Wafer test structure

Abstract

The present application relates to the field of wafer testing technology, and provides a wafer testing structure, including a test box, a transport door panel, a card changing door panel, and a drying assembly. The test box has a test chamber and a wafer transport window and a card changing window connected to the test chamber; the transport door panel can be movably installed at the wafer transport window, and a first seal is provided between the transport door panel and the test box; the card changing door panel can be movably installed at the card changing window, and a second seal is provided between the card changing door panel and the test box; the drying assembly is used to introduce dry gas into the test chamber; the drying assembly includes an injection pipe and a manifold, the injection pipe is arranged on the cavity wall of the test chamber along the circumference of the test chamber, the injection pipe is constructed with a plurality of injection holes arranged at intervals, and the manifold is connected to the injection pipe and extends out of the test chamber. The wafer testing structure provided in the present application is used to meet the test environment requirements of the wafer in a low temperature environment, and is convenient for controlling the dew point temperature during the test to ensure the safety of the test.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a wafer testing structure. Background Art

[0002] Since some wafer products will be used in low-temperature environments, they need to be placed in low-temperature environments for testing during wafer manufacturing to ensure good low-temperature performance. Usually, during low-temperature testing, the wafer temperature is controlled below 0°C, or even up to -55°C. At this time, if the water vapor content in the low-temperature environment is high, or the low-temperature wafer is directly exposed to the air, it is easy to cause frost or ice. Therefore, how to keep the inside of the test chamber in a relatively dry test environment during low-temperature testing is an urgent problem to be solved. Utility Model Content

[0003] Based on this, it is necessary to provide a wafer testing structure to meet the testing environment requirements of the wafer in a low temperature environment and ensure the safety of the test.

[0004] A wafer testing structure, comprising:

[0005] A test box body, comprising a test cavity and a wafer transport window and a card replacement window connected to the test cavity;

[0006] A transport door plate is movably mounted at the wafer transport window, and a first seal is provided between the transport door plate and the test box;

[0007] A card changing door plate is movably installed at the card changing window, and a second seal is provided between the card changing door plate and the test box body;

[0008] A drying component is used to introduce dry gas into the test cavity; the drying component includes an injection pipe and a manifold, the injection pipe is arranged in the test cavity along the circumference of the test cavity, the injection pipe is configured with a plurality of injection holes arranged at intervals, and the manifold is connected to the injection pipe and extends out of the test cavity.

[0009] It is understandable that the wafer handling window is used to move the wafer into or out of the test chamber, and the card changing window is used to replace the test mechanism for wafer testing in the test chamber. The drying component introduces dry gas into the test chamber to reduce the water vapor content in the air in the test chamber. When the dew point temperature in the test chamber reaches the target temperature, the low-temperature test of the wafer can be carried out to ensure the safety of the test. Since the injection pipe in the drying component is arranged circumferentially around the test chamber, the introduced dry gas can be evenly filled in the test chamber, ensuring that the water vapor content of the air around the wafer is evenly reduced and consistent, further improving the safety of wafer testing. At the same time, it is precisely because of the setting of the first seal and the second seal that the transport door plate can seal the wafer transport window and the card changing door plate can seal the card changing window, ensuring the sealing of the test chamber, avoiding leakage of dry gas through the wafer transport window and the card changing window, and further ensuring that the water vapor content in the test chamber is in a low state, avoiding frost or ice on the wafer in a low temperature environment.

[0010] In some of the embodiments, the injection pipe includes a plurality of connectors and a plurality of connecting pipe segments, the plurality of connecting pipe segments are arranged along the circumference of the test cavity, and any two adjacent connecting pipe segments are connected via a connector, and at least one connecting pipe segment is connected to the manifold; and / or, the drying component also includes a dryer, which is connected to an end of the manifold away from the injection pipe and is disposed outside the test box; and / or, the plurality of injection holes are arranged in the injection pipe at intervals along the circumference of the test cavity.

[0011] In some embodiments, a fixed door frame is provided at the wafer handling window, and the fixed door frame and / or the handling door panel are provided with a first sealing member, and the first sealing member forms the first seal.

[0012] In some embodiments, the fixed door frame is constructed with a sealing flange, the transport door plate is arranged on one side of the fixed door frame along the Z-axis direction, the transport door plate can move relative to the fixed door frame along the Z-axis direction, and the first sealing member is pressed between the sealing flange and the transport door plate.

