Heat dissipation structure in ATE equipment and ATE equipment formed by heat dissipation structure

Abstract

The utility model discloses a heat dissipation structure in ATE equipment, which comprises a bottom plate, an insulating plate and a back plate, the bottom plate is provided with a position avoiding hole, the side edge of the position avoiding hole is provided with a groove, the insulating plate is provided with a position avoiding hole corresponding to the bottom plate, and the bottom plate and the insulating plate are attached to enable the groove to be sealed to form an air passage; the air channel is communicated with an air pipe joint, and the air pipe joint is connected with a cooling air source; a PCB is arranged in the back plate, a connector is arranged in the PCB, the back plate is located on the side, away from the insulating plate, of the bottom plate, and when the back plate is attached to the bottom plate, the PCB penetrates through the receding hole. According to the heat dissipation structure in the ATE equipment and the ATE equipment formed by the heat dissipation structure, the air channel is arranged in the bottom plate, so that the working space is saved, and the test reliability is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation of ATE equipment, in particular to a heat dissipation structure in ATE equipment and the ATE equipment formed by the structure. Background Art

[0002] With the development of the semiconductor industry, the performance of semiconductor automated test equipment has been rapidly improved, and the power dissipation of the entire system has also increased rapidly. In the prior art, a gas flow channel or a liquid flow channel is usually set around the test board to use cooling gas or cooling liquid to dissipate the heat generated during the test. The current gas flow channel or liquid flow channel is to lay the pipe directly at the location where heat dissipation is required.

[0003] This structure has the following disadvantages:

[0004] 1. Occupy working space: External pipes squeeze the space of boards and limit the shape of boards.

[0005] 2. Limited pipeline form: Since there are working components such as boards and cards in the working area, the pipeline distribution form is restricted, making it difficult to meet the specified gas flow requirements in the specified area.

[0006] 3. Poor reliability: The pipeline is not formed in one piece, and is generally made of metal welding or plastic parts splicing. This form has problems such as air leakage and low service life.

[0007] 4. Increased cost: This is the addition of a component, which is bound to increase additional costs.

[0008] 5. Poor aesthetics: The external pipelines are rather messy, making the entire test device look messy and increasing the difficulty of plugging in the board test. Utility Model Content

[0009] The utility model aims to solve at least one of the problems in the related art to a certain extent. To this end, the utility model aims to provide a heat dissipation structure in an ATE device and an ATE device formed by the heat dissipation structure, wherein the air duct is built into the bottom plate, thereby saving working space and improving test reliability.

[0010] A heat dissipation structure in ATE equipment comprises a base plate, an insulating plate and a back plate, wherein the base plate is provided with a position avoidance hole, and the side of the position avoidance hole is provided with a groove.

[0011] The insulating plate is provided with a position avoidance hole corresponding to the bottom plate, and the bottom plate and the insulating plate are fitted together so that the groove is sealed to form an airway; the airway is connected to the air pipe joint, and the air pipe joint is connected to the cooling air source;

[0012] The back plate is provided with a PCB board, the PCB board is provided with a connector, the back plate is located at a side of the bottom plate away from the insulating plate, and when the back plate is attached to the bottom plate, the PCB board passes through the avoidance hole.

[0013] Furthermore, an air outlet is provided at one end of the airway away from the trachea joint.

[0014] Furthermore, there are several avoidance holes, and the airway includes a main airway and a split airway. The split airway is arranged on the side of each avoidance hole. The split airway is also connected to the trachea joint through the main airway, and an air outlet is arranged on the side of the split airway away from the main airway.

[0015] Furthermore, the split air duct includes m graded air ducts, and the m graded air ducts are connected in sequence and distributed around the sides of the corresponding avoidance holes, and m is an integer greater than 0.

[0016] Furthermore, the inner diameters of the split airways corresponding to each avoidance hole are not completely the same.

[0017] Furthermore, when the PCB board passing through the avoidance hole does not generate heat during the test process, no air outlet is provided at the end of the graded air channel on the side of the avoidance hole.

