Electroplating nozzle and electroplating device

Abstract

The embodiment of the present application provides an electroplating nozzle and an electroplating device, wherein the electroplating nozzle comprises: a plating liquid nozzle and an insulating liquid nozzle; wherein the insulating liquid nozzle is arranged on one side or both sides of the electroplating liquid nozzle along a first direction, the electroplating liquid nozzle is used to spray the plating liquid to the to-be-plated area of ​​the workpiece to be plated, and the insulating liquid nozzle is used to spray the insulating liquid to the area outside the to-be-plated area of ​​the workpiece to be plated. The electroplating nozzle can realize limited-area electroplating to improve the electroplating efficiency and the electroplating yield.

Description

Technical Field

[0001] The present application belongs to the technical field of electroplating processing, and specifically relates to an electroplating nozzle and an electroplating device. Background Art

[0002] The electroplating device is a surface processing method that uses the workpiece to be plated as the cathode, so that the cations of the metal to be plated in the plating solution are deposited on the cathode surface of the workpiece to be plated to form a coating. The properties of the coating can be different from the cathode properties and have new characteristics.

[0003] However, for electroplating scenarios with higher processing precision, for example, when forming gate lines on silicon wafers through electroplating, existing electroplating devices find it difficult to form gate lines in limited areas and protect the film layers in other areas from being corroded by the plating solution, which greatly reduces the electroplating efficiency and electroplating yield. Utility Model Content

[0004] The present application aims to provide an electroplating nozzle and an electroplating device to solve the problem that it is difficult to achieve confined area electroplating in existing electroplating devices.

[0005] In order to solve the above technical problems, this application is implemented as follows:

[0006] In the first aspect, the present application discloses an electroplating nozzle, which comprises: an electroplating liquid nozzle and an insulating liquid nozzle; wherein:

[0007] The insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle along the first direction, and the plating liquid nozzle is used to spray the plating liquid to the area to be plated of the workpiece to be plated, and the insulating liquid nozzle is used to spray the insulating liquid to the area outside the area to be plated of the workpiece to be plated.

[0008] Optionally, the number of the plating liquid nozzles and the number of the insulating liquid nozzles are both plural, and the plating liquid nozzles and the insulating liquid nozzles are alternately arranged along the first direction.

[0009] Optionally, there are multiple insulating liquid nozzles, and the multiple insulating liquid nozzles are distributed in a ring shape radially outside the electroplating liquid nozzle.

[0010] In an embodiment of the present application, a plating liquid nozzle and an insulating liquid nozzle are arranged on the plating nozzle, and the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle. In the process of the plating liquid nozzle spraying the plating liquid to the area to be plated of the workpiece to be plated, the insulating liquid nozzle can be used to spray the insulating liquid to the area outside the area to be plated, so as to limit the plating liquid from flowing to the area outside the area to be plated, so as to achieve the purpose of electroplating in the limited area. In this way, when the plating nozzle is used in electroplating scenarios with high processing precision, for example, when gate lines are formed by electroplating in a limited area of ​​a silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line area, the area outside the gate line area of ​​the silicon wafer can be protected from being corroded by the plating liquid, thereby greatly improving the electroplating efficiency and the electroplating yield.

[0011] In a second aspect, the present application further discloses an electroplating nozzle, the electroplating nozzle comprising: a nozzle body, wherein the nozzle body is provided with an electroplating liquid flow channel, an insulating liquid flow channel, an electroplating liquid nozzle and an insulating liquid nozzle; wherein,

[0012] The electroplating liquid flow channel is connected to the electroplating liquid nozzle, and the electroplating liquid flow channel is used to transfer the electroplating liquid to the electroplating liquid nozzle so that the electroplating liquid is sprayed out from the electroplating liquid nozzle;

[0013] The insulating liquid flow channel is connected to the insulating liquid nozzle, and the insulating liquid flow channel is used to transfer the insulating liquid to the insulating liquid nozzle so that the insulating liquid is sprayed out from the insulating liquid nozzle;

[0014] The insulating liquid nozzle is arranged on one side or both sides of the electroplating liquid nozzle along the first direction.

[0015] Optionally, the nozzle body is further provided with a plating liquid storage chamber for storing the plating liquid and an insulating liquid storage chamber for storing the insulating liquid.

[0016] The electroplating liquid flow channel is connected to the electroplating liquid storage chamber, and the insulating liquid flow channel is connected to the insulating liquid storage chamber.

[0017] Optionally, there are a plurality of the electroplating liquid nozzles and the insulating liquid nozzles, and the electroplating liquid nozzles and the insulating liquid nozzles are alternately arranged along the first direction.

