Metal hexahedron circuit interconnection welding structure and circuit module

Abstract

The utility model discloses a metal hexahedron circuit interconnection welding structure and a circuit module, comprising a pedestal, a circuit unit provided with a first interconnection hole group and / or a second interconnection hole group, and an electrical interconnection structure connecting the circuit unit and the pedestal. The electrical interconnection structure comprises a first interconnection unit in electrical contact with the first interconnection hole group and / or a second interconnection unit in electrical contact with the second interconnection hole group, and the first end of the first interconnection unit and the first end of the second interconnection unit are correspondingly connected with the base. The second end of the first interconnection unit penetrates through the first interconnection hole group and is in electrical contact with the circuit unit, and the second end of the second interconnection unit abuts against the interior of the first interconnection hole group and is in electrical contact with the circuit unit. Compared with the prior art, the circuit interconnection welding structure has the advantages that the layout of the circuit board can be well optimized, the integration level of the circuit can be improved as much as possible, welding procedures are few, and visual inspection is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit modules, in particular to a metal hexahedron circuit interconnection welding structure and a circuit module. Background Art

[0002] Integrated circuits are the foundation of modern electronic technology and are widely used in the fields of computers, communications, consumer electronics, medical treatment, and automobiles. With the development of emerging technologies such as artificial intelligence, the Internet of Things, and 5G, the demand for integrated circuits is also increasing. With the advancement of microelectronics technology, electronic systems are gradually developing from mechanization and informatization to networking, and the demand for small-volume, low-weight, high-reliability, and high-performance integrated circuits is becoming more and more urgent. Especially in the field of aerospace, the expansion of the application scope of the whole system and the improvement of the overall performance have put forward higher and higher requirements for the reliability and stability of such circuits, and higher requirements have been put forward for the indicators of the corresponding integrated circuits and the reliability of long-term work. Among them, the improvement of mechanical reliability is the top priority.

[0003] For integrated circuits, if you want to achieve high density, high reliability, high performance and extremely high mechanical reliability, you can only do so by improving the circuit structure while ensuring the electrical performance of the circuit. The outer shell of the hexahedral structure circuit can provide good protection for the internal circuit, and the metal shell has the highest strength and the best protection among all materials. Therefore, high-reliability hybrid integrated circuits all use a metal hexahedral structure, but due to factors such as the substrate material, the ceramic substrate used in hybrid integrated circuits can only be assembled on one side, and the assembly technology is limited to surface mount technology (SMT) technology, and the cost is relatively high. Printed circuit boards (PCBs) have low costs and mature technology, and can be assembled on both sides. In addition to surface mount technology (SMT), through-hole plug-in technology (THT) can also be used. Therefore, how to improve the reliability of printed circuit boards to adapt to the current development requirements of integrated circuits is an issue that the industry urgently needs to solve.

[0004] At present, the most common metal hexahedron circuit is composed of a pentahedral metal base and a flat cover. Although this structure can be used to place a printed circuit board with double-sided assembly components by adding steps in the inner cavity of the tube shell, it cannot improve its reliability. Instead, it will bring quality risks due to the limitation of the circuit structure. This is because in order to meet the overcurrent requirements, the internal circuit board and the tube shell lead pins can only be connected by perforation welding. The shell of the traditional pentahedral metal base will first have a great impact on the welding near the edge of the tube shell, increasing the difficulty of welding, and even making it impossible to weld due to insufficient space; secondly, the IPC standard for perforation welding requires that the tin penetration rate of the perforation welding should not be less than 75% of the aperture height (plate thickness), and the GJB standard for the tin penetration rate of the circuit with high reliability requirements even requires 100%. After the traditional pentahedral metal base is welded, the tin penetration of the lead pins cannot be visually inspected due to the obstruction of the shell, and can only be judged with the help of large-scale detection equipment such as X-rays. In addition to the problems of welding processability and quality control, the original structure also has the problem that the tin beads, tin skin, tin slag and other metal excess materials generated during welding will fall into the underlying space and cannot be removed. These metal excess materials will cause short circuits between devices and directly cause circuit failure. Utility Model Content

[0005] In view of this, the purpose of the utility model is to provide a metal hexahedral circuit interconnection welding structure and a circuit module to solve the problems of low circuit reliability and unreasonable circuit layout in the prior art.

[0006] To achieve the above-mentioned purpose, a technical solution of the utility model provides a metal hexahedral circuit interconnection welding structure, including a base, a circuit unit provided with a first interconnection hole group and / or a second interconnection hole group, and an electrical interconnection structure connecting the circuit unit and the base, the electrical interconnection structure including a first interconnection unit electrically in contact with the first interconnection hole group and / or a second interconnection unit electrically in contact with the second interconnection hole group, the first ends of the first interconnection unit and the second interconnection unit are correspondingly connected to the base, the second end of the first interconnection unit passes through the first interconnection hole group and is in electrical contact with the circuit unit, and the second end of the second interconnection unit is against the first interconnection hole group and is in electrical contact with the circuit unit.

[0007] Furthermore, the first interconnection unit includes a first lead pin portion electrically in contact with the first interconnection hole group, a first fixing portion integrally extending from the first lead pin portion and preformed as one piece with the base, and a first pin portion integrally extending from the first fixing portion to the outside of the base, and the first lead pin portion passes through the first interconnection hole group and penetrates the circuit unit.

[0008] Furthermore, the first interconnection hole group includes full perforations and / or half perforations, and the full perforations and half perforations are both defined as through holes arranged along the thickness direction of the circuit unit, the inner circumferential surface of the full perforation is defined as a complete circular surface closed in the circumferential direction, and the inner circumferential surface of the half perforation is defined as an unclosed incomplete circular surface connected to the circumferential side of the circuit unit, and the length of the inner circumferential surface of the half perforation is greater than one half of the circumference; the first lead needle portion is penetrated in the full perforation and / or half perforation and is in electrical contact with the full perforation and / or half perforation.

