Silicon wafer degumming frame and degumming cleaning machine

Abstract

The utility model discloses a silicon wafer degumming frame and a degumming cleaning machine, and belongs to the technical field of silicon wafer degumming. The silicon wafer degumming frame comprises a frame body, the frame body is used for loading a silicon wafer, and a guide shaft is arranged on an end plate of the frame body; the bearing mechanism is connected to the guide shaft in a sliding manner, and the bearing mechanism is used for bearing the bottom of the silicon wafer; the clamping mechanism is connected to the guide shaft in a sliding mode, and the clamping mechanism is used for clamping the side face of the silicon wafer; and the locking mechanism is connected to the frame body, and the locking mechanism is used for locking the bearing mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer degumming, in particular to a silicon wafer degumming rack and a degumming cleaning machine. Background Art

[0002] Silicon wafers are the core components of photovoltaic modules, which are cut from silicon rods. During the cutting process of silicon rods, the adhesive board needs to be bonded to the crystal tray, and then the silicon rod is bonded to the adhesive board. The silicon rod is transported to the slicer through the crystal tray, and the slicer cuts the silicon rod into multiple silicon wafers. After slicing, multiple silicon wafers are still bonded to the adhesive board, and the silicon wafers need to be debonded and cleaned before they can be used.

[0003] The prior art discloses a silicon wafer degumming rack (authorization publication number: CN216902810U), and specifically discloses that the silicon wafer degumming rack includes a frame for loading a plurality of silicon wafers arranged in sequence along its length direction; a carrier, which is arranged at the bottom of the frame, and the carrier is used to support the bottom edge of the silicon wafer; a first adjustable barrier rod, which is arranged on one side of the frame; a second adjustable barrier rod, which is arranged on the other side of the frame opposite to the first adjustable barrier rod, and the ends of the first adjustable barrier rod and / or the second adjustable barrier rod are respectively movably connected to the two end plates of the frame; the spacing between the second adjustable barrier rod and the first adjustable barrier rod is adjustable, and the contour edge of the silicon wafer is clamped and fixed from both sides of the frame.

[0004] However, when the existing silicon wafer debonding rack is used to transfer the silicon wafer to the debonding cleaning machine, during the debonding operation of the silicon wafer, the carrier is easily opened by mistake, causing the silicon wafer to fall, thereby causing damage to the silicon wafer. Utility Model Content

[0005] The utility model discloses a silicon wafer degumming rack and a degumming cleaning machine, so as to solve or at least partially solve the problem in the prior art that a carrier is easily opened by mistake, causing silicon wafers to fall and be damaged.

[0006] In order to solve the above technical problems, the utility model is achieved as follows:

[0007] In the first aspect, the utility model discloses a silicon wafer degumming rack, comprising a frame, the frame is used to load silicon wafers, and a guide shaft is arranged on the end plate of the frame; a bearing mechanism, the bearing mechanism is slidably connected to the guide shaft, and the bearing mechanism is used to support the bottom of the silicon wafer; a clamping mechanism, the clamping mechanism is slidably connected to the guide shaft, and the clamping mechanism is used to clamp the side of the silicon wafer; and a locking mechanism, the locking mechanism is connected to the frame, and the locking mechanism is used to lock the bearing mechanism.

[0008] Optionally, the supporting mechanism includes a support plate, a connecting rod and a supporting roller, wherein the supporting roller is arranged at the bottom of the frame, and the supporting roller is used to support the bottom of the silicon wafer; the support plate is slidably connected to the guide shaft along a first direction, and a first guide groove is provided on the end plate of the frame; one end of the connecting rod is rotatably connected to the support plate, an end of the supporting roller passes through the first guide groove, and is rotatably connected to the other end of the connecting rod, and the connecting rod is used to drive the supporting roller to slide along the first guide groove to support the bottom of the silicon wafer or release the support of the bottom of the silicon wafer.

[0009] Optionally, the locking mechanism includes a support member and a tray, wherein the tray is arranged on a side of the frame body close to the carrying roller; one end of the support member is connected to the support plate, and the other end of the support member abuts against the tray.

[0010] Optionally, the bearing roller includes a first bearing roller and a second bearing roller, the connecting rod includes a first connecting rod and a second connecting rod, the first guide groove includes two, the two first guide grooves are arranged at intervals along the second direction, and the second direction intersects with the first direction, wherein one end of the first connecting rod and the second connecting rod are both rotatably connected to the support plate, the end of the first bearing roller passes through one of the first guide grooves and is rotatably connected to the other end of the first connecting rod, and the end of the second bearing roller passes through another of the first guide grooves and is rotatably connected to the other end of the second connecting rod.

[0011] Optionally, the locking mechanism includes a mounting plate, a clamping piece and an elastic piece, wherein the mounting plate is fixedly connected to the end plate of the frame, and the mounting plate is arranged on a side of the support plate away from the connecting rod; the clamping piece is rotatably connected to the mounting plate, and a locking rod is provided on the support plate, and when the support plate slides along the first direction toward a direction away from the bottom of the frame, the clamping piece is clamped to the locking rod to lock the support plate; one end of the elastic piece is connected to the mounting plate, and the other end of the elastic piece abuts against the clamping piece.

