A semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module

Abstract

The utility model discloses a semiconductor water-cooled refrigeration and evaporative heat dissipation integrated module, comprising a semiconductor refrigeration sheet, an air-cooling component and a heat dissipation component, wherein the heat dissipation component is connected to the hot surface of the semiconductor refrigeration sheet; the air-cooling component comprises an upper shell and a lower shell with an air inlet and an air outlet, the upper shell and the lower shell are respectively provided with an air duct one and an air duct two, a water bag one is provided between the upper shell and the lower shell, the water bag one covers the air duct one and the air duct two, a fan one is provided at the air outlet end of the air duct one and the air duct two, the water inlet end and the water outlet end of the water bag one are respectively connected to a cold head one, the cold head one is fitted with the cold surface of the semiconductor refrigeration sheet, the semiconductor refrigeration sheet is used to cool the water bag, the water can fully store the cooling capacity of the semiconductor, and the waste in energy exchange is reduced, so that the temperature of the water is lowered, and in the process of inhaling and blowing air, only the circulation of the internal airflow in the closed space is relied on, and there is no need to inhale air from the outside to supplement, so as to form a miniature air conditioner, and further improve the cooling effect.

Description

Technical Field

[0001] The utility model belongs to the technical field of refrigeration equipment, in particular to a semiconductor water-cooling refrigeration and evaporation heat dissipation integrated module. Background Art

[0002] Semiconductor refrigeration chips are widely used in small refrigeration products such as wine refrigerators, hot and cold dual-purpose boxes for automobiles, and electronic ice cream machines due to their small size, compact structure, and convenient refrigeration capacity control. In addition, there are corresponding air cooling systems based on semiconductor refrigeration chip technology, such as the Chinese public patent document "CN105444462B, semiconductor refrigeration system". Based on this technical solution, the semiconductor refrigeration system mainly studies the distance D set within the following range: (LF-LT) / 2≤D≤(LF / 2+LT / 5), where LF>LT, which can significantly improve the equivalent heat exchange performance of the semiconductor refrigeration system, thereby effectively increasing the cooling capacity;

[0003] Based on the above theory, although the heat exchange effect of semiconductor refrigeration plates can be improved, the effect of the air cooling system does not only rely on the energy conversion effect. It also requires a reasonable air duct design and reduced energy heat dissipation to further improve the cooling effect. Utility Model Content

[0004] The purpose of the utility model is to provide a semiconductor water-cooled refrigeration and evaporative heat dissipation integrated module, which uses water as a medium and improves the heat dissipation performance of the semiconductor hot surface through evaporative heat dissipation at the hot end. The cold end also uses water as a medium to store the cooling capacity and transport it to the cold air module. While improving the semiconductor refrigeration effect, it has the advantages of flexible size and low noise, and can be suitable for different application scenarios to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0006] A semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module, comprising a semiconductor refrigeration sheet, an air-cooling component and a heat dissipation component, wherein the heat dissipation component is connected to the hot surface of the semiconductor refrigeration sheet;

[0007] The air cooling component includes an upper shell and a lower shell with an air inlet and an air outlet, the upper shell and the lower shell are respectively provided with air duct one and air duct two, a water bag one is provided between the upper shell and the lower shell, the water bag one covers air duct one and air duct two, a fan one is provided at the air outlet end of the air duct one and the air duct two, the water inlet end and the water outlet end of the water bag one are respectively connected to a cold head one, and the cold head one is in contact with the cold surface of the semiconductor refrigeration plate.

[0008] According to a further technical solution, the air duct one and the air duct two have the same layout, both of which are in an "S" shape or a combination of multiple "S"-shaped connections.

[0009] According to a further technical solution, the air outlet ends of the upper shell and the lower shell are provided with air bins, the fan 1 is installed in the air bins, the air bins are provided with an air outlet and an air inlet, and the air inlet end of the fan 1 is sealed and connected to the air inlet.

[0010] According to a further technical solution, the maximum air flow rate of the air outlet is less than the maximum air flow output rate of the fan, and a gap is provided at the air bin to connect the air bin with air duct one and air duct two.

[0011] According to a further technical solution, the upper shell, the lower shell and the water bag 1 are flat, and the air duct 1 and the air duct 2 each have a plurality of air outlets, and the air outlet ends of the two are connected to the air bin.

