A magnetic head structure, card reader and card swiping device

Abstract

The utility model discloses a magnetic head structure, a card reader and a card swiping device. The magnetic head structure includes a magnetic head base and an FPC. The bottom of the magnetic head base is provided with a mounting groove. The pins of the magnetic head structure have a welding plane. The FPC is accommodated in the mounting groove. The side of the FPC facing the mounting groove is provided with a back soldering pad, and the back soldering pad is welded and fixed to the welding plane. The pins of the magnetic head structure do not need to pass through the FPC, so the length of the pins extending toward the bottom surface of the magnetic head base can be shortened, and then the height between the bottom wall of the mounting groove and the bottom surface of the magnetic head base can be shortened, and finally the overall height of the magnetic head structure can be reduced, and the volume of the magnetic head structure can be reduced. In addition, the magnetic head structure after welding will not form a convex hull on the FPC. Therefore, after appropriately reducing the height between the front of the FPC and the bottom surface of the magnetic head base, the glue injection sealing thickness can still be met, so that the overall height of the magnetic head structure can be further reduced, and the volume of the magnetic head structure can be reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of magnetic heads, in particular to a magnetic head structure, a card reader and a card swiping device. Background Art

[0002] like Figure 1 As shown, the magnetic head structure in the prior art generally includes a magnetic head base and an FPC. The bottom of the magnetic head base is provided with a mounting groove for accommodating the FPC. The pins of the magnetic head structure penetrate the bottom wall of the mounting groove from the inside of the magnetic head structure and extend toward the bottom surface of the magnetic head base. A solder pad is provided on the FPC, and a through hole is provided at the center of the solder pad. The inner diameter of the through hole is larger than the outer diameter of the pin. Figure 2 and Figure 3 During assembly, place the FPC into the mounting slot so that the pins pass through the pad holes of the FPC. The FPC needs to fit snugly to the bottom of the pin to ensure that the height of the pin exposed from the pad is high enough to ensure the reliability of welding. However, in actual production welding, since the FPC is thin and soft, it may not fit well to the bottom of the pin, and it may float, resulting in insufficient solder space between the pin and the FPC pad, thus affecting the welding quality. Therefore, in order to ensure the quality of welding, it is necessary to ensure that the extension length of the pin is large enough, which requires occupying a larger internal space of the magnetic head, resulting in a larger overall volume of the magnetic head. In addition, referring to Figure 3 and Figure 4 After the soldering is completed, the solder paste solidifies and wraps the pins and FPC pads, forming a cone-shaped bulge, which occupies the space between the front of the FPC and the bottom of the head base, so that the internal height of the head needs to be increased to wrap the solder bulge inside the head to achieve glue injection and potting coverage, which further increases the internal space of the head and the overall volume of the head. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the utility model aims to provide a magnetic head structure, which can save the internal space of the magnetic head structure and reduce the volume of the magnetic head structure.

[0004] In order to solve the above problems, the technical solution adopted by the utility model is as follows: a magnetic head structure, including a magnetic head base and an FPC; a mounting groove is opened at the bottom of the magnetic head base, and the pins of the magnetic head structure pass through the bottom wall of the mounting groove from the inside of the magnetic head structure and extend toward the bottom surface of the magnetic head base, and the pins have a welding plane, and the welding plane faces the bottom surface of the magnetic head base; the FPC is accommodated in the mounting groove, and a back pad is provided on one side of the FPC facing the mounting groove, and the back pad is welded and fixed to the welding plane.

[0005] Compared with the prior art, the beneficial effect of the utility model is that: the magnetic head structure is provided with a welding plane on the pin, and a back soldering pad is provided on the FPC. By welding and fixing the back soldering pad and the welding plane, the FPC can be electrically connected and fixedly connected to the magnetic head base. Therefore, the pins of the magnetic head structure do not need to pass through the FPC, so that the extension length of the pins can be shortened, and then the height between the bottom wall of the mounting groove and the bottom surface of the magnetic head base can be shortened, and finally the overall height of the magnetic head structure can be reduced, the internal space of the magnetic head structure can be saved, and the volume of the magnetic head structure can be reduced. In addition, the magnetic head structure after welding will not form a convex solder structure occupying the internal space of the magnetic head on the FPC. Therefore, after appropriately reducing the height between the front of the FPC and the bottom surface of the magnetic head base, the thickness of the glue injection seal can still be met, so that the overall height of the magnetic head structure can be further reduced, the internal space of the magnetic head structure can be saved, and the volume of the magnetic head structure can be reduced.

[0006] In the above magnetic head structure, a front soldering pad is provided on a side of the FPC away from the mounting groove, and the front soldering pad is electrically connected to the back soldering pad.

[0007] In the above magnetic head structure, a via hole is provided on the FPC, and the via hole passes through the front pad and the back pad.

[0008] In the above magnetic head structure, the front solder pad is covered with a protective film.

[0009] In the above magnetic head structure, the via hole is a metallized hole.

[0010] In the above-mentioned magnetic head structure, the pin comprises an extending section and a bending section which are connected to each other, and the welding plane is located at the bending section.

