Solar cell and solar cell module

Abstract

The utility model discloses a solar cell sheet and a solar cell module, the solar cell sheet comprises a silicon wafer and a plurality of fine grid lines distributed on the surface of the silicon wafer along a first direction, at least one closed glue blocking frame is formed on the surface of the silicon wafer, and the surface of the silicon wafer in the glue blocking frame is not covered with the fine grid lines. And the glue blocking frame is at least connected with one thin grid line and is electrically conducted with the thin grid line. According to the utility model, the glue blocking frame is arranged on the surface of the silicon wafer, and the insulating glue printing position is reserved, so that even if the insulating glue diffuses or deviates, the problem of contact resistance increase caused by covering the fine grid lines can be avoided, the current collection capability is improved, and the assembly power is further improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of solar cells, and in particular relates to a solar cell sheet and a solar cell assembly. Background Art

[0002] As photovoltaic cell technology shifts from P-type to N-type, N-type cells, especially TOPCon (Tunnel Oxide Passivated Contact) cells, gradually replace PERC (Passivated Emitter and Rear Cell) cells and become mainstream. Topcon cells use silver paste on both the front and back electrodes, which means that their cost is still not competitive compared to PERC cells.

[0003] Currently, Topcon batteries’ cost reduction routes for silver paste mainly include: busbar-free (0BB) technology, silver-clad copper technology, copper electroplating technology, etc. Among them, 0BB technology can significantly reduce the cost of silver paste by eliminating the busbar.

[0004] Busbar-free (0BB) batteries eliminate the main grid lines and only retain the fine grid lines. Currently, there are three main welding technologies for 0BB battery modules: "SmartWire", "glue dispensing", and "welding first and then glue dispensing", and glue dispensing technology is the most commonly used. Due to the design of 0BB technology without busbars, if the welding ribbon is directly welded to the fine grid lines, the welding ribbon is easy to detach due to insufficient tension. Therefore, the welding ribbon and the battery are mainly fixed by insulating glue, and then welded to make close contact with the fine grid lines. However, the glue is an insulating glue. If the glue dispensing position deviates from the set position and covers the fine grid lines, the contact area between the welding ribbon and the fine grid lines will be reduced, which will lead to an increase in contact resistance, reduce the current collection efficiency, and thus affect the power of the battery module.

[0005] Therefore, in view of the above technical problems, it is necessary to provide a solar cell and a solar cell module. Utility Model Content

[0006] The utility model aims to provide a solar cell sheet and a solar cell assembly to avoid the problem of increased contact resistance caused by insulating glue covering thin grid lines.

[0007] In order to achieve the above purpose, the technical solution provided by an embodiment of the present utility model is as follows:

[0008] A solar cell comprises a silicon wafer and a plurality of fine grid lines distributed on the surface of the silicon wafer along a first direction, at least one closed glue resistance frame is formed on the surface of the silicon wafer, the surface of the silicon wafer in the glue resistance frame is not covered with the fine grid lines, and the glue resistance frame is connected to at least one fine grid line and is electrically conductive.

[0009] In one embodiment, the glue blocking frame includes two first glue blocking lines distributed along a direction perpendicular to the first direction, and a plurality of second glue blocking lines distributed along the first direction and connected to ends of the first glue blocking lines.

[0010] In one embodiment, the glue blocking frame includes two second glue blocking lines connected to the same end of the two first glue blocking lines, and a first reinforcing line, wherein the first reinforcing line is connected to the two second glue blocking lines and is electrically conductive.

[0011] In one embodiment, the first glue blocking line intersects at least two thin gate lines, and the second glue blocking line is connected to the thin gate lines, or is located between two adjacent thin gate lines along a direction perpendicular to the first direction.

[0012] In one embodiment, first alignment lines intersecting with the second glue resistance lines are disposed at both ends of the first reinforcement line, and at the intersection of the first alignment lines and the second glue resistance lines, the second glue resistance lines are stacked above the first alignment lines and are electrically connected to each other.

[0013] In one embodiment, the heights of the first glue resistance line and the second glue resistance line are equal to the heights of the thin gate lines, and the line widths of the first glue resistance line and the second glue resistance line are equal to the line widths of the thin gate lines.

