A hollow ion-selective patch electrode

Abstract

The utility model provides a hollow ion selective patch electrode, wherein a front conductive circuit (2) and an electrode loading area (1) are arranged on the front side of a substrate, a conductive hole (24) is arranged on the front conductive circuit (2), and the electrode loading area (1) comprises an electrode detection layer and a hollow hole (13) penetrating the substrate; a hollow hole (13) and a back conductive circuit (4) are arranged on the same plane on the back side of the substrate, a conductive hole (24) is arranged on the back conductive circuit (4), and the front conductive circuit (2) and the back conductive circuit (4) are interconnected through the conductive hole (24); a selective electrode patch (41) and a conductive tape (42) are also arranged on the back side of the substrate, the selective electrode patch (41) is tightly attached to the substrate and completely covers the position of the hollow hole (13), and the conductive tape (42) is arranged above the selective electrode patch (41) to fix the selective electrode patch (41) on the back side of the substrate and is in contact and conductive with the back conductive circuit (4).

Description

Technical Field

[0001] The utility model belongs to the field of electrochemical sensors and relates to a hollow ion selective patch electrode. Background Art

[0002] Electrodes are the most important sensitive components of electrochemical sensors. Generally, sensors must have more than two electrodes, and the three-electrode system is currently widely used. The three electrodes include a working electrode, a reference electrode, and a counter electrode. The three electrodes of the traditional three-electrode system are not integrated on the same plane, and the distance between the electrodes is far. During the electrochemical test, concentration polarization is prone to occur between the working electrode and the counter electrode, affecting the test accuracy. In addition, the traditional three-electrode system is large in size, which is not convenient for the design and processing of microsensors, limiting the application of the three-electrode system.

[0003] The existing portable three-electrode structure specifically integrates the working electrode, counter electrode and reference electrode on the same plane, greatly reducing the size of the three electrodes and facilitating the design and processing of microsensors.

[0004] However, the working electrode modification layer of the above-mentioned electrode is fixed and cannot be replaced according to the detection target, which may cause waste during use and cause some inconvenience in the specific use of the electrode. At the same time, different modification layers are modified on the surfaces of the three electrodes on the basis of the coplanarity of the three electrodes, which also brings difficulties to the electrode repair and processing. The electrode processing cost is relatively high and there are also some inconveniences in use.

[0005] All existing technical solutions for electrodes propose to separate the key working electrode modification layer and perform subsequent gluing and installation according to the requirements of the detection molecules. However, there are still tiny gaps in the later installed structure. When the detection liquid droplets are added to the electrode modification hole position and react with the electrode modification layer in contact, the tiny gaps between the electrode modification layer and the back of the substrate cause the electrode detection area to change and become unable to be fixed, thereby greatly affecting the stability and accuracy of the detection data. In order to transmit the electrical signal generated by the electrode patch, an annular conductive structure is set in the contact area between the electrode patch and the electrode substrate, and the electrical signal is transmitted to the electrode pin by the annular structure. The annular structure is not very effective in conducting electricity and transmitting signals, which affects the sensitivity of the electrode.

[0006] In order to further overcome the above problems, this patent aims to provide a hollow ion-selective patch electrode, which can freely assemble selective electrode patches according to the needs of the detection object and fix the area of ​​the electrode detection area, so that its detection accuracy and stability can reach the performance level of a normal three-electrode coplanar electrode. While ensuring the electrode detection performance, it is more flexible, reduces processing and use costs, and opens up broader application prospects for microelectrodes. Utility Model Content

[0007] In summary, the utility model provides a hollow ion-selective patch electrode.

