Display and fixation integrated semiconductor diode production device

Abstract

The utility model relates to a display and fixation integrated semiconductor diode production device, which belongs to the technical field of semiconductor diode production and comprises a shaping box, a drying component for drying and shaping is mounted on the inner side of the shaping box, and a placing component for placing a semiconductor diode is mounted on the inner side of the shaping box. A sealing cover is hinged to the top of the shaping box through a hinge; the containing assembly comprises a containing disc located in the shaping box, two fixing rods fixed to the inner bottom wall of the containing disc, circular rings fixed to the ends of the fixing rods, four sliding rods fixed to the bottom of the containing disc, sliding sleeves arranged on the outer sides of the sliding rods in a sleeving mode, and hooks fixed to the outer side of the shaping box. And the moving piece is hung on the outer side of the hook. According to the display and fixation integrated semiconductor diode production device, the operation convenience can be further improved, the production work can be efficiently carried out, and the practicability of the display and fixation integrated semiconductor diode production device is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor diode production, in particular to a semiconductor diode production device with integrated development and fixing. Background Art

[0002] A diode is an electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). Diodes can be found in common radio circuits, other household appliances, or industrial control circuits. The production process of semiconductor diodes requires sandblasting, photolithography, grooving, cleaning, spray development and fixing, surface treatment, etc. In the integrated development and fixing molding process, drying equipment is required to solidify the photoresist toner sprayed on the semiconductor surface so that it can adhere and form.

[0003] According to the diode drying device disclosed in Chinese Patent Publication No. CN219995781 U, the patent can rotate the placement plate through the cooperation of the motor and the cylinder, so that the diodes placed inside can be evenly heated, improving the efficiency and effect of drying, and is very practical. However, in the actual operation process, the patent has certain shortcomings. After completing the drying work of a batch of diodes, the patent needs to take out the dried diodes from the placement plate first, and then put the next batch of diodes into the drying work. A lot of time will be wasted in the process of taking and placing, resulting in poor operation convenience. There is a certain room for improvement. In this regard, the present application provides a semiconductor diode production device with integrated display and fixing to solve the above problems. Utility Model Content

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the utility model provides a semiconductor diode production device with integrated developing and fixing, which has the advantages of being able to further improve the convenience of operation, and solves the problem that the existing semiconductor diode production device wastes a lot of time during actual operation and is not convenient for actual operation.

[0006] (II) Technical solution

[0007] In order to achieve the above-mentioned purpose of further improving the convenience of operation, the utility model provides the following technical solutions: a semiconductor diode production device with integrated development and fixing, comprising a fixing box, a drying component for drying and fixing is installed on the inner side of the fixing box, a placement component for placing semiconductor diodes is installed on the inner side of the fixing box, and a sealing cover is hinged on the top of the fixing box through a hinge;

[0008] The placement assembly includes a placement plate located inside the shaping box, two fixing rods fixed to the inner bottom wall of the placement plate, a ring fixed to the end of the fixing rod, four sliding rods fixed to the bottom of the placement plate, a sliding sleeve sleeved on the outside of the sliding rod, a hook fixed to the outside of the shaping box, and a movable part hung on the outside of the hook.

[0009] Furthermore, the drying component includes a hot air blower fixedly installed on the outside of the shaping box, an air outlet duct fixed on the outside of the shaping box, a support frame fixed to the inner bottom wall of the shaping box, a driving mechanism fixedly installed on the top of the support frame, four vertical poles fixed to the inner bottom wall of the shaping box, a support plate fixed between the top ends of the four vertical poles, a rotating plate placed on the top of the support plate, an electric push rod fixedly installed on the top of the rotating plate, and a push plate fixedly installed on the output shaft of the electric push rod.

[0010] Furthermore, a rubber gasket is bonded to the fitting surface between the sealing cover and the shaping box, and a lock buckle is fixedly installed between the sealing cover and the outer side of the shaping box.

[0011] Furthermore, the four sliding rods are respectively inserted and slidably connected to the inner sides of four sliding sleeves, the top ends of the sliding sleeves are open, and the bottom ends of the sliding sleeves are fixedly connected to the top of the rotating plate.