[0014] In one embodiment, a plurality of thin gate lines spaced apart along a first direction and a second reinforcing line are disposed on the surface of the silicon wafer, and the second reinforcing line is connected to the two thin gate lines and is electrically conductive.

[0015] In one embodiment, second bit lines intersecting with the fine gate lines are disposed at both ends of the second reinforcing line, and at the intersection of the second bit lines and the fine gate lines, the fine gate lines are stacked above the second bit lines and are electrically connected to each other.

[0016] In one embodiment, the length of the glue blocking frame along the direction perpendicular to the first direction is greater than or equal to twice the distance between two thin gate lines; and / or,

[0017] The number of the glue blocking frames along the direction perpendicular to the first direction is 2 to n / 3, wherein n is the number of the fine gate lines.

[0018] In one embodiment, the length of the glue blocking frame along the direction perpendicular to the first direction is 0.5 mm to 3 mm, and the width along the first direction is 0.5 mm to 2 mm; and / or,

[0019] The resist frame is formed on the light-receiving surface of the silicon wafer, and the resist frame has a height of 8 μm to 14 μm; and / or,

[0020] The resist frame is formed on the backlight surface of the silicon wafer, and the height of the resist frame is 3 μm to 8 μm.

[0021] Another embodiment of the present invention provides a technical solution as follows:

[0022] A solar cell assembly comprises a plurality of solar cells, a plurality of welding strips and insulating adhesive, wherein the solar cells are the above-mentioned solar cells, the welding strips are electrically connected to the fine grid lines, the insulating adhesive is located in an adhesive resistance frame, and the insulating adhesive is respectively adhered to the silicon cells and the welding strips.

[0023] Compared with the prior art, the utility model has the following beneficial effects:

[0024] In the utility model, a glue blocking frame is arranged on the surface of the silicon wafer to reserve a position for printing the insulating glue. Even if the insulating glue diffuses or shifts, the problem of increased contact resistance caused by covering the fine grid lines can be avoided, thereby improving the current collection capability and further improving the component power. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0026] Figure 1 This is a schematic diagram of the structure of a solar cell in Comparative Example 1 of the present utility model;

[0027] Figure 2 It is a schematic diagram of the partial planar structure of a solar cell in comparative example 1 of the present utility model;

[0028] Figure 3 It is a schematic diagram of the partial planar structure of the solar cell assembly in Comparative Example 2 of the present utility model;

[0029] Figure 4 This is a schematic diagram of the structure of a solar cell in Example 1 of the utility model;

[0030] Figure 5 This is a schematic diagram of a partial planar structure of a solar cell in Example 1 of the utility model;

[0031] Figure 6 This is a schematic diagram of the planar structure of the thin gate line, the second reinforcement line, and the second alignment line in Embodiment 1 of the present utility model;

[0032] Figure 7 This is a schematic diagram of the planar structure of the glue blocking frame in Example 1 of the utility model;

[0033] Figure 8This is a schematic diagram of the planar structure of the first reinforcement line and the first alignment line in Example 1 of the utility model;

[0034] Fig. 9 This is a schematic diagram of a partial planar structure of a solar cell assembly in Example 2 of the utility model;

[0035] Fig.10 for Fig. 9 Schematic diagram of the cross-sectional structure at AA in the middle;

[0036] Fig.11 for Fig. 9 Schematic diagram of the cross-sectional structure at BB in the middle;

[0037] Fig.12 This is a schematic diagram of a partial planar structure of a solar cell in Example 3 of the utility model;

[0038] Fig.13 It is a partial planar structural schematic diagram of a solar cell assembly in Example 4 of the utility model;

[0039] Fig.14 This is a schematic diagram of a partial planar structure of a solar cell in Example 5 of the utility model;

[0040] Fig.15 This is a schematic diagram of a partial planar structure of a solar cell assembly in Example 6 of the utility model;

[0041] Fig.16 This is a schematic diagram of a partial planar structure of a solar cell in Example 7 of the utility model;

[0042] Fig.17 It is a schematic diagram of the partial planar structure of the solar cell assembly in Example 8 of the utility model. DETAILED DESCRIPTION

[0043] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0044] Furthermore, it should be understood that although the terms first, second, etc. can be used to describe various elements or structures in this article, these described objects should not be limited by these terms. These terms are only used to distinguish these described objects from each other. For example, the first glue resistance line can be called the second glue resistance line, and similarly the second glue resistance line can also be called the first glue resistance line, which does not deviate from the protection scope of the present utility model.