[0012] Optionally, the clamping member includes a pivot pin, a connecting portion and a locking hook, wherein the connecting portion is rotatably connected to the mounting plate via the pivot pin; the locking hook is arranged on one side of the connecting portion, and the other end of the elastic member abuts against the other side of the connecting portion away from the locking hook.

[0013] Optionally, the clamping parts include two, the two clamping parts are arranged at intervals along the second direction and are rotatably connected to the mounting plate; the locking rods include two, the two locking rods are arranged at intervals along the second direction on the support plate, and each locking rod is arranged corresponding to one of the clamping parts; the elastic parts also include two, each elastic part is arranged corresponding to one of the clamping parts.

[0014] Optionally, the silicon wafer debonding rack further comprises an unlocking mechanism, and the unlocking mechanism is used to abut against the clamping piece so that the locking rod is released from being clamped on the clamping piece.

[0015] Optionally, the unlocking mechanism includes a support frame and a plurality of support rods, and the plurality of support rods are all connected to the support frame; at least one of the support rods abuts against one of the clamping parts to release the corresponding locking rod from being clamped on the clamping part.

[0016] In a second aspect, the utility model further discloses a degumming and cleaning machine, which comprises the silicon wafer degumming rack described in the first aspect.

[0017] The utility model discloses a silicon wafer degumming rack and a degumming cleaning machine, wherein the silicon wafer degumming rack comprises a frame, a bearing mechanism, a clamping mechanism and a locking mechanism. The bearing mechanism and the clamping mechanism are both slidably connected to the guide shaft on the end plate of the frame, the silicon wafer is loaded into the frame, the bottom of the silicon wafer is supported by the bearing mechanism, and the side of the silicon wafer is clamped by the clamping mechanism. The locking mechanism is connected to the bearing mechanism, and the bearing mechanism is locked by the locking mechanism, so that the silicon wafer is stably supported on the bearing mechanism to prevent the silicon wafer from falling and causing damage to the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram showing the structure of the silicon wafer degumming rack described in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram showing the structure of the silicon wafer degumming rack in another embodiment of the utility model Figure 1 ;

[0020] Figure 3 A side view of a silicon wafer debonding rack according to another embodiment of the present invention is shown Figure 1 ;

[0021] Figure 4 A side view showing the locking mechanism locking the bearing mechanism of the silicon wafer debonding rack in another embodiment of the utility model after entering the debonding cleaning machine Figure 1 ;

[0022] Figure 5 A side view showing the unlocking of the locking mechanism of the carrier mechanism after the silicon wafer debonding rack in another embodiment of the utility model enters the debonding cleaning machine Figure 1 ;

[0023] Figure 6 A schematic diagram showing the structure of the silicon wafer degumming rack in another embodiment of the utility model Figure 2 ;

[0024] Figure 7 A side view of a silicon wafer debonding rack according to another embodiment of the present invention is shown Figure 2 ;

[0025] Figure 8 A side view showing the locking mechanism locking the bearing mechanism of the silicon wafer debonding rack in another embodiment of the utility model after entering the debonding cleaning machine Figure 2 ;

[0026] Fig. 9 A side view showing the unlocking of the locking mechanism of the carrier mechanism after the silicon wafer debonding rack in another embodiment of the utility model enters the debonding cleaning machine Figure 2 ;

[0027] Fig.10 A schematic diagram showing the structure of the unlocking mechanism in another embodiment of the present invention Figure 1 ;

[0028] Fig.11 A schematic diagram showing the structure of the unlocking mechanism in another embodiment of the present invention Figure 2 .

[0029] Reference numerals:

[0030] 10: frame; 11: first guide groove; 12: guide shaft;

[0031] 20: clamping mechanism; 21: driving plate; 22: clamping roller; 221: first clamping roller; 222: second clamping roller; 23: cam assembly; 231: first cam assembly; 232: second cam assembly;

[0032] 30: bearing mechanism; 31: supporting plate; 311: locking rod; 32: connecting rod; 321: first connecting rod; 322: second connecting rod; 33: bearing roller; 331: first bearing roller; 332: second bearing roller;

[0033] 40: locking mechanism; 41: supporting member; 42: mounting plate; 43: clamping member; 431: rotating shaft pin; 432: connecting portion; 433: locking hook; 44: elastic member; 441: elastic spring leaf; 442: torsion spring;

[0034] 50: unlocking mechanism; 51: support frame; 52: support rod;

[0035] A: first direction; B: second direction. DETAILED DESCRIPTION

[0036] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the fixed scope of the utility model.

[0037] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0038] Reference Figure 1 , showing a schematic diagram of the structure of the silicon wafer degumming rack in the embodiment of the utility model; referring to Figure 2 , showing the structure of the silicon wafer degumming rack in another embodiment of the utility model Figure 1 ;reference Figure 3 , showing a side view of the silicon wafer debonding rack in another embodiment of the utility model Figure 1 ;reference Figure 4 , showing a side view of the locking mechanism locking the bearing mechanism after the silicon wafer degumming rack in another embodiment of the utility model enters the degumming cleaning machine Figure 1 ;reference Figure 5 , showing a side view of the locking mechanism releasing the locking bearing mechanism of the silicon wafer debonding rack in another embodiment of the utility model after entering the debonding cleaning machine Figure 1 ;reference Figure 6 , showing a schematic structural diagram of a silicon wafer degumming rack in another embodiment of the present invention; referring to Figure 7 , showing a side view of the silicon wafer degumming rack in another embodiment of the utility model; referring to Figure 8 , showing a side view of the locking mechanism locking the bearing mechanism after the silicon wafer degumming rack in another embodiment of the utility model enters the degumming cleaning machine; referring to Fig. 9 , showing a side view of the locking mechanism releasing the locking bearing mechanism after the silicon wafer degumming rack in another embodiment of the utility model enters the degumming cleaning machine; referring to Fig.10 , showing the structure of the unlocking mechanism in another embodiment of the utility model Figure 1 ;reference Fig.11 , showing the structure of the unlocking mechanism in another embodiment of the utility model Figure 2 .

