Lighting module and carrier system

Abstract

The present application discloses a light-emitting module and a carrier system, which relates to the field of laser technology. The light-emitting module includes: a tube holder, a light-emitting element, a first lead, a second lead and a tube cap; the tube holder has a first end face and a second end face arranged opposite to each other, and the light-emitting element is fixed on the tube holder; the first lead and the second lead both penetrate the first end face and the second end face, the first connection part of the first lead is connected to the positive electrode of the light-emitting element, the second connection part of the first lead is used to connect to the positive electrode of the circuit on the substrate, the first connection part of the second lead is connected to the negative electrode of the light-emitting element, and the second connection part of the second lead is used to connect to the negative electrode of the circuit on the substrate; the tube cap has an inner cavity, and the tube cap and the tube holder are connected to jointly define an accommodation space, and the accommodation space accommodates the light-emitting element, the first connection part of the first lead and the first connection part of the second lead. The tube holder has a simple structure, which can reduce the cost of the light-emitting module.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and more specifically, to a light-emitting module and a carrier system. Background Art

[0002] In the field of laser technology, semiconductor lasers are the core components of light sources. Although some lasers have been designed, the structures of existing lasers are relatively complex and the manufacturing costs are high. Utility Model Content

[0003] The present application proposes a light emitting module and a carrier system to improve the above-mentioned defects.

[0004] In a first aspect, the present application provides a light-emitting module, which includes: a tube seat, a light-emitting element, a first lead, a second lead and a tube cap; the tube seat has a first end face and a second end face that are oppositely arranged, the light-emitting element is fixed on the tube seat for emitting light, and the second end face is used to connect to a substrate; the first lead and the second lead both pass through the first end face and the second end face, and both include a first connecting portion located at the first end face and a second connecting portion located at the second end face; the first connecting portion of the first lead is connected to the positive electrode of the light-emitting element, and the second connecting portion of the first lead is used to connect to the positive electrode of the circuit on the substrate, the first connecting portion of the second lead is connected to the negative electrode of the light-emitting element, and the second connecting portion of the second lead is used to connect to the negative electrode of the circuit on the substrate; the tube cap has an inner cavity, and the tube cap and the tube seat are connected to jointly define an accommodating space, and the accommodating space accommodates the light-emitting element, the first connecting portion of the first lead and the first connecting portion of the second lead.

[0005] Optionally, for a possible implementation, the tube holder includes a copper base plate and an outer frame, the outer frame surrounds the copper base plate and is sealed and welded to the copper base plate; the light-emitting element is fixed on the copper base plate, the first lead and the second lead both pass through the outer frame, the outer frame has a third surface and a fourth surface arranged opposite to each other, the third surface is the first end surface, and the fourth surface is the second end surface.

[0006] Optionally, in a possible implementation manner, the first lead wire and the second lead wire are sintered integrally with the outer frame via a first insulator to pass through the outer frame.

[0007] Optionally, in a possible implementation manner, the material of the outer frame is the same as the material of the copper bottom plate.

[0008] Optionally, for a possible implementation, the first lead and the second lead are sintered integrally with the outer frame through a transition piece, a second insulator, and pass through the outer frame, wherein the thermal expansion coefficient of the transition piece is between a first coefficient and a second coefficient, the first coefficient is the thermal expansion coefficient of the outer frame, and the second coefficient is the thermal expansion coefficient of the second insulator.

[0009] Optionally, in a possible implementation manner, the light emitting module further includes: a reflective element; the reflective element is fixed on the tube holder and is located in the accommodating space, and is used to change the direction of the light emitted by the light emitting element.

[0010] Optionally, in a possible implementation manner, the reflective element is disposed opposite to the plurality of light-emitting elements, so as to change the direction of the light emitted by the plurality of light-emitting elements.

[0011] Optionally, for a possible implementation, the light-emitting module further includes: a light window, a via hole is provided on the side wall of the tube cap, the via hole is connected to the accommodating space, the light window is sealed and connected to the via hole, and is arranged opposite to the reflective element to allow the light reflected by the reflective element to pass through the light window.

[0012] Optionally, in a possible implementation manner, the light emitting module further includes: a lens, wherein the lens is fixed to the tube cap via a fixing member, and is used to allow the light reflected by the reflective element to pass through the lens.

[0013] In a second aspect, the present application further provides a carrier system, which includes: a main body and the aforementioned light-emitting module; the main body has a mounting position, and the mounting position is used to install at least one of the light-emitting modules.