[0045] The utility model discloses a solar cell sheet, comprising a silicon sheet and a grid line electrode arranged on the surface of the silicon sheet, wherein the grid line electrode comprises a main grid line and a thin grid line, wherein the main grid lines are multiple and are arranged parallel to each other, and each main grid line is provided with a plurality of reinforcing lines connected with the thin grid lines, the reinforcing lines intersect the main grid lines perpendicularly, and alignment lines intersecting with the thin grid lines are arranged at both ends of the reinforcing lines.

[0046] The utility model also discloses a solar cell chip, comprising a silicon chip and a plurality of fine grid lines distributed on the surface of the silicon chip along a first direction, at least one closed glue resistance frame is formed on the surface of the silicon chip, the surface of the silicon chip in the glue resistance frame is not covered with the fine grid lines, and the glue resistance frame is connected to at least one fine grid line and is electrically conductive.

[0047] The utility model also discloses a solar cell assembly, comprising a plurality of solar cell sheets, a plurality of welding strips and insulating adhesive, wherein the welding strips are electrically connected to the fine grid lines, the insulating adhesive is located in an adhesive resistance frame, and the insulating adhesive is respectively adhered to the silicon sheets and the welding strips.

[0048] In the utility model, a glue blocking frame is arranged on the surface of the silicon wafer to reserve a position for printing the insulating glue. Even if the insulating glue diffuses or deviates during the glue dispensing process or the welding process, the glue blocking frame can block the insulating glue to prevent it from covering the fine grid lines.

[0049] The present invention is further described below with reference to specific examples.

[0050] Comparative Example 1:

[0051] Ginseng Figure 1 The schematic diagram of the planar structure of the solar cell in this comparative example is shown, and the solar cell 100' includes a silicon wafer (not numbered) and a gate electrode 11' located on the surface of the silicon wafer. Taking the 0BB TOPCon 210 cell as an example, the size of the full-sheet solar cell is 210mm*210mm, and the full-sheet solar cell includes two identical half-sheet solar cells, with a cutting path 101' reserved in the middle.

[0052] Combination Figure 2 As shown, the gate line electrode 11 ′ in this embodiment includes a plurality of thin gate lines 111 ′ distributed along a first direction (ie, transverse direction), and the plurality of thin gate lines 111 ′ are evenly distributed at equal intervals in a direction perpendicular to the first direction (ie, vertical direction).

[0053] In addition, a plurality of fine gate lines 111' are distributed along the first direction, and two adjacent fine gate lines 111' are electrically connected via the reinforcing line 12'. Preferably, alignment lines 13' intersecting with the fine gate lines 111' are provided at both ends of the reinforcing line 12', and at the intersection of the alignment lines 13' and the fine gate lines 111', the fine gate lines 111' are stacked above the alignment lines 13' and are electrically connected to each other.

[0054] The maximum width of the reinforcing wire 12' is 30 μm to 60 μm, and the length is 0.8 mm to 1.5 mm, while the width of the thin gate wire 11' is 10 μm to 20 μm. The problem of poor contact between the welding strip and the thin gate wire can be avoided by setting the reinforcing wire.

[0055] During the printing process, the reinforcement line 12' is printed first, and then the fine grid line 111' is printed. In order to solve the alignment problem of the fine grid line 111' with the reinforcement line 12' during the printing process, alignment lines 13' are set at both ends of the reinforcement line 12'. The alignment problem of the fine grid line 111' and the reinforcement line 12' can be significantly improved. Even if the fine grid line and the reinforcement line are offset, electrical conduction between the fine grid line and the reinforcement line can be achieved through the alignment lines.

[0056] In this comparative example, the width of the reinforcing line 12' gradually decreases from the middle position to the two ends. The width is the widest at the middle position, which is 40 μm, and the width is the smallest at the two ends, which is 20 μm. The length of the reinforcing line is 1 mm.