[0012] A further technical solution is that the heat dissipation component includes two cold heads, two water pumps, two water bags and a heat dissipation device which are cyclically connected. The two cold heads are tightly fitted to the hot surface of the semiconductor refrigeration plate. The heat dissipation device includes a shell having a water inlet end and a water outlet end. A water storage tank is provided on the side of the shell near the water inlet end. The water storage tank is provided with a plurality of water inlet holes. A water storage tank is provided on the side of the shell near the water outlet end. The water storage tank is provided with a plurality of water outlet holes. A water passage is provided between the water storage tanks one and two. The shell is provided with a plurality of air inlets and air outlets corresponding to the water passage. A fan is installed corresponding to the air outlet.

[0013] According to a further technical solution, the water-passing part comprises a plurality of diverter grooves arranged in the shell, one end of the diverter groove is connected to the water inlet hole, and a water-absorbing sheet is arranged on the upper end surface of the diverter groove, and the water-absorbing sheet is in close contact with the inner wall of the shell.

[0014] A further technical solution is that the shell includes an upper cover and a lower cover, the upper cover is provided with a right baffle plate 1 on one side close to the water inlet end, the lower cover is provided with a right baffle plate 2 on one side close to the water inlet end, the right baffle plate 1 and the right baffle plate 2 are fitted together with the upper cover and the lower cover to form a water storage tank 1, the upper cover is provided with a left baffle plate 1 on one side close to the water outlet end, the lower cover is provided with a left baffle plate 2 on one side close to the water outlet end, the left baffle plate 1 and the left baffle plate 2 are fitted together with the upper cover and the lower cover to form a water storage tank 2.

[0015] According to a further technical solution, the right baffle plate 1 is provided with a convex portion 1, the right baffle plate 2 is provided with a concave portion 1 for inserting the convex portion 1, the left baffle plate 1 is provided with a convex portion 2, and the left baffle plate 2 is provided with a concave portion 2 for inserting the convex portion 2.

[0016] Beneficial effects of the utility model:

[0017] The utility model adopts semiconductor refrigeration sheet to cool the water bag. Since the specific heat capacity of water is large, water can fully store the cooling capacity of semiconductor, and reduce the waste in energy exchange, so that the temperature of water is lowered. In addition, in the process of air inhalation and blowing, it only relies on the circulation of air flow inside the closed space, and does not need to inhale air from the outside to supplement, forming a miniature air conditioner, which further improves the cooling effect.

[0018] In addition, the heat dissipation effect can be effectively improved and the heat dissipation speed can be accelerated through evaporative heat dissipation.

[0019] Other features and advantages of the present invention will be described in detail in the subsequent specific implementation section. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 : Connection diagram of each component of the utility model.

[0021] Figure 2 : Distribution diagram of the components of the present utility model.

[0022] Figure 3 : Structural diagram of the air-cooling assembly of the present utility model.

[0023] Figure 4 : Disassembly diagram of the air cooling component of the utility model.

[0024] Figure 5 : Schematic diagram of air flow direction of the air cooling component of the utility model.

[0025] Figure 6 : Structural diagram of the heat dissipation component of the present utility model.

[0026] Figure 7 : The upper cover structure diagram of the utility model.

[0027] Figure numerals: 1-semiconductor refrigeration plate, 2-air cooling assembly, 21-upper shell, 22-lower shell, 23-air duct one, 24-air duct two, 25-water bag one, 26-fan one, 271-cold head one, 272-water pump one, 28-air chamber, 29-gap, 3-heat dissipation assembly, 31-cold head two, 32-water pump two, 33-water bag two, 34-heat dissipation device, 3411-upper cover, 3412-lower cover, 3413-right baffle one , 3414-right baffle 2, 3415-left baffle 1, 3416-left baffle 2, 34171-convex part 1, 34172-concave part 1, 34181-convex part 2, 34182-concave part 2, 342-water storage tank 1, 343-water inlet hole, 344-water storage tank 2, 345-water outlet hole, 3461-diverter trough, 3462-water absorbing sheet, 3471-air inlet hole, 3472-air outlet hole, 348-fan 2. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0029] Please refer to Figure 1-7 ;

