Selective gold plating device for PCB (Printed Circuit Board)
By designing a PCB board selective electro-gold device including a support bracket, guide rail and sliding mechanism, the problem of damage caused by excessive pressure during the electroplating process is solved, and the stable clamping and automatic pressure adjustment of the circuit board are achieved, ensuring the safety of components and conductive paths.
Patent Information
- Application Number
- CN202421252613.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-04
- Publication Date
- 2025-03-28
- Estimated Expiration
- 2034-06-04
AI Technical Summary
During the electroplating process of the circuit board, tightening the circuit board through the connection screw may cause excessive pressure to cause damage to components or conductive paths.
A PCB board selective electric gold device including a support bracket, a guide rail and a sliding mechanism is designed. The clamp assembly is fixedly connected by a guide rail. The clamp assembly is composed of a base, a clamp, a limiting rod and a spring. The limiting rod closely presses one end of the spring to ensure stable clamping of the circuit board and automatic pressure adjustment.
It effectively avoids excessive pressure problems caused by screw fixing, ensures stable fixing and protection of the circuit board, avoids damage to components or conductive paths, and improves the automation and safety of the clamping process.
Smart Images

Figure CN222691977U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board electroplating, in particular to a selective electroplating device for a PCB board. Background Art
[0002] As a support for electronic components and a provider of circuit connections for electronic components, printed circuit boards (PCBs) play a vital role in the electronics industry. In order to improve the conductivity, wear resistance and aesthetics of PCBs, metal plating is usually performed on specific areas of PCBs. Publication No. CN113811088A discloses a PCB electroplating device and electroplating method, wherein the device comprises a guide rail, a clamping mechanism slidably mounted with the guide rail, an electrolytic cell disposed below the guide rail, and a control system for controlling the clamping mechanism; the clamping mechanism comprises a clamping plate, the clamping plate is two pieces, and the two clamping plates are disposed oppositely, a plurality of locking screws are evenly distributed on the surface of the clamping plate, a row of rollers is disposed at the bottom end of the clamping plate, a guide rail trolley is connected to the top end of the clamping plate, and the guide rail trolley is slidably connected to the guide rail; the control system is electrically connected to the guide rail trolley, and although the beneficial effect is obvious, excessive pressure may be caused to the circuit board by overtightening the connecting screws during operation, and the components or conductive paths on the circuit board may even be damaged.
[0003] Therefore, we propose a selective electroplating device for PCB boards. Utility Model Content
[0004] The purpose of the utility model is to provide a selective electroplating device for a PCB board to solve the problem raised in the above-mentioned background technology that excessive pressure may be caused to the circuit board and even components or conductive paths on the circuit board due to over-tightening of the connecting screws during operation.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a PCB selective electroplating device, comprising a supporting bracket, a guide rail is provided inside the supporting bracket, a sliding mechanism is slidably connected inside the guide rail, one end of the sliding mechanism is fixedly connected to a clamp assembly, the clamp assembly comprises a base, a group of relatively parallel clamps are provided on the inner side of the base, each group of the clamps is fixedly connected to a plurality of limit rods, a spring is provided on the outer side of the limit rod, and one end of the spring is tightly pressed against the inner side of the base.
[0006] Preferably, the base is composed of a pedestal and a sliding plate, a group of relatively parallel connecting rods are provided on both sides of the pedestal, one end of the connecting rod is snap-fitted with the bottom of the sliding plate, and the top of the sliding plate is rotatably connected to the top of the pedestal.
[0007] Preferably, a plurality of sliding rods are provided on one side of the splint, the sliding rods are slidably connected to the base, and one side of the splint is fixedly connected to one end of a limiting rod, and the limiting rods are distributed in a row.
[0008] Preferably, a second spring is provided inside the limiting rod, one end of the second spring is tightly pressed against one end of the push rod, and the push rod is slidably connected to the inside of the limiting rod.
[0009] Preferably, the sliding mechanism comprises a limit block, a sliding block is arranged inside the limit block, and one end of the sliding block is fixedly connected to the central axis of the top of the base.
[0010] Preferably, fixed brackets are provided on both sides of the guide rail, the fixed brackets are fixedly connected to the inner side of the support bracket, and the inside of the guide rail is slidably connected to the other end of the sliding block.