[0057] Comparative Example 2:

[0058] Ginseng Figure 3 The schematic diagram of the partial planar structure of the solar cell assembly in this comparative example is shown. The solar cell assembly includes a plurality of solar cells 100', a plurality of welding strips 200' and an insulating adhesive 300'. The solar cell 100' is exactly the same as that in comparative example 1 and will not be described again here.

[0059] The welding strip 200' in this comparative example is fixedly welded to the solar cell through a welding process. The welding strip 200' intersects with the reinforcing wire 12' and is electrically conductive to each other, and the reinforcing wire 12' is electrically conductive to the fine grid wire 111', so the welding strip 200' can be electrically conductive to the fine grid wire 111'. The insulating glue 300' is formed between two adjacent reinforcing wires 12' through processes such as glue dispensing, and the vertical distance of the glue points formed by the insulating glue 300 needs to be smaller than the spacing between the two reinforcing wires 12'. The insulating glue 300 is respectively adhered to the surface of the silicon wafer and the welding strip 200', thereby achieving fixed welding of the welding strip and the solar cell.

[0060] As described in the background technology, the insulating glue in this comparative example is formed on the surface of the silicon wafer through a dispensing process. If the dispensing position deviates from the set position and covers the fine grid lines, the contact area between the welding strip and the fine grid lines will be reduced, which will lead to an increase in contact resistance and reduce the current collection efficiency, which will further affect the power of the battery assembly.

[0061] Embodiment 1:

[0062] Ginseng Figure 4 The schematic diagram of the planar structure of the solar cell in this embodiment is shown, and the solar cell 100 includes a silicon wafer (not numbered) and a gate electrode 11 located on the surface of the silicon wafer. Taking the 0BB TOPCon 210 cell as an example, the size of the full-sheet solar cell is 210mm*210mm, and the full-sheet solar cell includes two identical half-sheet solar cells, with a cutting path 101 reserved in the middle.

[0063] Ginseng Figure 5 , Figure 6 As shown, the gate line electrode 11 in this embodiment includes a plurality of fine gate lines distributed along a first direction (i.e., horizontally), and the plurality of fine gate lines are evenly distributed at equal intervals along a direction perpendicular to the first direction (i.e., vertically). Specifically, the present embodiment includes a first fine gate line 111 and a second fine gate line 112, two adjacent first fine gate lines 111 are electrically connected through a second reinforcing line 122, and two adjacent fine gate lines 112 are spaced apart.

[0064] Preferably, second alignment lines 132 intersecting with the first fine gate lines 111 are provided at both ends of the second reinforcement line 122. At the intersection of the second alignment lines 132 and the first fine gate lines 111, the first fine gate lines 111 are stacked above the second alignment lines 132 and are electrically connected to each other.

[0065] Ginseng Figure 5 Combined with Figure 7 As shown, at least one closed resist frame 14 is formed on the surface of the silicon wafer in this embodiment, the surface of the silicon wafer in the resist frame 14 is not covered with fine gate lines, and the resist frame 14 is connected to at least one fine gate line and is electrically conductive.

[0066] The glue blocking frame 14 includes two first glue blocking lines 141 distributed perpendicular to the first direction, and a plurality of second glue blocking lines 142 distributed along the first direction and connected to the ends of the first glue blocking lines. Preferably, the glue blocking frame 14 in this embodiment includes two second glue blocking lines connected to the same end of the two first glue blocking lines 141, and a first reinforcing line 121, and the first reinforcing line 121 is connected to the two second glue blocking lines 142 and is electrically conductive.

[0067] Furthermore, first alignment lines 131 intersecting with the second rubber blocking lines 142 are disposed at both ends of the first reinforcement line 121 , and at the intersection of the first alignment lines 131 and the second rubber blocking lines 142 , the second rubber blocking lines 142 are stacked above the first alignment lines 131 and are electrically connected to each other.