[0013] In some of the embodiments, along the Z-axis direction, the fixed door frame has a closed side and an open side that are relatively and spaced apart, and the closed side is located downstream of the open side in the closing direction of the transport door panel; the sealing flange is arranged around the wafer transport window, and the sealing flange is configured with an avoidance notch located at the open side, and the transport door panel is protrudingly provided with an abutment flange away from the closed side, and the abutment flange can be pressed on a side edge of the avoidance notch away from the closed side.

[0014] In some embodiments, the width of the transport door panel along a first direction gradually increases from the closed side toward the open side; the first direction, the Z-axis direction and the thickness direction of the transport door panel are arranged at angles to each other.

[0015] In some of the embodiments, the wafer testing structure also includes a power source, which is installed on the test box and connected to the transport door plate, and the power source is used to drive the transport door plate to reciprocate along the Z-axis direction; and / or the transport door plate is slidably connected to the test box, and a guide member is arranged between the two.

[0016] In some embodiments, a door frame is provided at the card changing window, and a second sealing ring is provided on the door frame and / or the card changing door panel, and the second sealing ring forms the second seal.

[0017] In some embodiments, the wafer testing structure further includes a wafer fixing plate and a dew point sensor, the wafer fixing plate and the dew point sensor are both installed in the testing chamber, the injection pipe is arranged around the outer side of the wafer fixing plate, and the dew point sensor is arranged close to the wafer fixing plate.

[0018] In some of the embodiments, the test box is formed by at least splicing a plurality of sheet metal plates, and a sealing strip is provided at the joint of each of the sheet metal plates. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0020] Figure 1 A schematic diagram of a wafer test structure provided in one embodiment of the present application;

[0021] Figure 2 A first partial schematic diagram of a wafer test structure provided by an embodiment of the present application;

[0022] Figure 3 A schematic diagram of a drying component in a wafer testing structure provided in an embodiment of the present application;

[0023] Figure 4 for Figure 2 A first schematic diagram of cooperation between a transport door panel and a fixed door frame in a wafer testing structure provided;

[0024] Figure 5 for Figure 2A second schematic diagram of cooperation between a transport door panel and a fixed door frame in a wafer testing structure provided;

[0025] Figure 6 A second partial schematic diagram of a wafer test structure provided by an embodiment of the present application;

[0026] Figure 7 A third partial schematic diagram of a wafer test structure provided in an embodiment of the present application.

[0027] Figure numerals: 10, test box; 101, test cavity; 102, wafer handling window; 103, card changing window; 11, fixed door frame; 111, sealing flange; 112, avoidance gap; 1101, closed side; 1102, open side; 12, door frame; 20, drying component; 21, spray pipe; 2101, spray hole; 211, connecting pipe section; 212, connecting piece; 212a, first connecting piece; 212b, second connecting piece; 22, manifold; 23, dryer; 30, handling door panel; 31, abutting flange; 40, card changing door panel; 50, power source; 51, guide piece; 52, mounting substrate. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0029] It should be noted that when a component is referred to as being "fixed to" or "disposed on" another component, it may be directly on the other component or there may also be a central component. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may be a central component at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in the specification of this application are for illustrative purposes only and do not represent the only implementation method.

[0030] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first feature is directly in contact with the second feature, or the first feature and the second feature are indirectly in contact through an intermediate medium. Moreover, a first feature being “above”, “above” or “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below” or “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] Unless otherwise defined, all technical and scientific terms used in the specification of this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in the specification of this application includes any and all combinations of one or more related listed items.

[0033] See also Figures 1 to 3 An embodiment of the present application provides a wafer test structure, including a test box 10, a drying assembly 20, a transport door plate 30 and a card changing door plate 40. The test box 10 has a test chamber 101 and a wafer transport window 102 and a card changing window 103 connected to the test chamber 101. The transport door plate 30 can be movably installed at the wafer transport window 102, and a first seal is provided between the transport door plate 30 and the test box 10; the card changing door plate 40 can be movably installed at the card changing window 103, and a second seal is provided between the card changing door plate 40 and the test box 10. The drying assembly 20 is used to pass dry gas into the test chamber 101. The drying assembly 20 includes an injection pipe 21 and a manifold 22. The injection pipe 21 is arranged in the test chamber 101 along the circumference of the test chamber 101, and the injection pipe 21 is configured with a plurality of injection holes 2101 arranged at intervals. The manifold 22 is connected to the injection pipe 21 and extends out of the test chamber 101.