[0011] Compared with the prior art, the beneficial effects of the utility model are:
[0012] The utility model connects the sliding mechanism to fix the connection clamp assembly through the guide rail sliding connection, including a base and a group of relatively parallel clamping plates, a plurality of limit rods are fixedly connected to the clamping plates, one end of the limit rod tightly presses the spring tightly against the inner side of the base, effectively solving the problem of excessive pressure caused by the screw fixing method, which may cause damage to the circuit board, and can stably fix the circuit board, and can automatically adjust the pressure during the clamping process, thereby avoiding damage to the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] Figure 1 It is a schematic diagram of the structure of the utility model as a whole;
[0014] Figure 2 It is a schematic diagram of the structure of the decomposed clamp assembly of the utility model;
[0015] Figure 3 It is a schematic diagram of the structure of the clamp assembly of the utility model from a cross-section top view;
[0016] Figure 4 It is a schematic diagram of the overall structure of the utility model;
[0017] In the figure: 1. supporting bracket; 2. guide rail; 3. sliding mechanism; 4. clamp assembly; 201. fixed bracket; 301. limit block; 302. sliding block; 401. base; 402. clamp; 403. limit rod; 404. spring; 405. base; 406. sliding plate; 407. connecting rod; 408. sliding rod; 409. second spring; 410. push rod. DETAILED DESCRIPTION
[0018] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0019] Example
[0020] See also Figure 1-Figure 4 , a PCB selective electroplating device shown in the figure includes a support bracket 1, a guide rail 2 is arranged inside the support bracket 1, a sliding mechanism 3 is slidably connected inside the guide rail 2, one end of the sliding mechanism 3 is fixedly connected to a clamp assembly 4, and the clamp assembly 4 includes a base 401, a group of relatively parallel clamps 402 are arranged on the inner side of the base 401, each group of clamps 402 is fixedly connected to a plurality of limit rods 403, a spring 404 is arranged on the outer side of the limit rod 403, and one end of the spring 404 is tightly pressed on the inner side of the base 401. The utility model fixes the clamp assembly by slidingly connecting the sliding mechanism with the guide rail, including a base and a group of relatively parallel clamps, a plurality of limit rods are fixedly connected to the clamps, and one end of the limit rod tightly presses the spring tightly on the inner side of the base, which effectively solves the problem of excessive pressure caused by the screw fixing method, which may cause damage to the circuit board. At the same time, it can stably fix the circuit board and automatically adjust the pressure during the clamping process, thereby avoiding damage to the circuit board.
[0021] Furthermore, the base 401 is composed of a base 405 and a sliding plate 406. A group of relatively parallel connecting rods 407 are provided on both sides of the base 405. One end of the connecting rod 407 is snap-fitted with the bottom of the sliding plate 406, and the top of the sliding plate 406 is rotatably connected to the top of the base 405. The base is composed of two parts, the base and the sliding plate, which ensures that the clamp will not move or tilt due to external force during operation. At the same time, the clamp can easily adapt to circuit boards of different sizes and shapes, thereby greatly improving the versatility and flexibility of the clamp, and facilitating the installation and disassembly of the sliding plate, thereby greatly improving the operating efficiency.
[0022] Furthermore, a plurality of sliding rods 408 are provided on one side of the splint 402, and the sliding rods 408 are slidably connected to the base 401. One side of the splint 402 is fixedly connected to one end of a limiting rod 403, and the limiting rods 403 are distributed in a row. The plurality of sliding rods are provided on one side of the splint, and a sliding connection is adopted between the sliding rods and the base, which improves the flexibility and convenience of operation, and also enables the splint to easily adapt to circuit boards of different sizes and shapes, thereby expanding the scope of application of the clamp, avoiding excessive or insufficient local pressure on the circuit board, and protecting the circuit board and the components thereon.
[0023] Furthermore, a second spring 409 is provided inside the limiting rod 403, and one end of the second spring 409 is tightly pressed against one end of the ejector rod 410, and the ejector rod 410 is slidably connected to the inside of the limiting rod 403. Through the second spring provided inside the limiting rod, the second spring not only provides a continuous and stable thrust for the ejector rod, but also enables the clamp to have a certain buffering capacity when clamping the circuit board. When the clamp clamps the circuit board, if the clamping force is too large, the second spring will absorb the excess force through its own compression, thereby avoiding damage to the circuit board, ensuring that the ejector rod can be adaptively adjusted according to the thickness and shape of the circuit board, thereby ensuring that the circuit board can be clamped quickly and accurately.