[0018] Furthermore, it also includes a test board, which is plugged into the connector in the PCB board.

[0019] Furthermore, a backing adhesive is provided on one side of the insulating plate close to the bottom plate.

[0020] Furthermore, the cooling air source is dry air.

[0021] An ATE device includes the heat dissipation structure in the ATE device as described above.

[0022] The above technical solution provided by the embodiment of the present application has the following advantages over the prior art: the heat dissipation structure in a ATE device provided by the present application includes a base plate, an insulating plate and a back plate, the base plate is provided with a position avoidance hole, the side of the position avoidance hole is provided with a groove, the insulating plate is provided with a position avoidance hole corresponding to the base plate, the base plate and the insulating plate are fitted so that the groove is sealed to form an airway; the airway is connected to the air pipe joint, and the air pipe joint is connected to the air source; a PCB board is provided in the back plate, a connector is provided in the PCB board, the back plate is located on the side of the base plate away from the insulating plate, and when the back plate is fitted with the base plate, the PCB board passes through the position avoidance hole. In the present application, the groove in the base plate and the back plate are sealed to form an airway after being fitted, the airway is built inside the base plate and is located around the PCB board, when the connector in the PCB board is plugged with the test board for testing, the airway is connected to the cooling air source through the air pipe joint, and the heat generated by the test board during the test can be taken away by the cooling gas in the airway in time, ensuring the timely stability of heat dissipation. At the same time, the air duct in the present application is built into the bottom plate, which will not affect the placement of the PCB board or the test board, thereby simplifying the overall structure of the test device. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The accompanying drawings herein are incorporated in and constitute a part of the specification, illustrate embodiments consistent with the present utility model, and together with the description, are used to explain the principles of the present utility model.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the utility model or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0025] Figure 1 Schematic diagram of the structure after the base plate, insulation plate and back plate are assembled.

[0026] Figure 2 Schematic diagram of the structure of the airway in this application.

[0027] Figure numerals: 1. base plate; 2. test board; 3. air pipe joint; 4. back plate; 5. insulating plate; 6. connector; 8. main air duct; 9. split air duct. DETAILED DESCRIPTION

[0028] In order to have a clearer understanding of the technical features, purposes and effects of the present invention, the specific implementation methods of the present invention are now described in detail with reference to the accompanying drawings. In the following description, it should be understood that the directions or positional relationships indicated by "front", "rear", "up", "down", "left", "right", "longitudinal", "horizontal", "vertical", "horizontal", "top", "bottom", "inside", "outside", "head", "tail", etc. are based on the directions or positional relationships shown in the accompanying drawings, are constructed and operated in a specific direction, and are only for the convenience of describing the present technical solution, rather than indicating that the mechanism or element referred to must have a specific direction, and therefore cannot be understood as a limitation to the present invention.

[0029] It should also be noted that, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed", "set" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. When an element is referred to as being "on" or "under" another element, the element can be "directly" or "indirectly" located on the other element, or there may be one or more intermediate elements. The terms "first", "second", "third", etc. are only for the convenience of describing the present technical solution, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first", "second", "third", etc. can explicitly or implicitly include one or more of the features. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to the specific circumstances.

[0030] In the following description, specific details such as specific system structures and technologies are provided for the purpose of illustration rather than limitation, so as to provide a thorough understanding of the embodiments of the present invention. However, it should be clear to those skilled in the art that the present invention can also be implemented in other embodiments without these specific details. In other cases, detailed descriptions of well-known systems, mechanisms, circuits, and methods are omitted to avoid unnecessary details that hinder the description of the present invention.

[0031] Example 1

[0032] See also Figure 1-Figure 2The present application provides a heat dissipation structure in an ATE device, comprising a base plate 1, an insulating plate 5 and a back plate 4, wherein the base plate 1 is provided with a avoidance hole, the side of the avoidance hole is provided with a groove, the insulating plate 5 is provided with a avoidance hole corresponding to the base plate 1, the base plate 1 and the insulating plate 5 are fitted together so that the groove is sealed to form an airway; the airway is connected to the air pipe joint 3, and the air pipe joint 3 is connected to the air source; a PCB board is provided in the back plate 4, and a connector 6 is provided in the PCB board, the back plate 4 is located on the side of the base plate 1 away from the insulating plate 5, and when the back plate 4 is fitted with the base plate 1, the PCB board passes through the avoidance hole.