[0009] Furthermore, the first interconnection unit also includes a first interconnection tin-through portion arranged between the first pin lead portion and the first fixing portion, the inner diameter of the first interconnection hole group is larger than the diameter of the first pin lead portion and smaller than the diameter of the first interconnection tin-through portion, the corresponding surface of the first interconnection tin-through portion abuts against the second side surface of the circuit unit, the outer peripheral surface of the first interconnection tin-through portion is formed with a first interconnection tin-through section extending in the axial direction, and the radial dimension from the axis of the first interconnection tin-through portion to the first interconnection tin-through section is smaller than the inner diameter of the first interconnection hole group, so that the first interconnection projection of the first interconnection tin-through portion on the horizontal plane partially overlaps with the second interconnection projection of the first interconnection hole group on the horizontal plane.

[0010] Furthermore, the second interconnection unit includes a second pin portion electrically in contact with the second interconnection hole group, a second fixing portion integrally extending from the second pin portion and preformed as one piece with the base, and a second pin portion integrally extending from the second fixing portion to the outside of the base, and the second pin portion abuts against the circuit unit through the second interconnection hole group.

[0011] Furthermore, the second interconnected hole group includes full blind holes and / or half blind holes, and the full blind holes and / or half blind holes are defined as blind holes recessed on the corresponding side surfaces of the circuit unit, the inner circumferential surface of the full blind hole is defined as a complete circular surface closed in the circumferential direction, the inner circumferential surface of the half blind hole is defined as an unclosed incomplete circular surface connected to the circumferential side of the circuit unit, and the length of the inner circumferential surface of the half blind hole is greater than one half of the circumference; the second lead needle portion is against the full blind hole and / or half blind hole and is in electrical contact with the full blind hole and / or half blind hole.

[0012] Furthermore, the second interconnection unit also includes a second interconnection tin-through portion arranged between the second pin lead portion and the second fixing portion, the inner diameter of the second interconnection hole group is larger than the diameter of the second pin lead portion and smaller than the diameter of the second interconnection tin-through portion, the corresponding surface of the second interconnection tin-through portion abuts against the corresponding side surface of the circuit unit, the outer peripheral surface of the second interconnection tin-through portion is formed with a second interconnection tin-through section extending in the axial direction, and the radial dimension from the axis of the second interconnection tin-through portion to the second interconnection tin-through section is smaller than the inner diameter of the second interconnection hole group, so that the third interconnection projection of the second interconnection tin-through portion on the horizontal plane partially overlaps with the fourth interconnection projection of the second interconnection hole group on the horizontal plane.

[0013] Furthermore, a third interconnection hole group is provided at a position on the base corresponding to the electrical interconnection structure, and the first interconnection unit and the second interconnection unit are fixed to the corresponding third interconnection hole group.

[0014] Furthermore, the first interconnection unit and the second interconnection unit are fixed to and insulated from the base through a sintering process.

[0015] In order to achieve the above-mentioned object, another technical solution of the utility model provides a circuit module, including the metal hexahedral circuit interconnection structure as described above.

[0016] The utility model preforms the electrical interconnection structure on the base, then assembles and welds the circuit board and the electrical interconnection structure, and finally packages the assembled base and circuit unit with the tube shell. The circuit unit does not need to be welded to the tube shell, which can effectively reduce the difficulty of assembly and welding between the circuit unit and the tube shell, which is conducive to improving the packaging efficiency. At the same time, it can also avoid the problem that welding waste slag falls into the bottom space and is difficult to remove, ensuring that the circuit will not fail due to short circuit of welding waste slag, thereby improving the safety and reliability of the circuit module. In addition, the circuit board is provided with interconnection hole groups such as full perforation, semi-perforation, full blind hole, semi-blind hole, etc. to achieve welding with the electrical interconnection structure, which can optimize the circuit layout to improve the integration of the circuit module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a structural schematic diagram of an embodiment of a high-reliability metal hexahedron circuit module of the utility model.

[0018] Figure 2 for Figure 1 Internal cross-sectional view at the circuit support structure and electrical interconnect structure.

[0019] Figure 3 It is a schematic diagram of the structure of the tube shell.

[0020] Figure 4 A schematic diagram of the structure of the base.

[0021] Figure 5 It is a structural schematic diagram of the circuit unit.

[0022] Figure 6 for Figure 4 Schematic diagram of the structure at A in the middle.

[0023] Figure 7 It is a schematic structural diagram of the first interconnection unit.

[0024] Figure 8 It is a schematic structural diagram of the second interconnection unit.

[0025] Fig. 9 for Figure 2 Enlarged view of point B in the middle.

[0026] Fig.10 It is a structural schematic diagram of another embodiment of the high-reliability metal hexahedron circuit module of the utility model.

[0027] Fig.11 It is a structural schematic diagram of another embodiment of the high-reliability metal hexahedron circuit module of the utility model.

[0028] Fig.12 It is a structural schematic diagram of another embodiment of the high-reliability metal hexahedron circuit module of the utility model.