[0018] In an embodiment of the present application, a plating liquid nozzle and an insulating liquid nozzle are arranged on the plating nozzle, and the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle along the first direction. In the process of the plating liquid nozzle spraying the plating liquid to the area to be plated of the workpiece to be plated, the insulating liquid nozzle can be used to spray the insulating liquid to the area outside the area to be plated, so as to limit the plating liquid from flowing to the area outside the area to be plated, so as to achieve the purpose of electroplating in the limited area. In this way, when the plating nozzle is used in a plating scenario with high processing precision, for example, when the gate line is formed by electroplating in a limited area of ​​the silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line area, the area outside the gate line area of ​​the silicon wafer can be protected from being corroded by the plating liquid, which greatly improves the electroplating efficiency and the electroplating yield.

[0019] In a third aspect, the present application further discloses an electroplating device, which includes: an electroplating nozzle as described in any one of the above items.

[0020] Optionally, the electroplating device further comprises: a cleaning fluid injection mechanism, wherein the cleaning fluid injection mechanism is arranged on one side or both sides of the electroplating nozzle along a second direction, and the second direction is perpendicular to the first direction; wherein,

[0021] The cleaning fluid spraying mechanism is used for spraying cleaning fluid, and the cleaning fluid includes at least one of air and insulating liquid.

[0022] Specifically, the cleaning fluid spraying mechanism can be used to spray a cleaning fluid, and the cleaning fluid can be used to clean the surface of the workpiece to be plated and prevent the electroplating liquid from remaining on the surface of the workpiece to be plated.

[0023] Optionally, the cleaning fluid spraying mechanism is a linear structure, and the linear structure extends along the first direction;

[0024] The cleaning fluid injection mechanism is an air knife, a water knife or a combination thereof.

[0025] Optionally, when the cleaning fluid spraying mechanism is disposed on one side of the electroplating nozzle along the second direction, the cleaning fluid spraying mechanism is inclined toward the electroplating nozzle;

[0026] When the cleaning fluid injection mechanism is arranged on both sides of the electroplating nozzle along the second direction, the cleaning fluid injection mechanism on both sides of the electroplating nozzle are inclined toward the electroplating nozzle, and the inclination angles of the cleaning fluid injection mechanism on both sides of the electroplating nozzle are different.

[0027] Optionally, the electroplating device further comprises a first driving mechanism, the first driving mechanism is connected to the electroplating nozzle, and the first driving mechanism is used to drive the electroplating nozzle to move;

[0028] And / or, the electroplating device further comprises an electroplating tank, in which a carrier and a second driving mechanism are further arranged, the second driving mechanism is connected to the carrier, and the second driving mechanism is used to drive the carrier to move.

[0029] In the embodiment of the present application, since the electroplating nozzle of the electroplating device is provided with a plating liquid nozzle and an insulating liquid nozzle, the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle. Alternatively, the electroplating nozzle is provided with a plating liquid nozzle connected to the plating liquid flow channel and an insulating liquid nozzle connected to the insulating liquid flow channel, and the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle. In the process of the plating liquid nozzle or the plating liquid nozzle spraying the plating liquid to the to-be-plated area of ​​the workpiece to be plated, the insulating liquid nozzle or the insulating liquid nozzle can be used to spray the insulating liquid to the area outside the to-be-plated area to limit the plating liquid from flowing to the area outside the to-be-plated area, so as to achieve the purpose of electroplating in the limited area. In this way, when the electroplating device is used in a plating scene with high processing precision, for example, when the gate line is formed by electroplating in the limited area of ​​the silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line area, the area outside the gate line area of ​​the silicon wafer can be protected from being corroded by the plating liquid, which greatly improves the electroplating efficiency and the electroplating yield.

[0030] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0032] Figure 1 It is a structural schematic diagram of an electroplating nozzle described in an embodiment of the present application;

[0033] Figure 2 yes Figure 1 A schematic diagram of the structure of the electroplating nozzle from another angle is shown;

[0034] Figure 3 is a schematic structural diagram of an electroplating device described in an embodiment of the present application;

[0035] Figure 4 It is a schematic diagram of the structure of another electroplating nozzle described in an embodiment of the present application;

[0036] Figure 5 yes Figure 4 A schematic diagram of the structure of the electroplating nozzle from another angle is shown;

[0037] Figure 6 yes Figure 4 The cross-sectional structure diagram of the electroplating nozzle A-A section is shown.

