Integrated circuit board structure

Abstract

The utility model discloses an integrated circuit board structure, which relates to the technical field of integrated circuit boards and comprises an upper PCB (printed circuit board) layer and a lower PCB layer, and a reinforcing layer is arranged between the upper PCB layer and the lower PCB layer. The reinforcing layer is located at the edge of the integrated circuit board, reinforcing assemblies of sheet structures are arranged at the positions of the hole positions and the expansion groove positions, gaps between the reinforcing assemblies are filled with resin to form a resin filling layer, and the reinforcing layer, the upper PCB layer and the lower PCB layer form an integrated structure through the resin filling layer in a gluing mode. The integrated circuit board provided by the utility model is high in structural strength, especially on the hole positions and the expansion positions of the integrated circuit board, the integrated circuit board has good anti-deformation capability after being subjected to external force, and the circuit and the components of the integrated circuit board can be effectively protected.

Description

Technical Field

[0001] The utility model belongs to the technical field of integrated circuit boards, and in particular relates to an integrated circuit board structure. Background Art

[0002] Integrated circuit boards are the foundation of the electronics industry and are used as carriers of electronic components and integrated circuits. In order to improve their heat dissipation performance, integrated circuit boards are generally installed in a suspended manner in the chassis during installation. For example, computer integrated circuit boards often need to exert a large downward pressure on the integrated circuit board when assembling accessories such as CPU cooling fans, graphics cards, and memory sticks. The downward pressure will place high requirements on the fixing points of the integrated circuit board and the strength of the integrated circuit board itself. Existing integrated circuit boards are usually made of PCB boards with a thickness of generally 0.4-2.0mm. When the downward pressure is too large, the circuits on the integrated circuit board will be affected or even damaged, making it unable to work normally. In order to provide the strength of the integrated circuit board, our company has designed and proposed a reinforced integrated circuit board structure. Utility Model Content

[0003] The purpose of the utility model is to solve the disadvantage of low strength in the prior art and propose an integrated circuit board structure. The integrated circuit board structure has high strength and better pressure resistance, which can effectively protect the integrated circuit board from being affected by external forces during assembly.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An integrated circuit board structure is designed, comprising an upper PCB board layer and a lower PCB board layer, wherein a reinforcing layer is arranged between the upper PCB board layer and the lower PCB board layer; the reinforcing layer is provided with reinforcing components of a thin sheet structure at the edge, hole position and expansion slot position of the integrated circuit board, the gaps between the reinforcing components are filled with resin to form a resin filling layer, and the reinforcing layer is bonded with the upper PCB board layer and the lower PCB board layer by means of the resin filling layer to form an integrated structure.

[0006] Furthermore, the reinforcement component includes a metal frame, an annular reinforcement pad and a strip reinforcement pad. The outer frame size of the metal frame is compatible with the outer frame size of the integrated circuit board. The annular reinforcement pad is located on each hole position of the integrated circuit board, and the hole on the annular reinforcement pad is compatible with the size of the hole position. The strip reinforcement pad is located on each expansion slot position of the circuit board. The strip reinforcement pad is provided with a through hole for avoiding the expansion slot pins, and the resin filling layer is filled in the gap between the metal frame, the annular reinforcement pad and the strip reinforcement pad.

[0007] Furthermore, a plurality of extension strips are provided on the circumference of the annular reinforcement pad.

[0008] Furthermore, when the annular reinforcement pad intersects with the metal frame, the intersecting annular reinforcement pad and the metal frame form an integrated structure.

[0009] Furthermore, the coverage area of ​​the strip-shaped reinforcement pad is larger than the area of ​​the expansion slot.

[0010] The utility model proposes an integrated circuit board structure, which has the beneficial effect that: the integrated circuit board structure proposed by the utility model has high strength, especially at the hole position and the expansion position of the integrated circuit board, and has good anti-deformation ability after being subjected to external force, which can effectively protect the circuit and the components of the integrated circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0012] Figure 1 It is a structural schematic diagram of the utility model;

[0013] Figure 2 It is a schematic diagram of the exploded structure of the utility model;

[0014] The markings in the figure are: 1. upper PCB layer; 2. lower PCB layer; 3. reinforcement layer; 31. metal frame; 32. ring reinforcement pad; 33. extension strip; 34. strip reinforcement pad; 35. through hole; 36. resin filling layer; 4. hole position; 5. expansion slot position. DETAILED DESCRIPTION

[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model; it is obvious that the described embodiments are only part of the embodiments of the utility model, rather than all of the embodiments, and all other embodiments obtained by ordinary technicians in this field based on the embodiments of the utility model without making creative work are within the scope of protection of the utility model.

[0016] In the description of the present invention, it should be noted that the terms "upper", "lower", "inside", "outside", "top / bottom" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0017] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "set / connected", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0018] The structural features of the utility model are now described in detail with reference to the accompanying drawings of the specification.