[0033] In the present application, the groove in the bottom plate 1 and the back plate 4 are sealed to form an airway after being fitted. The airway is built inside the bottom plate 1 and is located around the PCB board. When the connector 6 in the PCB board is plugged with the test board 2 for testing, the airway is connected to the cooling air source through the air pipe joint 3. The heat generated by the test board 2 during the test process can be taken away in time by the cooling gas in the airway, ensuring the timely stability of heat dissipation. At the same time, the airway in the present application is built inside the bottom plate 1, which will not affect the placement of the PCB board or the test board 2, simplifying the overall structure of the test device.

[0034] Example 2

[0035] See also Figure 1-Figure 2 The present application provides a heat dissipation structure in an ATE device, comprising a base plate 1, an insulating plate 5 and a back plate 4, wherein the base plate 1 is provided with a avoidance hole, the side of the avoidance hole is provided with a groove, the insulating plate 5 is provided with a avoidance hole corresponding to the base plate 1, the base plate 1 and the insulating plate 5 are fitted together so that the groove is sealed to form an airway; the airway is connected to the air pipe joint 3, and the air pipe joint 3 is connected to the air source; a PCB board is provided in the back plate 4, and a connector 6 is provided in the PCB board, the back plate 4 is located on the side of the base plate 1 away from the insulating plate 5, and when the back plate 4 is fitted with the base plate 1, the PCB board passes through the avoidance hole.

[0036] In the present application, an air outlet is provided at one end of the airway away from the air pipe connector 3. The cooling gas source enters the airway through the air pipe connector 3 and is then discharged from the air outlet of the airway. In this process, the cooling gas can take away the heat around the airway. In the present application, the cooling gas does not need to be circulated, and is directly discharged into the air through the air outlet or recovered into the gas storage tank.

[0037] In the present application, the cooling air source can be dry air. Dry air can be obtained directly from the air. This is because the heat generated during the test of the PCB board and the test board 2 next to the airway makes the temperature at this position much higher than the room temperature. At this time, directly using air through the airway is equivalent to speeding up the air flow at the heat generating position, which can achieve the purpose of cooling. The air after passing through the airway can be directly discharged into the air without setting up an additional gas tank.

[0038] The present application can also collect the air and then dry and cool it down, for example, by cooling the air through preparation equipment such as a fan or air conditioner before passing it into the airway, thus ensuring the cooling effect.

[0039] In the present application, drying the air can remove moisture from the air and prevent moisture from remaining in the grooves. In the present application, the bottom plate 1 can be a metal bottom plate, and the moisture remaining in the grooves can prevent metal rust and corrosion.

[0040] In the present application, the cooling gas source may also be an inert gas with a relatively low temperature.

[0041] In the present application, the insulating plate 5 is provided with adhesive backing on one side close to the bottom plate 1. The insulating plate 5 is attached to the side of the bottom plate 1 where the groove is provided, and the insulating plate 5 is provided with adhesive backing on one side close to the bottom plate 1, and the adhesive backing may be insulating adhesive, etc. When the insulating plate 5 and the bottom plate 1 are attached, the insulating plate 5 is a planar structure, and the insulating plate 5 is directly attached to the bottom plate 1, and the groove is sealed to form a sealed airway, and the sealing here refers to sealing the top of the groove, and the airway still maintains the air outlet at the end.

[0042] The grooves provided in the bottom plate 1 can be directional or semicircular structures, as long as they are recessed relative to the surface of the bottom plate 1. Corresponding avoidance holes also need to be provided in the insulating plate 5 of the present application to ensure that when the bottom plate 1 and the insulating plate 5 are attached, the avoidance holes will not be blocked by the insulating plate 5. The avoidance holes are through holes reserved for the PCB board in the back plate 4 to pass through.