[0039] like Figures 1 to 11 As shown, an embodiment of the utility model discloses a silicon wafer degumming rack, which includes a frame 10, the frame 10 is used to load silicon wafers, and a guide shaft 12 is arranged on the end plate of the frame 10; a bearing mechanism 30, the bearing mechanism 30 is slidably connected to the guide shaft 12, and the bearing mechanism 30 is used to support the bottom of the silicon wafer; a clamping mechanism 20, the clamping mechanism 20 is slidably connected to the guide shaft 12, and the clamping mechanism 20 is used to clamp the side of the silicon wafer; a locking mechanism 40, the locking mechanism 40 is connected to the frame 10, and the locking mechanism 40 is used to lock the bearing mechanism 30.

[0040] The embodiment of the utility model discloses a silicon wafer degumming rack, through which the silicon wafer is transported to the cleaning tank of the degumming and cleaning machine to perform degumming and cleaning operations on the silicon wafer. During the process of transporting and degumming the silicon wafer, the silicon wafer can be supported on the supporting mechanism 30 more stably to avoid the silicon wafer falling and causing damage to the silicon wafer.

[0041] like Figures 1 to 11 As shown, the silicon wafer debonding rack disclosed in the embodiment of the utility model includes a frame 10, a bearing mechanism 30, a clamping mechanism 20 and a locking mechanism 40. The frame 10 is used to load silicon wafers. Specifically, as Figures 1 to 9 As shown, the frame 10 may be a rectangular parallelepiped structure, and in the length direction of the frame 10, two ends of the frame 10 have two end plates, and a plurality of silicon wafers are sequentially arranged along the length direction of the frame 10 and loaded in the frame 10. A guide shaft 12 is provided on the end plate of the frame 10, and the guide shaft 12 extends along the first direction A.

[0042] Of course, the above are only individual examples of the structure of the frame 10, and are not intended to be specific limitations on the structure of the frame 10. In actual applications, technicians can also set the frame 10 to a cube structure, a cylindrical structure, etc. as needed.

[0043] like Figures 1 to 9 As shown, the bearing mechanism 30 is slidably connected to the guide shaft 12. After the silicon wafer is loaded into the frame 10, the bearing mechanism 30 can slide to a position abutting against the bottom of the silicon wafer to support the bottom of the silicon wafer. Exemplarily, the bearing mechanism 30 includes a bearing roller 33, which is disposed in the frame 10, and the two ends of the bearing roller 33 are respectively slidably connected to the guide shafts 12 disposed on the two end plates of the frame 10. After the silicon wafer is loaded into the frame 10, the bearing roller 33 is slid to a position abutting against the bottom of the silicon wafer to support the bottom of the silicon wafer through the bearing roller 33.

[0044] like Figures 1 to 9As shown, the clamping mechanism 20 is also slidably connected to the guide shaft 12. When the silicon wafer is loaded into the frame 10, the clamping mechanism 20 can slide to a position abutting against the side of the silicon wafer to clamp the side of the silicon wafer. Exemplarily, the clamping mechanism 20 includes two clamping rollers 22, both of which are arranged in the frame 10, the two clamping rollers 22 are parallel to each other, and the ends of the two clamping rollers 22 are respectively slidably connected to the guide shaft 12. When the silicon wafer is loaded into the frame 10, the two clamping rollers 22 can slide relative to the guide shaft 12, one clamping roller 22 slides in a direction close to the other clamping roller 22, so that the two clamping rollers 22 are close to each other, one clamping roller 22 is slid to a position abutting against one side of the silicon wafer, and the other clamping roller 22 is slid to a position abutting against the other side opposite to the silicon wafer, so that the two sides of the silicon wafer can be clamped by the two clamping rollers 22.

[0045] like Figures 1 to 11 As shown, the silicon wafer debonding rack disclosed in the embodiment of the utility model further includes a locking mechanism 40, which is connected to the frame 10. After the supporting mechanism 30 supports the bottom of the silicon wafer, the locking mechanism 40 is connected to the supporting mechanism 30, so that the supporting mechanism 30 is locked by the locking mechanism 40, so that the silicon wafer is stably supported on the supporting mechanism 30 to prevent the silicon wafer from falling and causing damage to the silicon wafer.

[0046] For example, the locking mechanism 40 can be connected to a certain position of the carrier mechanism 30, so that the carrier mechanism 30 can be locked by the locking mechanism 40 to prevent the carrier mechanism 30 from opening by mistake, causing the silicon wafer to fall. The locking mechanism 40 can also be connected to a certain position of the carrier mechanism 30, so that the carrier mechanism 30 can be supported by the locking mechanism 40 to prevent the carrier mechanism 30 from opening by mistake, causing the silicon wafer to fall.

