Wafer adaptive three-point edge clamping device

Abstract

The utility model discloses a wafer self-adaptive three-point type edge clamping device, which comprises a workbench and a plurality of clamping mechanisms, the workbench is provided with a circular hollow part, and the plurality of clamping mechanisms are sequentially arranged along the circumferential direction of the circular hollow part. The clamping mechanism comprises a reciprocating moving assembly and clamping wheels which are arranged on the reciprocating moving assembly in a free rotating mode, the reciprocating moving assembly can drive the clamping wheels to move in a reciprocating mode in the diameter direction of the hollow type circular workbench, and the clamping wheels comprise small wheels and large wheels arranged below the small wheels. And a clamping step for clamping the edge of the wafer is formed between the small wheel and the large wheel. According to the utility model, a three-point type edge clamping structure design is adopted, and the device has the characteristics of simple structure, good compatibility, stability, reliability, small influence on the form of a wafer and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of wafer processing, and in particular relates to a wafer self-adaptive three-point edge clamping device. Background Art

[0002] Currently, wafers are indispensable materials in the chip manufacturing process, and the entire chip manufacturing process involves multiple processing and measurement processes. In order to ensure the processing quality of the chip, it is necessary to perform high-precision measurement of the processed state of the wafer after multiple processing steps. At this time, a high-precision wafer clamping motion detection platform is needed.

[0003] Traditional wafer measurement clamping methods mostly use mechanical clamps to clamp and fix, or use vacuum adsorption to fix. The above clamping methods have many disadvantages. For example, the mechanical clamp clamping method can only be used to clamp and fix wafers of one size, and is not compatible with the clamping of wafers of multiple sizes. It may cause damage to the wafer due to hard contact. Therefore, in a variety of detection environments, it is necessary to frequently replace the clamp to adapt to wafers of different sizes. After replacing the clamp, debugging and other work are required, which increases the workload and leads to low detection efficiency. Although the adsorption fixing method has the advantages of strong compatibility, stability and reliability, this adsorption method has a relatively complex structure and has particularly high requirements for the flatness of the suction cup. It is necessary to design a reserved fork position to facilitate the loading and unloading of the wafer, which increases the difficulty of the suction cup processing. Moreover, when the wafer is adsorbed on the surface of the suction cup by the vacuum suction cup, the wafer will be partially deformed due to air pressure. After the processing is completed, the wafer will rebound, causing its surface to be corrugated and the surface flatness to decrease. Utility Model Content

[0004] The utility model aims to solve one of the technical problems in the related art at least to a certain extent.

[0005] To this end, the technical solution adopted by the utility model is: a wafer adaptive three-point edge clamping device, including a workbench and multiple clamping mechanisms, the workbench is provided with a circular hollow portion, and the multiple clamping mechanisms are arranged in sequence along the circumferential direction of the circular hollow portion, the clamping mechanism includes a reciprocating moving component and a clamping wheel that can rotate freely on the reciprocating moving component, the reciprocating moving component can drive the clamping wheel to reciprocate along the diameter direction of the hollow circular workbench, the clamping wheel includes a small wheel and a large wheel arranged below the small wheel, and a clamping step for clamping the edge of the wafer is formed between the small wheel and the large wheel.

[0006] The small wheel is coaxially arranged with the large wheel.

[0007] The reciprocating moving component includes an electric cylinder.

[0008] The electric cylinder is connected to the workbench through an electric cylinder fixing seat.

[0009] A slider and a guide rail are provided on one side of the electric cylinder. The slider is connected to the workbench through a slider fixing seat. The end of the push rod of the electric cylinder is connected to a clamping wheel fixing block. The large wheel is installed on the clamping wheel fixing block. The clamping wheel fixing block is connected to the guide rail, and the guide rail and the slider can produce relative sliding.

[0010] There are three clamping mechanisms in total, and the three clamping mechanisms are evenly spaced in sequence along the circumferential direction of the hollow circular worktable.

[0011] Preferably, the small wheel and the large wheel are integrally formed.

[0012] Compared with the prior art, the utility model has the following beneficial effects: the utility model adopts a three-point edge clamping structure design, and the invention has the characteristics of simple structure, good compatibility, stability and reliability, and little impact on wafer morphology. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a structural schematic diagram of the utility model;

[0014] Figure 2 It is a structural schematic diagram of the clamping wheel. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0016] On the contrary, the present application covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present application as defined by the claims. Further, in order to make the public have a better understanding of the present application, some specific details are described in detail in the detailed description of the present application below. Those skilled in the art can fully understand the present application without the description of these details.

[0017] See also Figure 1-2 A wafer adaptive three-point edge clamping device includes a workbench 1 and multiple clamping mechanisms 2. The workbench 1 is provided with a circular hollow portion 11. The multiple clamping mechanisms 2 are arranged in sequence along the circumferential direction of the circular hollow portion 11. The clamping mechanism 2 includes a reciprocating component and a clamping wheel 21 that can rotate freely on the reciprocating component. The reciprocating component can drive the clamping wheel 21 to reciprocate along the diameter direction of the hollow circular workbench 1. The clamping wheel 21 includes a small wheel 211 and a large wheel 212 arranged below the small wheel 211. A clamping step 213 for clamping the edge of a wafer 3 is formed between the small wheel 211 and the large wheel 212.

[0018] The small wheel 211 is coaxially arranged with the large wheel 212. During use, the size of the small wheel can be replaced to change the clamping step to meet the needs of different supporting surfaces, thereby achieving the purpose of high compatibility and high versatility.