[0034] Specifically, the wafer can be moved into or out of the test chamber 101 through the wafer handling window 102, and the card replacement window 103 can facilitate the replacement of the test mechanism (such as a probe card) for wafer testing in the test chamber 101. The drying component 20 introduces dry gas into the test chamber 101 to reduce the water vapor content in the air in the test chamber 101. Since the injection pipe 21 in the drying component 20 is arranged circumferentially around the test chamber 101, the introduced dry gas can be evenly filled in the test chamber 101 through the injection hole 2101, ensuring that the water vapor content in the air around the wafer is evenly reduced and consistent, further ensuring that the test chamber 101 is in a dry test environment to improve the safety of wafer testing. At the same time, due to the setting of the first seal and the second seal, the transport door panel 30 can seal the wafer transport window 102, and the card changing door panel 40 can seal the card changing window 103, thereby ensuring the sealing of the test chamber 101, avoiding leakage of dry gas through the wafer transport window 102 and the card changing window 103, and further ensuring that the water vapor content in the test chamber 101 is in a low state, avoiding frost or ice on the wafer in a low temperature environment.

[0035] like Figure 2 As shown, in some specific embodiments, a plurality of injection holes 2101 are arranged at intervals on the injection pipe 21 along the circumference of the test chamber 101. Such an arrangement further ensures that the dry gas introduced through the manifold 22 and the injection pipe 21 can be more evenly distributed into the test chamber 101, ensuring the consistency of the water vapor content. Among them, the nozzles of the plurality of injection holes 2101 can be directed horizontally toward the interior of the test chamber 101, or partially downward in the vertical direction, partially upward in the vertical direction, and partially inward in the horizontal direction. It is sufficient as long as it can ensure that the dry gas is evenly introduced.

[0036] The diameter of the injection hole 2101 is relatively small, so that the drying gas can be accelerated and ejected at the injection hole 2101 .

[0037] Meanwhile, the injection tube 21 can be directly fixed on the cavity wall of the test cavity 101. In this case, a plurality of annular collars arranged at intervals along the circumferential direction can be provided on the cavity wall of the test cavity 101, and the injection tube 21 is clamped on the annular collars to achieve fixation. Of course, a bracket can also be installed in the test cavity 101 to support the injection tube 21. It only needs to ensure that the injection tube 21 is installed in the test cavity 101 in an annular shape.

[0038] Please combine Figure 2 and Figure 3In some optional embodiments, the injection pipe 21 includes a plurality of connectors 212 and a plurality of connecting pipe sections 211, the plurality of connecting pipe sections 211 are arranged along the circumference of the test cavity 101, and any two adjacent connecting pipe sections 211 are connected through a connector 212, and at least one connecting pipe section 211 is connected to a manifold 22. In other words, the injection pipe 21 can be formed by splicing a plurality of connecting pipe sections 211 through connectors 212, which is convenient for assembly and disassembly; and such a setting facilitates the adjustment of the size of the annular injection pipe 21, that is, the size of the annular shape, which is not only convenient for adjusting the installation position of the injection pipe 21, but also adaptable to test cavities 101 of different sizes. Among them, the connector 212 is used for the connection of two connecting pipe sections 211, which can be two axially identical connecting pipe sections 211, or two axially intersecting connecting pipe sections 211. In addition, the connector 212 can also be used for the connection between the injection pipe 21 and the manifold 22.

[0039] Specifically, take the test cavity 101 as a cube or a cuboid as an example. Multiple connectors 212 can be divided into a first connector 212a and a second connector 212b. The first connector 212a is arranged in an L shape, and has two interfaces arranged at an angle, which are used to connect and communicate two connecting pipe sections 211 at the corners of the test cavity 101. The second connector 212b is T-shaped and has three interfaces, two of which are coaxially arranged, and the axis of the other interface is arranged at an angle thereto; at this time, the two coaxially arranged interfaces are used to connect and communicate two connecting pipe sections 211 with the same axial direction, and the other interface arranged at an angle is connected to the manifold 22. Of course, the manifold 22 can also be connected to two angled connecting pipe sections 211, in which case the connector 212 has three interfaces arranged at an angle to the axis.

[0040] Alternatively, a hole may be formed in the side wall of one of the connecting pipe sections 211 , and one end of the manifold 22 may be welded to the hole, as long as the manifold 22 is connected to the injection pipe 21 .