[0047] The silicon wafer degumming rack disclosed in the embodiment of the utility model comprises a frame 10, a bearing mechanism 30, a clamping mechanism 20 and a locking mechanism 40. The bearing mechanism 30 and the clamping mechanism 20 are both slidably connected to the guide shaft 12 on the end plate of the frame 10, and the silicon wafer is loaded into the frame 10, the bottom of the silicon wafer is supported by the bearing mechanism 30, and the side of the silicon wafer is clamped by the clamping mechanism 20. The locking mechanism 40 is connected to the bearing mechanism 30, so that the bearing mechanism 30 is locked by the locking mechanism 40, so that the silicon wafer is stably supported on the bearing mechanism 30 to prevent the silicon wafer from falling and causing damage to the silicon wafer.

[0048] Alternatively, if Figures 1 to 9As shown, the bearing mechanism 30 in the embodiment of the utility model includes a support plate 31, a connecting rod 32 and a bearing roller 33, wherein the bearing roller 33 is arranged at the bottom of the frame 10, and the bearing roller 33 is used to support the bottom of the silicon wafer; the support plate 31 is slidably connected to the guide shaft 12 along the first direction A, and a first guide groove 11 is arranged on the end plate of the frame 10; one end of the connecting rod 32 is rotatably connected to the support plate 31, and the end of the bearing roller 33 passes through the first guide groove 11 and is rotatably connected to the other end of the connecting rod 32, and the connecting rod 32 is used to drive the bearing roller 33 to slide along the first guide groove 11 to support the bottom of the silicon wafer or release the bottom of the silicon wafer.

[0049] like Figures 1 to 9 As shown, the guide shaft 12 in the embodiment of the utility model is connected to the end plate of the frame 10 along the first direction A, and the support plate 31 is slidably connected to the guide shaft 12 along the first direction A. It can be understood that the support plate 31 is slidably connected to the outside of the frame 10 along the first direction A. Exemplarily, a guide groove can be provided on a side of the support plate 31 close to the frame 10, and the guide groove is sleeved on the guide shaft 12 and is clearance-matched with the guide shaft 12. Under the action of external force, the guide groove can slide relative to the guide shaft 12 to drive the support plate 31 to slide relative to the guide shaft 12 along the first direction A.

[0050] It should be noted that if Figures 1 to 9 As shown, in the embodiment of the utility model, a first guide groove 11 is provided on the end plate of the frame 10. The length of the first guide groove 11 along the second direction B is greater than the length of the first guide groove 11 along the first direction A. In addition, the first guide groove 11 is inclined, that is, there is a certain angle between the length direction of the first guide groove 11 and the second direction B. In addition, along the first direction A, the end of the first guide groove 11 close to the middle area of ​​the end plate is higher than the end of the first guide groove 11 close to the side area of ​​the end plate. Figures 1 to 9 As shown, the bearing roller 33 is disposed in the frame 10 and is located at the bottom of the frame 10. One end of the connecting rod 32 is rotatably connected to the support plate 31, and the end of the bearing roller 33 passes through the first guide groove 11 and is rotatably connected to the other end of the connecting rod 32.

[0051] After the silicon wafer is loaded into the frame 10, under the action of external force, the support plate 31 slides along the first direction A in the direction away from the bottom of the frame 10. The support plate 31 can drive the connecting rod 32 to rotate, and the connecting rod 32 drives the bearing roller 33 to move toward the middle area of ​​the frame 10 under the action of the first guide groove 11. The bearing roller 33 can abut against the bottom of the silicon wafer, thereby supporting the bottom of the silicon wafer. When the silicon wafer degumming operation is completed, under the action of the first guide groove 11 and gravity, the bearing roller 33 moves toward the side of the frame 10, and the silicon wafer can fall from the frame 10 to the loading mechanism of the degumming cleaning machine to complete the silicon wafer loading operation.

[0052] Alternatively, if Figure 1 As shown, the locking mechanism 40 in the embodiment of the utility model includes a support member 41 and a tray, wherein the tray is arranged on a side of the frame 10 close to the bearing roller 33; one end of the support member 41 is connected to the support plate 31, and the other end of the support member 41 abuts against the tray.

[0053] like Figure 1 As shown, after the carrying mechanism 30 is supported on the bottom of the silicon wafer, the tray is set on the side of the frame 10 close to the carrying roller 33. One end of the support member 41 is connected to the support plate 31, and the other end is abutted against the tray, and the tray can limit the support member 41. The support member 41 can limit the support plate 31, and the silicon wafer is more stably supported on the carrying mechanism 30 to prevent the silicon wafer from falling and causing damage to the silicon wafer.

[0054] It should be noted that the support member 41 in the embodiment of the present invention can be as follows: Figure 1 The guide wheel support plate shown can also be a support member of any other structure. In the embodiment of the utility model, there is no restriction on the specific structure of the support member 41. In actual application, the technician can set the specific structure of the support member 41 as needed.