[0068] Ginseng Figure 5 As shown, the glue blocking frame 14 in this embodiment is connected to three rows of second fine grid lines 112 and is electrically conductive. Specifically, the first glue blocking lines 141 are respectively connected to the ends of the three second fine grid lines 112, and the distance between two second glue blocking lines 141 is equal to the lateral spacing of the second fine grid lines. The second glue blocking lines 142 are respectively connected to one end of the second fine grid lines 112.

[0069] In this configuration, the vertical length of the glue blocking frame 14 is equal to twice the distance between two second thin grid lines, preferably 0.5 mm to 3 mm, and the horizontal width of the glue blocking frame 14 is equal to the horizontal spacing between two second thin grid lines, preferably 0.5 mm to 2 mm.

[0070] Ginseng Figure 8 The diagram shows the planar structure of the first reinforcing line 121 and the first alignment line 131 in this embodiment. The maximum width of the first reinforcing line 121 is 30 μm to 60 μm, the length is 0.8 mm to 1.5 mm, the width of the fine gate line is 10 μm to 20 μm, and the line width and height of the first resisting glue line 141 and the second resisting glue line 142 are equal to the line width and height of the fine gate line. The structures of the second reinforcing line 122 and the second alignment line 132 are exactly the same as those of the first reinforcing line 121 and the first alignment line 131, and will not be described in detail here.

[0071] The fine gate lines and the resist frame in this embodiment can be formed on the light-receiving surface (i.e., the front side) of the silicon wafer, or on the backlight side (i.e., the back side) of the silicon wafer. Specifically, the height of the fine gate lines and the resist frame on the light-receiving surface of the silicon wafer is 8μm to 14μm, and the height of the fine gate lines and the resist frame on the backlight side of the silicon wafer is 3μm to 8μm.

[0072] During the printing process, the reinforcement lines and alignment lines are printed first, and then the fine grid lines and glue resistance lines are printed. In order to solve the alignment problem of the fine grid lines and glue resistance lines with the reinforcement lines during the printing process, alignment lines are set at both ends of the reinforcement lines. This can significantly improve the alignment problem of the fine grid lines or glue resistance lines with the reinforcement lines. Even if an offset occurs, electrical conduction between the fine grid lines or glue resistance lines and the reinforcement lines can be achieved through the alignment lines.

[0073] For example, in this embodiment, 9 uniformly distributed glue blocking frames are arranged on the surface of the silicon wafer in the vertical direction, and each glue blocking frame has a vertical length of 2.5 mm and a horizontal width of 1.8 mm. In other embodiments, the length and width of the glue blocking frame can be set to other sizes, and the number of the glue blocking frames in the vertical direction is at most n / 3, where n is the number of fine gate lines.

[0074] Embodiment 2:

[0075] Ginseng Fig. 9 Combined with Fig.10 , Fig.11 As shown, the solar cell assembly in this embodiment includes multiple solar cells 100, multiple welding strips 200 and insulating glue 300. The solar cell 100 is exactly the same as that in Example 1. The fine grid lines and the glue resistance frame are formed on the light-receiving surface and the backlight surface of the silicon wafer.

[0076] The welding strip 200 in this embodiment is fixedly welded on the solar cell through a welding process. The welding strip 200 intersects with the first reinforcement line 121 and the second reinforcement line 122 and is electrically conductive to each other. The first reinforcement line 121 and the second reinforcement line 122 are electrically conductive to the first fine grid line 111 and the second fine grid line 112 respectively. Therefore, the welding strip 200 can be electrically conductive to the first fine grid line 111 or to the second fine grid line 112 through the glue resistance frame 14.

[0077] The insulating glue 300 is formed inside the glue blocking frame 14 by a process such as glue dispensing, and the insulating glue 300 is respectively adhered to the surface of the silicon wafer and the welding strip 200, thereby achieving fixed welding of the welding strip and the solar cell. Through the setting of the glue blocking frame 14, even if the glue dispensing diffuses or shifts, the insulating glue will not diffuse to the fine grid wire outside the glue blocking frame 14, thereby solving the problem of increased contact resistance caused by the insulating glue covering the fine grid wire, improving the current collection capacity of the fine grid wire, and thus improving the component power.