[0038] Figure numerals: 10 - frame, 100 - nozzle body, 101 - plating liquid storage chamber, 102 - insulating liquid storage chamber, 103 - plating liquid flow channel, 104 - insulating liquid flow channel, 105 - plating liquid nozzle, 106 - insulating liquid nozzle, 11 - plating liquid nozzle, 12 - insulating liquid nozzle, 13 - nozzle bracket, 14 - cleaning fluid injection mechanism, 15 - plating tank, 151 - carrier, 20 - workpiece to be plated, x - first direction, y - second direction. DETAILED DESCRIPTION

[0039] The embodiments of the utility model will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the utility model, and cannot be understood as limiting the utility model. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0040] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this utility model, unless otherwise specified, "multiple" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0042] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0043] The present application embodiment provides an electroplating nozzle, which can be used in an electroplating device, and the electroplating device can be used to form a coating on a workpiece to be plated. The present application embodiment only takes the electroplating device forming a plated gate line on a silicon wafer as an example, and other application scenarios can be implemented by reference.

[0044] Reference Figure 1 , showing a schematic diagram of the structure of an electroplating nozzle according to an embodiment of the present application, referring to Figure 2 , showing Figure 1 The schematic diagram of the structure of the electroplating nozzle from another angle is shown in FIG. Figure 1 and Figure 2 As shown, the electroplating nozzle may specifically include: a plating liquid nozzle 11 and an insulating liquid nozzle 12; wherein, the insulating liquid nozzle 12 is arranged on one side or both sides of the plating liquid nozzle 11 along the first direction x, the plating liquid nozzle 11 can be used to spray the plating liquid to the area to be plated of the workpiece to be plated, and the insulating liquid nozzle 12 can be used to spray the insulating liquid to the area outside the area to be plated of the workpiece to be plated.

[0045] In the embodiment of the present application, a plating liquid nozzle 11 and an insulating liquid nozzle 12 are arranged on the plating nozzle, and the insulating liquid nozzle 12 is arranged on one side or both sides of the plating liquid nozzle 11 along the first direction x. In the process of the plating liquid nozzle 11 spraying the plating liquid to the area to be plated of the workpiece 20 to be plated, the insulating liquid nozzle 12 can be used to spray the insulating liquid to the area outside the area to be plated, so as to limit the plating liquid from flowing to the area outside the area to be plated, so as to achieve the purpose of electroplating in the limited area. In this way, when the plating nozzle is used in a plating scenario with high processing precision, for example, when plating a gate line in a limited area of ​​a silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line, the area outside the gate line of the silicon wafer can be protected from being corroded by the plating liquid, which greatly improves the electroplating efficiency and the electroplating yield.

[0046] like Figure 1 As shown, the electroplating liquid nozzle may further include a frame 10 , and the frame 10 may be used to install and fix the electroplating liquid nozzle 11 and the insulating liquid nozzle 12 .

[0047] Optionally, a plating liquid storage chamber (not shown in the figure) and an insulating liquid storage chamber (not shown in the figure) are provided on the frame 10, the plating liquid storage chamber can be used to store the plating liquid, and the insulating liquid storage chamber can be used to store the insulating liquid; the plating liquid nozzle 11 is connected to the frame 10 and communicated with the plating liquid storage chamber, the plating liquid nozzle 11 can be used to spray the plating liquid to the area to be plated of the workpiece 20 to be plated; the insulating liquid nozzle 12 is communicated with the insulating liquid storage chamber, and the insulating liquid nozzle 12 can be used to spray the insulating liquid to the area outside the area to be plated of the workpiece 20 to be plated.

[0048] Alternatively, the frame 10 may not need to be provided with a plating liquid storage chamber and an insulating liquid storage chamber, and the plating liquid nozzle 11 and the insulating liquid nozzle 12 may also be connected to an external plating liquid storage device and an insulating liquid storage device through pipelines.

[0049] It should be noted that Figure 1 and Figure 2 The nozzle shown only shows the situation where the insulating liquid nozzle 12 is arranged on both sides of the plating liquid nozzle 11 along the first direction. In actual applications, the insulating liquid nozzle 12 can also be arranged only on one side of the plating liquid nozzle 11 along the first direction. The embodiment of the present application does not make specific limitations on this.

[0050] like Figure 1 and Figure 2 As shown, the electroplating nozzle can also be provided with a nozzle bracket 13, and the plating liquid nozzle 11 and the insulating liquid nozzle 12 can both be fixed on the nozzle bracket 13, and the nozzle bracket 13 can be connected to the frame 10. An anode is provided in the plating liquid nozzle 11. During the electroplating process, the metal ions in the plating solution move to the cathode of the workpiece 20 to be plated under the action of the potential difference to form a plating layer. The metal of the anode can undergo an oxidation reaction to form metal ions that enter the plating solution to maintain the concentration of metal ions in the plating solution. When the electroplating device starts electroplating, the plating liquid nozzle 11 and the insulating liquid nozzle 12 can be directed toward the workpiece 20 to be plated. Then, the plating liquid nozzle 11 and the insulating liquid nozzle 12 can be controlled to open at the same time, so that the plating liquid and the insulating liquid can be sprayed out from the plating liquid nozzle 11 and the insulating liquid nozzle 12 at the same time. Since the plating liquid can be sprayed to the area to be plated of the workpiece 20 to be plated, and the insulating liquid can be sprayed to the area outside the area to be plated, after the plating liquid completes the plating of the area to be plated, the plating liquid is constrained by the insulating liquid outside the area to be plated and cannot flow to the area outside the area to be plated, thereby realizing limited electroplating with high electroplating accuracy.