[0055] Alternatively, if Figures 1 to 9 As shown, the load-bearing roller 33 in the embodiment of the utility model includes a first load-bearing roller 331 and a second load-bearing roller 332, the connecting rod 32 includes a first connecting rod 321 and a second connecting rod 322, and the first guide groove 11 includes two, the two first guide grooves 11 are arranged at intervals along the second direction B, and the second direction B intersects with the first direction A, wherein one end of the first connecting rod 321 and the second connecting rod 322 are both rotatably connected to the support plate 31, the end of the first load-bearing roller 331 passes through a first guide groove 11 and is rotatably connected to the other end of the first connecting rod 321, and the end of the second load-bearing roller 332 passes through another first guide groove 11 and is rotatably connected to the other end of the second connecting rod 322.

[0056] like Figures 1 to 9 As shown, in the embodiment of the utility model, two first guide grooves 11 are provided on the end plate of the frame body 10, and the two first guide grooves 11 are provided at intervals along the second direction B. One end of the first connecting rod 321 is rotatably connected to the support plate 31, and the end of the first bearing roller 331 passes through one first guide groove 11 and is rotatably connected to the other end of the first connecting rod 321. One end of the second connecting rod 322 is rotatably connected to the support plate 31, and the end of the second bearing roller 332 passes through another first guide groove 11 and is rotatably connected to the other end of the second connecting rod 322.

[0057] After the silicon wafer is loaded on the frame 10, under the action of external force, the support plate 31 slides along the first direction A toward the direction away from the bottom of the frame 10, and the support plate 31 can drive the first connecting rod 321 and the second connecting rod 322 to rotate. Under the action of one first guide groove 11, the first connecting rod 321 drives the first bearing roller 331 to move toward the direction close to the second bearing roller 332. Under the action of another first guide groove 11, the second connecting rod 322 drives the second bearing roller 332 to move toward the direction close to the first bearing roller 331. The first bearing roller 331 and the second bearing roller 332 are in contact with the bottom of the silicon wafer, so that the bottom of the silicon wafer can be supported by the first bearing roller 331 and the second bearing roller 332, so that the silicon wafer can be more stably supported on the first bearing roller 331 and the second bearing roller 332.

[0058] Alternatively, if Figures 2 to 9 As shown, the locking mechanism 40 in another embodiment of the utility model includes a mounting plate 42, a clamping member 43 and an elastic member 44, wherein the mounting plate 42 is fixedly connected to the end plate of the frame 10, and the mounting plate 42 is arranged on the side of the support plate 31 away from the connecting rod 32; the clamping member 43 is rotatably connected to the mounting plate 42, and a locking rod 311 is arranged on the support plate 31. When the support plate 31 slides along the first direction A toward the direction away from the bottom of the frame 10, the clamping member 43 is clamped on the locking rod 311 to lock the support plate 31; one end of the elastic member 44 is connected to the mounting plate 42, and the other end of the elastic member 44 abuts against the clamping member 43.

[0059] like Figures 2 to 9 As shown, the mounting plate 42 in another embodiment of the present invention is fixedly connected to the end plate of the frame 10, and the mounting plate 42 is located on the side of the support plate 31 away from the connecting rod 32. Exemplarily, the mounting plate 42 can be fixedly mounted on the end plate of the frame 10 by fixing the support pillar.

[0060] The clamping member 43 is rotatably connected to the mounting plate 42. When the support plate 31 slides along the first direction A toward the direction away from the bottom of the frame 10 under the action of external force, the clamping member 43 can be clamped to the locking rod 311 located on the support plate 31, so that the support plate 31 is clamped by the clamping member 43. The silicon wafer is more stably supported on the supporting mechanism 30 to prevent the silicon wafer from falling.

[0061] It should be noted that the locking mechanism 40 in another embodiment of the present invention further includes an elastic member 44, one end of which is connected to the mounting plate 42, and the other end of which is in contact with the clamping member 43. Under the elastic force of the elastic member 44, the clamping member 43 can be more securely clamped to the locking rod 311.

[0062] Alternatively, if Figures 2 to 9As shown, the clamping member 43 in another embodiment of the utility model includes a rotating shaft pin 431, a connecting portion 432 and a locking hook 433, wherein the connecting portion 432 is rotatably connected to the mounting plate 42 via the rotating shaft pin 431; the locking hook 433 is arranged on one side of the connecting portion 432, and the other end of the elastic member 44 abuts against the other side of the connecting portion 432 away from the locking hook 433.

[0063] like Figures 2 to 9 As shown, the connecting portion 432 is rotatably connected to the mounting plate 42 through the rotating shaft pin 431. A locking hook 433 is provided on one side of the connecting portion 432. When the supporting plate 31 slides along the first direction A toward the direction away from the bottom of the frame 10 under the action of an external force, the locking hook 433 can be engaged with the locking rod 311 located on the supporting plate 31, thereby locking the supporting plate 31 through the locking hook 433. This allows the silicon wafer to be more stably supported on the supporting mechanism 30 to prevent the silicon wafer from falling and causing damage to the silicon wafer.

[0064] Furthermore, in another embodiment of the present invention, one end of the elastic member 44 is connected to the mounting plate 42, and the other end of the elastic member 44 is abutted against the other side of the connecting portion 432 away from the locking hook 433. Thus, under the elastic force of the elastic member 44, the locking hook 433 is more securely connected to the locking rod 311.

[0065] It should be noted that if Figures 2 to 9 As shown, the elastic member 44 in another embodiment of the present invention includes at least one of an elastic spring leaf 441 and a torsion spring 442 .