[0029] The accompanying drawings in the specification are numeraled as follows:

[0030] Tube shell 100, mounting cavity 110, packaging opening 120, packaging step 130, screw mounting hole 140;

[0031] Base 200, third interconnected hole group 210, matching step 220, potting hole 230;

[0032] Circuit unit 300, circuit board 310, support hole group 311, first interconnection hole group 312, full through hole 312a, half through hole 312b, second interconnection hole group 313, full blind hole 313a, half blind hole 313b, first component 320, second component 330;

[0033] Circuit support structure 400, support unit 410, support seat body 411, support tin-through portion 412, welding portion 413, support step surface 414, support tin-through cut surface 415;

[0034] Electrical interconnection structure 500, first interconnection unit 510, first pin lead portion 511, first fixing portion 512, first pin portion 513, first interconnection tin-through portion 514, first interconnection tin-through cut surface 515, second interconnection unit 520, second pin lead portion 521, second fixing portion 522, second pin portion 523, second interconnection tin-through portion 524, second interconnection tin-through cut surface 525;

[0035] Plastic package 600;

[0036] A first fixing column 710 , a second fixing column 720 , and a fixing flange 730 . DETAILED DESCRIPTION

[0037] The following is further described in detail through specific implementation methods:

[0038] Example 1

[0039] Please refer to Figure 1 and Figure 2 The high-reliability metal hexahedral circuit module (hereinafter referred to as “circuit module”) of the present embodiment includes a tube shell 100, a base 200 covering the tube shell 100, a circuit unit 300 suspended in the tube shell 100 and corresponding to the base 200, a circuit support structure 400 arranged on the base 200 and supporting the circuit unit 300, an electrical interconnection structure 500 arranged on the base 200 and connected to the circuit unit 300, and a plastic package 600 filled in the tube shell 100 and covering the circuit unit 300.

[0040] The circuit support structure 400 supports the circuit unit 300 to be suspended in the tube shell 100, so that the circuit unit 300 can arrange electrical components on both sides, thereby improving the integration of the circuit unit 300; the electrical interconnection structure 500 is connected between the circuit unit 300 and the base 200, and can lead the circuit unit 300 to connect with the external circuit, thereby realizing signal transmission between the circuit module and the external circuit; in specific implementation, the electrical interconnection structure 500 can also play the role of supporting the circuit unit 300, that is, in some embodiments, the circuit support structure 400 can also be omitted, and the support and conduction of the circuit unit 300 can be jointly realized by the electrical interconnection structure 500. In this embodiment, the circuit support structure 400 and the electrical interconnection structure 500 can be preformed on the base 200. In specific implementation, the circuit support structure 400 can be preformed on the base 200 by riveting, welding or one-piece processing, and the electrical interconnection structure 500 can be preformed on the base 200 by sintering or other processes and then assembled with the circuit unit 300 and the tube shell 100, so as to reduce the welding process in the subsequent assembly process, thereby reducing the difficulty of welding and the difficulty of cleaning welding residues.

[0041] Please refer to Figure 3The tube shell 100 is a pentahedral structure as a whole. The tube shell 100 has a mounting cavity 110 and a packaging opening 120 connected to the mounting cavity 110. The base 200 is covered on the packaging opening 120 to close the mounting cavity 110, so that the interior of the entire circuit module is hollow to suspend the circuit unit 300; the plastic package 600 is filled in the mounting cavity 110 and completely wraps the circuit unit 300. On the one hand, it can increase the force area of ​​the circuit unit 300 at the suspended position, reduce the force at the circuit support structure 400 to prevent deformation, and reduce the force at the electrical interconnection structure 500 to ensure stable connection of the circuit, thereby improving the mechanical and electrical properties of the circuit module. On the other hand, the circuit unit 300 at the suspended position is in contact with the plastic package 600, which is beneficial to the heat dissipation of the components on the circuit unit 300 through the plastic package 600, so as to further improve the performance of the circuit module. In this embodiment, the tube shell 100 can be made of metal materials such as stainless steel, iron-nickel alloy, cold-rolled steel, high-quality carbon structural steel, rust-proof aluminum, etc., to improve the mechanical strength of the entire circuit module, prevent the circuit module from being deformed after long-term use and affecting the normal use of the circuit module as a whole, and ensure the safety and reliability of use.

[0042] A packaging step 130 is formed on the edge of one end of the tube shell 100 corresponding to the packaging opening 120, which is used to embed the base 200, so that the base 200 can be supported on the packaging step 130 when covering the packaging opening 120 to close the installation cavity 110; the embedded combination between the tube shell 100 and the base 200 can not only quickly position the tube shell 100 and the base 200 during assembly, but also ensure the bonding strength between the tube shell 100 and the base 200. In specific implementation, according to the packaging bonding strength, the base 200 can be fixed to the packaging step 130 of the tube shell 100 by parallel sealing welding, energy storage sealing welding, laser sealing welding, tin sealing, bonding, etc. The matching step 220 abuts against the packaging step 130. It can be understood that in some other embodiments, the setting of the packaging step 130 can also be omitted, and the base 200 can be directly placed on the packaging opening 120 of the tube shell 100 and then the tube shell 100 and the base 200 are sealed by the aforementioned packaging method.

[0043] A potting mark (not shown) lower than the potting step 130 is also formed on the inner wall of the tube shell 100 corresponding to one end of the packaging opening 120. The potting mark is used to indicate the potting amount of the colloid when potting the colloid of the plastic packaging body 600. During potting, the height of the plastic packaging body 600 is lower than the potting mark to avoid overflow of the colloid during assembly or capping.

[0044] As a preferred mode of this embodiment, a screw mounting hole 140 is further provided on the outer surface of the tube shell 100. The screw mounting hole 140 is used to fix the circuit module with the external structure when the circuit module is used, so as to increase the stability of the installation of the circuit module.

[0045] Please refer to Figure 4 The base 200 as a whole adopts a flat plate structure, and the base 200 has a first surface facing the circuit unit 300 and a second surface facing away from the circuit unit 300. A third interconnection hole group 210 is provided at a position corresponding to the electrical interconnection structure 500 on the base 200, and the third interconnection hole group 210 is provided through the first surface and the second surface of the base 200 to preform the electrical interconnection structure 500 on the base 200. In this embodiment, the base 200 can be made of the same metal materials as the tube shell 100, such as stainless steel, iron-nickel alloy, cold-rolled steel, high-quality carbon structural steel, rust-proof aluminum, etc., to further improve the mechanical strength of the entire circuit module, prevent the circuit module from being deformed after long-term use and affect the normal use of the circuit module as a whole, and ensure the safety and reliability of use.