[0078] Embodiment 3:

[0079] Ginseng Fig.12 The figure shows a schematic diagram of the planar structure of the solar cell sheet in this embodiment. The glue blocking frame 14 in this embodiment is exactly the same as that in Embodiment 1, except that the second glue blocking line 142 in the glue blocking frame 14 does not directly contact the end of the second fine grid line 112, and the first glue blocking line 141 extends between the first fine grid line 111 and the second fine grid line 112, and the corresponding second glue blocking line 142, the first reinforcement line 121 and the first alignment line 131 are also located between the first fine grid line 111 and the second fine grid line 112.

[0080] In this embodiment, the configuration of the first fine gate line 111 , the second reinforcement line 122 and the second alignment line 132 is completely the same as that in the first embodiment, and will not be described again herein.

[0081] Embodiment 4:

[0082] Ginseng Fig.13 The figure shows a schematic diagram of the planar structure of the solar cell assembly in this embodiment. The solar cell assembly in this embodiment includes a plurality of solar cells 100, a plurality of welding strips 200 and insulating glue 300. The solar cell 100 is exactly the same as that in Embodiment 3. The fine grid lines and the glue resistance frame are formed on the light-receiving surface and the backlight surface of the silicon wafer.

[0083] Similarly, the insulating glue 300 in this embodiment is formed inside the glue blocking frame 14 by a dispensing process, and the insulating glue 300 is adhered to the surface of the silicon wafer and the welding ribbon 200 respectively, thereby achieving fixed welding of the welding ribbon and the solar cell.

[0084] Embodiment 5:

[0085] Ginseng Fig.14 Shown is a schematic diagram of the planar structure of the solar cell sheet in this embodiment. The fine grid lines and the glue blocking frame in this embodiment are similar to those in Example 1, and the second fine grid lines 112 and the first glue blocking lines 141 are exactly the same as those in Example 1. The difference is that the first fine grid line 111 is a whole horizontal fine grid line, on which the second reinforcement line and the second alignment line are not arranged, and the second glue blocking lines 142 are two oppositely arranged ones, on which the first reinforcement line and the first alignment line are not arranged.

[0086] Embodiment 6:

[0087] Ginseng Fig.15 The figure shows a schematic diagram of the planar structure of the solar cell assembly in this embodiment. The solar cell assembly in this embodiment includes a plurality of solar cells 100, a plurality of welding strips 200 and insulating glue 300. The solar cell 100 is exactly the same as that in Example 5. The fine grid lines and the glue resistance frame are formed on the light-receiving surface and the backlight surface of the silicon wafer.

[0088] Similarly, the insulating glue 300 in this embodiment is formed inside the glue blocking frame 14 by a dispensing process, and the insulating glue 300 is adhered to the surface of the silicon wafer and the welding ribbon 200 respectively, thereby achieving fixed welding of the welding ribbon and the solar cell.

[0089] Different from the second embodiment, after the welding ribbon in this embodiment is fixedly welded to the solar cell, the welding ribbon is directly connected to the first thin grid line 111 and the second glue resistance line 142 instead of being connected to the first reinforcement line and the second reinforcement line.

[0090] Embodiment 7:

[0091] Ginseng Fig.16The figure shows a schematic diagram of the planar structure of the solar cell sheet in this embodiment. The fine grid lines and the glue blocking frame in this embodiment are similar to those in Example 3. The second fine grid lines 112 and the first glue blocking lines 141 are exactly the same as those in Example 3. The difference is that the first fine grid line 111 is a whole horizontal fine grid line, on which the second reinforcement line and the second alignment line are not arranged, and the second glue blocking lines 142 are two oppositely arranged ones, on which the first reinforcement line and the first alignment line are not arranged.

[0092] Embodiment 8:

[0093] Ginseng Fig.17 The figure shows a schematic diagram of the planar structure of the solar cell assembly in this embodiment. The solar cell assembly in this embodiment includes a plurality of solar cells 100, a plurality of welding strips 200 and insulating glue 300. The solar cell 100 is exactly the same as that in Embodiment 7. The fine grid lines and the glue resistance frame are formed on the light-receiving surface and the backlight surface of the silicon wafer.