[0066] like Figures 2 to 5 As shown, when the elastic member 44 is an elastic spring 441 , one end of the elastic spring 441 can be mounted on the mounting plate 42 by means of bolts, and the other end of the elastic spring 441 is abutted against the other side of the connecting portion 432 away from the locking hook 433 .

[0067] like Figures 6 to 9 As shown, when the elastic member 44 is a torsion spring 442, the middle position of the torsion spring 442 can be connected to the mounting plate 42 through a center pin, one end of the torsion spring 442 is limited to the gear lever, and the other end of the torsion spring 442 is abutted against the other side of the connecting portion 432 away from the locking hook 433.

[0068] Of course, the above-mentioned method of setting the elastic member 44 as the elastic spring 441 or the torsion spring 442 is only an individual example of another embodiment of the utility model, and is not intended to be a limitation of the utility model. In actual applications, technicians can also set the specific structure and installation method of the elastic member 44 as needed.

[0069] Alternatively, if Figures 2 to 9As shown, in another embodiment of the utility model, the clamping members 43 include two, the two clamping members 43 are spaced apart along the second direction B and are both rotatably connected to the mounting plate 42; the locking rods 311 include two, the two locking rods 311 are spaced apart along the second direction B on the support plate 31, and each locking rod 311 is correspondingly arranged with a clamping member 43; the elastic members 44 also include two, and each elastic member 44 is correspondingly arranged with a clamping member 43.

[0070] like Figures 2 to 9 As shown, in another embodiment of the utility model, two locking rods 311 are arranged on the support plate 31, and the two locking rods 311 are arranged at intervals along the second direction B. Correspondingly, two clamping members 43 are rotatably connected on the mounting plate 42, and the two clamping members 43 are also arranged at intervals along the second direction B, and each clamping member 43 corresponds to one locking rod 311.

[0071] When the support plate 31 slides along the first direction A toward a direction away from the bottom of the frame 10 under the action of external force, one clamping member 43 can be clamped to the corresponding locking rod 311, and the other clamping member 43 can be clamped to the corresponding other locking rod 311, so that the support plate 31 can be clamped by the two clamping members 43 to further improve the reliability of the connection between the support plate 31 and the clamping member 43.

[0072] Of course, in another embodiment of the utility model, two elastic members 44 are also provided, and each elastic member 44 is provided corresponding to a clamping member 43, so that one end of each elastic member 44 is connected to the mounting plate 42, and the other end abuts against the corresponding clamping member 43. Therefore, under the action of the elastic force of the two elastic members 44, the two clamping members 43 are more securely clamped to the corresponding locking rod 311.

[0073] Alternatively, if Figure 4 , Figure 5 , Figures 8 to 11 As shown, the silicon wafer debonding rack disclosed in another embodiment of the present invention further includes an unlocking mechanism 50 , which is used to abut against the clamping member 43 to release the locking rod 311 from being clamped on the clamping member 43 .

[0074] like Figure 4 , Figure 5 , Figures 8 to 11 As shown, when the silicon wafer debonding operation is completed, the unlocking mechanism 50 is abutted against the clamping member 43, so that the unlocking mechanism 50 drives the clamping member 43 to rotate, so that the locking rod 311 is released from the clamping member 43. Under the action of gravity and the first guide groove 11, the bearing roller 33 can move toward the side of the frame 10, so that the silicon wafer falls from the frame 10 to the loading mechanism of the debonding cleaning machine, completing the loading operation of the silicon wafer.

[0075] It should be noted that during the silicon wafer debonding operation, the unlocking mechanism 50 in another embodiment of the present invention is located in the cleaning tank of the debonding cleaning machine. When the silicon wafer debonding operation is completed, the unlocking mechanism 50 slowly rises to a position abutting against the clamping member 43, so that the locking rod 311 is released from the clamping member 43.

[0076] Specifically, Figure 4 , Figure 5 , Figures 8 to 11 As shown, in another embodiment of the utility model, the unlocking mechanism 50 includes a support frame 51 and a plurality of support rods 52, and the plurality of support rods 52 are all connected to the support frame 51; at least one support rod 52 abuts against a clamping member 43 to release the corresponding locking rod 311 from being clamped to the clamping member 43.

[0077] like Figure 4 , Figure 5 , Figures 8 to 11 As shown, the unlocking mechanism 50 in another embodiment of the utility model includes a support frame 51 and a plurality of support rods 52. The plurality of support rods 52 are connected to the support frame 51 so as to fix the plurality of support rods 52 through the support frame 51. When the silicon wafer debonding operation is completed, the support frame 52 drives the plurality of support rods 52 to slowly move upward so that at least one support rod 52 abuts against a clamping member 43, thereby releasing the plurality of locking rods 311 from being clamped to the corresponding clamping member 43 through the plurality of support rods 52.

[0078] It should be noted that if Fig.10 and Fig.11 As shown, the support rod 52 in another embodiment of the utility model can be a cylindrical structure or a rectangular parallelepiped structure. In another embodiment of the utility model, there are no excessive restrictions on the specific structure of the support rod 52. In actual applications, technicians can set it according to needs.