[0012] Furthermore, the moving part is composed of a straight rod, two oblique rods and hooks fixedly connected to the ends of the oblique rods, and is arched. The two oblique rods are inclined away from each other, and the two hooks can be inserted into the inner sides of the two rings at the same time.

[0013] Furthermore, the output end of the hot air blower passes through the outside of the shaping box and extends to the inside of the shaping box, and the bottom of the rotating plate and the top of the supporting plate are both smooth surfaces.

[0014] Furthermore, the output shaft of the driving mechanism passes through the bottom of the supporting plate and is fixedly connected to the bottom of the rotating plate, and the top of the pushing plate abuts against the bottom of the placing plate.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a semiconductor diode production device integrating development and fixing, which has the following beneficial effects:

[0017] The semiconductor diode production device with integrated development and fixing can further improve the operating convenience through the coordinated use of the drying component and the placement component inside the fixing box, so that the production device can place the next batch of semiconductor diodes in advance when performing the drying work, so that the next batch of semiconductor diodes can be directly placed after the previous batch of semiconductor diodes is dried, which is convenient for efficient production work and effectively improves the practicality of the semiconductor diode production device with integrated development and fixing. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the structure of the utility model;

[0019] Figure 2 It is a three-dimensional schematic diagram of the moving parts in the structure of the utility model;

[0020] Figure 3 It is a three-dimensional schematic diagram of the placement disk connection structure in the structure of the utility model.

[0021] In the figure: 1 shaping box, 200 drying component, 201 hot air blower, 202 air outlet pipe, 203 support frame, 204 driving mechanism, 205 upright pole, 206 support plate, 207 rotating plate, 208 electric push rod, 209 push plate, 300 placement component, 301 placement plate, 302 fixed rod, 303 ring, 304 sliding rod, 305 sliding sleeve, 306 hook, 307 moving part, 4 sealing cover. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figures 1 to 3The utility model provides a technical solution: a semiconductor diode production device with integrated development and fixing, comprising a shaping box 1, a drying component 200 for drying and shaping is installed on the inner side of the shaping box 1, a placement component 300 for placing semiconductor diodes is installed on the inner side of the shaping box 1, and a sealing cover 4 is hinged on the top of the shaping box 1 through a hinge; through the coordinated use of the drying component 200 and the placement component 300 on the inner side of the shaping box 1, the operation convenience can be further improved, so that the production device can place the next batch of semiconductor diodes in advance when performing the drying work, so that the next batch of semiconductor diodes can be directly placed after the previous batch of semiconductor diodes are dried, which is convenient for efficient production work and very convenient, thereby effectively improving the practicality of the semiconductor diode production device with integrated development and fixing.

[0024] It should be noted that a rubber gasket is bonded to the fitting surface of the sealing cover 4 and the shaping box 1, and a lock is fixedly installed between the sealing cover 4 and the outer side of the shaping box 1, so that the sealing cover 4 can be connected to the shaping box 1 through the lock, and the sealing performance of the internal space can be guaranteed under the action of the rubber gasket.

[0025] In this embodiment, the placement component 300 is a structure used to place the developing and fixing integrated semiconductor diode and facilitate its removal.

[0026] like Figure 1 , Figure 2 and Figure 3 As shown, the placement component 300 includes a placement plate 301 located inside the shaping box 1, two fixed rods 302 fixed to the inner bottom wall of the placement plate 301, a ring 303 fixed to the end of the fixed rod 302, four sliding rods 304 fixed to the bottom of the placement plate 301, a sliding sleeve 305 sleeved on the outside of the sliding rod 304, a hook 306 fixed to the outside of the shaping box 1, and a moving part 307 hung on the outside of the hook 306.

[0027] It should be noted that the movable member 307 is composed of a straight rod, two oblique rods and hooks fixedly connected at the ends of the oblique rods, and is arched. The two oblique rods are inclined toward the side away from each other, and the two hooks can be simultaneously plugged into the inner sides of the two rings 303. Specifically, the two oblique rods are pressed toward the side close to each other to change the positions of the oblique rods, and one of the hooks is moved to the inner side of the ring 303. The pressing grip is released to move the other hook to the inner side of the other ring 303, thereby achieving a hanging effect. The movable member 307 is a metal member that can undergo a certain elastic deformation.