[0051] In a specific application, the insulating liquid is incompatible with the electroplating liquid. Generally, the electroplating liquid is a water-soluble solution, and the insulating liquid is a non-water-soluble solution. Moreover, the density of the insulating liquid is different from that of the electroplating liquid. The density of the insulating liquid may be greater than that of the electroplating liquid, or the density of the insulating liquid may be less than that of the electroplating liquid.

[0052] For example, when the workpiece 20 to be plated is located below the electroplating liquid nozzle 11 and the insulating liquid nozzle 12, that is, the electroplating liquid nozzle 11 sprays the electroplating liquid downward for electroplating, the density of the insulating liquid can be greater than the density of the electroplating liquid. In this way, after the electroplating liquid and the insulating liquid are simultaneously sprayed onto the workpiece 20 to be plated, since the insulating liquid is immiscible with the electroplating liquid and the density of the insulating liquid is greater than the density of the electroplating liquid, a liquid separation surface will be formed between the insulating liquid and the electroplating liquid. Under the action of gravity, the insulating liquid will be deposited under the electroplating liquid and accumulate on the surface of the workpiece 20 to be plated to form an insulating liquid layer, so as to prevent the electroplating liquid from contacting with areas outside the area to be plated of the workpiece 20 to be plated, and to prevent the areas outside the area to be plated from being corroded by the electroplating liquid.

[0053] For another example, when the workpiece 20 to be plated is located above the electroplating liquid nozzle 11 and the insulating liquid nozzle 12, that is, the electroplating liquid nozzle 11 sprays the electroplating liquid upward for electroplating, the density of the insulating liquid can be less than the density of the electroplating liquid. In this way, after the electroplating liquid and the insulating liquid are simultaneously sprayed onto the workpiece 20 to be plated, since the insulating liquid is not miscible with the electroplating liquid and the density of the insulating liquid is less than the density of the electroplating liquid, a liquid separation surface will be formed between the insulating liquid and the electroplating liquid. Under the action of gravity, the insulating liquid will be located above the electroplating liquid and accumulate on the surface of the workpiece 20 to be plated to form an insulating liquid layer, so as to prevent the electroplating liquid from contacting with areas outside the area to be plated of the workpiece 20 to be plated, and to prevent the areas outside the area to be plated from being corroded by the electroplating liquid.

[0054] For example, the electroplating solution may be a water-soluble solution containing anode metal ions such as nickel, copper, tin, copper alloy, chromium, tungsten, gold, silver, etc., and the insulating liquid may be a non-water-soluble solution containing halogen atoms, ester groups, hydrocarbon groups, and hydroxyl groups (chain hydrocarbons containing hydroxyl groups). The insulating liquid having a density greater than the density of the electroplating solution may be selected to contain halogen hydrides and carbon tetrachloride. The insulating liquid having a density less than the density of the electroplating solution may be selected to contain n-butanol, benzene and its homologues, alkanes above pentane, etc. The specific types of the electroplating solution and the insulating liquid may not be limited in the embodiments of the present application.

[0055] In some optional embodiments of the present application, the flow rate of the insulating liquid sprayed out of the insulating liquid nozzle 12 is a first flow rate, and the flow rate of the plating liquid sprayed out of the plating liquid nozzle 11 is a second flow rate, and the first flow rate is greater than or equal to the second flow rate, that is, the flow rate of the insulating liquid can be greater than or equal to the flow rate of the plating liquid, so that the insulating liquid can better constrain the flow range of the plating liquid and achieve more precise confined area electroplating.

[0056] In a specific application, separate flow meters and valve bodies may be provided in the electroplating liquid nozzle 11 and the insulating liquid nozzle 12 to achieve flow control of the electroplating liquid and the insulating liquid through the cooperation of the flow meters and the valve bodies.

[0057] like Figure 1 As shown, the number of the plating liquid nozzles 10 and the insulating liquid nozzles 12 can be multiple, and the plating liquid nozzles 11 and the insulating liquid nozzles 12 are alternately arranged along the first direction. In this way, in the process of the plating liquid nozzle 11 spraying the plating liquid toward the to-be-plated area of ​​the workpiece 20 to be plated, the insulating liquid nozzles 12 on both sides of the plating liquid nozzle 11 along the first direction x can simultaneously spray the insulating liquid toward both sides of the to-be-plated area. In this way, the insulating liquid can simultaneously constrain the flow of the plating liquid from both sides of the plating liquid, further improving the constraining effect of the insulating liquid on the plating liquid, and realizing more precise limited-area electroplating.

