Automatic suction nozzle replacing device and semiconductor process machine table

Abstract

The utility model provides an automatic suction nozzle replacing device and a semiconductor process machine. The automatic suction nozzle replacing device is used for replacing suction nozzles of a semiconductor process machine table, and comprises a suction nozzle placing box which comprises a suction nozzle placing area, and the suction nozzle placing area is provided with a plurality of suction nozzle placing holes used for placing the suction nozzles; the mechanical arm comprises a clamping jaw and a motor, the clamping jaw is used for clamping the suction nozzle, and the motor is used for driving the clamping jaw to move; the mechanical arm can take out and install the suction nozzles placed in the suction nozzle containing box. And the suction nozzles are detached and placed in the suction nozzle placing holes of the suction nozzle placing box. According to the technical scheme, by arranging the mechanical arm with the detachable suction nozzle and the suction nozzle containing box capable of containing the suction nozzle, suction nozzle replacement automation of the semiconductor process machine table is achieved, the suction nozzle replacement efficiency of the machine table is improved, the operation error rate is reduced, and machine table faults are reduced.

Description

Technical Field

[0001] The utility model relates to the semiconductor field, in particular to an automatic nozzle replacement device and a semiconductor process machine. Background Art

[0002] With the development of semiconductor technology, the chips used in semiconductor products are becoming more and more diversified. Chips of various sizes are integrated in the same package. When performing processes of different chip products on the same semiconductor chip automatic inspection machine, the nozzle of the machine needs to be replaced to make the specifications of the nozzle compatible with the type of carrier or chip so that the machine can successfully complete the process. However, manual nozzle replacement is complicated and the machine needs to be stopped and waited during replacement, which wastes time and is prone to machine failure due to operator errors. In addition, the existing semiconductor process also requires multiple stops to replace nozzles, which reduces the production efficiency of the machine and increases the workload of the operator, which is not conducive to the efficient and high-quality production of semiconductor products.

[0003] Therefore, improving the efficiency of replacing nozzles on the machine, reducing the operating error rate and reducing machine failures are issues that need to be addressed at present. Summary of the invention

[0004] The technical problem to be solved by the utility model is to improve the efficiency of replacing nozzles of a machine, reduce the operating error rate and reduce machine failures, and provide an automatic nozzle replacement device and a semiconductor process machine.

[0005] In order to solve the above problems, the utility model provides an automatic nozzle replacement device for replacing the nozzle of a semiconductor process machine, comprising: a nozzle placement box, including a nozzle placement area, the nozzle placement area having a plurality of nozzle placement holes for placing the nozzle; a robotic arm, including a clamp and a motor, the clamp is used to clamp the nozzle, and the motor is used to drive the clamp to move; the robotic arm can take out and install the nozzle placed in the nozzle placement box; and disassemble the nozzle and place it in the nozzle placement hole of the nozzle placement box.

[0006] In some embodiments, the jaws are pneumatic cylinder jaws.

[0007] In some embodiments, the robotic arm further includes a sensing element for detecting whether the nozzle is located in the gripper.

[0008] In some embodiments, the robotic arm further comprises an alarm element for sounding an alarm when the sensing element detects that the nozzle has fallen off from the clamp.

[0009] In some embodiments, the robotic arm further includes a magnetic element, which is disposed on the clamping claw to assist in clamping the nozzle.

[0010] In some embodiments, the nozzle placement box includes a plurality of nozzle placement areas for placing different types of nozzles.

[0011] In some embodiments, the nozzle placement box is movable in the horizontal direction so that the robot arm can pick up or place the nozzle in different nozzle placement holes.

[0012] In some embodiments, a positioning element is also included for positioning the nozzle placement hole when the robot arm places the nozzle in the nozzle placement hole, or for positioning the nozzle when the robot arm takes the nozzle from the nozzle placement hole.