[0043] A PCB board is provided on one side of the back plate 4, and a connector 6 is provided in the PCB board. The back plate 4 is located on the side of the bottom plate 1 away from the insulating plate 5. When the back plate 4 is fitted with the bottom plate 1, the PCB board passes through the avoidance hole. The present application also includes a test board 2 during the test process, and the test board 2 is plugged into the connector 6 in the PCB board. The test board 2 and the PCB board are connected together for testing, and heat is generated during the test process. In the present application, the grooves are distributed around the avoidance holes, that is, distributed around the PCB board, for timely heat dissipation of the PCB board during the test process.

[0044] like Figure 1 and 2 As shown, there are several avoidance holes in the present application, and the air duct includes a main air duct 8 and a split air duct 9. The split air duct 9 is arranged on the side of each avoidance hole. The split air duct 9 is also connected to the trachea joint 3 through the main air duct 8. An air outlet is arranged on the side of the split air duct 9 away from the main air duct 8.

[0045] In the present application, one end of the main airway 8 is used to connect to the air pipe connector 3, and the other end is used to connect to the split airway 9. It can be understood that the main airway 8 is the main airway, and the split airway 9 is the branch airway distributed on the side of each avoidance hole. The inner diameter of the main airway can be larger than the inner diameter of the branch airway to ensure that the cooling gas in the main airway can be dispersed into each branch airway 9.

[0046] In the present application, the main air duct 8 can be set at the edge position of the base plate 1, and the split air duct 9 extends the main air duct 8 to the corresponding avoidance hole position, so that the cooling gas is transmitted to the main air duct 8 through an air inlet joint, and then the cooling gas is transmitted to different avoidance hole sides, that is, different PCB board sides, through several split air ducts 9.

[0047] In the present application, a plurality of split air passages 9 are connected in parallel in the main air passage 8, that is, a plurality of parallel outlets are provided in the main air passage 8 to connect the split air passages 9 at different positions.

[0048] The split air duct 9 described in the present application includes m graded air ducts, and the m graded air ducts are connected in sequence and distributed around the corresponding side of the avoidance hole, and m is an integer greater than 0. Each split air duct 9 refers to an air duct surrounding the side of the same avoidance hole, which corresponds to a specific PCB board. Depending on how much heat the PCB board generates during the test, the m value can be set to different sizes. For areas where heat generation is more concentrated, the m value can be set larger, so that the stroke of the split air duct 9 becomes larger, ensuring that the cooling air source can extend a longer path at the corresponding position.

[0049] In the present application, the inner diameter of the graded air duct can be reduced step by step, for example, the first-level graded air duct is connected to the main air duct 8, the second-level graded air duct is connected to the first-level graded air duct, and so on. At the same time, the number of graded air ducts can also be increased step by step, for example, there is one first-level graded air duct, and one first-level graded air duct is connected to the main air duct 8, there are three second-level graded air ducts, and three second-level graded air ducts are simultaneously connected to the first graded air duct, and so on. An air outlet is provided at the end of the last-level graded air duct, so that each last-level graded air duct can be connected to the main air duct 8 through the upper-level air duct to form a complete cooling gas channel.

[0050] The more levels of graded air channels on the side of the avoidance hole, the more the number of graded air channels in the last level, the more gas channels with outlets formed around the corresponding avoidance hole will be, and the better the heat dissipation effect will be. In the present application, only the air outlet is set at the end of the last level of graded air channels, and the number of the last level of graded air channels also indicates the number of gas channels formed on the side of the avoidance hole. In the present application, the more levels of graded air channels, the longer the path of the corresponding gas channel on the surface, and the better the heat dissipation effect.

[0051] Since each PCB board generates different amounts of heat during the test, the present application can set different inner diameters of the split air ducts 9 corresponding to each avoidance hole, different inner diameters of the graded air ducts, different levels of the graded air ducts, and other parameters. For areas where heat generation is more concentrated, graded air ducts with larger inner diameters and graded air ducts with more levels can be set to ensure timely heat dissipation. For areas where heat generation is less, graded air ducts with smaller inner diameters and graded air ducts with fewer levels can be set to meet the heat dissipation requirements.