[0008] The utility model aims to provide a hollow ion selective patch electrode, comprising an electrode substrate, characterized in that a front conductive circuit (2) and an electrode loading area (1) are arranged on the front side of the substrate, a conductive hole (24) is arranged on the front conductive circuit (2), and the electrode loading area (1) comprises an electrode detection layer and a hollow hole (13) penetrating the substrate; a hollow hole (13) and a back conductive circuit (4) are arranged on the same plane on the back side of the substrate, a conductive hole (24) is arranged on the back conductive circuit (4), and the front conductive circuit (2) and the back conductive circuit (4) are interconnected through the conductive hole (24); a selective electrode patch (41) and a conductive tape (42) are also arranged on the back side of the substrate, the selective electrode patch (41) is tightly attached to the substrate and completely covers the position of the hollow hole (13), and the conductive tape (42) is arranged above the selective electrode patch (41) to fix the selective electrode patch (41) on the back side of the substrate and is in contact and conductive with the back conductive circuit (4).

[0009] The electrode detection layer comprises a first electrode layer (11) and a second electrode layer (12) which are arranged on the same plane and are not interconnected, a hollow hole (13) is arranged adjacent to the first electrode layer (11) and the second electrode layer (12), and the first electrode layer (11) and the second electrode layer (12) are respectively connected to the front conductive line (2).

[0010] As attached Figure 1 Shown is a front schematic diagram of a hollow ion-selective patch electrode.

[0011] The positions of the first electrode layer (11), the second electrode layer (12), and the hollow holes (13) can refer to the conventional three-electrode coplanar electrode surface three-electrode position arrangement, and the distance between the three electrodes is shortened as much as possible to eliminate concentration polarization and improve electrode sensitivity. In the embodiment of the utility model, the first electrode layer (11) is partially annular, and the hollow holes (13) are wrapped inside the ring. The second electrode layer (12) is located on the other side of the missing ring shape, wherein the first electrode layer (11) corresponds to the counter electrode, the second electrode layer (12) corresponds to the reference electrode, and the position of the hollow holes (13) corresponds to the working electrode. Such an arrangement greatly reduces the distance between the working electrode and the counter electrode, and promotes the miniaturization and sensitivity improvement of the coplanar electrode; the electrode position arrangement of the utility model can also symmetrically arrange the first electrode layer (11) and the second electrode layer (12) on both sides of the hollow holes (13), and the three-electrode position arrangement can be adjusted according to actual needs.

[0012] The hollow holes (13) may be regular shapes including circular and rectangular.

[0013] The front conductive circuit (2) comprises a first circuit (21), a second circuit (22) and a third circuit (23) which are not connected to each other, the first circuit (21) is connected to the first electrode layer (11), the second circuit (22) is connected to the second electrode layer (12), and the third circuit (23) is arranged outside the hollow hole (13).

[0014] One or more via holes (24) are arranged on the third circuit (23); the via holes (24) are also located on the back conductive circuit (4) on the back side of the substrate and are interconnected with the third circuit (23) through the via holes (24).

[0015] The conductive holes and the conductive circuits are generally filled with a metal layer, which can conduct the conductive circuit metal layers on the front and back sides of the substrate. The number of conductive holes is set to one or more, usually three, to ensure that the front and back sides of the substrate are connected and the electrical signal transmission is normal.

[0016] As attached Figure 2 The back side of the hollow ion selective patch electrode is shown in the figure. Figure 1 .

[0017] In the embodiment of the utility model, the third circuit (23) of the electrode is not connected to the hollow hole (13), that is, the third circuit (23) on the front side of the electrode is not connected to the working electrode position, but is connected to the back conductive circuit (4) on the back side of the electrode substrate through the conductive hole (24) arranged in the third circuit (23), and then connected to the electrode sheet subsequently loaded at the position of the hollow hole (13) and transmits the electrical signal. This can not only reduce the volume of the electrode and make the arrangement of the circuits on the electrode surface more concise, but also make the transmission of the electrical signal smoother. It is also in line with the design concept of the utility model of loading the working electrode separately from the electrode sheet, avoiding the disadvantage that the transmission of the electrical signal is affected by the poor contact of the loaded electrode sheet.

[0018] Electrode pins are also provided on the front side of the substrate, including a first pin (31), a second pin (32) and a third pin (33) which are coplanar and equidistant and are respectively connected to the first circuit (21), the second circuit (22) and the third circuit (23).