[0013] In order to solve the above problems, the utility model provides a semiconductor process machine, including a nozzle module, including a plurality of nozzle mounting parts for mounting nozzles; the automatic nozzle replacement device described in the utility model is used to disassemble or place the nozzles.

[0014] The above technical solution realizes the automation of nozzle replacement of semiconductor process equipment by providing a mechanical arm with a detachable nozzle and a nozzle placement box for placing the nozzle, thereby improving the efficiency of nozzle replacement of the machine, reducing the operating error rate and reducing machine failures.

[0015] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0017] Figure 1 This is a schematic structural diagram of an embodiment of the automatic nozzle replacement device of the utility model;

[0018] Figure 2 A top view of the clamping jaws of an embodiment of the automatic nozzle replacement device of the utility model;

[0019] Figure 3 The figure is a top view of a nozzle placement box of an embodiment of the automatic nozzle replacement device of the utility model.

[0020] Figure 4 It is a partial structural diagram of an embodiment of the semiconductor process machine of the present invention. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0022] The utility model provides an automatic nozzle replacement device for replacing the nozzle of a semiconductor process machine. Figure 1 to Figure 3 ,in, Figure 1 This is a schematic structural diagram of an embodiment of the automatic nozzle replacement device of the utility model; Figure 2 A top view of the clamping jaws of an embodiment of the automatic nozzle replacement device of the utility model; Figure 3 This is a top view of a nozzle placement box of an embodiment of the automatic nozzle replacement device of the utility model. Figure 1 to Figure 3 As shown, the automatic nozzle replacement device includes: a nozzle placement box 12 and a mechanical arm 13. The nozzle placement box 12 includes a nozzle placement area 121, and the nozzle placement area 121 has a plurality of nozzle placement holes 120 for placing the nozzles 10. The mechanical arm 13 includes a clamp 131 and a motor 132, the clamp 131 is used to clamp the nozzle, and the motor 132 is used to drive the clamp 131 to move. The mechanical arm 13 can take out and install the nozzle placed in the nozzle placement box 12; and disassemble the nozzle and place it in the nozzle placement hole 120 of the nozzle placement box 12.

[0023] The above technical solution realizes the automation of nozzle replacement of semiconductor process equipment by providing a mechanical arm with a detachable nozzle and a nozzle placement box for placing the nozzle, thereby improving the efficiency of nozzle replacement of the machine, reducing the operating error rate and reducing machine failures.

[0024] In some embodiments, the clamp 131 is a cylinder clamp. A cylinder clamp is a clamp driven by compressed air, which can clamp or release an object by controlling the air pressure. Figure 2, the clamping jaw 131 includes a clamping arm 1311 and a connecting member 1312. In this embodiment, the suction nozzle 10 is clamped by the two clamping arms 1311, and the two clamping arms 1311 are connected by the connecting member 1312. A cylinder 1319 is arranged in the connecting member 1312, and the two clamping arms 1311 are driven to move by the pneumatic action of the cylinder 1319 to achieve the clamping and loosening of the two clamping arms 1311. In other embodiments, the cylinder clamping jaw is composed of four parts, namely, a clamping arm, a cylinder, a transmission mechanism and a control system. The clamping arm is mainly used to clamp the workpiece, and its structure is varied and can be designed into different shapes as needed; the cylinder is the core component of the driving clamping jaw, which is driven by providing an air pressure signal. The transmission mechanism is used to convert the movement of the cylinder into the movement of the clamping jaw to achieve the function of clamping or loosening the object. The control system is used to control the parameters such as the movement and motion trajectory of the cylinder clamping jaw.