[0046] A matching step 220 complementary to the packaging step 130 is provided on one side of the edge of the base 200 corresponding to the packaging opening 120, so as to quickly and stably cover the packaging opening 120. It is understandable that in some other embodiments, when the packaging opening 120 is not provided with the packaging step 130, the base 200 may also omit the provision of the matching step 220 or be provided with a matching step 220 matching the packaging opening 120, so as to be laid flatly to cover the packaging opening 120, and then the base 200 and the tube shell 100 are capped in a suitable connection manner.

[0047] The base 200 is also provided with a potting hole 230 penetrating through the first surface and the second surface of the base 200 , which is used to potting colloid into the packaging cavity 110 to form the packaging body 600 during packaging.

[0048] Please refer to Figure 5 The circuit unit 300 includes a circuit board 310 suspended in the mounting cavity 110 and having a first side surface and a second side surface arranged opposite to each other, a first component 320 mounted on the first side surface of the circuit unit 300, and a second component 330 mounted on the second side surface of the circuit unit 300. The circuit board 310 is supported by the circuit support structure 400 and suspended in the mounting cavity 110. The first component 320 and the second component 330 are led out through the electrical interconnection structure 500 to be connected to an external circuit.

[0049] A support hole group 311 is provided at a position on the circuit unit 300 corresponding to the circuit support structure 400, and one end of the circuit support structure 400 away from the base 200 is inserted into the support hole group 311 to cooperate with the support hole group 311 to support the circuit unit 300. The support hole group 311 is defined as a through hole that penetrates the circuit unit 300, and the through hole penetrates the first side surface and the second side surface of the circuit board 310 along the thickness direction of the circuit board 310, so that the corresponding end of the circuit support structure 400 can be inserted into the support hole group 311, and then the corresponding end of the circuit support structure 400 can be fixed to the support hole group 311 to stably support the circuit unit 300.

[0050] A first interconnection hole group 312 and / or a second interconnection hole group 313 are also provided at the position corresponding to the electrical interconnection structure 500 on the circuit unit 300. The end of the electrical interconnection structure 500 away from the base 200 penetrates into the first interconnection hole group 312 or abuts against the second interconnection hole group 313 to lead out the signals of the first component 320 and the second component 330.

[0051] The first interconnection hole group 312 includes full through holes 312a and / or half through holes 312b, and the full through holes 312a and / or half through holes 312b are defined as through holes set along the circuit unit 300 and passing through the circuit unit 300. The full through holes 312a and / or half through holes 312b pass through the first side and the second side of the circuit board 310 along the thickness direction of the circuit board 310, so that the corresponding end of the electrical interconnection structure 500 can be inserted into the full through holes 312a or the half through holes 312b, thereby facilitating the electrical interconnection structure 500 to be welded and fixed to the full through holes 312a or the half through holes 312b by full-hole welding, so as to increase the stability of the connection between the electrical interconnection structure 500 and the circuit board 310, and realize electrical contact between the electrical interconnection structure 500 and the first component 320 located on the first side of the circuit board 310 and the second component 330 located on the second side of the circuit board 310, so as to lead the signal of the circuit unit 300 to the outside of the base 200 to be connected with the external circuit. In this embodiment, the inner circumferential surface of the full perforation 312a is defined as a complete circular surface that is closed in the circumferential direction. According to the arrangement of the first component 320 and the second component 330, the full perforation 312a can be arranged at any position of the circuit board 310 to facilitate the routing of the circuit. The inner circumferential surface of the half perforation 312b is defined as an unclosed incomplete circular surface that is connected to the peripheral side of the circuit unit 300. The half perforation 312b can be arranged at the edge of the circuit board 310 to minimize the occupied area of ​​the circuit board 310, meet the layout requirements of the first component 320 and the second component 330 on the circuit board 310, and improve the integration of the circuit. When the half perforation 312b is used to connect the electrical interconnection structure 500, the inner circumferential surface length of the half perforation 312b is greater than half of the circumference, so as to prevent the electrical interconnection structure 500 from detaching from the circuit board 310 from the side, and further improve the stability of the connection between the electrical interconnection structure 500 and the circuit board 310.

[0052] The second interconnection hole group 313 includes full blind holes 313a and / or half blind holes 313b, and the full blind holes 313a and / or half blind holes 313b are defined as blind holes arranged on the corresponding side surfaces of the circuit unit 300. The full blind holes 313a and / or half blind holes 313b are recessed on the second side surface of the circuit board 310, so that the corresponding end of the electrical interconnection structure 500 can extend into the full blind hole 313a or the half blind hole 313b and abut against the bottom of the full blind hole 313a or the half blind hole 313b, which can facilitate the electrical interconnection. The corresponding end of the electrical interconnection structure 500 is welded and fixed to the full blind hole 313a or the half blind hole 313b. On the other hand, the electrical interconnection structure 500 can also play a role in assisting the support of the circuit unit 300. The full blind hole 313a and / or the half blind hole 313b are defined as blind holes recessed on the corresponding side of the circuit unit 300. With this arrangement, it is only necessary to weld and fix the electrical interconnection structure 500 and the blind hole on one side of the opening, which can greatly reduce the occupancy rate of the perforated welding on the circuit board 310, so as to achieve the purpose of optimizing the circuit layout. In this embodiment, the inner circumferential surface of the full blind hole 313a is defined as a complete circular surface closed in the circumferential direction. Similarly, according to the arrangement of the first component 320 and the second component 330, the full blind hole 313a can be arranged at any position on the second side surface of the circuit board 310 to facilitate the routing of the circuit. The inner circumferential surface of the semi-blind hole 313b is defined as an unclosed incomplete circular surface connected to the peripheral side of the circuit unit 300. The semi-blind hole 313b can be arranged at the edge of the circuit board 310 like the semi-perforated hole 312b to minimize the occupied area of ​​the circuit board 310, further optimize the circuit layout, and further improve the integration of the circuit. Similarly, when the semi-blind hole 313b is used to connect the electrical interconnection structure 500, the inner circumferential surface length of the semi-blind hole 313b is greater than half of the circumference to prevent the electrical interconnection structure 500 from detaching from the circuit board 310 from the side, thereby improving the stability of the connection between the electrical interconnection structure 500 and the circuit board 310.