[0028] In addition, the placement plate 301 is a box body with an open top and evenly distributed through holes on the outside, so that the semiconductor diode can be placed on the inside of the placement plate 301 and airflow can pass normally.

[0029] In this embodiment, the drying assembly 200 is a structure for drying and shaping the developing and fixing integrated semiconductor diode.

[0030] like Figure 1 As shown, the drying component 200 includes a hot air blower 201 fixedly installed on the outside of the shaping box 1, an air outlet duct 202 fixedly installed on the outside of the shaping box 1, a support frame 203 fixedly installed on the inner bottom wall of the shaping box 1, a driving mechanism 204 fixedly installed on the top of the support frame 203, four vertical rods 205 fixedly installed on the inner bottom wall of the shaping box 1, a support plate 206 fixedly installed between the top ends of the four vertical rods 205, a rotating plate 207 fitly placed on the top of the support plate 206, an electric push rod 208 fixedly installed on the top of the rotating plate 207, and a push plate 209 fixedly installed on the output shaft of the electric push rod 208.

[0031] It should be noted that the four sliding rods 304 are respectively inserted and slidably connected to the inner sides of the four sliding sleeves 305. The top of the sliding sleeve 305 is open, and the bottom end of the sliding sleeve 305 is fixedly connected to the top of the rotating plate 207, so that the rotating plate 207 can drive the sliding sleeve 305 to move during the rotation process, thereby allowing the sliding rod 304 to move.

[0032] In addition, the output end of the hot air blower 201 passes through the outside of the shaping box 1 and extends to the inside of the shaping box 1, so that the hot air blown by the hot air blower 201 can act on the inside of the shaping box 1, so that the inside of the shaping box 1 can be dried. The bottom of the rotating plate 207 and the top of the support plate 206 are both smooth. The output shaft of the driving mechanism 204 passes through the bottom of the support plate 206 and is fixedly connected to the bottom of the rotating plate 207, so that the driving mechanism 204 can drive the rotating plate 207 to rotate on the top of the support plate 206, wherein the driving mechanism 204 is a high temperature resistant and explosion-proof servo motor.

[0033] At the same time, the top of the push plate 209 abuts against the bottom of the placement tray 301, the electric push rod 208 is a high-temperature resistant electric explosion-proof push rod, and the maximum stroke distance of the electric push rod 208 is less than the height of the sliding rod 304, so that the electric push rod 208 can push the placement tray 301 upward through the push plate 209, and during the pushing process, the sliding rod 304 is always located on the inner side of the corresponding sliding sleeve 305.

[0034] The working principle of the above embodiment is:

[0035] When producing semiconductor diodes formed by developing and fixing integration, the semiconductor diodes with film coating are placed on the inner side of the placement plate 301, and the inner side of the ring 303 is hooked by the moving member 307, so that the moving member 307 can lift and move the placement plate 301 through the ring 303 and the fixed rod 302, and the placement plate 301 is moved to the interior of the shaping box 1, and the sliding rod 304 is inserted into the inner side of the corresponding sliding sleeve 305, and the position of the placement plate 301 can be limited under the cooperation between the four sliding rods 304 and the four sliding sleeves 305, and the sealing cover 4 is closed, and the hot air blower 201 is started, and the hot air can be continuously transported to the interior of the shaping box 1, so as to dry the semiconductor diodes inside, and the driving mechanism 204 is started, which can drive the rotating plate 207 to rotate, so that the placement plate 301 rotates, and the electric push rod 208 is started, and the placement plate 301 can be placed through the push plate 209. The placing plate 301 is pushed upward, and under the action of gravity, when the electric push rod 208 is retracted downward, the placing plate 301 can also move downward, so as to facilitate the uniform drying of the internal semiconductor diodes. In the drying process, the next batch of semiconductor diodes to be integrated with the developing and fixing can be placed in another placing plate 301 outside to wait. After the semiconductor diodes inside the fixing box 1 are dried, according to the above principle, the placing plate 301 is taken out from the inside of the fixing box 1 through the cooperation of the moving part 307 and the corresponding two rings 303, and then the external placing plate 301 is moved to the inner side of the fixing box 1 through the moving part 307 for placement and positioning, so that the next batch of semiconductor diodes to be integrated with the developing and fixing can be dried quickly. At this time, the dried semiconductor diodes can be taken out from the inner side of the placing plate 301, and the semiconductor diodes can continue to be placed to achieve continuous production.