[0019] The above three electrode pins are arranged in parallel and equidistantly according to the conventional three-electrode coplanar electrode, and the entire electrode size is set to match the USB size. The metal area size and distance of the three pins can also be adjusted as needed to facilitate the transmission of electrical signals.

[0020] Furthermore, the surfaces of the front conductive circuit (2), the electrode pins, the electrode detection layer and the back conductive circuit (4) are modified with a metal layer as a base metal, and the metal type includes silver.

[0021] Furthermore, the first electrode layer (11) is provided with a modification layer on the surface of the base metal, and the material of the modification layer includes carbon.

[0022] Furthermore, a modification layer is provided on the surface of the second electrode layer (12), and the modification layer comprises a silver-silver chloride layer.

[0023] The conductive tape (42) completely covers the area where the selective electrode patch (41) and the conducting hole (24) are located.

[0024] As attached Figure 3 and attached Figure 4 The following are schematic diagrams of the back side of the hollow ion selective patch electrode. Figure 2 And the back side Figure 3 , and attached Figure 5 This is a schematic diagram of the side structure of a hollow ion-selective patch electrode.

[0025] Conventional three-electrode coplanar electrodes need to be modified with different metals or modified layers in the working electrode, counter electrode and reference electrode areas respectively, but this is difficult to achieve in actual processing. The different orders and processes of the three-electrode processing may affect the processing of other electrodes, especially for the working electrode modified with the core detection layer. The process effect may be affected by the other two electrodes or more cumbersome processes may be required to avoid influencing factors. This patent separates the working electrode into a component, and the electrode patch can be processed or selected separately. The process is simpler and more convenient, and more types of modification processing can be performed. More targets can be detected, and more targeted selections can be made according to different targets, which greatly expands the electrode detection range and detection methods.

[0026] In order to tightly fix the electrode patch on the back side of the substrate, the utility model uses conductive tape to cover the electrode patch, tightly fixes the electrode patch on the back side of the substrate, and connects it to the back conductive circuit, thereby realizing the transmission of electrical signals from the electrode patch to the conductive tape, the back conductive circuit and the through hole to the third circuit and the third pin on the front side.

[0027] The conductive tape has conductive properties and can transmit the electrical signal generated by the electrochemical reaction on the electrode patch to the conductive holes on the back of the electrode substrate, and then transmit it to the electrode pins on the front of the electrode substrate through the conductive holes, and then be read by the device connected to the electrode pins.

[0028] The metal part area can be appropriately increased in the contact area between the conductive circuit and the conductive tape on the back side, so that the contact area between the conductive circuit and the conductive tape can be increased as much as possible, thereby increasing the conductive area, making the conductive effect better and the electrical signal transmission effect better.

[0029] Fixing the electrode patch to the substrate with conductive tape can prevent the electrode patch from moving due to external force, cover and protect the electrode patch, and at the same time expand the contact area between the conductive tape and the electrode patch, and the contact area between the conductive tape and the conductive circuit on the back as much as possible, thereby facilitating signal transmission and achieving excellent results, making the electrode performance more sensitive and stable.

[0030] The selective electrode patch (41) can be made of metal sheets, and the materials include carbon, gold, silver, platinum, bismuth, chromium, and copper.

[0031] The side of the selective electrode patch (41) in contact with the back side of the substrate can be modified with an ion selective modification layer. The specific material of the ion selective modification layer can be changed arbitrarily according to the detection requirements, including metal film, enzyme, porous metal.

[0032] The electrode patch material can be selected from carbon, gold, silver, platinum, bismuth, chromium, copper, etc., and different types of metal ions can be detected according to the different electrode patch materials. A metal sheet can also be used as a substrate and the metal can be modified on its surface. A modification layer is set on the surface of the electrode patch, such as active enzymes or nanoporous gold, nanoporous silver or other ion-selective substances, which can selectively detect specific biochemical molecules and be applied to the detection of specific substances such as biochemical molecules and heavy metals. That is, a specific electrode patch can be selected according to the target detection object and assembled into an ion-selective electrode that can detect the target detection object.

