two flipping discs (121) are sleeved on the fixing assembly (122) at intervals and are fixedly connected to the fixing assembly (122), and the spacing between the flipping discs (121) is less than the length of a silicon wafer. The flip plate (121) comprises a plurality of detachable fan blade assemblies (100) arranged along the circumference of a fixed assembly (122), a receiving groove (101) for receiving a silicon wafer is formed between adjacent fan blade assemblies (100), the fan blade assembly (100) comprises a first fan blade (001) and a second fan blade (002), the second fan blade (002) has the same shape as the first fan blade (001) and is larger than the first fan blade (001), and the second fan blade (002) is connected to the first fan blade (001).

2. The flap mechanism according to claim 1, characterized in that: A detachable wear-resistant disk (123) is provided on one side opposite to the two flip disks (121). The wear-resistant disk (123) is sleeved on the fixing assembly (122), and the outer edge of the wear-resistant disk (123) is close to the containing groove (101).

3. The flap mechanism according to claim 2, characterized in that: The turnover disk (121) includes two semicircular turnover disks (102), and the wear-resistant disk (123) includes two semicircular wear-resistant disks (103).

4. The flap mechanism according to claim 3, characterized in that: The fixing assembly (122) comprises two fixing parts (104), the fixing parts (104) comprising two semicircular protrusions (003) and a semicircular cylinder (004), a groove (005) for accommodating a drive shaft (13) being arranged in the semicircular cylinder (004), the two semicircular protrusions (003) being installed on the semicircular cylinder (004) at intervals, the interval between the semicircular protrusions (003) being less than the length of a silicon wafer, fixing holes (006) fixedly connected to the drive shaft (13) being arranged at both ends of the semicircular cylinder (004), the semicircular flip disk (102) being sleeved on the semicircular cylinder (004) between the semicircular protrusions (003) and the fixing holes (006) and being connected to the semicircular protrusions (003), and the semicircular wear-resistant disk (103) being sleeved on the semicircular protrusions (003) and being connected to the semicircular flip disk (102).

5. The flap mechanism according to claim 2, characterized in that: The wear-resistant disc (123) is made of POM material.

6. The flap mechanism according to claim 1, characterized in that: A trigger component (131) is disposed at one end of the driving shaft (13), and a photoelectric sensor (111) is disposed on one side of the frame (11) close to the trigger component (131). The photoelectric sensor (111) cooperates with the trigger component (131) to control the motor to return to a reference point.

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