[0011] In the above magnetic head structure, the pins and the back pads are both provided in plurality.

[0012] In the above magnetic head structure, the welding plane and the back welding pad are fixed by thermal compression welding.

[0013] The utility model also provides a card reader, comprising the magnetic head structure mentioned above, which at least has all the beneficial effects that can be brought by the magnetic head structure mentioned above.

[0014] The utility model also provides a card swiping device, comprising the above-mentioned magnetic head structure, which at least has all the beneficial effects that can be brought by the above-mentioned magnetic head structure.

[0015] The utility model is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an exploded view of a magnetic head structure in the prior art;

[0017] Figure 2 It is a structural schematic diagram of the FPC of the magnetic head structure in the prior art after being placed in the mounting groove;

[0018] Figure 3 It is a schematic diagram of the structure of the magnetic head structure in the prior art after welding is completed;

[0019] Figure 4 is a cross-sectional view of a magnetic head structure in the prior art after welding is completed;

[0020] Figure 5 An exploded view of the magnetic head structure of an embodiment of the utility model;

[0021] Figure 6 This is a schematic diagram of the structure of the magnetic head structure after the FPC of the embodiment of the utility model is placed in the installation groove;

[0022] Figure 7 It is a cross-sectional view of the local structure after the FPC of the magnetic head structure of the embodiment of the utility model is placed in the installation groove;

[0023] Figure 8 This is one of the cross-sectional views of the local structure of the magnetic head structure after welding is completed in the embodiment of the utility model;

[0024] Fig. 9 This is the second cross-sectional view of the local structure of the magnetic head structure after welding according to the embodiment of the utility model.

[0025] Description of the accompanying drawings: 100 head base, 110 mounting slot, 120 pin, 121 welding plane, 200 FPC, 210 back pad, 220 front pad, 230 via, 240 protective film. DETAILED DESCRIPTION

[0026] The embodiments of the present invention are described in detail below. Figures 5 to 9 The embodiment of the utility model provides a magnetic head structure, including a magnetic head base 100 and an FPC 200. Figure 5 The bottom of the head base 100 is provided with a mounting groove 110, and the pin 120 of the head structure passes through the bottom wall of the mounting groove 110 from the inside of the head structure and extends toward the bottom surface of the head base 100. The pin 120 has a welding plane 121, and the welding plane 121 faces the bottom surface of the head base 100. Figures 6 to 8 The FPC 200 is accommodated in the mounting groove 110 , and a back soldering pad 210 is provided on a side of the FPC 200 facing the mounting groove 110 . The back soldering pad 210 is fixed to the welding plane 121 by welding.

[0027] Compared with the prior art, the present magnetic head structure is provided with a welding plane 121 on the pin 120, and a back soldering pad 210 is provided on the FPC 200. By welding and fixing the back soldering pad 210 and the welding plane 121, the FPC 200 can be electrically connected and fixedly connected to the magnetic head base 100. Therefore, the pin 120 of the present magnetic head structure does not need to pass through the FPC 200, so that the length of the pin 120 extending toward the bottom surface of the magnetic head base 100 can be shortened, and then the height between the bottom wall of the mounting groove 110 and the bottom surface of the magnetic head base 100 can be shortened, that is, the groove depth of the mounting groove 110 can be reduced, and finally the overall height of the magnetic head structure can be reduced, the internal space of the magnetic head structure can be saved, and the volume of the magnetic head structure can be reduced. In addition, after the welding is completed, the head structure will not form a convex solder structure on the FPC200 that occupies the internal space of the head. Therefore, after appropriately reducing the height between the front surface of the FPC200 and the bottom surface of the head base 100, the glue injection sealing thickness can still be met, thereby further reducing the overall height of the head structure, saving the internal space of the head structure, and reducing the volume of the head structure.

[0028] It is understandable that in the magnetic head structure of the present invention, the height between the bottom wall of the mounting slot 110 and the top of the magnetic head base 100 is not changed, and is consistent with the height in the prior art. Fig. 9 and Figure 4 It can be seen from the comparison that in the present magnetic head structure, the groove depth of the mounting groove 110 is less than the groove depth in the prior art. Therefore, the bottom height of the magnetic head base 100 is reduced, thereby reducing the overall height of the magnetic head structure. Figure 4 and Fig. 9 , the groove depth of the mounting groove 110 = pin welding height + FPC thickness + glue injection sealing thickness. Compared with the prior art, the FPC thickness in the present magnetic head structure remains unchanged, but the pin welding height and the glue injection sealing thickness are both smaller than the prior art. Therefore, the overall height of the present magnetic head structure is significantly smaller than the magnetic head structure in the prior art. In addition, it can also be understood that the magnetic head structure of the present utility model replaces the current DIP welding magnetic head, and is therefore suitable for FPC welding that does not require MESH protection. For FPC welding that requires MESH protection, it is another type of SMT magnetic head, which will not be elaborated here.