[0053] In specific implementation, according to the actual layout of the first component 320 and the second component 330 on the circuit board 310, at least one of the full through hole 312a, the half through hole 312b, the full blind hole 313a and the half blind hole 313b can be selected to set to achieve the purpose of optimizing the circuit layout.

[0054] In this embodiment, the circuit support structure 400 cooperates with the base 200 and the circuit unit 300 to form a circuit trimming and tin penetration structure, so that when the circuit support structure 400 and the circuit unit 300 are assembled and connected, a ventilation channel can be formed between the circuit support structure 400 and the circuit board 310, thereby ensuring the tin penetration rate of the circuit support structure 400 and the circuit board 310 during welding, thereby improving the welding quality and strength between the circuit support structure 400 and the circuit board 310. At the same time, the ventilation channel also helps to visually inspect the connection between the circuit support structure 400 and the circuit board 310 after welding is completed, and quickly judge the tin penetration situation, which is convenient and quick.

[0055] Please refer to Figure 6 , the first end of the circuit support structure 400 is preformed as one piece with the base 200, and the second end of the circuit support structure 400 supports the circuit unit 300. The circuit support structure 400 includes a support unit 410 disposed on the base 200 and cooperating with the support hole group 311 to support the circuit unit 300, the support unit 410 is disposed corresponding to the support hole group 311, the first end of the support unit 410 is preformed as one piece with the base 200 or is preformed as one piece with the base 200 in an integrated manner, the second end of the support unit 410 penetrates into the support hole group 311 and is fixed to the support hole group 311, so as to support the circuit board 310 and the circuit unit 300 to be suspended above the base 200.

[0056] The support unit 410 includes a support base body 411 integrally formed with the base 200, a support tin-through portion 412 integrally extended from the support base body 411, and a soldering portion 413 integrally extended from the support tin-through portion 412. In this embodiment, the support unit 410 is preformed on the base 200 in an integrally formed manner to fix the support unit 410 to the base 200. The corresponding surface of the support tin-through portion 412 (the surface away from one end of the support base 411) abuts against the corresponding side surface of the circuit unit 300 (i.e., the second side surface of the circuit board 310) to support the circuit board 310. The soldering portion 413 penetrates into the support hole group 311 and is soldered and fixed in the support hole group 311 to fix the support unit 410 to the circuit board 310.

[0057] In this embodiment, the diameter of the supporting tin-through portion 412 is larger than the diameter of the welding portion 413, so that a supporting step surface 414 is formed at one end of the supporting tin-through portion 412 adjacent to the welding portion 413. At the same time, the diameter of the supporting tin-through portion 412 is also larger than the inner diameter of the supporting hole group 311, so that after the supporting unit 410 and the circuit unit 300 are assembled in place, the supporting step surface 414 can be supported on the corresponding side of the circuit unit 300 (i.e., the second side of the circuit board 310) to play a role in supporting the circuit board 310. The diameter of the welding portion 413 is smaller than the diameter of the support hole group 311, so that when the welding portion 413 and the support hole group 311 are assembled, the welding portion 413 can be intermittently arranged in the support hole group 311, thereby forming a welding space between the outer circumference of the welding portion 413 and the inner circumference of the support hole group 311, which is convenient for welding the welding portion 413 and the support hole group 311; preferably, the inner diameter of the support hole group 311 is 1.1 to 1.5 times the diameter of the welding portion 413, so as to facilitate welding between the outer circumference of the welding portion 413 and the inner circumference of the support hole group 311.

[0058] The first support projection of the supporting tin-penetrating portion 412 on the horizontal plane partially overlaps with the second support projection of the supporting hole group 311 on the horizontal plane. In this way, the supporting hole group 311 is not completely blocked by the supporting tin-penetrating portion 412, which can not only meet the supporting function of the supporting unit 410 on the circuit board 310, but also form a ventilation channel between the supporting tin-penetrating portion 412 and the supporting hole group 311 to ensure the tin penetration rate of the supporting unit 410 and the circuit board 310 during welding. Specifically, the outer peripheral surface of the supporting tin-penetrating portion 412 is formed with a supporting tin-penetrating cut surface 415 extending in the axial direction, and the axial first end of the supporting tin-penetrating cut surface 415 is connected to the supporting step surface 414. The radial dimension from the axis of the supporting tin-penetrating portion 412 to the supporting tin-penetrating cut surface 415 is smaller than the inner diameter of the supporting hole group 311, so that the first support projection of the supporting tin-penetrating portion 412 on the horizontal plane can partially overlap with the second support projection of the supporting hole group 311 on the horizontal plane. In this embodiment, the second end of the supporting tin-through cut surface 415 does not penetrate the supporting tin-through portion 412 in the axial direction, so as to form a tin-through stop step on the supporting tin-through portion 412 corresponding to the second end of the supporting tin-through cut surface 415. The tin-through stop step can block the molten solder during the welding process to save solder.

[0059] In the specific implementation of this embodiment, the welding portion 413 can also be connected to the circuit board 310 by riveting, that is, the welding portion 413 is set to extend out of the first side of the circuit board 310, and then the exceeding part of the welding portion 413 is riveted on the first side of the circuit board 310, so as to achieve the fixation of the entire support unit 410 and the circuit board 310. In this way, the welding process can be omitted, the generation of welding waste slag is reduced, and the risk of circuit failure caused by welding waste slag during use is reduced, thereby improving the reliability of the circuit module.

