Non-closed local heat dissipation system of semiconductor lead frame

Abstract

The utility model relates to a non-closed local heat dissipation system of a semiconductor lead frame, which comprises a first gas flow guide mechanism arranged on one side edge of an oven, the first gas flow guide mechanism comprises a heat dissipation channel, the heat dissipation channel is provided with a first gas inlet and a first gas outlet, and the first gas inlet is communicated with the first gas outlet. The first air inlet is communicated with the first air outlet through a first channel; the first air inlet is higher than a heating platform of the oven, and a preset angle is formed between the plane of the first air inlet and the horizontal plane. After the structure is adopted, the film baking machine has the beneficial effects that the structure is simple, the maintenance is convenient, the occupied space is small, high-temperature air is effectively guided by a simple and stable structure, the overflow of the high-temperature air is controlled, the temperature of a heating part is controlled, the influence on peripheral functional mechanisms is reduced, and the film baking quality is ensured.

Description

Technical Field

[0001] The utility model belongs to the technical field of semiconductor lead frame heating, in particular to a non-enclosed local heat dissipation system of a semiconductor lead frame. Background Art

[0002] After the semiconductor lead frame is filmed, it needs to be heated and baked for a certain period of time to eliminate the bubbles generated after the film is applied. In the film baking process, the existing film baking process usually only sets up an exhaust system in a relatively closed space environment where the entire equipment is running. The exhaust port is generally set on the top of the equipment or on the exterior door panel. Since the exhaust port is relatively far away from the heat source, the high-temperature gas near the film baking unit cannot be discharged in time, and the local ambient temperature will be relatively high, which will have a certain impact on the durability of the surrounding functional mechanisms, especially the motors, cylinders, screws and other more precise mechanisms. When the operator opens the door panel of the equipment, he will also feel uncomfortable due to the large temperature difference between the inside and outside of the equipment, so improvement is needed. Utility Model Content

[0003] The utility model aims to provide a non-enclosed local heat dissipation system for a semiconductor lead frame, so as to solve the problem that the local ambient temperature near the existing film baking unit is high, which affects the surrounding functional mechanisms and operators.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] A non-enclosed local heat dissipation system for a semiconductor lead frame, comprising: a first gas guide mechanism arranged on one side of an oven, the first gas guide mechanism comprising a heat dissipation channel, the heat dissipation channel having a first air inlet and a first air outlet, the first air inlet and the first air outlet being connected through a first channel; the first air inlet is higher than a heating platform of the oven, and a plane of the first air inlet forms a preset angle with a horizontal plane, the first air outlet is connected to the outside of the entire device, the heat generated by the heating platform will heat up the air around the heating plate, and the gas caused by this will flow upward due to a decrease in density, and the upward-flowing hot air is discharged to the outside through the first gas guide mechanism.

[0006] In one of the embodiments, it also includes an air supply system, which is arranged above the oven to transport clean air at room temperature downward and control the upward flow and overflow of hot air.

[0007] In one of the embodiments, a bracket is further included, and the air supply system is arranged above the oven through the bracket.

[0008] In one of the embodiments, a gas guiding mechanism is further included. The gas guiding mechanism is arranged on the other side of the oven, and the gas guiding mechanism is arranged opposite to the first gas guiding mechanism.

[0009] In one embodiment, the gas guiding mechanism includes a gas injection pipe, a plurality of injection ports are provided on the gas injection pipe, a nozzle is provided on the injection port, and the outlet of the nozzle has a preset injection angle; the gas injection pipe is connected to the gas generator, and the nozzle transports normal temperature gas laterally to guide the hot air laterally to the first air inlet.

[0010] In one embodiment, the plane where the nozzle is located is higher than the plane where the heating platform is located, and the injection angle is smaller than the preset angle, so that the horizontally flowing hot air can be covered by the first air inlet to control the overflow of hot air.

[0011] In one of the embodiments, an exhaust system is further included, wherein the exhaust system includes a second gas guide mechanism, wherein the second gas guide mechanism includes a guide cover, wherein the guide cover has a second air inlet and a second air outlet, wherein the second air inlet and the second air outlet are connected via a second channel; the guide cover is connected to the oven, and the second air inlet is connected to the first air outlet and the heat dissipation holes of the oven.

[0012] In one of the embodiments, an air extraction system is further included, wherein the air extraction system includes a fan, an air inlet of the fan is connected to the first air outlet or the second air outlet through a pipeline, and an air outlet of the fan is connected to the outside.