[0058] It should be noted that Figure 1 Only the case where one insulating liquid nozzle 12 is provided on each side of the plating liquid nozzle 11 is shown. In actual applications, 2, 3 or other numbers of insulating liquid nozzles 12 may be provided on each side of the plating liquid nozzle 11. Moreover, the numbers of insulating liquid nozzles 12 on both sides of the plating liquid nozzle 11 may be the same or different, and the present application does not make any specific limitation on this.

[0059] In some other optional embodiments of the present application, the number of insulating liquid nozzles 12 in the electroplating nozzle can be multiple, and the multiple insulating liquid nozzles 12 are distributed in a ring shape on the radial outside of the electroplating liquid nozzle 11. In this way, when the electroplating liquid nozzle 11 sprays the electroplating liquid toward the to-be-plated area of ​​the workpiece 20 to be plated, the multiple insulating liquid nozzles 12 distributed around the electroplating liquid nozzle 11 can simultaneously spray the insulating liquid in a ring shape toward the radial outside of the to-be-plated area, further improving the restraining effect of the insulating liquid on the electroplating liquid, and realizing more precise limited-area electroplating.

[0060] In a specific application, the electroplating device further includes a first driving mechanism, which is connected to the frame 10, and can be used to drive the electroplating liquid nozzle 11 and the insulating liquid nozzle 12 on the frame 10 to move for electroplating. For example, in the case of electroplating a gate line, the first driving mechanism can drive the electroplating liquid nozzle 11 and the insulating liquid nozzle 12 to move along the length direction of the gate line to form a plated gate line on the silicon wafer.

[0061] Reference Figure 4 , showing a schematic diagram of the structure of another electroplating nozzle according to an embodiment of the present application, referring to Figure 5 , showing Figure 4 The schematic diagram of the electroplating nozzle from another angle is shown in FIG. Figure 6 , showing Figure 4 The cross-sectional structure diagram of the electroplating nozzle A-A section is shown.

[0062] like Figures 4 to 5 As shown, the electroplating nozzle includes a nozzle body 100, and the nozzle body 100 is provided with a plating liquid flow channel 103, an insulating liquid flow channel 104, a plating liquid nozzle 105 and an insulating liquid nozzle 106; wherein, the plating liquid flow channel 103 is connected to the plating liquid nozzle 105, and the plating liquid flow channel 103 can be used to transfer the plating liquid to the plating liquid nozzle 105, so that the plating liquid is sprayed out from the plating liquid nozzle 105; the insulating liquid flow channel 104 is connected to the insulating liquid nozzle 106, and the insulating liquid flow channel 104 can be used to transfer the insulating liquid to the insulating liquid nozzle 106, so that the insulating liquid is sprayed out from the insulating liquid nozzle 106; the insulating liquid nozzle 106 is arranged on one side or both sides of the plating liquid nozzle 105 along the first direction x.

[0063] In the embodiment of the present application, a plating liquid nozzle 105 and an insulating liquid nozzle 106 are arranged on the plating nozzle, and the insulating liquid nozzle 106 is arranged on one side or both sides of the plating liquid nozzle 105 along the first direction x. In the process of the plating liquid nozzle 105 spraying the plating liquid to the area to be plated of the workpiece to be plated, the insulating liquid nozzle 106 can be used to spray the insulating liquid to the area outside the area to be plated, so as to limit the plating liquid from flowing to the area outside the area to be plated, so as to achieve the purpose of electroplating in the limited area. In this way, when the plating nozzle is used in a plating scenario with high processing precision, for example, when the gate line is formed by electroplating in a limited area of ​​the silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line area, the area outside the gate line area of ​​the silicon wafer can be protected from being corroded by the plating liquid, which greatly improves the electroplating efficiency and the electroplating yield.

[0064] Optionally, the nozzle body 100 is further provided with a plating liquid storage chamber 101 for storing a plating liquid and an insulating liquid storage chamber 102 for storing an insulating liquid; wherein the plating liquid flow channel 103 is connected to the plating liquid storage chamber 101 to transfer the plating liquid in the plating liquid storage chamber 101 to the plating liquid nozzle 105, so that the plating liquid is sprayed out from the plating liquid nozzle 105. The insulating liquid flow channel 104 is connected to the insulating liquid storage chamber 102 to transfer the insulating liquid in the insulating liquid storage chamber 102 to the insulating liquid nozzle 106, so that the insulating liquid is sprayed out from the insulating liquid nozzle 106.