[0060] In this embodiment, the electrical interconnection structure 500 cooperates with the base 200 and the circuit unit 300 to form a metal hexahedral circuit interconnection welding structure, so that when the electrical interconnection structure 500 and the circuit unit 300 are assembled, a stable connection can be formed between the electrical interconnection structure 500 and the circuit board 310, and the layout requirements of the circuit board 310 can be met.

[0061] Please refer to Figure 7 , Figure 8 and Fig. 9 , the first end of the electrical interconnection structure 500 extends outside the base 200 for connecting with an external circuit, and the electrical interconnection structure 500 is insulated from the base 200; the second end of the electrical interconnection structure 500 penetrates the circuit unit 300 and is in electrical contact with the circuit unit 300, so as to connect the circuit unit 300 with the external circuit through the electrical interconnection structure 500 to achieve signal transmission. The electrical interconnection structure 500 includes a first interconnection unit 510 in electrical contact with the first interconnection hole group 312 and / or a second interconnection unit 520 in electrical contact with the second interconnection hole group 313. The first end of the first interconnection unit 510 is insulated and connected to the base 200. When connected, the first end of the first interconnection unit 510 can be preformed into one piece with the base 200 through the third interconnection hole group 210 provided on the base 200 to reduce the welding process after assembly. The second end of the first interconnection unit 510 penetrates the first interconnection hole group 312 and is in electrical contact with the circuit unit 300, so as to transmit the electrical signals of the first component 320 and the second component 330 on the circuit board 310. The first end of the second interconnect unit 520 is insulated and connected to the base 200. Similarly, when connected, the first end of the second interconnect unit 520 can be pre-formed into one piece with the base 200 through the third interconnect hole group 210 set on the base 200 to reduce the welding process after assembly. The second end of the second interconnect unit 520 is against the first interconnect hole group 312 and is in electrical contact with the circuit unit 300 to transmit the electrical signal of the second component 330 on the second side of the circuit board 310.

[0062] In a specific implementation, the first interconnect unit 510 is arranged corresponding to the first interconnect hole group 312, and the second interconnect unit 520 is arranged corresponding to the second interconnect hole group 313. When the first interconnect unit 510 and the second interconnect unit 520 are arranged, the first interconnect unit 510 or the second interconnect unit 520 can be arranged separately according to layout requirements, or the first interconnect unit 510 and the second interconnect unit 520 can be arranged at the same time to realize the connection between the circuit unit 300 and the external circuit.

[0063] The first interconnection unit 510 includes a first pin portion 511 electrically contacting the first interconnection hole group 312, a first fixing portion 512 integrally extending from the first pin portion 511 and preformed as one with the base 200, and a first pin portion 513 integrally extending from the first fixing portion 512 to the outside of the base 200. The first pin portion 511 passes through the first interconnection hole group 312 and is electrically contacting the circuit unit 300. When the first pin portion 511 is assembled with the first interconnection hole group 312, the first pin portion 511 can be inserted into the full perforation 312a or the half perforation 312b at the corresponding position, so as to facilitate welding and fixing the first pin portion 511 with the corresponding full perforation 312a or half perforation 312b, so as to achieve electrical contact between the first pin portion 511 and the full perforation 312a and / or the half perforation 312b. The first fixing portion 512 is disposed in the third interconnection hole group 210 at the corresponding position on the base 200, and is fixed to the corresponding third interconnection hole group 210 through a sintering process and insulated from the base 200, so as to pre-fix the first interconnection unit 510 on the base 200. The first pin portion 513 extends to the outside of the base 200 through the third interconnection hole group 210 to form a pin connection of the entire circuit module with an external circuit to achieve signal transmission.

[0064] In this embodiment, the diameter of the first needle-introducing portion 511 is smaller than the inner diameter of the full through hole 312a and the half through hole 312b of the first interconnected hole group 312, so that when the first needle-introducing portion 511 is assembled with the corresponding full through hole 312a or half through hole 312b, the first needle-introducing portion 511 can be arranged in the full through hole 312a or the half through hole 312b at intervals, and then the outer circumference of the first needle-introducing portion 511 and the inner circumference of the full through hole 312a or the half through hole 312b are connected. A welding space is formed between the surfaces to facilitate welding of the first lead needle portion 511 and the full perforation 312a or the half perforation 312b; preferably, the inner diameter of the full perforation 312a or the half perforation 312b is 1.1 to 1.5 times the diameter of the first lead needle portion 511, so as to facilitate welding between the outer circumference of the first lead needle portion 511 and the inner circumference of the full perforation 312a or the half perforation 312b, thereby achieving electrical contact between the first lead needle portion 511 and the circuit unit 300.

[0065] As a preferred mode of this embodiment, the first interconnection unit 510 also includes a first interconnection tin-through portion 514 arranged between the first pin-lead portion 511 and the first fixing portion 512, and the diameter of the first interconnection tin-through portion 514 is greater than the diameter of the first pin-lead portion 511. At the same time, the diameter of the first interconnection tin-through portion 514 is also greater than the inner diameter of the first interconnection hole group 312, so that after the first interconnection unit 510 and the circuit board 310 are assembled in place, the corresponding surface of the first interconnection tin-through portion 514 can abut against the second side of the circuit unit 300 (i.e., the circuit board 310) to assist in supporting the circuit board 310.

[0066] A first interconnected tin-through cut surface 515 extending in the axial direction is formed on the outer peripheral surface of the first interconnected tin-through portion 514, and the radial dimension from the axis of the first interconnected tin-through portion 514 to the first interconnected tin-through cut surface 515 is smaller than the inner diameter of the first interconnected hole group 312, so that the first interconnected projection of the first interconnected tin-through portion 514 on the horizontal plane partially overlaps with the second interconnected projection of the first interconnected hole group 312 on the horizontal plane. In this way, the full through hole 312a or the half through hole 312b of the first interconnected hole group 312 is not completely blocked by the first interconnected tin-through portion 514, so as to form a ventilation channel between the first interconnected hole group 312 and the first interconnected tin-through portion 514, which can ensure the tin penetration rate of the first interconnected unit 510 and the circuit board 310 during welding.