[0030] The semiconductor water-cooled refrigeration and evaporative heat dissipation integrated module described in the utility model aims to improve the refrigeration effect and realize the adjustability of the cold air temperature and air volume, and is specifically composed of a semiconductor refrigeration sheet 1, an air-cooling component 2 and an evaporative heat dissipation component 3, wherein the air-cooling component 2 is connected to the cold surface of the semiconductor refrigeration sheet 1 to obtain a lower temperature to generate cold air, and the evaporative heat dissipation component 3 is connected to the hot surface of the semiconductor refrigeration sheet 1 to dissipate heat therefrom; the following focuses on the air-cooling component 2;

[0031] Reference Figure 3 and Figure 4 , specifically including an upper shell 21 and a lower shell 22 that are both matched and installed, and the upper shell 21 and the lower shell 22 are correspondingly provided with an air duct 1 23 and an air duct 2 24, wherein the air duct 1 23 and the air duct 2 24 can adopt the same design or different designs, which is not limited here, but the two sides of the water bag 1 25 arranged between the upper shell 21 and the lower shell 22 respectively cover the air duct 1 23 and the air duct 2 24; it should be noted that when the upper shell 21 and the lower shell 22 are separated, the air duct 1 23 and the air duct 2 24 are respectively a groove, and after the upper shell 21 and the lower shell 22 and the water bag 1 25 are assembled together, the two sides of the water bag 1 25 respectively close one side of the air duct 1 23 and the air duct 2 24, forming a water bag 1 with an air outlet end and an air inlet end. The air duct, the air outlet ends of air duct 1 23 and air duct 2 24 are provided with fan 1 26, which of course corresponds to the air inlet end of fan 1 26; the water inlet end and the water outlet end of the water bag 25 are respectively connected to the cold head 271, and the cold head 271 is in contact with the cold surface of the semiconductor refrigeration plate 1. In this embodiment, a water pump 272 should be provided, wherein the water pump can be independent or integrated in the cold head 271, such as the cold head with pump used in the water cooling system of the computer system. If the water pump is independent, its output end or input end is connected to the input end or output end of the water bag 25, and the other end is connected to the cold head 271. The use of water pump 272 to provide circulation power is a common technical means and will not be described in detail here.

[0032] When working, the semiconductor refrigeration sheet 1 and the fan 26 work simultaneously. In this process, the semiconductor refrigeration sheet 1 reduces the temperature of the liquid through the cold head 271, and then flows back into the water bag 25, so that the overall temperature of the water bag 25 decreases, and the circulation refrigeration is performed in this way. Preferably, the liquid temperature of the water bag 25 is below 10°C;

[0033] When fan 1 26 is started, air flows in from the air inlet ends of air duct 1 23 and air duct 2 24 respectively, and then flows into fan 1 26 from the air outlet end and is blown out. During this process, the air flows through air duct 1 23 and air duct 2 24 and contacts the side of water bag 1 25. The longer the distance between air duct 1 23 and air duct 2 24, the longer the air flows through, and the longer the air contacts with water bag 1 25. At this time, the temperature of water bag 1 25 is relatively low, and the water bag 1 25 absorbs heat in the air flow to reduce the temperature, and finally blows out air with a relatively low temperature from fan 1 26.

[0034] In actual application, the upper shell 21, the water bag 25 and the lower shell 22 are assembled and placed in a closed space, and then started according to the above principle. At this time, the air entering from the air inlet end is in the closed space, and the airflow blown out after cooling will enter the closed space here, that is, the airflow circulation in the closed space is realized to form a miniature air conditioner. It should be noted that the volume of the closed space is small here, and the water bag 25 is used as a medium to absorb the heat of the airflow. The role is to enable the airflow to fully contact and reduce the temperature of the airflow as much as possible. At the same time, the liquid in the water bag 25 has a large specific heat capacity and can absorb more heat. The semiconductor refrigeration sheet 1 is sufficient to cool it and ensure the cooling effect of the liquid.

[0035] In addition, such an air duct design is adopted, so that part of the exhaust gas of the fan outlet is discharged from the outlet, and part is discharged into the air duct, so as to achieve a higher heat exchange efficiency. At the same time, the fan exhaust volume and temperature can be controlled by controlling the fan speed. The utility model utilizes the cooling capacity of the water storage semiconductor and conducts it to the sheet water bag. Through the setting of the air duct and the air outlet, the temperature and flow of the cold air can be adjusted.