[0041] like Figures 1 to 3 As shown, the drying assembly 20 also includes a dryer 23, which is connected to the end of the manifold 22 away from the injection pipe 21 and is arranged outside the test box 10. The dryer 23 is used to dry the gas, reduce the water vapor content in the gas, and even remove the water vapor in the gas. The dried dry gas is passed into the injection pipe 21 through the manifold 22, and then sprayed into the test chamber 101 through the multiple injection holes 2101.

[0042] The specific structure and working principle of the dryer 23 are existing mature technologies, so they are not described here in detail.

[0043] See also Figure 1 , Figure 2 , Figure 4 and Figure 5 In an optional embodiment, a fixed door frame 11 is provided at the wafer transport window 102, and a first sealing member is provided on the transport door panel 30, and the first sealing member forms a first seal. The fixed door frame 11 is provided to ensure that the transport door panel 30 can be pressed against the fixed door frame 11, so that the first sealing member is pressed between the transport door panel 30 and the fixed door frame 11, thereby achieving sealing at the wafer transport window 102. The fixed door frame 11 protrudes relative to the test box 10, ensuring that there is sufficient pressing area with the transport door panel 30.

[0044] Specifically, the fixed door frame 11 is configured with a sealing flange 111, the transport door panel 30 is arranged on one side of the fixed door frame 11 along the Z-axis direction, the transport door panel 30 can move relative to the fixed door frame 11 along the Z-axis direction, and the first sealing member is pressed between the sealing flange 111 and the transport door panel 30. At this time, the first sealing member can be arranged on the side of the transport door panel 30 along the Z-axis direction facing the sealing flange 111, so as to facilitate compression and sealing; and such a setting can also limit the movement of the transport door panel 30 along the Z-axis direction, so as to prevent the transport door panel 30 from moving excessively and affecting the sealing performance. Among them, the first sealing member can be a sealing strip or a sealing ring.

[0045] The fixed door frame 11 also includes a connecting substrate (not shown in the figure) pressed against the inner wall of the test box 10, the connecting substrate is provided with a hole adapted to the wafer handling window 102, a sealing flange 111 is arranged along the circumference of the hole and protrudes along the thickness direction of the connecting substrate, and the side of the connecting substrate away from the sealing flange 111 is pressed against the inner wall of the test box 10, and is fastened to the test box 10 by screws or bonded, welded, etc.

[0046] like Figure 4 and Figure 5 As shown, in some embodiments, along the Z-axis direction, the fixed door frame 11 has a closed side 1101 and an open side 1102 that are opposite and spaced apart, and the closed side 1101 is located downstream of the open side 1102 in the closing direction of the transport door plate 30. The sealing flange 111 is arranged around the wafer transport window 102, and the sealing flange 111 is configured with an avoidance notch 112 located at the open side 1102. The transport door plate 30 is convexly provided with an abutting flange 31 away from the closed side 1101, and the abutting flange 31 can be pressed on a side edge of the avoidance notch 112 away from the closed side 1101.

[0047] For example, the transport door panel 30 moves upward along the Z-axis direction to close the wafer transport window 102, and moves downward to open the wafer transport window 102. At this time, the closing direction of the transport door panel 30 is the upward direction along the Z-axis. Then, the closed side 1101 is the end position of the transport door panel 30 moving upward, and the open side 1102 is the position where the transport door panel 30 moves downward to completely move out of the wafer transport window 102. The setting of the annular sealing flange 111 is used to ensure that the wafer transport window 102 can be pressed with the transport door panel 30 along its own circumference for sealing. At this time, the corresponding first sealing member is also set along the circumference of the wafer transport window 102 to ensure the sealing in the circumferential direction. In this process, an avoidance gap 112 is constructed on the open side 1102 of the fixed door panel to avoid interference with the Z-axis reciprocating movement of the transport door panel 30; and, considering the sealing performance at the avoidance gap 112, a protruding abutting flange 31 on the transport door panel 30 is utilized to press the sealing flange 111 on the side of the avoidance gap 112 away from the closed side 1101 to form a seal.

[0048] Furthermore, from the closed side 1101 toward the open side 1102, the width of the transport door panel 30 along the first direction gradually increases. Among them, the first direction, the Z-axis direction and the thickness direction of the transport door panel 30 are set at angles in pairs. The transport door panel 30 is set in an isosceles trapezoidal shape, including a horizontal edge and a hypotenuse connected to the horizontal edge, and the horizontal edge is connected to the hypotenuse on both sides along its own length direction. The shape of the sealing flange 111 is compatible with the shape of the transport door panel 30, ensuring that the horizontal edge and the two hypotenuses of the transport door panel 30 are pressed against the corresponding sealing flange 111 to ensure sealing. At this time, a first sealing member can be attached to the horizontal edge and the two hypotenuses of the transport door panel 30, and a first sealing member is also attached to the upper surface of the abutting flange 31 of the transport door panel 30 to ensure sealing.