[0065] In a specific application, by arranging the electroplating liquid storage chamber 101 and the insulating liquid storage chamber 102 in the nozzle body 100, the integration level of the electroplating nozzle can be improved.

[0066] like Figure 5 As shown, there are multiple plating liquid nozzles 105 and insulating liquid nozzles 106, and the plating liquid nozzles 105 and insulating liquid nozzles 106 are alternately arranged along the first direction x, so that at least one insulating liquid nozzle 106 is arranged on both sides of the plating liquid nozzle 105 along the first direction x. By providing multiple plating liquid nozzles 105 and at least one insulating liquid nozzle 106 between the plating liquid nozzles 105, the multiple plating liquid nozzles 105 can simultaneously complete multiple groups of electrodeposition, thereby improving the electroplating efficiency.

[0067] For example, when the electroplating device is used to process gate lines on a silicon wafer, by driving the nozzle body 100 or the workpiece 20 to be plated to move along the second direction y (perpendicular to the first direction x), multiple gate lines can be processed simultaneously, and the electroplating efficiency is high.

[0068] An embodiment of the present application further provides an electroplating device, which may specifically include the electroplating nozzle described in any of the above embodiments.

[0069] In the embodiment of the present application, since the electroplating nozzle of the electroplating device is provided with a plating liquid nozzle and an insulating liquid nozzle, the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle. Alternatively, the electroplating nozzle is provided with a plating liquid nozzle connected to the plating liquid flow channel and an insulating liquid nozzle connected to the insulating liquid flow channel, and the insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle. In the process of the plating liquid nozzle or the plating liquid nozzle spraying the plating liquid to the to-be-plated area of ​​the workpiece to be plated, the insulating liquid nozzle or the insulating liquid nozzle can be used to spray the insulating liquid to the area outside the to-be-plated area to limit the plating liquid from flowing to the area outside the to-be-plated area, so as to achieve the purpose of electroplating in the limited area. In this way, when the electroplating device is used in a plating scene with high processing precision, for example, when the gate line is formed by electroplating in the limited area of ​​the silicon wafer, since the insulating liquid can limit the plating liquid from flowing to the area outside the gate line area, the area outside the gate line area of ​​the silicon wafer can be protected from being corroded by the plating liquid, which greatly improves the electroplating efficiency and the electroplating yield.

[0070] like Figure 1 and Figure 2 As shown, the electroplating device may further include a cleaning fluid injection mechanism 14, which is disposed on both sides or one side of the electroplating nozzle along the second direction y, and the second direction y is perpendicular to the first direction x; the cleaning fluid injection mechanism 14 may be used to inject a cleaning fluid, which may be used to clean the surface of the workpiece 20 to be plated and prevent the electroplating liquid from remaining on the surface of the workpiece 20 to be plated. The cleaning fluid may include at least one of air and insulating liquid, and the embodiment of the present application may not limit the type of the cleaning fluid.

[0071] In a specific application, the second direction y can be the traveling direction of the electroplating nozzle. In this way, the cleaning fluid injection mechanism 14 on both sides of the electroplating nozzle can spray the cleaning fluid toward the surface of the workpiece 20 to be plated from the front and rear directions of the electroplating liquid nozzle 11. In practical applications, the cleaning fluid ejected by the cleaning fluid injection mechanism 14 located in the front of the traveling direction can not only clean the surface of the workpiece 20 to be plated, but also form an insulating liquid film on the surface of the workpiece 20 to be plated, so as to prevent the subsequent electroplating liquid from contacting the non-to-be-plated area, and can also limit the electroplating liquid from the front of the traveling direction. The cleaning fluid ejected by the cleaning fluid injection mechanism 14 located in the rear of the traveling direction can not only be used to clean the surface of the workpiece 20 to be plated again, so as to avoid the electroplating liquid from remaining on the surface of the workpiece 20 to be plated, and further prevent the electroplating liquid from corroding the workpiece 20 to be plated, but also limit the plating liquid from the rear of the traveling direction. Moreover, by cleaning the electroplating liquid on the surface of the workpiece 20 to be plated, after the electroplating is completed, it is not necessary to clean the electroplating liquid on the workpiece 20 to be plated, so as to improve the efficiency of the electroplating operation.