[0019] The reciprocating moving component includes an electric cylinder 22 .

[0020] The electric cylinder 22 is connected to the workbench 1 via an electric cylinder fixing seat 23 .

[0021] A slider 25 and a guide rail 24 are provided on one side of the electric cylinder 22. The slider 25 is connected to the workbench 1 through a slider fixing seat 26. The end of the push rod of the electric cylinder 22 is connected to a clamping wheel fixing block 27. The large wheel 212 is installed on the clamping wheel fixing block 27. The clamping wheel fixing block 27 is connected to the guide rail 24, and the guide rail 24 and the slider 25 can produce relative sliding.

[0022] When the push rod of the electric cylinder 22 moves back and forth, the guide rail 24 and the slider 25 slide relative to each other. When the clamping wheels 21 of the three clamping mechanisms 2 clamp the wafer 3 together, the wafer is clamped and fixed. A pressure sensor is provided in the electric cylinder. The pressure sensor inside the electric cylinder monitors the pressure of the electric cylinder push rod in real time. When the pressure of the electric cylinder push rod reaches the set pressure value, the electric cylinder stops working and finally completes the fixation of the wafer.

[0023] Before the utility model works, the wafer handling robot places the wafer on the clamping device so that the edge of the wafer is naturally placed on the three clamping wheels, and the wafer is supported by the supporting surfaces of the three clamping wheels. After the placement is completed, the wafer handling robot returns to its position.

[0024] There are three clamping mechanisms 2 in total, and the three clamping mechanisms 2 are evenly spaced in sequence along the circumferential direction of the hollow circular workbench 1 .

[0025] Preferably, the small wheel 211 and the large wheel 212 are integrally formed.

[0026] The utility model has a simple overall structure and adopts a circular hollow design in the center of the workbench. This structural design can not only effectively reduce the weight of the structure, but also is conducive to the arrangement of optical detection devices. For example, when performing wafer thickness detection, an optical sensor needs to be arranged under the wafer, and the secondary hollow design reserves sufficient arrangement space for the detection device.

[0027] There is a certain height difference between the wafer clamping plane and the workbench plane. This height difference leaves enough space for the fork to work, making it convenient for wafer loading and unloading operations.

[0028] The clamping mechanism uses three clamping wheels to clamp and fix the wafer. The three-point clamping method and the freely rotatable clamping wheel design can not only evenly distribute the wafer pressure, but also freely disperse the holding force through the free rotation of the clamping wheels during the clamping and fixing process, thereby ensuring uniform force at each clamping point.

[0029] The clamping mechanism is driven by an electric cylinder, which can clamp and fix wafers of various sizes by controlling the advancement stroke of the electric cylinder push rod, and has good compatibility and versatility. A pressure sensor is installed inside the electric cylinder to monitor and control the clamping force in real time, effectively avoiding the situation where the wafer is deformed due to excessive clamping force.

[0030] The clamping mechanism is provided with a guide rail and a slider, and the clamping wheel fixing block is fixedly connected to the guide rail. This structural design enables the three clamping wheels to always move along the guide rail during the forward movement and have high movement accuracy.

[0031] By combining the above technical solutions, the entire wafer clamping device can have the advantages of simple structure, strong compatibility, convenient operation, stable clamping, little impact on the wafer, and strong adaptability.

Claims

1. A wafer adaptive three-point edge clamping device, characterized in that: The invention comprises a workbench (1) and a plurality of clamping mechanisms (2), wherein the workbench (1) is provided with a circular hollow portion (11), and the plurality of clamping mechanisms (2) are arranged in sequence along the circumferential direction of the circular hollow portion (11), wherein the clamping mechanism (2) comprises a reciprocating component and a clamping wheel (21) which is freely rotatable and arranged on the reciprocating component, wherein the reciprocating component can drive the clamping wheel (21) to reciprocate along the diameter direction of the hollow circular workbench (1), wherein the clamping wheel (21) comprises a small wheel (211) and a large wheel (212) arranged below the small wheel (211), and a clamping step (213) for clamping the edge of a wafer (3) is formed between the small wheel (211) and the large wheel (212).

2. The wafer adaptive three-point edge clamping device according to claim 1, characterized in that: The small wheel (211) and the large wheel (212) are coaxially arranged.

3. The wafer adaptive three-point edge clamping device according to claim 1, characterized in that: The reciprocating moving component comprises an electric cylinder (22).

4. The wafer adaptive three-point edge clamping device according to claim 3, characterized in that: The electric cylinder (22) is connected to the workbench (1) via an electric cylinder fixing seat (23).

5. The wafer adaptive three-point edge clamping device according to claim 3, characterized in that: A slider (25) and a guide rail (24) are provided on one side of the electric cylinder (22); the slider (25) is connected to the workbench (1) via a slider fixing seat (26); the end of the push rod of the electric cylinder (22) is connected to a clamping wheel fixing block (27); the large wheel (212) is mounted on the clamping wheel fixing block (27); the clamping wheel fixing block (27) is connected to the guide rail (24); and the guide rail (24) and the slider (25) can slide relative to each other.

6. The wafer adaptive three-point edge clamping device according to claim 1, characterized in that: There are three clamping mechanisms (2) in total, and the three clamping mechanisms (2) are arranged in sequence and evenly spaced apart along the circumference direction of the hollow circular workbench (1).

7. The wafer adaptive three-point edge clamping device according to claim 1, characterized in that: The small wheel (211) and the large wheel (212) are integrally formed.

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