[0049] The first sealing member may be a sealing strip, so as to adapt to different assembly positions.

[0050] Alternatively, the first sealing member may also be pasted on the sealing flange 111 , as long as it satisfies the sealing between the transport door panel 30 and the fixed door frame 11 and reduces and avoids gas leakage.

[0051] like Figure 2 and Figure 4As shown, further, the wafer test structure also includes a power source 50, which is installed on the test box 10 and connected to the transport door plate 30, and the power source 50 is used to drive the transport door plate 30 to move back and forth along the Z-axis direction. The power source 50 can be a mechanism for realizing linear motion such as an electric push rod, a cylinder, a linear module, etc. With the setting of the power source 50, the opening and closing adjustment of the transport door plate 30 can be performed by an electric control method, and the operation is more convenient. In actual use, the transport door plate 30 is slidably connected to the test box 10, and a guide member 51 is provided between the two to guide the movement of the transport door plate 30, ensuring that the transport door plate 30 will not be offset and cause the sealing to be damaged. Among them, the guide member 51 can be a guide rail, and a slide groove can be provided on the transport door plate 30 at this time, so as to utilize the slide groove to slide with the guide rail. Alternatively, a slider is connected to the side of the transport door plate 30 facing the test box 10, and the slider is configured with a slide groove to slide with the guide rail.

[0052] In actual use, two guide members 51 are provided and spaced apart along the X-axis direction. The two guide members 51 can be integrated and assembled on the mounting base plate 52, and the mounting base plate 52 is screwed and fixed to the test box 10. The power source 50 is installed between the two guide members 51 and connected to the mounting base plate 52.

[0053] In an alternative embodiment, the transport door panel 30 may also be movable along the X-axis direction. In this case, the arrangement of the transport door panel 30 relative to the test box 10 is substantially similar to that described above, and thus will not be described in detail.

[0054] See also Figure 1 , Figure 6 and Figure 7 , exemplarily, a door frame 12 is provided at the card changing window 103, and a second sealing ring is provided at the door frame 12 or the card changing door panel 40, and the second sealing ring forms a second seal. Preferably, the door frame 12 is provided at the edge of the card changing window 103, and protrudes toward the middle of the card changing window 103. When the card changing door panel 40 is closed, it can be pressed against the door frame 12, causing the second sealing ring to deform for sealing. Among them, the card changing door panel 40 is rotatably connected to the test box 10 through a hinge, and is locked and unlocked by a locking assembly. The locking assembly may include a cylinder and a locking pin connected to the cylinder, and a locking socket is provided on the card changing door panel 40, and the cylinder controls the locking pin to penetrate into the locking socket for locking, or controls the locking pin to exit the locking socket for unlocking. Of course, the card changing door plate 40 may also slide relative to the test box 10 to be closed and opened. In this case, the assembly method and sealing method of the card changing door plate 40 may be substantially similar to those of the above-mentioned transport door plate 30 , and thus will not be described in detail.

[0055] Optionally, the test box 10 is formed by at least splicing a plurality of sheet metal plates, and a sealing strip is provided at the joint of each sheet metal plate. Such a setting is not only convenient for manufacturing, but also ensures good sealing of the entire test box 10, thereby reducing the leakage of dry gas. The sealing strip can be made of materials such as silicone and sponge.

[0056] In actual use, the wafer test structure also includes a wafer fixing plate and a dew point sensor. The wafer fixing plate and the dew point sensor are both installed in the test chamber 101. The outer side of the wafer fixing plate is surrounded by a spray pipe 21, and the dew point sensor is arranged near the wafer fixing plate. The dew point sensor is used to detect the dew point temperature in the test chamber 101, and the wafer fixing plate is used to receive and fix the wafer for easy wafer testing. In order to avoid problems such as frosting and icing of the wafer in low-temperature testing due to excessive water vapor content, the dew point sensor is arranged near the wafer fixing plate to more timely and accurately judge the dew point temperature at the wafer fixing plate. When performing low-temperature testing, the dryer 23 can be turned on first to pass dry gas into the test chamber 101, and the dew point sensor detects the dew point temperature in real time. After the dew point temperature in the test chamber 101 reaches below the target temperature, the refrigeration can be turned on to cool the wafer. At the same time, during the test process, the dew point sensor also continuously detects the dew point temperature to prevent the wafer from frosting.