[0033] The beneficial effects of the utility model are:

[0034] (1) The utility model sets a three-electrode coplanar structure on the same plane, digs a hole in the detection core area to make a hollow hole, and splits the working electrode into components, which are installed as independent electrode patches at a later stage. The conductive tape is used to fix the outside while achieving conductivity and electrical signal transmission, thereby ensuring the sensitivity and accuracy of the electrode and solving the stability problem of patch-type electrodes.

[0035] (2) The utility model connects the back conductor line and the front conductive line through the conductive hole of the conductive substrate, and transmits the electrochemical reaction signal generated by the electrode patch in the hollow hole area to the electrode pin through this path, and then transmits it out, while ensuring the sensitivity and accuracy of the electrode, greatly reducing the coplanar electrode area of ​​the three electrodes, providing more conductive line layout solutions, greatly reducing the difficulty and cost of electrode electroplating processing, avoiding secondary processing, optimizing the function and structural design of standard electrodes, and expanding the application field of electrodes.

[0036] (3) The utility model realizes the purpose of selecting different electrode modification layers according to the characteristics of the detection target by setting the core detection area of ​​the working electrode as an independent electrode patch that can be freely replaced and selected. At the same time, the material and modification layer of the independent electrode patch serving as the core detection layer can be freely replaced and can be used immediately after replacement, making the selection of electrode patches more diversified, thereby realizing the purpose of detecting a variety of different biochemical molecules by replacing electrode patches. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The utility model is further described using the accompanying drawings, but the embodiments in the accompanying drawings do not constitute any limitation to the utility model. A person skilled in the art can obtain other drawings based on the following drawings without creative work.

[0038] Figure 1 This is a front view schematic diagram of a hollow ion-selective patch electrode;

[0039] Figure 2 This is the back side of the hollow ion selective patch electrode. Figure 1 ;

[0040] Figure 3 This is the back side of the hollow ion selective patch electrode. Figure 2 ;

[0041] Figure 4 This is the back side of the hollow ion selective patch electrode. Figure 3 ;

[0042] Figure 5 This is a schematic diagram of the side structure of a hollow ion-selective patch electrode.

[0043] Legend:

[0044] 1. Electrode loading area; 11. First electrode layer; 12. Second electrode layer; 13. Hollow holes; 2. Front conductive circuit; 21. First circuit; 22. Second circuit; 23. Third circuit; 24. Through hole; 31. First pin; 32. Second pin; 33. Third pin; 4. Back conductive circuit; 41. Selective electrode patch; 42. Conductive tape. DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail with reference to the following specific embodiments and the accompanying drawings.

[0046] Example 1

[0047] As attached Figure 1As shown, a hollow ion selective patch electrode provided by the utility model includes a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm. The substrate can be made of flexible polymer materials, or conventional electrode materials such as epoxy resin, ceramic, silicon base, glass, etc.

[0048] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is circular with a radius set to 1 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0049] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0050] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0051] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0052] like Figure 2 As shown, a hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate, a via hole 24 is arranged on the back conductive circuit 4, and the front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24.

[0053] like Figure 3 to Figure 5 As shown, a selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate, and the selective electrode patch 41 is closely attached to the substrate and completely covers the position of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 on the back of the substrate, completely covers the area where the selective electrode patch 41 and the conductive hole 24 are located, and is in contact with the back conductive line 4 for conduction.

[0054] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0055] The selective electrode patch 41 selects a gold electrode sheet with an overall thickness of 0.01 to 0.02 mm and an overall radius of 2 mm. The shape can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it. In order to save costs, the gold electrode sheet uses a copper base, which is polished and plated with bright copper, then silver-plated, and finally gold-plated. Only the side in contact with the base layer can be processed on one side.