[0072] like Figure 1 and Figure 2 As shown, the cleaning fluid injection mechanism 14 can be fixed on the frame 10, so that the movement of the frame 10 drives the cleaning fluid injection mechanism 14, the plating liquid nozzle 11 and the insulating liquid nozzle 12 to move together. During the electroplating process, the frame 10 can move along the second direction y, and the plating liquid and the insulating liquid can be sprayed onto the surface of the workpiece 20 to be plated at the same time. The sprayed plating liquid can be surrounded and constrained by the insulating liquid to avoid diffusion, so as to achieve limited electroplating. After the electroplating is completed, since the plating liquid and the insulating liquid are immiscible and have different densities, the plating liquid and the insulating liquid are mixed and layered. In order to further separate the plating liquid from the workpiece 20 to be plated, a cleaning fluid injection mechanism 14 is arranged behind the moving direction of the frame 10. After the electroplating is completed, the cleaning fluid injection mechanism 14 can spray the cleaning fluid to the workpiece 20 to be plated. Under the flushing of the cleaning fluid, the residual plating liquid on the surface of the workpiece 20 to be plated that is not completely layered can be separated for the second time, so as to protect the surface of the workpiece 20 to be plated from being corroded by the plating liquid.

[0073] Optionally, when the cleaning fluid is air, the cleaning fluid spraying mechanism 14 may be an air knife. When the cleaning fluid is insulating liquid, the cleaning fluid spraying mechanism 14 may be a water knife. The specific type of the cleaning fluid spraying mechanism 14 may not be limited in the embodiment of the present application.

[0074] Moreover, when the cleaning fluid is an insulating liquid, the type of the insulating liquid may be the same as or different from the insulating liquid sprayed from the insulating liquid nozzle 12. When the cleaning fluid is the same as the insulating liquid sprayed from the insulating liquid nozzle 12, the two may share an insulating liquid storage chamber 102 to simplify the structure of the electroplating device.

[0075] Optionally, the cleaning fluid spraying mechanism 14 is a linear structure, and the linear structure extends along the first direction x. In this way, when the nozzle bracket 13 moves along the second direction y, the cleaning fluid sprayed by the cleaning fluid spraying mechanism 14 can be sprayed linearly along the first direction x onto the workpiece 20 to be plated, with a larger coverage area, which can improve the cleaning efficiency of the workpiece 20 to be plated.

[0076] It should be noted that the linear structure extends along the first direction x. Specifically, the linear structure may extend along the first direction x in a straight line, or in an arc line, which is not limited in this embodiment of the present application.

[0077] like Figure 1 and Figure 2 As shown, the cleaning fluid injection mechanism 14 on one or both sides of the electroplating nozzle can be tilted toward the electroplating nozzle, and the cleaning fluid injected by the cleaning fluid injection mechanism 14 can be injected toward the workpiece 20 to be plated at a certain tilt angle, thereby improving the cleaning effect of the cleaning fluid on the workpiece 20 to be plated.

[0078] Specifically, when the cleaning fluid injection mechanism 14 in the front of the traveling direction of the rack 10 is tilted toward the electroplating nozzle, the cleaning fluid injected from the cleaning fluid injection mechanism 14 can better clean the area to be plated, so as to improve the cleanliness of the area to be plated, which is conducive to improving the quality of electroplating. When the cleaning fluid injection mechanism 14 in the rear of the traveling direction of the rack 10 is tilted toward the electroplating nozzle, the cleaning fluid injected from the cleaning fluid injection mechanism 14 can better clean the electroplating liquid on the area to be plated, so as to avoid the electroplating liquid from remaining on the surface of the workpiece 20 to be plated.

[0079] In some optional embodiments of the present application, the cleaning fluid injection mechanisms 14 on both sides of the electroplating liquid nozzle 11 have different inclination angles. Generally, the larger the inclination angle of the cleaning fluid injection mechanism 14, the better the cleaning effect of the sprayed cleaning fluid on the area to be plated. Since the cleaning fluid at the rear of the traveling direction of the rack 10 is usually used to clean the electroplating liquid, the cleaning effect is required to be higher, therefore, the cleaning fluid injection mechanism 14 with a larger inclination angle can be set at the rear of the traveling direction.

[0080] For example, Figure 2 As shown, among the cleaning fluid injection mechanisms 14 on both sides of the plating liquid nozzle 11, since the cleaning angle of the cleaning fluid injection mechanism 14 on the left side is larger, the cleaning fluid injection mechanism 14 on the left side can be set at the rear of the traveling direction, and the cleaning fluid injection mechanism 14 on the right side can be set at the front of the traveling direction.

[0081] Reference Figure 3 , shows a schematic structural diagram of an electroplating device according to an embodiment of the present application, such as Figure 3 As shown, the electroplating device may further include a first driving mechanism, the first driving mechanism is connected to the electroplating nozzle, and the first driving mechanism may be used to drive the electroplating nozzle to move; and / or, the electroplating device may further include an electroplating tank 15, the electroplating tank 15 is further provided with a carrier 151 and a second driving mechanism, the second driving mechanism is connected to the carrier 151, and the second driving mechanism may be used to drive the carrier 151 to move for electroplating. For example, in the case of electroplating a gate line, the second driving mechanism may drive the carrier 151 to move along the length direction of the gate line to form a plated gate line on a silicon wafer.