[0079] Alternatively, if Figures 1 to 9 As shown, the clamping mechanism 20 in the embodiment of the utility model includes a driving plate 21, a cam assembly 23 and a clamping roller 22, wherein the clamping roller 22 is arranged in the frame 10, and the clamping roller 22 is used to clamp the side of the silicon wafer; the driving plate 21 is slidably connected to the guide shaft 12 along the first direction A, and a second guide groove is provided on the end plate of the frame 10, one end of the cam assembly 23 is rotatably connected to the driving plate 21, the end of the clamping roller 22 passes through the second guide groove, and is rotatably connected to the other end of the cam assembly 23, and the cam assembly 23 is used to drive the clamping roller 22 to slide along the second guide groove to clamp the side of the silicon wafer or release the clamping of the side of the silicon wafer.

[0080] like Figures 1 to 9As shown, the guide shaft 12 in the embodiment of the utility model is connected to the end plate of the frame 10 along the first direction A, and the driving plate 21 is slidably connected to the guide shaft 12 along the first direction A. It can be understood that the driving plate 21 is slidably connected to the outside of the frame 10 along the first direction A. Exemplarily, a guide groove can be provided on a side of the driving plate 21 close to the frame 10, and the guide groove is sleeved on the guide shaft 12 and is clearance-matched with the guide shaft 12. Under the operation of external force, the guide groove can slide relative to the guide shaft 12 to drive the driving plate 21 to slide relative to the guide shaft 12 along the first direction A.

[0081] like Figures 1 to 9 As shown, a second guide groove is provided on the end plate of the frame body 10, and the shape of the second guide groove is similar to that of the first guide groove 11. Here, it is not repeated.

[0082] like Figures 1 to 9 As shown, the clamping roller 22 is disposed in the frame 10 and is close to the middle or top of the frame 10. One end of the cam assembly 23 is rotatably connected to the driving plate 21, and the end of the clamping roller 22 passes through the second guide groove and is rotatably connected to the other end of the cam assembly 23.

[0083] After the silicon wafer is loaded into the frame 10, under the action of external force, the driving plate 21 slides along the first direction A in the direction away from the bottom of the frame 10, and the driving plate 21 can drive the cam assembly 23 to rotate. Under the action of the second guide groove, the cam assembly 23 drives the clamping roller 22 to move toward the middle area of ​​the frame 10 to abut against the side of the silicon wafer, thereby clamping the side of the silicon wafer. After the silicon wafer degumming operation is completed, under the action of the second guide groove and gravity, the clamping roller 22 can move toward the side of the frame 10, so that the silicon wafer falls from the frame 10 to the loading mechanism of the degumming cleaning machine, completing the loading of the silicon wafer.

[0084] Alternatively, if Figures 1 to 9 As shown, the clamping roller 22 in the embodiment of the utility model includes a first clamping roller 221 and a second clamping roller 222, the cam assembly 23 includes a first cam assembly 231 and a second cam assembly 232, and the second guide groove also includes two, and the two second guide grooves are arranged at intervals along the second direction B, wherein one end of the first cam assembly 231 and the second cam assembly 232 are both rotatably connected to the driving plate 21, the end of the first clamping roller 221 passes through a second guide groove and is rotatably connected to the other end of the first cam assembly 231, and the end of the second clamping roller 222 passes through another second guide groove and is rotatably connected to the other end of the second cam assembly 232.

[0085] like Figures 1 to 9As shown, in the embodiment of the utility model, two second guide grooves are provided on the end plate of the frame body 10, and the two second guide grooves are provided at intervals along the second direction B. One end of the first cam assembly 231 is rotatably connected to the driving plate 21, and the end of the first clamping roller 221 passes through one second guide groove and is rotatably connected to the other end of the first cam assembly 231. One end of the second cam assembly 232 is rotatably connected to the driving plate 21, and the end of the second clamping roller 222 passes through another second guide groove and is rotatably connected to the other end of the second cam assembly 232.

[0086] After the silicon wafer is loaded on the frame 10, under the action of external force, the driving plate 21 slides along the first direction A toward the direction away from the bottom of the frame 10, and the driving plate 21 can drive the first cam assembly 231 and the second cam assembly 232 to rotate. Under the action of one second guide groove, the first cam assembly 231 drives the first clamping roller 221 to move toward the direction close to the second clamping roller 222. Under the action of another second guide groove, the second cam assembly 232 drives the second clamping roller 222 to move toward the direction close to the first clamping roller 221. The first clamping roller 221 clamps one side of the silicon wafer, and the second clamping roller 222 clamps the other side opposite to the silicon wafer, so that the silicon wafer is clamped more firmly between the first clamping roller 221 and the second clamping roller 222.

[0087] The embodiment of the utility model further discloses a degumming and cleaning machine, which comprises the silicon wafer degumming rack disclosed in the above embodiment.

[0088] It should be noted that in the embodiment of the utility model, the silicon wafer degumming rack included in the degumming and cleaning machine has the same structure as the silicon wafer degumming rack described in the above embodiment, and its beneficial effects are also similar, which will not be described in detail here.

[0089] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0090] Although the optional embodiments of the utility model embodiments have been described, those skilled in the art, once knowing the basic creative concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including optional embodiments and all changes and modifications falling within the scope of the utility model embodiments.

[0091] Finally, it should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or terminal device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or terminal device. In the absence of further restrictions, the elements defined by the sentence "including one..." do not exclude the existence of other identical elements in the article or terminal device including the elements.