[0019] See also Figure 1-Figure 2 , an integrated circuit board structure, including an upper PCB board layer 1 and a lower PCB board layer 2, a reinforcing layer 3 is arranged between the upper PCB board layer 1 and the lower PCB board layer 2, wherein the reinforcing layer 3 is located at the edge of the integrated circuit board, the hole position 4 and the expansion slot position 5 and is provided with a reinforcing component with a thin sheet structure, the reinforcing component is made of a light and high-strength material, such as an aluminum alloy material, a titanium alloy material, etc., the gap between the reinforcing components is filled with resin to form a resin filling layer 36, and the reinforcing layer 3 is glued to form an integral structure with the upper PCB board layer 1 and the lower PCB board layer 2 by the resin filling layer 36, and the resin filling layer 36 plays a role of filling and adhesion, so that the reinforcing component is stably fixed between the upper PCB board layer 1 and the lower PCB board layer 2.

[0020] The reinforcement component includes a metal frame 31, an annular reinforcement pad 32 and a strip reinforcement pad 34. The outer frame size of the metal frame 31 is adapted to the outer frame size of the integrated circuit board, so that the edge of the metal frame 31 is flush with the edge of the integrated circuit board. The annular reinforcement pad 32 is located on each hole position 4 of the integrated circuit board. The hole on the annular reinforcement pad 32 is adapted to the size of the hole position 4, and the hole diameter is the same, which does not affect the fixed connection of the integrated circuit board. The size of the annular reinforcement pad 32 can be as large as possible without affecting the circuit of the integrated circuit board. The larger its size, the better the support strength for the hole position of the integrated circuit board. In order to increase the support strength of the annular reinforcement pad 32, a plurality of extension strips 33 can be provided on the circumference of the annular reinforcement pad 32. The extension strips 33 can increase the support area of ​​the annular reinforcement pad 32 in the integrated circuit board, thereby enhancing its support strength for the hole position 4. In addition, when the annular reinforcement pad 32 intersects with the metal frame 31, the intersecting annular reinforcement pad 32 and the metal frame 31 form an integrated structure. The strip reinforcement pad 34 is located on each expansion slot 5 of the circuit board. The coverage area of ​​the strip reinforcement pad 34 is larger than the area of ​​the expansion slot 5. The strip reinforcement pad 34 is provided with a through hole 35 for avoiding the pins of the expansion slot 5. The strip reinforcement pad 34 can play a supporting role in plugging and unplugging and installing expansion devices on the expansion slot 5. The resin filling layer 36 is filled in the gap between the metal frame 31, the annular reinforcement pad 32 and the strip reinforcement pad 34. The resin filling layer 36 can also make the annular reinforcement pad 32 and the strip reinforcement pad 34 better positioned in the metal frame 31.

[0021] The integrated circuit board structure of the utility model provides a reinforcement layer inside the integrated circuit board, and provides a metal frame 31, an annular reinforcement pad 32 and a strip reinforcement pad 34 at the edge, hole position 4 and expansion slot position 5 of the integrated circuit board in the reinforcement layer, thereby effectively enhancing the strength of the integrated circuit board structure, making the integrated circuit board have good anti-deformation ability after being subjected to external force, and effectively protecting the circuit and components of the integrated circuit board.

[0022] The above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. An integrated circuit board structure, comprising an upper PCB board layer (1) and a lower PCB board layer (2), characterized in that: A reinforcement layer (3) is provided between the upper PCB board layer (1) and the lower PCB board layer (2); The reinforcing layer (3) is provided with reinforcing components of a thin sheet structure at the edge, hole position (4) and expansion slot position (5) of the integrated circuit board, and the gaps between the reinforcing components are filled with resin to form a resin filling layer (36), and the reinforcing layer (3) is bonded to the upper PCB board layer (1) and the lower PCB board layer (2) by means of the resin filling layer (36) to form an integral structure.

2. An integrated circuit board structure according to claim 1, characterized in that: The reinforcement component comprises a metal frame (31), an annular reinforcement pad (32) and a strip reinforcement pad (34); the outer frame size of the metal frame (31) is matched to the outer frame size of the integrated circuit board; the annular reinforcement pad (32) is located on each hole position (4) of the integrated circuit board; the hole on the annular reinforcement pad (32) is matched to the size of the hole position (4); the strip reinforcement pad (34) is located on each expansion slot position (5) of the circuit board; the strip reinforcement pad (34) is provided with a through hole (35) for avoiding the pin of the expansion slot position (5); and the resin filling layer (36) is filled in the gap between the metal frame (31), the annular reinforcement pad (32) and the strip reinforcement pad (34).

3. An integrated circuit board structure according to claim 2, characterized in that: A plurality of extension strips (33) are provided in the circumferential direction of the annular reinforcement pad (32).

4. An integrated circuit board structure according to claim 3, characterized in that: When the annular reinforcement pad (32) and the metal frame (31) intersect, the intersecting annular reinforcement pad (32) and the metal frame (31) form an integral structure.

5. The integrated circuit board structure according to claim 3, characterized in that: The coverage area of ​​the strip-shaped reinforcement pad (34) is larger than the area of ​​the expansion slot (5).

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