[0036] Furthermore, an external controller may be provided, the controller being connected to the fan, and the wind speed may be adjusted by setting a plurality of gears, thereby ultimately adjusting the air volume.

[0037] In the utility model, a semiconductor refrigeration sheet 1 is used to cool the water bag 25, and then the water bag 25 is fully in contact with the airflow to absorb its heat, so that its temperature drops and the refrigeration effect is improved. In the process of inhaling and blowing air, it only relies on the circulation of the airflow inside the closed space, and there is no need to inhale air from the outside to supplement it, forming a miniature air conditioner, which further improves the refrigeration effect.

[0038] The utility model further describes the air duct 1 23 and the air duct 24, referring to Figure 4 The layout of air duct 1 23 and air duct 2 24 is the same, both of which are "S"-shaped or a combination of multiple "S"-shaped connections. The design of multiple "S" is that one end of the first duct is connected to one end of the second duct. Through such a winding design, the time for the air flow to pass through the air duct can be prolonged, that is, the time of contact with the water bag 1 25 is increased, which is conducive to further reducing the temperature.

[0039] In the embodiment of the utility model, an air bin 28 is provided at the air outlet end of the upper shell 21 and the lower shell 22. The air bin 28 provides an installation position for the fan, and at the same time, the air flow can be gathered in the air bin 28 and then blown out from the air outlet of the air bin 28, thereby improving the air tightness. In addition, the air bin 28 is also provided with an air inlet, and the air inlet end of the fan is sealed and connected to the air inlet to ensure the heat exchange effect.

[0040] Further expansion, the air outlet of the air bin 28 is smaller, so that the maximum air flow rate of the air outlet is smaller than the maximum air flow output rate of the fan 26, so that the air pressure inside the air bin 28 can be increased, thereby speeding up the air flow rate blown out of the air outlet.

[0041] In addition, a notch 29 is provided at the air chamber 28 to connect the air chamber 28 with the air duct. Figure 4 and Figure 5 The air outlet of the air bin 28 is small, which will cause the air pressure inside the air bin 28 to increase. Therefore, a notch 29 is provided at the air bin 28 to connect the air bin 28 with the air duct. Part of the air flow can flow back to the air duct 1 23 and the air duct 2 24 through the notch 29 for circulation, ensuring that the air flow in the heat exchange air duct circulates repeatedly at a higher speed, thereby improving the heat exchange efficiency, while ensuring the air intake volume of the fan, and then ensuring the air flow rate at the air outlet.

[0042] The upper shell 21, the lower shell 22 and the water bag are flat, and the air duct 1 23 and the air duct 2 24 have a plurality of strips, that is, they have two air inlet ends and air outlet ends. The air outlet ends of the two are connected to the air bin 28, which can increase the air volume and fully contact the water bag 1 25 to maximize the cooling effect.

[0043] One embodiment of the heat dissipation assembly 3 of the present invention is shown in FIG. Figure 6 and Figure 7In this embodiment, evaporative heat dissipation is used to improve the heat dissipation effect, specifically including a cold head 31, a water pump 32, a water bag 33 and a heat dissipation device 34 that are cyclically connected. One end of the cold head 31 is connected to the water pump 32, one end of the water bag 33 and the water inlet of the heat dissipation device 34 in sequence, and the other end of the cold head 31 is connected to the other end of the water bag 33 and the water outlet of the heat dissipation device 34 in sequence, so as to form a water cycle. The water circulation structure is connected by a water pipe. The water pump 32 is responsible for driving the operation of the entire water circulation system to ensure that the water continues to flow. The cold head 31 is tightly fitted to the hot surface of the semiconductor refrigeration plate 1. The heat dissipation device 34 includes a shell with a water inlet end and a water outlet end. The shell can be a rectangular parallelepiped or a cube-shaped structure. A water storage tank 1 342 is provided on one side of the water end, a water inlet hole 343 is provided on the side of the water storage tank 1 342 away from the water inlet end, a water storage tank 2 344 is provided on the side close to the water outlet end in the shell, a water outlet hole 345 is provided on the side of the water storage tank 2 344 away from the water outlet end, a water passing part is provided between the water storage tank 1 342 and the water storage tank 2 344, the water storage tank 1 342, the water passing part and the water storage tank 2 344 are connected through the water inlet hole 343 and the water outlet hole 345, a plurality of air outlet holes 3472 and air inlet holes 3471 corresponding to the water passing part are provided on the shell, which are used to guide external air into the water passing part, take away the heat in the water, and form a continuous evaporation heat dissipation process, and a fan 2 348 is installed corresponding to the air inlet hole 3471, and the air flow speed is accelerated by using the fan 2 348 to improve the heat dissipation efficiency.