[0092] The technical solution provided by the present invention is introduced in detail above. Specific examples are used in this article to illustrate the principle and implementation method of the present invention. At the same time, for those skilled in the art, according to the principle and implementation method of the present invention, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A silicon wafer degumming rack, characterized in that: include: A frame (10), the frame (10) being used to load silicon wafers, and a guide shaft (12) being arranged on an end plate of the frame (10); A bearing mechanism (30), the bearing mechanism (30) being slidably connected to the guide shaft (12), and the bearing mechanism (30) being used to support the bottom of the silicon wafer; A clamping mechanism (20), the clamping mechanism (20) being slidably connected to the guide shaft (12), and the clamping mechanism (20) being used to clamp the side surface of the silicon wafer; A locking mechanism (40), the locking mechanism (40) is connected to the frame (10), and the locking mechanism (40) is used to lock the supporting mechanism (30).

2. The silicon wafer degumming rack according to claim 1, characterized in that: The bearing mechanism (30) comprises a support plate (31), a connecting rod (32) and a bearing roller (33), wherein: The bearing roller (33) is arranged at the bottom of the frame (10), and the bearing roller (33) is used to support the bottom of the silicon wafer; The support plate (31) is slidably connected to the guide shaft (12) along a first direction (A), and a first guide groove (11) is provided on the end plate of the frame (10); One end of the connecting rod (32) is rotatably connected to the support plate (31), and the end of the supporting roller (33) passes through the first guide groove (11) and is rotatably connected to the other end of the connecting rod (32). The connecting rod (32) is used to drive the supporting roller (33) to slide along the first guide groove (11) to support the bottom of the silicon wafer or release the support of the bottom of the silicon wafer.

3. The silicon wafer degumming rack according to claim 2, characterized in that: The locking mechanism (40) comprises a support member (41) and a tray, wherein: The tray is arranged on a side of the frame (10) close to the carrying roller (33); One end of the support member (41) is connected to the support plate (31), and the other end of the support member (41) abuts against the tray.

4. The silicon wafer degumming rack according to claim 2, characterized in that: The bearing roller (33) comprises a first bearing roller (331) and a second bearing roller (332); the connecting rod (32) comprises a first connecting rod (321) and a second connecting rod (322); the first guide groove (11) comprises two, the two first guide grooves (11) are arranged at intervals along a second direction (B), the second direction (B) intersects with the first direction (A), wherein: One end of the first connecting rod (321) and the second connecting rod (322) are both rotatably connected to the support plate (31), the end of the first supporting roller (331) passes through one of the first guide grooves (11) and is rotatably connected to the other end of the first connecting rod (321), and the end of the second supporting roller (332) passes through another of the first guide grooves (11) and is rotatably connected to the other end of the second connecting rod (322).

5. The silicon wafer degumming rack according to claim 2, characterized in that: The locking mechanism (40) comprises a mounting plate (42), a clamping member (43) and an elastic member (44), wherein: The mounting plate (42) is fixedly connected to the end plate of the frame (10), and the mounting plate (42) is arranged on a side of the support plate (31) away from the connecting rod (32); The clamping member (43) is rotatably connected to the mounting plate (42), and a locking rod (311) is provided on the support plate (31). When the support plate (31) slides along the first direction (A) toward a direction away from the bottom of the frame (10), the clamping member (43) is clamped on the locking rod (311) to lock the support plate (31); One end of the elastic member (44) is connected to the mounting plate (42), and the other end of the elastic member (44) is abutted against the clamping member (43).

6. The silicon wafer degumming rack according to claim 5, characterized in that: The clamping member (43) comprises a rotating shaft pin (431), a connecting portion (432) and a locking hook (433), wherein: The connecting portion (432) is rotatably connected to the mounting plate (42) via the rotating shaft pin (431); The locking hook (433) is arranged on one side of the connecting portion (432), and the other end of the elastic member (44) abuts against the other side of the connecting portion (432) away from the locking hook (433).

7. The silicon wafer degumming rack according to claim 5, characterized in that: The clamping members (43) include two clamping members (43), which are arranged at intervals along a second direction (B) and are both rotatably connected to the mounting plate (42), and the second direction (B) intersects with the first direction (A); The locking rods (311) include two locking rods (311), which are arranged on the support plate (31) at intervals along the second direction (B), and each locking rod (311) is arranged corresponding to one of the clamping members (43); The elastic members (44) also include two, and each of the elastic members (44) is arranged corresponding to one of the clamping members (43).

8. The silicon wafer degumming rack according to claim 5, characterized in that: The silicon wafer debonding rack further comprises an unlocking mechanism (50), wherein the unlocking mechanism (50) is used to abut against the clamping member (43) so as to release the locking rod (311) from being clamped on the clamping member (43).

9. The silicon wafer degumming rack according to claim 8, characterized in that: The unlocking mechanism (50) comprises a support frame (51) and a plurality of support rods (52), wherein the plurality of support rods (52) are all connected to the support frame (51); At least one of the support rods (52) abuts against one of the clamping members (43) so that the corresponding locking rod (311) is released from being clamped on the clamping member (43).

10. A degumming and cleaning machine, characterized in that: A silicon wafer degumming rack comprising any one of claims 1-9.

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