[0056] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0057] Example 2

[0058] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0059] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is square, and the length and width are set to 2 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0060] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0061] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0062] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0063] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0064] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0065] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0066] The selective electrode patch 41 is a silver electrode sheet, and its shape can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0067] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0068] Example 3

[0069] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0070] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is circular with a radius set to 2 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0071] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0072] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0073] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0074] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0075] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0076] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0077] The selective electrode patch 41 is a platinum electrode sheet, and its shape can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0078] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0079] Example 4

[0080] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0081] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is circular with a radius set to 1 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0082] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0083] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0084] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0085] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0086] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0087] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0088] The selective electrode patch 41 selects a bismuth electrode sheet, and specifically, a bismuth film can be modified on the surface of the electrode sheet reaction surface. The shape of the electrode sheet can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0089] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0090] Example 5

[0091] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0092] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is circular with a radius set to 1 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0093] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0094] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0095] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0096] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0097] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0098] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0099] The selective electrode patch 41 is a carbon electrode sheet, and the material can be selected from carbon-related materials including graphene. The shape can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0100] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0101] Example 6

[0102] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0103] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is rectangular, and the length and width are set to 1 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0104] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0105] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0106] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0107] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0108] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0109] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0110] The selective electrode patch 41 selects a chromium electrode sheet, and specifically, a chromium film can be modified on the surface of the electrode sheet reaction surface. The shape of the electrode sheet can be circular or rectangular, and can also be freely set. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0111] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0112] Example 7

[0113] The utility model provides a hollow ion selective patch electrode, comprising a PET plate electrode substrate, the electrode size is 12x35mm, and the thickness is 0.35mm.

[0114] A front conductive circuit 2 and an electrode loading area 1 are arranged on the front side of the substrate. The electrode loading area 1 includes an electrode detection layer and a hollow hole 13 penetrating the substrate. The hollow hole 13 is circular with a radius set to 1 mm. The electrode detection layer includes a first electrode layer 11 and a second electrode layer 12 that are coplanar and not interconnected. The hollow hole 13 is arranged adjacent to the first electrode layer 11 and the second electrode layer 12. The first electrode layer 11 and the second electrode layer 12 are respectively connected to the front conductive circuit 2.

[0115] The front conductive circuit 2 includes a first circuit 21, a second circuit 22 and a third circuit 23 which are not connected to each other. The first circuit 21 is connected to the first electrode layer 11, the second circuit 22 is connected to the second electrode layer 12, and the third circuit 23 is arranged outside the hollow hole 13 and is not in contact with it.

[0116] Three via holes 24 are disposed on the third circuit 23 . The via holes 24 are also located on the back conductive circuit 4 on the back side of the substrate and are interconnected with the third circuit 23 through the via holes 24 .

[0117] Electrode pins are also provided on the front side of the substrate, including a first pin 31, a second pin 32 and a third pin 33 that are coplanar and equidistant, and are connected to the first circuit 21, the second circuit 22 and the third circuit 23 respectively.

[0118] A hollow hole 13 and a back conductive circuit 4 are coplanarly arranged on the back side of the substrate. A via hole 24 is arranged on the back conductive circuit 4 . The front conductive circuit 2 and the back conductive circuit 4 are interconnected through the via hole 24 .

[0119] A selective electrode patch 41 and a conductive tape 42 are also provided on the back of the substrate. The selective electrode patch 41 is tightly attached to the substrate and completely covers the position of the hollow hole 13. A hollow hole is provided at the position corresponding to the hollow hole 13. The shape of the hollow hole 13 is concentric with the hollow hole 13, and the size of the hollow hole 13 is consistent with the size of the hollow hole 13. The conductive tape 42 is provided above the selective electrode patch 41, fixes the selective electrode patch 41 to the back of the substrate, completely covers the selective electrode patch 41 and the area where the conductive hole 24 is located, and is in contact with the back conductive line 4 for conduction.

[0120] The surface of the front conductive circuit 2, electrode pins and the first electrode layer 11 of the electrode detection layer is coated with silver paste, the first electrode layer 11 is modified with carbon paste on the silver paste base, and the second electrode layer 12 is modified with silver-silver chloride paste with a thickness greater than 5μm.

[0121] The selective electrode patch 41 is based on a gold electrode sheet, which is modified with active enzyme substances. The electrode sheet in contact with the electrode substrate can be modified on one side. The shape of the substrate can be circular or rectangular, and can also be set freely. Its area is larger than the area of ​​the hollow hole 13 and can completely cover it.