[0029] Furthermore, the pin 120 includes an extension section and a bending section connected to each other, and the welding plane 121 is located in the bending section, so as to form the welding plane 121 on the pin 120. For example, the existing pin can be directly bent, so as to achieve the purpose of reducing the length of the pin 120 extending toward the head base 100 and forming the welding plane 121 on the pin 120. Furthermore, a front pad 220 is provided on the side of the FPC 200 away from the mounting groove 110, and the front pad 220 is electrically connected with the back pad 210. While retaining the functions of the existing magnetic head structure, there is no other structure between the front surface of the FPC 200 and the bottom surface of the magnetic head base 100 of the magnetic head structure. Therefore, the height between the front surface of the FPC 200 and the bottom surface of the magnetic head base 100 only needs to meet the thickness of the injection seal.

[0030] Further, refer to Figure 7 and Figure 8 , a via 230 is provided on the FPC 200, and the via 230 passes through the front pad 220 and the back pad 210. Before assembling the FPC 200 and the magnetic head base 100, solder paste is first applied to the back pad 210 of the FPC 200, and then the FPC 200 is installed in the mounting groove 110, and the solder paste on the back pad 210 of the FPC 200 contacts the welding plane 121 on the top surface of the pin 120. During welding, the back pad 210, the welding plane 121 and the via 230 are all filled with solder paste. After welding, the solder paste solidifies to fix the back pad 210 and the welding plane 121, and the solidified part of the solder paste is filled in the via 230. The staff can observe and judge whether the soldering effect of the pin 120 is sufficient and full according to the soldering condition in the via 230, so as to form a visual and reliable welding. Furthermore, the pins 120, the back pads 210 and the front pads 220 are all provided in multiple and one-to-one correspondence, and the welding plane 121 and the back pads 210 can be welded and fixed by hot pressing, and a welding head covering all FPC pads is pressed down for heating and welding, so that all pins 120 can be welded to FPC200 at one time, without welding one by one like the current DIP welding head, thereby improving work efficiency and making it easier to achieve excellent welding effects. Furthermore, the vias 230 can be set as metallized holes, so that it is easy to achieve electrical conduction between the front pads 220 and the back pads 210. Further, continue to refer to Figure 7 and Figure 8 The front pad 220 is covered with a protective film 240 to prevent solder paste from overflowing from the via 230 onto the front pad 220 .

[0031] Furthermore, an embodiment of the utility model also provides a card reader, including the above-mentioned magnetic head structure, which at least has all the beneficial effects that can be brought by the above-mentioned magnetic head structure.

[0032] Furthermore, an embodiment of the utility model also provides a card swiping device, including the above-mentioned magnetic head structure, which at least has all the beneficial effects that can be brought by the above-mentioned magnetic head structure.

[0033] It should be noted that in the description of the present invention, if there are any orientation descriptions, such as up, down, front, back, left, right, etc., the orientations or positional relationships indicated are all based on the orientations or positional relationships shown in the drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed or operated in a specific orientation, and cannot be understood as a limitation on the present invention.

[0034] In the description of the present utility model, "several" means one or more, "more" means two or more, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0035] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0036] The above-mentioned implementation modes are only preferred implementation modes of the present invention, and cannot be used to limit the protection scope of the present invention. Any non-substantial changes and substitutions made by technicians in this field on the basis of the present invention shall fall within the scope of protection required by the present invention.

Claims

1. A magnetic head structure, characterized in that: It comprises a magnetic head base (100) and an FPC (200); The bottom of the magnetic head base (100) is provided with a mounting groove (110); the pin (120) of the magnetic head structure passes through the bottom wall of the mounting groove (110) from the inside of the magnetic head structure and extends toward the bottom surface of the magnetic head base (100); the pin (120) has a welding plane (121), and the welding plane (121) faces the bottom surface of the magnetic head base (100); The FPC (200) is accommodated in the installation groove (110), and a back soldering pad (210) is provided on a side of the FPC (200) facing the installation groove (110), and the back soldering pad (210) is fixed to the welding plane (121) by welding.

2. The magnetic head structure according to claim 1, characterized in that: A front soldering pad (220) is provided on a side of the FPC (200) away from the mounting groove (110), and the front soldering pad (220) is electrically connected to the back soldering pad (210).

3. The magnetic head structure according to claim 2, characterized in that: The FPC (200) is provided with a via hole (230), and the via hole (230) passes through the front solder pad (220) and the back solder pad (210).

4. The magnetic head structure according to claim 3, characterized in that: The front solder pad (220) is covered with a protective film (240).

5. The magnetic head structure according to claim 3, characterized in that: The via hole (230) is a metallized hole.

6. The magnetic head structure according to claim 1, characterized in that: The pin (120) comprises an extending section and a bending section which are connected to each other, and the welding plane (121) is located in the bending section.

7. The magnetic head structure according to claim 1, characterized in that: The pins (120) and the back solder pads (210) are both provided in plurality.

8. The magnetic head structure according to claim 7, characterized in that: The welding plane (121) and the back side welding pad (210) are welded and fixed by means of hot pressing welding.

9. A card reader, characterized in that: Comprising the magnetic head structure as described in any one of claims 1-8.

10. A card swiping device, characterized in that: Comprising the magnetic head structure as described in any one of claims 1-8.

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