[0082] It should be noted that, in a specific application, during the electroplating process, the first driving mechanism may drive the frame 10 to move the electroplating liquid nozzle 11. The second driving mechanism may drive the carrier 151 to move the workpiece 20 to be plated. The frame 10 and the carrier 151 may also move in coordination, which is not limited in the present embodiment.

[0083] For example, the first driving mechanism and the second driving mechanism may include but are not limited to at least one of a motor, a cylinder or an oil cylinder. The embodiment of the present application may not limit the specific types of the first driving mechanism and the second driving mechanism.

[0084] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0085] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An electroplating nozzle, characterized in that: The electroplating nozzle comprises: an electroplating liquid nozzle and an insulating liquid nozzle; wherein, The insulating liquid nozzle is arranged on one side or both sides of the plating liquid nozzle along the first direction, and the plating liquid nozzle is used to spray the plating liquid to the area to be plated of the workpiece to be plated, and the insulating liquid nozzle is used to spray the insulating liquid to the area outside the area to be plated of the workpiece to be plated.

2. The electroplating nozzle according to claim 1, characterized in that: The number of the plating liquid nozzles and the number of the insulating liquid nozzles are both plural, and the plating liquid nozzles and the insulating liquid nozzles are alternately arranged along the first direction.

3. The electroplating nozzle according to claim 1, characterized in that: There are multiple insulating liquid nozzles, and the multiple insulating liquid nozzles are distributed in a ring shape on the radial outside of the electroplating liquid nozzle.

4. An electroplating nozzle, characterized in that: The electroplating nozzle comprises: a nozzle body, in which a plating liquid flow channel, an insulating liquid flow channel, a plating liquid nozzle and an insulating liquid nozzle are arranged; wherein, The electroplating liquid flow channel is connected to the electroplating liquid nozzle, and the electroplating liquid flow channel is used to transfer the electroplating liquid to the electroplating liquid nozzle so that the electroplating liquid is sprayed out from the electroplating liquid nozzle; The insulating liquid flow channel is connected to the insulating liquid nozzle, and the insulating liquid flow channel is used to transfer the insulating liquid to the insulating liquid nozzle so that the insulating liquid is sprayed out from the insulating liquid nozzle; The insulating liquid nozzle is arranged on one side or both sides of the electroplating liquid nozzle along the first direction.

5. The electroplating nozzle according to claim 4, characterized in that: The nozzle body is also provided with a plating liquid storage chamber for storing plating liquid and an insulating liquid storage chamber for storing insulating liquid; wherein, The electroplating liquid flow channel is connected to the electroplating liquid storage chamber, and the insulating liquid flow channel is connected to the insulating liquid storage chamber.

6. The electroplating nozzle according to claim 4 or 5, characterized in that: The number of the electroplating liquid nozzles and the insulating liquid nozzles is plural, and the electroplating liquid nozzles and the insulating liquid nozzles are alternately arranged along the first direction.

7. An electroplating device, characterized in that: The electroplating device comprises: the electroplating nozzle according to any one of claims 1 to 6.

8. The electroplating device according to claim 7, characterized in that: The electroplating device further comprises: a cleaning fluid injection mechanism, wherein the cleaning fluid injection mechanism is arranged on one side or both sides of the electroplating nozzle along a second direction, wherein the second direction is perpendicular to the first direction; The cleaning fluid spraying mechanism is used for spraying cleaning fluid, and the cleaning fluid includes at least one of air and insulating liquid.

9. The electroplating device according to claim 8, characterized in that: The cleaning fluid spraying mechanism is a linear structure, and the linear structure extends along the first direction; The cleaning fluid injection mechanism is an air knife, a water knife or a combination thereof.

10. The electroplating device according to claim 8, characterized in that: In the case where the cleaning fluid spraying mechanism is disposed on one side of the electroplating nozzle along the second direction, the cleaning fluid spraying mechanism is inclined toward the electroplating nozzle; When the cleaning fluid injection mechanism is arranged on both sides of the electroplating nozzle along the second direction, the cleaning fluid injection mechanism on both sides of the electroplating nozzle are inclined toward the electroplating nozzle, and the inclination angles of the cleaning fluid injection mechanism on both sides of the electroplating nozzle are different.

11. The electroplating device according to any one of claims 7 to 10, characterized in that: The electroplating device further comprises a first driving mechanism, the first driving mechanism is connected to the electroplating nozzle, and the first driving mechanism is used to drive the electroplating nozzle to move; And / or, the electroplating device further comprises an electroplating tank, in which a carrier and a second driving mechanism are further arranged, the second driving mechanism is connected to the carrier, and the second driving mechanism is used to drive the carrier to move.

Images