[0044] In the working state, the hot end of the semiconductor refrigeration sheet 1 generates heat, which is quickly transferred to the cold head 2 31 in close contact with it. After the water inside the cold head 2 31 absorbs the heat released by the hot end of the semiconductor refrigeration sheet 1, the water pump 2 32 is started at the same time, and the water in the cold head 2 31 is pumped into the water bag 2 33 through the water pump 2 32, and flows from the water bag 2 33 to the water storage tank 1 342 along the water inlet end 41 of the heat dissipation device 34, and the water flows to the water passage 47 through the water inlet hole 343 of the water storage tank 1 342. The air flowing inside the water passage takes away the heat in the water, and then flows from the water outlet hole 345 to the water storage tank 2 344, and finally flows from the water outlet end along the other end of the water bag 2 33 back to the cold head 2 31, and this water circulation process is repeated continuously. This design is small in size, easy to carry, and has strong scalability. A multi-layer water passage design can be used to meet higher heat dissipation requirements.

[0045] The second cold head 31 and the second water pump 32 of the utility model are provided with a protective shell outside to prevent the components from being damaged due to accidental collision.

[0046] In the utility model, the shell includes an upper cover 3411 and a lower cover 3412. The upper cover 3411 is provided with a right baffle 1 3413 on one side close to the water inlet end, and the lower cover 3412 is provided with a right baffle 2 3414 on one side close to the water inlet end. The right baffle 1 3413 and the right baffle 2 3414 fit together with the upper cover 3411 and the lower cover 3412 to form a water storage tank 1 342. The upper cover 3411 is provided with a left baffle 1 3415 on one side close to the water outlet end, and the lower cover 3412 is provided with a left baffle 2 3416 on one side close to the water outlet end. 416, the left baffle plate 1 3415 and the left baffle plate 2 3416 are fitted with the upper cover 3411 and the lower cover 3412 to form the water storage tank 2 344, the right baffle plate 1 3413 is provided with a convex part 1 34171, the right baffle plate 2 3414 is provided with a recess 1 34172 for inserting the convex part 1 341714311, the left baffle plate 1 3415 is provided with a convex part 2 34181, and the left baffle plate 2 3416 is provided with a recess 2 34182 for inserting the convex part 2 34181. Through the embedded installation of the convex part and the recess part, the sealing effect of the utility model can be enhanced, and at the same time, it can be convenient for assembly and disassembly, and it is convenient for maintenance and cleaning of the heat dissipation device 34.

[0047] The water-passing portion includes a diverter groove 3461 arranged on the inner side of the shell, one end of the diverter groove 3461 is connected to the water inlet hole 343, and a water-absorbing sheet 3462 is arranged on the upper end surface of the diverter groove 3461. The water-absorbing sheet 3462 is tightly attached to the inner wall of the shell to completely cover the diverter groove 3461. The water-absorbing sheet 3462 is made of a hydrophilic material. Based on this embodiment, the heat dissipation device 34 is placed upright when in use. When water enters the diverter groove 3461, it will be absorbed by the water-absorbing sheet 3462. After the water sheet 3462 is in a saturated state, the water will move downward under the action of gravity and flow into the water storage tank 344 from the water outlet 345. Preferably, the diverter groove 3461 is connected to the water outlet 345. At the same time, the fan 348 evaporates and dissipates the water adsorbed on the water-absorbing sheet 3462, thereby increasing the cooling area and accelerating the cooling effect. Of course, evaporation and heat dissipation will cause water loss, so the user needs to replace the water bag in time or add water manually.