[0025] See also Figure 2 In some embodiments, the robot arm 13 further includes a sensing element 1313 for detecting whether the suction nozzle 10 is located in the clamping jaw 131. In this embodiment, the sensing element 1313 is a pressure sensor, which is disposed in the clamping arm 1311, and detects whether the suction nozzle 10 is located in the clamping jaw 131 by detecting the pressure on the surface of the clamping arm 1311. In other embodiments, the sensing element 1313 can also be an infrared sensor, including an infrared transmitter and an infrared receiver, which are respectively disposed on the surfaces of the two clamping arms 1311, and detects whether the suction nozzle 10 is located in the clamping jaw 131 by whether the infrared receiver can receive the infrared light emitted by the infrared transmitter.

[0026] In some embodiments, the robot arm 13 further includes an alarm element 1314, which is used to sound an alarm when the sensing element 1313 detects that the nozzle 10 has fallen out of the clamp 131. By combining the sensing element 1313 and the alarm element 1314, the error rate of automatic nozzle replacement is reduced, and machine failures caused by errors in automatic nozzle replacement are reduced. In this embodiment, the alarm element 1314 is a buzzer, which sounds an alarm through vibration and sound when the sensing element 1313 detects that the nozzle 10 has fallen out of the clamp 131. In other embodiments, the alarm element 1314 can also be a flash light, which sounds an alarm through flashing light when the sensing element 1313 detects that the nozzle 10 has fallen out of the clamp 131.

[0027] In some embodiments, the robot arm 13 further includes a magnetic element 1315, which is disposed on the clamp 131 to assist in clamping the nozzle 10. In this embodiment, the magnetic element 1315 is an electromagnet. When the clamp 131 clamps the nozzle 10, the magnetic element 1315 is activated to assist in clamping the nozzle 10; when the clamp 131 releases the nozzle 10, the magnetic element 1315 is closed to release the nozzle 10. By using the magnetic element 1315 to assist in clamping, the stability of the clamp 131 in clamping the nozzle 10 can be improved, the possibility of the nozzle 10 falling off can be reduced, and the error rate of automatic nozzle replacement can be reduced, thereby reducing machine failures caused by errors in automatic nozzle replacement.

[0028] See also Figure 3 In some embodiments, the nozzle placement box 12 includes a plurality of nozzle placement areas 121 for placing different types of nozzles 10. In this embodiment, nozzle placement holes 120 of different shapes may be provided in different nozzle placement areas 121 according to different types of nozzles 10 to better fit and distinguish different types of nozzles 10. In other embodiments, universal nozzle placement holes 120 may also be provided in the nozzle placement areas 121 to improve the compatibility of the nozzle placement box 12.

[0029] In some embodiments, the nozzle placement box 12 can be moved in the horizontal direction so that the robot arm can pick up or place the nozzle in different nozzle placement holes. In this embodiment, the nozzle placement box 12 can move along the X direction and the Y direction. When the robot arm 13 needs to place the nozzle 10 in the nozzle placement box 12, the nozzle placement box 12 moves along the X direction and the Y direction to the position corresponding to the nozzle placement hole 120 and the nozzle 10, so that the nozzle 10 can be smoothly placed in the nozzle placement hole 120.

[0030] In some embodiments, the automatic nozzle replacement device further includes a positioning element 14, which is used to position the nozzle placement hole 120 when the robot arm 13 places the nozzle 10 in the nozzle placement hole, or to position the nozzle when the robot arm takes the nozzle from the nozzle placement hole. In this embodiment, the positioning element is a charge-coupled device (CCD). In this embodiment, the positioning element 14 is an independent element, which is arranged above the nozzle placement box 12. In other embodiments, the positioning element 14 can also be arranged on the surface of the robot arm 13.

[0031] Based on the same inventive concept, an embodiment of the present invention further provides a semiconductor process machine.

[0032] See also Figure 4 , which is a partial structural diagram of an embodiment of the semiconductor process machine of the utility model. Figure 4 As shown, the semiconductor process machine described in the utility model includes: a nozzle module 41 and an automatic nozzle replacement device 42. The nozzle module 41 includes a plurality of nozzle mounting parts 410 for mounting the nozzles 10. The automatic nozzle replacement device 42 adopts the utility model Figure 1 to Figure 3 The embodiment shown is used to disassemble or place the suction nozzle 10, as described above, which will not be repeated here.