[0094] Similarly, the insulating glue 300 in this embodiment is formed inside the glue blocking frame 14 by a dispensing process, and the insulating glue 300 is adhered to the surface of the silicon wafer and the welding ribbon 200 respectively, thereby achieving fixed welding of the welding ribbon and the solar cell.

[0095] Different from the fourth embodiment, after the welding ribbon in this embodiment is fixedly welded to the solar cell, the welding ribbon is directly connected to the first thin grid line 111 and the second glue blocking line 142 instead of being connected to the first reinforcement line and the second reinforcement line.

[0096] It can be seen from the above technical solution that the utility model has the following beneficial effects:

[0097] In the utility model, a glue blocking frame is arranged on the surface of the silicon wafer to reserve a position for printing the insulating glue. Even if the insulating glue diffuses or shifts, the problem of increased contact resistance caused by covering the fine grid lines can be avoided, thereby improving the current collection capability and further improving the component power.

[0098] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0099] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A solar cell, characterized in that: The solar cell comprises a silicon wafer and a plurality of fine grid lines distributed on the surface of the silicon wafer along a first direction, at least one closed resist frame is formed on the surface of the silicon wafer, the surface of the silicon wafer in the resist frame is not covered with the fine grid lines, and the resist frame is connected to at least one fine grid line and is electrically conductive.

2. The solar cell according to claim 1, characterized in that: The glue blocking frame includes two first glue blocking lines distributed along a direction perpendicular to the first direction, and a plurality of second glue blocking lines distributed along the first direction and connected to ends of the first glue blocking lines.

3. The solar cell according to claim 2, characterized in that: The glue blocking frame includes two second glue blocking lines connected to the same end of the two first glue blocking lines, and a first reinforcing line, wherein the first reinforcing line is connected to the two second glue blocking lines and is electrically conductive.

4. The solar cell according to claim 2 or 3, characterized in that: The first glue blocking line intersects at least two thin gate lines, and the second glue blocking line is connected to the thin gate lines, or is located between two adjacent thin gate lines along a direction perpendicular to the first direction.

5. The solar cell according to claim 3, characterized in that: The first reinforcing line has first alignment lines intersecting with the second glue resistance lines at both ends, and the second glue resistance lines are stacked on the first alignment lines at the intersection of the first alignment lines and the second glue resistance lines and are electrically connected to each other.

6. The solar cell according to claim 2 or 3, characterized in that: The heights of the first and second glue resistance lines are equal to the heights of the thin gate lines, and the line widths of the first and second glue resistance lines are equal to the line widths of the thin gate lines.

7. The solar cell according to claim 1, characterized in that: A plurality of thin gate lines spaced apart along a first direction and a second reinforcing line are arranged on the surface of the silicon wafer. The second reinforcing line is connected to the two thin gate lines and is electrically conductive.

8. The solar cell according to claim 7, characterized in that: Second alignment lines intersecting with the fine gate lines are disposed at both ends of the second reinforcing line, and at the intersection of the second alignment lines and the fine gate lines, the fine gate lines are stacked above the second alignment lines and are electrically connected to each other.

9. The solar cell according to claim 1, characterized in that: The length of the glue blocking frame along the direction perpendicular to the first direction is greater than or equal to twice the distance between two thin grid lines; and / or, The number of the glue blocking frames along the direction perpendicular to the first direction is 2 to n / 3, wherein n is the number of the fine gate lines.

10. The solar cell according to claim 1, characterized in that: The length of the glue blocking frame along the direction perpendicular to the first direction is 0.5 mm to 3 mm, and the width along the first direction is 0.5 mm to 2 mm; and / or, The resist frame is formed on the light-receiving surface of the silicon wafer, and the resist frame has a height of 8 μm to 14 μm; and / or, The resist frame is formed on the backlight surface of the silicon wafer, and the height of the resist frame is 3 μm to 8 μm.

11. A solar cell module, characterized in that: The solar cell assembly includes multiple solar cells, multiple welding strips and insulating glue. The solar cells are the solar cells described in any one of claims 1 to 10. The welding strips are electrically conductive with the fine grid lines. The insulating glue is located in the glue blocking frame, and the insulating glue is respectively adhered to the silicon wafers and welding strips.

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