[0067] The second interconnection unit 520 includes a second pin-leading portion 521 electrically contacting the second interconnection hole group 313, a second fixing portion 522 integrally extending from the second pin-leading portion 521 and preformed as one body with the base 200, and a second pin portion 523 integrally extending from the second fixing portion 522 to the outside of the base 200. The second pin-leading portion 521 abuts against the inside of the second interconnection hole group 313 and electrically contacts the circuit unit 300. When the second pin-leading portion 521 is assembled with the second interconnection hole group 313, the second pin-leading portion 521 can abut against the bottom of the full blind hole 313a or the bottom of the corresponding half blind hole 313b, so as to facilitate welding and fixing the second pin-leading portion 521 with the corresponding full blind hole 313a or half blind hole 313b, so as to realize electrical contact between the second pin-leading portion 521 and the full blind hole 313a and / or the half blind hole 313b. The second fixing portion 522 is inserted into the third interconnection hole group 210 at the corresponding position on the base 200, and is also fixed to the corresponding third interconnection hole group 210 through a sintering process and insulated from the base 200, so as to pre-fix the second interconnection unit 520 on the base 200. The second pin portion 523 extends to the outside of the base 200 through the corresponding third interconnection hole group 210 to form a pin connection of the entire circuit module with the external circuit to achieve signal transmission.

[0068] In this embodiment, the diameter of the second needle lead portion 521 is smaller than the inner diameter of the full blind hole 313a and the half blind hole 313b of the second interconnected hole group 313, so that when the second needle lead portion 521 is assembled with the corresponding full blind hole 313a or half blind hole 313b, the second needle lead portion 521 can be arranged in the full blind hole 313a or the half blind hole 313b at intervals, and then the outer circumference of the second needle lead portion 521 is connected to the inner circumference of the full blind hole 313a or the half blind hole 313b. A welding space is formed between the surfaces to facilitate welding of the second lead needle portion 521 and the full blind hole 313a or the half blind hole 313b; preferably, the inner diameter of the full blind hole 313a or the half blind hole 313b is 1.1 to 1.5 times the diameter of the second lead needle portion 521, so as to facilitate welding between the outer circumference of the second lead needle portion 521 and the inner circumference of the full blind hole 313a or the half blind hole 313b, thereby achieving electrical contact between the second lead needle portion 521 and the circuit unit 300.

[0069] As a preferred mode of this embodiment, the second interconnection unit 520 also includes a second interconnection tin-through portion 524 arranged between the second pin-lead portion 521 and the second fixing portion 522, and the inner diameter of the second interconnection hole group 313 is larger than the diameter of the second pin-lead portion 521 and smaller than the diameter of the second interconnection tin-through portion 524, so that after the second interconnection unit 520 and the circuit board 310 are assembled in place, the corresponding surface of the second interconnection tin-through portion 524 can abut against the corresponding side of the circuit unit 300 (i.e., the second side of the circuit board 310) to further assist in supporting the circuit board 310.

[0070] A second interconnected tin-through cut surface 525 extending in the axial direction is formed on the outer peripheral surface of the second interconnected tin-through portion 524, and the radial dimension from the axis of the second interconnected tin-through portion 524 to the second interconnected tin-through cut surface 525 is smaller than the inner diameter of the second interconnected hole group 313, so that the third interconnected projection of the second interconnected tin-through portion 524 on the horizontal plane partially overlaps with the fourth interconnected projection of the second interconnected hole group 313 on the horizontal plane. In this way, the full blind hole 313a or the semi-blind hole 313b of the second interconnected hole group 313 is not completely blocked by the second interconnected tin-through portion 524, so as to form a gap between the second interconnected hole group 313 and the second interconnected tin-through portion 524, which is convenient for welding.

[0071] In this embodiment, the first interconnection unit 510 and the second interconnection unit 520 are configured to have a structure with interconnected tin-penetrating sections, which, on the one hand, can facilitate tin penetration and ensure the tin penetration rate, and on the other hand, can also achieve a quick visual inspection of the welding quality. It is understandable that in some other embodiments, the first interconnection unit 510 and the second interconnection unit 520 can also be implemented with a straight pin structure to achieve the purpose of rapid processing and assembly, and is conducive to reducing process costs.

[0072] As a preferred method of this embodiment, in order to fix the entire circuit module during use and increase the stability of the connection between the circuit module and the external structure, the tube shell 100 is provided with a first fixing column 710 ( Fig.10 ) and / or the base 200 is provided with a second fixing column 720 ( Fig.11 As shown in the figure), the circuit module is fixed to the external structure; or a welding column (not shown) is integrally formed on one side of the tube shell 100 corresponding to the packaging opening 120 (i.e., on the packaging step 130) to fix the circuit module to the external structure; or a connecting flange 730 (not shown) extending outward is integrally provided on the outer periphery of the tube shell 100 and / or the base 200 to extend outward Fig.12 In specific implementation, the first fixing column 710, the second fixing column 720, the welding column and the connecting flange 730 can be set one by one, or multiple or even all of them can be set in combination to achieve stable fixation of the entire circuit module and the external structure.

[0073] In a specific implementation, the first fixing column 710, the second fixing column 720 and the connecting flange 730 are integrally formed with the same metal material as the tube shell 100 and / or the base 200, which can not only achieve the purpose of rapid prototyping, but also increase the connection strength between the first fixing column 710, the second fixing column 720 and the connecting flange 730 and the tube shell 100 and / or the base 200, so as to ensure the structural strength of the entire circuit module.