[0013] In one of the embodiments, a speed regulating valve is further included. The speed regulating valve is arranged in the air inlet end of the gas injection pipe and is used to adjust the air outlet speed of the nozzle.

[0014] The non-enclosed local heat dissipation system of the semiconductor lead frame of the utility model has the following beneficial effects:

[0015] The structure is simple, maintenance is convenient, and the space occupied is small. The high-temperature air is effectively guided with a simple and stable structure to control the overflow of the high-temperature air, realize the temperature control of the heating part, reduce the impact on the surrounding functional mechanisms, and ensure the quality of the baked film. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a structural schematic diagram of the heat dissipation system of the utility model;

[0017] Figure 2 It is a structural schematic diagram of the first gas flow guiding mechanism and the gas guiding mechanism of the utility model;

[0018] Figure 3 It is a structural schematic diagram of the gas guide mechanism of the utility model;

[0019] Figure 4It is a structural schematic diagram of the second gas flow guiding mechanism of the utility model;

[0020] Figure 5 It is a schematic diagram of high temperature gas flow in the local heat dissipation system of the utility model;

[0021] Figure 6 It is a schematic diagram of the high-temperature gas exhaust flow of the local heat dissipation system of the utility model. DETAILED DESCRIPTION

[0022] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant utility model, rather than to limit the utility model. It is also necessary to explain that, for ease of description, only the parts related to the utility model are illustrated in the accompanying drawings.

[0023] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0024] like Figure 1-Figure 4 As shown, the non-enclosed local heat dissipation system of the semiconductor lead frame of the present application includes:

[0025] The first gas guiding mechanism 1 is provided in the oven 2. 一 On the side, the oven 2 is used for baking semiconductor lead frames, and its structure is prior art and will not be described in detail; the first gas guide mechanism 1 includes a heat dissipation channel, and the heat dissipation channel has a first air inlet 101 and a first air outlet 102. The first air inlet 101 is provided with a filter screen, and the first air inlet 101 and the first air outlet 102 are connected through the first heat dissipation channel; the first air inlet 101 is higher than the heating platform 202 of the oven 2, and the plane of the first air inlet 101 is at a preset angle to the horizontal plane, so that the hot air generated by the oven 2 can enter from the first air inlet 101 in time;

[0026] An air supply system 3, the air supply system 3 is arranged above the oven 2. Preferably, the air supply system 3 and the oven 2 are on the same vertical axis. The air supply system 3 can be a fan or an air conditioner. The air supply system 3 can be arranged above the oven 2 through a bracket, or it can be an air conditioning system in the operating room where the equipment is located. The air supply system 3 transports clean air at room temperature downward to prevent the hot air around the heating platform 202 from flowing upward and overflowing;

[0027] The gas guide mechanism 4 is arranged on the other side of the oven 2, and the gas guide mechanism 4 is arranged opposite to the first gas guide mechanism 1. The gas guide mechanism 4 includes a gas injection pipe 401, and the gas injection pipe 401 is provided with a plurality of injection ports 402. The injection ports 402 are provided with nozzles 403, and the outlets of the nozzles 403 have a preset injection angle; the gas injection pipe 401 is connected to a gas generator (not shown in the figure), and the gas generator is a prior art, and its structure and working principle are no longer described. In detail, a speed regulating valve 404 is further provided in the air inlet end of the gas injection pipe 401, and the speed regulating valve 404 adjusts the air outlet speed of the nozzle 403. The speed regulating valve 404 here is an air inlet speed regulating valve, which is a purchased part and the structure is not described in detail. The plane where the nozzle 403 is located is higher than the plane where the heating platform 202 is located, and the injection angle is less than the preset angle. The gas guide mechanism 4 transports normal temperature gas laterally, guides the hot air laterally to the first air inlet 101, and discharges it through the first gas guide mechanism 1;

[0028] An exhaust system, wherein the exhaust system comprises a second gas guide mechanism 5, wherein the second gas guide mechanism 5 comprises a guide cover, wherein the guide cover has a second air inlet 501 and a second air outlet 502, wherein the second air inlet 501 and the second air outlet 502 are connected via a second channel; the guide cover is connected to the oven 2, wherein the second air inlet 501 is connected to the first air outlet 102 and the heat dissipation holes of the oven 2, and the exhaust system guides and discharges the hot air in the oven 2 and through the first gas guide mechanism 1;

[0029] An exhaust system, wherein the exhaust system includes a fan 6, an air inlet of the fan 6 is connected to the first air outlet 102 or the second air outlet 502 through a pipe 601, and an air outlet of the fan is connected to the outside through a pipe 602. The exhaust system extracts hot air around the heating platform 202 or hot air in the oven 2 to accelerate the discharge of hot air.