[0048] Furthermore, an air guide baffle is provided on the inner wall of the upper cover 3411 to form an air flow channel and fix the water absorbing sheet 3462 at the same time.

[0049] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0050] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. A semiconductor water-cooled refrigeration and evaporative heat dissipation integrated module, comprising a semiconductor refrigeration sheet (1), an air-cooling component (2) and a heat dissipation component (3), wherein the heat dissipation component (3) is connected to the hot surface of the semiconductor refrigeration sheet (1), characterized in that: The air cooling component (2) comprises an upper shell (21) and a lower shell (22) having an air inlet and an air outlet, the upper shell (21) and the lower shell (22) are respectively provided with an air duct one (23) and an air duct two (24), a water bag one (25) is provided between the upper shell (21) and the lower shell (22), the water bag one (25) covers the air duct one (23) and the air duct two (24), a fan one (26) is provided at the air outlet end of the air duct one (23) and the air duct two (24), the water inlet end and the water outlet end of the water bag one (25) are respectively connected to a cold head one (271), and the cold head one (271) is in contact with the cold surface of the semiconductor refrigeration plate (1).

2. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 1, characterized in that: The air duct one (23) and the air duct two (24) have the same layout, both of which are in an "S" shape or a combination of multiple "S" shapes.

3. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 1, characterized in that: The air outlet ends of the upper shell (21) and the lower shell (22) are provided with air bins (28), the fan (26) is installed in the air bin (28), the air bin (28) is provided with an air outlet and an air inlet, and the air inlet end of the fan (26) is sealed and connected to the air inlet.

4. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 3, characterized in that: The maximum air flow rate of the air outlet is less than the maximum air flow output rate of the fan (4), and a notch (29) is provided at the air bin (28) so that the air bin (28) is connected with the air duct one (23) and the air duct two (24).

5. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 1, characterized in that: The upper shell (21), the lower shell (22) and the water bag 1 (25) are flat, and the air duct 1 (23) and the air duct 2 (24) each have a plurality of air outlets, and the air outlet ends of the two are connected to the air bin (28).

6. A semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to any one of claims 1 to 5, characterized in that: The heat dissipation component (3) comprises a cold head (31) (2) (31), a water pump (32) (32), a water bag (33) (33) and a heat dissipation device (34) which are cyclically connected. The cold head (31) (31) is tightly fitted with the hot surface of the semiconductor refrigeration plate (1). The heat dissipation device (34) comprises a shell having a water inlet end and a water outlet end. A water storage tank (342) is provided on the side of the shell near the water inlet end. The water storage tank (342) is provided with a plurality of water inlet holes (343). A water storage tank (344) is provided on the side of the shell near the water outlet end. The water storage tank (344) is provided with a plurality of water outlet holes (345). A water passage is provided between the water storage tank (342) and the water storage tank (344). The shell is provided with a plurality of air inlet holes (3471) and air outlet holes (3472) corresponding to the water passage. A fan (348) is installed corresponding to the air outlet holes (3472).

7. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 6, characterized in that: The water-passing portion comprises a plurality of diverter grooves (3461) arranged in the shell, one end of the diverter groove (3461) is connected to the water inlet hole (343), and a water-absorbing sheet (3462) is arranged on the upper end surface of the diverter groove (3461), and the water-absorbing sheet (3462) is in close contact with the inner wall of the shell.

8. The semiconductor water-cooling refrigeration and evaporative heat dissipation integrated module according to claim 6, characterized in that: The shell comprises an upper cover (3411) and a lower cover (3412); a right baffle plate 1 (3413) is provided on a side of the upper cover (3411) close to the water inlet end; a right baffle plate 2 (3414) is provided on a side of the lower cover (3412) close to the water inlet end; the right baffle plate 1 (3413) and the right baffle plate 2 (3414) are fitted with the upper cover (3411) and the lower cover (3412) to form a water storage tank 1 (342); a left baffle plate 1 (3415) is provided on a side of the upper cover (3411) close to the water outlet end; a left baffle plate 2 (3416) is provided on a side of the lower cover (3412) close to the water outlet end; the left baffle plate 1 (3415) and the left baffle plate 2 (3416) are fitted with the upper cover (3411) and the lower cover (3412) to form a water storage tank 2 (344).

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