[0057] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0058] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of patent protection of the present application shall be subject to the attached claims.

Claims

1. A wafer testing structure, characterized in that: The wafer test structure comprises: A test box (10) having a test cavity (101) and a wafer transport window (102) and a card replacement window (103) connected to the test cavity (101); A transport door plate (30) is movably mounted at the wafer transport window (102), and a first seal is provided between the transport door plate (30) and the test box (10); A card-changing door plate (40) is movably mounted at the card-changing window (103), and a second seal is provided between the card-changing door plate (40) and the test box (10); A drying component (20) is used to introduce drying gas into the test cavity (101); the drying component (20) comprises an injection pipe (21) and a manifold (22); the injection pipe (21) is arranged in the test cavity (101) along the circumference of the test cavity (101); the injection pipe (21) is provided with a plurality of injection holes (2101) arranged at intervals; and the manifold (22) is connected to the injection pipe (21) and extends out of the test cavity (101).

2. The wafer testing structure according to claim 1, characterized in that: The injection pipe (21) comprises a plurality of connectors (212) and a plurality of connecting pipe sections (211), the plurality of connecting pipe sections (211) are arranged along the circumference of the test chamber (101), and any two adjacent connecting pipe sections (211) are connected via a connector (212), and at least one connecting pipe section (211) is connected to the manifold (22); and / or, The drying assembly (20) further comprises a dryer (23), the dryer (23) being connected to an end of the manifold (22) away from the injection pipe (21) and being arranged outside the test box (10); and / or the plurality of injection holes (2101) being arranged at intervals on the injection pipe (21) along the circumference of the test cavity (101).

3. The wafer testing structure according to claim 1, characterized in that: A fixed door frame (11) is provided at the wafer transport window (102), and the fixed door frame (11) and / or the transport door plate (30) are provided with a first sealing member, and the first sealing member forms the first seal.

4. The wafer testing structure according to claim 3, characterized in that: The fixed door frame (11) is configured with a sealing flange (111); the transport door panel (30) is arranged on one side of the fixed door frame (11) along the Z-axis direction; the transport door panel (30) is movable relative to the fixed door frame (11) along the Z-axis direction; and the first sealing member is pressed between the sealing flange (111) and the transport door panel (30).

5. The wafer testing structure according to claim 4, characterized in that: Along the Z-axis direction, the fixed door frame (11) has a closed side (1101) and an open side (1102) that are arranged oppositely and at intervals, and the closed side (1101) is located downstream of the open side (1102) in the closing direction of the transport door panel (30); The sealing flange (111) is arranged around the wafer handling window (102), and the sealing flange (111) is constructed with an avoidance notch (112) located at the open side (1102). The handling door panel (30) is provided with a contact flange (31) protruding away from the closed side (1101), and the contact flange (31) can be pressed on a side edge of the avoidance notch (112) away from the closed side (1101).

6. The wafer testing structure according to claim 5, characterized in that: From the closed side (1101) toward the open side (1102), the width of the transport door plate (30) along the first direction gradually increases; the first direction, the Z-axis direction and the thickness direction of the transport door plate (30) are arranged at angles to each other.

7. The wafer testing structure according to claim 4, characterized in that: The wafer testing structure further comprises a power source (50), wherein the power source (50) is installed on the testing box (10) and connected to the transport door plate (30), and the power source (50) is used to drive the transport door plate (30) to reciprocate along the Z-axis direction; and / or, The transport door plate (30) is slidably connected to the test box (10), and a guide member (51) is provided between the two.

8. The wafer testing structure according to claim 1 or 3, characterized in that: The card-changing window (103) is provided with a door frame (12), and the door frame (12) and / or the card-changing door panel (40) are provided with a second sealing ring, and the second sealing ring forms the second seal.

9. The wafer testing structure according to claim 1, characterized in that: The wafer test structure also includes a wafer fixing plate and a dew point sensor. The wafer fixing plate and the dew point sensor are both installed in the test cavity (101). The injection pipe (21) is arranged around the outer side of the wafer fixing plate, and the dew point sensor is arranged close to the wafer fixing plate.

10. The wafer testing structure according to claim 1, characterized in that: The test box (10) is formed by at least splicing a plurality of sheet metal plates, and a sealing strip is provided at the splicing position of each of the sheet metal plates.

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