[0030] like Figure 5-Figure 6The figure shows a schematic diagram of the high-temperature gas flow and discharge of the local heat dissipation system of the present application. When in use, the injection pipe 401 of the gas guide mechanism 4 is adjusted to a preset injection angle so that the air flow trajectory of the nozzle 403 outlet can be covered by the first air inlet 101 of the first gas guide mechanism 1. The gas guide mechanism 4 transports normal temperature gas laterally, and the air supply system 3 transports normal temperature clean air downward. The heat generated by the heating platform 202 will heat up the air around the heating plate, and the resulting gas will flow upward due to the decrease in density. The upward-flowing hot air contacts the normal temperature air wall transported downward by the air supply system 3 and the flowing air wall ejected laterally by the nozzle 403. The hot air is guided to the first air inlet 101 and enters the first gas guide mechanism 1. At the same time, the fan 6 extracts the hot air from the first gas guide mechanism 1 and the second gas guide mechanism 5 by vacuuming, and at the same time discharges the extracted hot air to the outside through the exhaust pipe 602, so as to achieve temperature control of the local area.

[0031] When in use, the first gas flow guiding mechanism 1 can be used in combination with the air supply system 3, the gas guiding mechanism 4, the exhaust system, and the air extraction system, any one or more of the functional units therein, to achieve temperature control of a local area of ​​the heating platform.

[0032] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0033] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0034] In addition, it should be noted that the use of terms such as "first" and "second" to limit components is only for the convenience of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be understood as limiting the scope of protection of this application.

[0035] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "provided with", "connected", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0036] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made according to the scope of the patent application of the present invention should fall within the scope of the present invention.

Claims

1. A non-enclosed local heat dissipation system for a semiconductor lead frame, characterized in that: It includes: A first gas guide mechanism is arranged on one side of the oven, the first gas guide mechanism includes a heat dissipation channel, the heat dissipation channel has a first air inlet and a first air outlet, the first air inlet and the first air outlet are connected through the first heat dissipation channel; the first air inlet is higher than the heating platform of the oven, and the plane of the first air inlet forms a preset angle with the horizontal plane.

2. The non-enclosed local heat dissipation system for a semiconductor lead frame according to claim 1, characterized in that: The utility model also comprises an air supply system, and the air supply system is arranged above the oven.

3. The non-enclosed local heat dissipation system for a semiconductor lead frame according to claim 2, characterized in that: It also includes a bracket, and the air supply system is arranged above the oven through the bracket.

4. The non-enclosed local heat dissipation system for a semiconductor lead frame according to claim 1, characterized in that: It also includes a gas guiding mechanism, which is arranged on the other side of the oven and is arranged opposite to the first gas guiding mechanism.

5. The non-enclosed local heat dissipation system for a semiconductor lead frame as claimed in claim 4, characterized in that: The gas guide mechanism comprises a gas injection pipe, a plurality of injection ports are arranged on the gas injection pipe, a nozzle is arranged on the injection port, and the outlet of the nozzle has a preset injection angle; the gas injection pipe is connected to the gas generator.

6. The non-enclosed local heat dissipation system for a semiconductor lead frame as claimed in claim 5, characterized in that: The plane where the nozzle is located is higher than the plane where the heating platform is located, and the spraying angle is smaller than the preset angle.

7. The non-enclosed local heat dissipation system for a semiconductor lead frame according to claim 1, characterized in that: The invention also includes an exhaust system, wherein the exhaust system includes a second gas guide mechanism, wherein the second gas guide mechanism includes a guide cover, wherein the guide cover has a second air inlet and a second air outlet, wherein the second air inlet and the second air outlet are connected via a second channel; the guide cover is connected to the oven, and the second air inlet is connected to the first air outlet and the heat dissipation holes of the oven.

8. The non-enclosed local heat dissipation system for a semiconductor lead frame as claimed in claim 7, characterized in that: It also includes an air extraction system, which includes a fan, an air inlet of the fan is connected to the first air outlet or the second air outlet through a pipeline, and the air outlet of the fan is connected to the outside.

9. The non-enclosed local heat dissipation system for a semiconductor lead frame according to claim 5, characterized in that: It also includes a speed regulating valve, which is arranged in the air inlet end of the gas injection pipe.

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