[0024] Furthermore, the sliding mechanism 3 includes a limit block 301, a sliding block 302 is arranged inside the limit block 301, one end of the sliding block 302 is fixedly connected to the top center axis of the base 401, and the limit block plays a role in limiting and guiding the movement of the sliding block. By setting the size and shape of the limit block, it can be ensured that the sliding block slides smoothly within the predetermined track without deviation or shaking, thereby improving the stability and accuracy of the sliding mechanism.
[0025] Furthermore, fixed brackets 201 are provided on both sides of the guide rail 2, and the fixed brackets 201 are fixedly connected to the inner side of the support bracket 1, and the inner side of the guide rail 2 is slidably connected to the other end of the sliding block 302, and the existence of the guide rail provides a clear and smooth moving path for the sliding block. The precise manufacturing of the guide rail ensures the smoothness and straightness of its surface, so that the sliding block can slide smoothly on it, reducing the friction and resistance during the movement, thereby ensuring that no shaking or deviation occurs during use, thereby ensuring the accuracy and stability of the sliding block during the movement, and also making maintenance relatively simple. Once repairs or replacement of parts are required, they can be easily disassembled and installed.
[0026] In this solution, the workflow is as follows: First, the initial position of the clamp assembly needs to be adjusted according to the size and shape of the PCB. This can be achieved by moving the position of the sliding mechanism in the guide rail. Then, the PCB is placed between the clamp assemblies and the position of the clamp and the compression of the spring are adjusted to clamp the PCB. During the clamping process, the design of the second spring and the ejector rod will play a key buffering role to protect the PCB from damage. Finally, the selective electroplating operation can be performed by sliding inside the guide rail.
[0027] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.
[0028] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A selective electroplating device for a PCB, comprising a support bracket (1), characterized in that: A guide rail (2) is provided inside the support bracket (1), and a sliding mechanism (3) is slidably connected inside the guide rail (2), and one end of the sliding mechanism (3) is fixedly connected to a clamp assembly (4), and the clamp assembly (4) comprises a base (401), and a group of relatively parallel clamping plates (402) are provided inside the base (401), and each group of the clamping plates (402) is fixedly connected to a plurality of limit rods (403), and a spring (404) is provided outside the limit rod (403), and one end of the spring (404) is tightly pressed against the inner side of the base (401).
2. A PCB selective electroplating device according to claim 1, characterized in that: The base (401) is composed of a pedestal (405) and a sliding plate (406). A group of relatively parallel connecting rods (407) are provided on both sides of the pedestal (405). One end of the connecting rod (407) is snap-fitted with the bottom of the sliding plate (406). The top of the sliding plate (406) is rotatably connected to the top of the pedestal (405).
3. A PCB selective electroplating device according to claim 2, characterized in that: A plurality of sliding rods (408) are provided on one side of the clamping plate (402), and the sliding rods (408) are slidably connected to the base (401). One side of the clamping plate (402) is fixedly connected to one end of a limiting rod (403), and the limiting rods (403) are distributed in a row.
4. A PCB selective electroplating device according to claim 3, characterized in that: A second spring (409) is provided inside the limiting rod (403), one end of the second spring (409) is tightly pressed against one end of a push rod (410), and the push rod (410) is slidably connected to the inside of the limiting rod (403).
5. The selective electroplating device for PCB board according to claim 1, characterized in that: The sliding mechanism (3) comprises a limit block (301), a sliding block (302) is arranged inside the limit block (301), and one end of the sliding block (302) is fixedly connected to the top center axis of the base (401).
6. A PCB selective electroplating device according to claim 5, characterized in that: Fixed brackets (201) are provided on both sides of the guide rail (2), the fixed brackets (201) are fixedly connected to the inner side of the support bracket (1), and the guide rail (2) is slidably connected to the other end of the sliding block (302) inside.
Citation Information
Patent Citations
PCB gold plating device and gold plating method
CN113811088A