[0122] For convenience of subsequent use, the front conductive circuit 2 of the substrate can be partially coated with ink, and then the periphery of the electrode loading area 1 can be coated with a second layer of ink, leaving only the electrode detection layer and the hollow holes 13 and the area where the electrode pins are located exposed. The thickness of each layer of ink is 10 to 20 μm.

[0123] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

[0124] In addition, it should be understood that although this specification is described in accordance with the implementation methods, not every implementation method contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation methods that can be understood by those skilled in the art. The technical details not described in detail in this utility model can be implemented by any existing technology in the art. In particular, all technical features not described in detail in this utility model can be implemented by any existing technology.

Claims

1. A hollow ion-selective patch electrode, comprising an electrode substrate, characterized in that: A front conductive circuit (2) and an electrode loading area (1) are arranged on the front side of the substrate, a conductive hole (24) is arranged on the front conductive circuit (2), and the electrode loading area (1) includes an electrode detection layer and a hollow hole (13) penetrating the substrate; the hollow hole (13) and a back conductive circuit (4) are arranged on the same plane on the back side of the substrate, the conductive hole (24) is arranged on the back conductive circuit (4), and the front conductive circuit (2) and the back conductive circuit (4) are interconnected through the conductive hole (24); a selective electrode patch (41) and a conductive tape (42) are also arranged on the back side of the substrate, the selective electrode patch (41) is tightly attached to the substrate and completely covers the position of the hollow hole (13), and the conductive tape (42) is arranged above the selective electrode patch (41) to fix the selective electrode patch (41) on the back side of the substrate and is in contact and conductive with the back conductive circuit (4).

2. A hollow ion selective patch electrode according to claim 1, characterized in that: The electrode detection layer comprises a first electrode layer (11) and a second electrode layer (12) which are arranged on the same plane and are not interconnected, the hollow hole (13) is arranged adjacent to the first electrode layer (11) and the second electrode layer (12), and the first electrode layer (11) and the second electrode layer (12) are respectively connected to the front conductive line (2).

3. A hollow ion selective patch electrode according to claim 2, characterized in that: The front conductive circuit (2) comprises a first circuit (21), a second circuit (22) and a third circuit (23) which are not connected to each other, the first circuit (21) is connected to the first electrode layer (11), the second circuit (22) is connected to the second electrode layer (12), and the third circuit (23) is arranged outside the hollow hole (13).

4. The hollow ion selective patch electrode according to claim 3, characterized in that: One or more vias (24) are provided on the third circuit (23); the vias (24) are also located on the back conductive circuit (4) on the back side of the substrate and are interconnected with the third circuit (23) through the vias (24).

5. The hollow ion selective patch electrode according to claim 3, characterized in that: The front side of the substrate is also provided with electrode pins, including a first pin (31), a second pin (32) and a third pin (33) which are coplanar and equidistant, and are respectively connected to the first circuit (21), the second circuit (22) and the third circuit (23).

6. The hollow ion selective patch electrode according to claim 1, characterized in that: The surfaces of the front conductive circuit (2), electrode pins, electrode detection layer and back conductive circuit (4) are modified with a metal layer as a base metal, and the metal type includes silver.

7. The hollow ion selective patch electrode according to claim 1, characterized in that: The surface of the first electrode layer (11) of the electrode detection layer is also provided with a modification layer, and the material of the modification layer includes carbon; the surface of the second electrode layer (12) of the electrode detection layer is provided with a modification layer, and the modification layer includes a silver-silver chloride layer.

8. The hollow ion selective patch electrode according to claim 1, characterized in that: The conductive tape (42) completely covers the selective electrode patch (41) and the area where the conducting hole (24) is located.

9. The hollow ion selective patch electrode according to claim 1, characterized in that: The selective electrode patch (41) may be made of a metal sheet.

10. The hollow ion selective patch electrode according to claim 1, characterized in that: The side of the selective electrode patch (41) in contact with the back side of the substrate may be modified with an ion selective modification layer, and the specific material of the ion selective modification layer may be arbitrarily changed according to detection requirements.

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