[0036] Compared with the prior art, the semiconductor diode production device with integrated development and fixing can further improve the operational convenience through the coordinated use of the drying component 200 and the placement component 300 inside the fixing box 1, so that the production device can place the next batch of semiconductor diodes in advance when performing the drying work, so that the next batch of semiconductor diodes can be directly placed after the previous batch of semiconductor diodes are dried, which is convenient for efficient production work and effectively improves the practicability of the semiconductor diode production device with integrated development and fixing, and solves the problem that the existing semiconductor diode production device wastes a lot of time during actual operation and is not convenient in actual operation.

[0037] The electrical components appearing in the article are all electrically connected to the main controller and the power supply. The provision of power supply is common knowledge in the field. The main controller can be a conventional known device for control such as a computer, which can be realized through simple programming by technicians in the field. They are all existing public power connection technologies and will not be described in detail in the article.

[0038] It should be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or device including the element.

[0039] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention.

Claims

1. A semiconductor diode production device with integrated development and fixing, comprising a fixing box (1), characterized in that: A drying assembly (200) for drying and shaping is installed on the inner side of the shaping box (1), a placement assembly (300) for placing semiconductor diodes is installed on the inner side of the shaping box (1), and a sealing cover (4) is hingedly connected to the top of the shaping box (1) via a hinge; The placement assembly (300) comprises a placement plate (301) located inside the shaping box (1), two fixing rods (302) fixed to the inner bottom wall of the placement plate (301), a ring (303) fixed to the end of the fixing rod (302), four sliding rods (304) fixed to the bottom of the placement plate (301), a sliding sleeve (305) sleeved on the outside of the sliding rod (304), a hook (306) fixed to the outside of the shaping box (1), and a moving part (307) hung on the outside of the hook (306).

2. The semiconductor diode production device integrating development and fixing according to claim 1, characterized in that: The drying assembly (200) comprises a hot air blower (201) fixedly mounted on the outside of the shaping box (1), an air outlet pipe (202) fixedly mounted on the outside of the shaping box (1), a support frame (203) fixedly mounted on the inner bottom wall of the shaping box (1), a driving mechanism (204) fixedly mounted on the top of the support frame (203), four vertical rods (205) fixedly mounted on the inner bottom wall of the shaping box (1), a support plate (206) fixedly mounted between the top ends of the four vertical rods (205), a rotating plate (207) placed in close contact with the top of the supporting plate (206), an electric push rod (208) fixedly mounted on the top of the rotating plate (207), and a push plate (209) fixedly mounted on the output shaft of the electric push rod (208).

3. The semiconductor diode production device integrating development and fixing according to claim 1, characterized in that: A rubber gasket is bonded to the fitting surface of the sealing cover (4) and the shaping box (1), and a lock buckle is fixedly installed between the sealing cover (4) and the outer side of the shaping box (1).

4. The semiconductor diode production device integrating development and fixing according to claim 2, characterized in that: The four sliding rods (304) are respectively inserted and slidably connected to the inner sides of four sliding sleeves (305), the top ends of the sliding sleeves (305) are open, and the bottom ends of the sliding sleeves (305) are fixedly connected to the top of the rotating plate (207).

5. The semiconductor diode production device integrating development and fixing according to claim 1, characterized in that: The moving member (307) is composed of a straight rod, two oblique rods and hooks fixedly connected to the ends of the oblique rods, and is arched. The two oblique rods are inclined away from each other, and the two hooks can be plugged into the inner sides of the two rings (303) at the same time.

6. The semiconductor diode production device integrating development and fixing according to claim 2, characterized in that: The output end of the hot air blower (201) passes through the outside of the shaping box (1) and extends to the inside of the shaping box (1), and the bottom of the rotating plate (207) and the top of the supporting plate (206) are both smooth surfaces.

7. The semiconductor diode production device integrating development and fixing according to claim 2, characterized in that: The output shaft of the driving mechanism (204) passes through the bottom of the supporting plate (206) and is fixedly connected to the bottom of the rotating plate (207), and the top of the pushing plate (209) abuts against the bottom of the placement plate (301).

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