[0074] The utility model preforms the electrical interconnection structure 500 on the base 200, then assembles and welds the circuit board 310 and the electrical interconnection structure 500, and finally packages the assembled base 200 and the circuit unit 300 with the tube shell 100. The circuit unit 300 does not need to be welded to the tube shell 100, which can effectively reduce the difficulty of assembly and welding between the circuit unit 300 and the tube shell 100, which is conducive to improving the packaging efficiency. At the same time, it can also avoid the problem that welding waste slag falls into the bottom space and is difficult to remove, ensuring that the circuit will not fail due to short circuit of welding waste slag, thereby improving the safety and reliability of the circuit module. In addition, the circuit board 310 is provided with a group of interconnection holes such as full perforation 313a, half perforation 313b, full blind hole 314a, and half blind hole 314b to achieve the welding of the circuit board 310 and the electrical interconnection structure 500, which can optimize the circuit layout to improve the integration of the circuit module.

Claims

1. A metal hexahedral circuit interconnect welding structure, characterized in that: It includes a base, a circuit unit provided with a first interconnection hole group and / or a second interconnection hole group, and an electrical interconnection structure connecting the circuit unit and the base, the electrical interconnection structure includes a first interconnection unit electrically in contact with the first interconnection hole group and / or a second interconnection unit electrically in contact with the second interconnection hole group, the first ends of the first interconnection unit and the second interconnection unit are correspondingly connected to the base, the second end of the first interconnection unit passes through the first interconnection hole group and is in electrical contact with the circuit unit, and the second end of the second interconnection unit abuts against the first interconnection hole group and is in electrical contact with the circuit unit.

2. The metal hexahedral circuit interconnection welding structure according to claim 1, characterized in that: The first interconnection unit includes a first lead pin portion electrically in contact with the first interconnection hole group, a first fixing portion integrally extending from the first lead pin portion and preformed as one body with the base, and a first pin portion integrally extending from the first fixing portion to the outside of the base, and the first lead pin portion passes through the first interconnection hole group and penetrates the circuit unit.

3. The metal hexahedral circuit interconnection welding structure according to claim 2, characterized in that: The first interconnection hole group includes full perforations and / or half perforations, and the full perforations and half perforations are both defined as through holes arranged through the circuit unit along the thickness direction of the circuit unit, the inner circumferential surface of the full perforation is defined as a complete circular surface closed in the circumferential direction, and the inner circumferential surface of the half perforation is defined as an unclosed incomplete circular surface connected to the circumferential side of the circuit unit, and the length of the inner circumferential surface of the half perforation is greater than one half of the circumference; the first lead needle portion is penetrated in the full perforation and / or half perforation and is in electrical contact with the full perforation and / or half perforation.

4. The metal hexahedral circuit interconnection welding structure according to any one of claims 2 to 3, characterized in that: The first interconnection unit also includes a first interconnection tin-through portion arranged between the first pin-leading portion and the first fixing portion, the inner diameter of the first interconnection hole group is larger than the diameter of the first pin-leading portion and smaller than the diameter of the first interconnection tin-through portion, the corresponding surface of the first interconnection tin-through portion abuts against the second side surface of the circuit unit, the outer peripheral surface of the first interconnection tin-through portion is formed with a first interconnection tin-through section extending in the axial direction, and the radial dimension from the axis of the first interconnection tin-through portion to the first interconnection tin-through section is smaller than the inner diameter of the first interconnection hole group, so that a first interconnection projection of the first interconnection tin-through portion on a horizontal plane partially overlaps with a second interconnection projection of the first interconnection hole group on the horizontal plane.

5. The metal hexahedral circuit interconnection welding structure according to claim 1, characterized in that: The second interconnection unit includes a second pin portion electrically in contact with the second interconnection hole group, a second fixing portion integrally extending from the second pin portion and preformed as one piece with the base, and a second pin portion integrally extending from the second fixing portion to the outside of the base, and the second pin portion abuts against the circuit unit through the second interconnection hole group.

6. The metal hexahedral circuit interconnection welding structure according to claim 5, characterized in that: The second interconnected hole group includes full blind holes and / or half blind holes, and the full blind holes and / or half blind holes are defined as blind holes recessed on the corresponding side surfaces of the circuit unit, the inner circumferential surface of the full blind hole is defined as a complete circular surface closed in the circumferential direction, the inner circumferential surface of the half blind hole is defined as an unclosed incomplete circular surface connected to the circumferential side of the circuit unit, and the length of the inner circumferential surface of the half blind hole is greater than half of the circumference; the second lead needle portion abuts against the full blind hole and / or half blind hole and is in electrical contact with the full blind hole and / or half blind hole.

7. The metal hexahedral circuit interconnection welding structure according to any one of claims 5 to 6, characterized in that: The second interconnection unit also includes a second interconnection tin-through portion arranged between the second pin lead portion and the second fixing portion, the inner diameter of the second interconnection hole group is larger than the diameter of the second pin lead portion and smaller than the diameter of the second interconnection tin-through portion, the corresponding surface of the second interconnection tin-through portion abuts against the corresponding side surface of the circuit unit, the outer peripheral surface of the second interconnection tin-through portion is formed with a second interconnection tin-through section extending in the axial direction, and the radial dimension from the axis of the second interconnection tin-through portion to the second interconnection tin-through section is smaller than the inner diameter of the second interconnection hole group, so that the third interconnection projection of the second interconnection tin-through portion on the horizontal plane partially overlaps with the fourth interconnection projection of the second interconnection hole group on the horizontal plane.

8. The metal hexahedral circuit interconnection welding structure according to claim 1, characterized in that: A third interconnection hole group is arranged on the base at a position corresponding to the electrical interconnection structure, and the first interconnection unit and the second interconnection unit are fixed to the corresponding third interconnection hole group.

9. The metal hexahedral circuit interconnection welding structure according to claim 1, characterized in that: The first interconnection unit and the second interconnection unit are fixed to and insulated from the base through a sintering process.

10. A circuit module, characterized in that: The invention comprises the metal hexahedral circuit interconnection welding structure as claimed in any one of claims 1 to 9.

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