[0033] In some embodiments, the nozzle placement box 12 is located on one side of the nozzle module 41 close to the nozzle mounting portion 410; specifically, Figure 4 As shown, the nozzle module 41 is located on one side of the nozzle placement box 12 along the Z direction, and the nozzle mounting portion 410 is disposed on the surface of the nozzle module 41 close to the nozzle placement box 12. In this embodiment, a plurality of the nozzle mounting portions 410 are arranged along the X direction. In other embodiments, a plurality of the nozzle mounting portions 410 may also be arranged in an array, or a suitable arrangement may be provided according to process requirements.

[0034] In this embodiment, the motor 132 of the robot arm 13 moves along the Z direction in the nozzle module 41 and the nozzle placement box 12, and the clamping claw 131 of the robot arm 13 can move along the arrangement direction of the plurality of nozzle mounting parts 410 to clamp different nozzles 10. The robot arm 13 can take out the nozzle 10 placed in the nozzle placement box 12 and install it to the nozzle mounting part 410 of the nozzle module 41; and remove the nozzle 10 installed to the nozzle mounting part 410 of the nozzle module 41 and place it in the nozzle placement hole 120 of the nozzle placement box 12, so as to realize the automation of nozzle replacement of semiconductor process machines, improve the efficiency of machine nozzle replacement, reduce the operation error rate and reduce machine failure.

[0035] The above technical solution realizes the automation of nozzle replacement of semiconductor process equipment by providing a mechanical arm with a detachable nozzle and a nozzle placement box for placing the nozzle, thereby improving the efficiency of nozzle replacement of the machine, reducing the operating error rate and reducing machine failures.

[0036] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.

[0037] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.

[0038] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0039] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. An automatic nozzle replacement device for replacing the nozzle of a semiconductor process machine, characterized in that: include: A nozzle placement box, comprising a nozzle placement area, wherein the nozzle placement area has a plurality of nozzle placement holes for placing the nozzles; A mechanical arm, comprising a clamp and a motor, wherein the clamp is used to clamp the nozzle, and the motor is used to drive the clamp to move; The robot arm can take out and install the suction nozzle placed in the suction nozzle placement box; and disassemble the suction nozzle and place it in the suction nozzle placement hole of the suction nozzle placement box.

2. The automatic nozzle replacement device according to claim 1, characterized in that: The clamping jaws are cylinder clamping jaws.

3. The automatic nozzle replacement device according to claim 1, characterized in that: The robot arm also includes a sensing element for detecting whether the suction nozzle is located in the clamping claw.

4. The automatic nozzle replacement device according to claim 3, characterized in that: The robot arm also includes an alarm element, which is used to issue an alarm when the sensing element detects that the suction nozzle falls off from the clamping claw.

5. The automatic nozzle replacement device according to claim 1, characterized in that: The robot arm also includes a magnetic element, which is arranged on the clamping claw and is used to assist in clamping the nozzle.

6. The automatic nozzle replacement device according to claim 1, characterized in that: The nozzle placement box includes a plurality of nozzle placement areas for placing different types of nozzles.

7. The automatic nozzle replacement device according to claim 1, characterized in that: The nozzle placement box can be moved in the horizontal direction so that the robot arm can take or place the nozzles in different nozzle placement holes.

8. The automatic nozzle replacement device according to claim 1, characterized in that: It also includes a positioning element for positioning the nozzle placement hole when the robot arm places the nozzle in the nozzle placement hole, or for positioning the nozzle when the robot arm takes the nozzle from the nozzle placement hole.

9. A semiconductor process machine, characterized in that: include: A nozzle module, comprising a plurality of nozzle mounting parts for mounting the nozzles; The automatic nozzle replacement device according to any one of claims 1 to 8, used for removing or placing the nozzle.

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