[0052] When the PCB board passing through the avoidance hole does not generate heat during the test process, no air outlet is provided at the end of the graded air channel on the side of the avoidance hole, or no groove or air channel is provided.

[0053] In order to improve the applicability of the heat dissipation base plate 1, grooves or air passages may be provided, but no air outlets may be provided. Thus, when the base plate 1 and different back plates 4 are fitted together, the air passages on the sides of the avoidance holes may be connected or disconnected by adding air outlets or blocking the air outlets.

[0054] The present application adopts the method of removing material to form the airway by processing a groove of a certain shape on the lower surface of the base plate 1 to form the airway; since there is no restriction on other components such as other boards and cards in the working space, the airway form can be freely processed and changed according to needs, and the purpose of freely changing the size of each outlet flow can be achieved by changing the airway trend and outlet area according to the gas flow required for each part.

[0055] In the present application, since the air duct is formed by removing material from the metal base plate, the air duct is self-contained and has high reliability. Since the base plate 1 is one of the components of the test head, the air duct is combined with the base plate 1 to reduce the production cost of the external pipeline. The air duct is hidden in the base plate 1 and cannot be found visually, which increases the aesthetics of the device.

[0056] It can be understood that the above embodiments only express the preferred implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the utility model. It should be pointed out that, for ordinary technicians in this field, without departing from the concept of the utility model, the above-mentioned technical features can be freely combined, and several deformations and improvements can be made, which all belong to the protection scope of the utility model. Therefore, all equivalent changes and modifications made to the scope of the claims of the utility model should belong to the scope covered by the claims of the utility model.

Claims

1. A heat dissipation structure in an ATE device, characterized in that: The invention comprises a bottom plate, an insulating plate and a back plate, wherein the bottom plate is provided with a position avoidance hole, and the side of the position avoidance hole is provided with a groove. The insulating plate is provided with a position avoidance hole corresponding to the bottom plate, and the bottom plate and the insulating plate are fitted together so that the groove is sealed to form an airway; the airway is connected to the air pipe joint, and the air pipe joint is connected to the cooling air source; The back plate is provided with a PCB board, the PCB board is provided with a connector, the back plate is located at a side of the bottom plate away from the insulating plate, and when the back plate is attached to the bottom plate, the PCB board passes through the avoidance hole.

2. The heat dissipation structure in the ATE equipment according to claim 1, characterized in that: An air outlet is arranged at one end of the airway away from the trachea joint.

3. The heat dissipation structure in the ATE equipment according to claim 1, characterized in that: There are several avoidance holes, and the airway includes a main airway and a split airway. The split airway is arranged on the side of each avoidance hole. The split airway is connected to the trachea joint through the main airway at the same time, and an air outlet is arranged on the side of the split airway away from the main airway.

4. The heat dissipation structure in the ATE equipment according to claim 3, characterized in that: The split air duct includes m graded air ducts, and the m graded air ducts are connected in sequence and distributed around the sides of the corresponding avoidance holes, and m is an integer greater than 0.

5. The heat dissipation structure in the ATE equipment according to claim 3, characterized in that: The inner diameters of the split airways corresponding to each avoidance hole are not completely the same.

6. The heat dissipation structure in ATE equipment according to claim 3, characterized in that: When the PCB board passing through the avoidance hole does not generate heat during the test process, no air outlet is provided at the end of the graded air channel on the side of the avoidance hole.

7. The heat dissipation structure in ATE equipment according to claim 1, characterized in that: It also includes a test board, which is plugged into a connector in the PCB board.

8. The heat dissipation structure in ATE equipment according to claim 1, characterized in that: A backing adhesive is arranged on one side of the insulating plate close to the bottom plate.

9. The heat dissipation structure in ATE equipment according to claim 1, characterized in that: The cooling air source is dry air.

10. An ATE device, characterized in that: A heat dissipation structure in an ATE device comprising any one of claims 1-9.

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