[0014] The solution provided by the present application provides a light-emitting module, which includes: a tube base, a light-emitting element, a first lead, a second lead and a tube cap. The tube base has a first end face and a second end face that are arranged opposite to each other, the light-emitting element is fixed on the tube base for emitting light, and the second end face is used to connect to a substrate. The first lead and the second lead both pass through the first end face and the second end face, and both include a first connection portion located at the first end face and a second connection portion located at the second end face. The first connection portion of the first lead is connected to the positive electrode of the light-emitting element, the second connection portion of the first lead is used to connect to the positive electrode of the circuit on the substrate, the first connection portion of the second lead is connected to the negative electrode of the light-emitting element, and the second connection portion of the second lead is used to connect to the negative electrode of the circuit on the substrate. The tube cap has an inner cavity, and the tube cap and the tube base are connected to define a storage space together, and the storage space accommodates the light-emitting element, the first connection portion of the first lead and the first connection portion of the second lead.

[0015] In the light-emitting module provided in the present application, the positive electrode of the light-emitting element can be connected to the positive electrode of the circuit on the substrate through the first lead, and the negative electrode of the light-emitting element can be connected to the negative electrode of the circuit on the substrate through the second lead. The first lead and the second lead both pass through the first end face and the second end face. Through this structure, the light-emitting element can be connected to the circuit on the external substrate, so that the tube seat structure is simple, and the lead sintering process is mature, which can reduce the cost of the light-emitting module.

[0016] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of the exploded structure of the light-emitting module provided in an embodiment of the present application is shown;

[0019] Figure 2 A schematic diagram of the structure of a tube socket provided in an embodiment of the present application is shown;

[0020] Figure 3 A schematic diagram of the exploded structure of a tube socket provided in an embodiment of the present application is shown;

[0021] Figure 4 A schematic diagram of an exploded structure of a tube socket provided in another embodiment of the present application is shown;

[0022] Figure 5 A schematic diagram of the structure of a laser single module provided in an embodiment of the present application is shown;

[0023] Figure 6 Shows Figure 5 A schematic diagram of the structure of the substrate in FIG.

[0024] Figure 7 A schematic diagram of the structure of a laser dual-module provided in an embodiment of the present application is shown;

[0025] Figure 8 Shows Figure 7 Schematic diagram of the structure of the substrate.

[0026] Description of reference numerals:

[0027] 1. Tube base; 11. First end face; 12. Second end face; 13. Copper base plate; 14. Outer frame; 2. Light-emitting element; 21. Substrate; 22. Wire; 23. Reflective element; 3. Tube cap; 31. Via hole; 4. First lead; 5. Second lead; 6. Light window; 7. Lens; 71. Fixing piece; 8. First insulator; 9. Second insulator; 10. Transition piece. DETAILED DESCRIPTION

[0028] In order to make those skilled in the art better understand the present application scheme, the technical scheme in the present application embodiment will be clearly and completely described below in conjunction with the drawings in the present application embodiment. Obviously, the described embodiment is only a part of the present application embodiment, rather than all the embodiments. The components of the present application embodiment usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiment of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0029] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0030] In the field of laser technology, semiconductor lasers are the core components of light sources. Although some lasers have been designed, the structures of existing lasers are relatively complex and the manufacturing costs are high.

[0031] Therefore, in an embodiment of the present application, a light-emitting module and a carrier system are provided to solve or partially solve the above-mentioned problems.

[0032] See also Figure 1-Figure 2 , which shows a structural schematic diagram of a light-emitting module 100 provided in an embodiment of the present application, the light-emitting module can be applied to a laser projection system, and the light-emitting module includes: a tube holder 1, a light-emitting element 2, a first lead 4, a second lead 5 and a tube cap 3.

[0033] The tube base 1 has a first end surface 11 and a second end surface 12 which are arranged opposite to each other. The light emitting element 2 is fixed on the tube base 1 for emitting light. The second end surface 12 is used for connecting with a substrate.

[0034] The first lead 4 and the second lead 5 both pass through the first end surface 11 and the second end surface 12 , and both include a first connecting portion located at the first end surface 11 and a second connecting portion located at the second end surface 12 .

[0035] The first connection portion of the first lead 4 is connected to the positive electrode of the light-emitting element 2, and the second connection portion of the first lead 4 is used to connect to the positive electrode of the circuit on the substrate. The first connection portion of the second lead 5 is connected to the negative electrode of the light-emitting element 2, and the second connection portion of the second lead 5 is used to connect to the negative electrode of the circuit on the substrate.

[0036] The tube cap 3 has an inner cavity. The tube cap 3 is connected with the tube base 1 to define a receiving space. The receiving space receives the light emitting element 2 , the first connecting portion of the first lead 4 , and the first connecting portion of the second lead 5 .

[0037] In the light-emitting module provided in the present application, the positive electrode of the light-emitting element 2 can be connected to the positive electrode of the circuit on the substrate through the first lead 4, and the negative electrode of the light-emitting element 2 can be connected to the negative electrode of the circuit on the substrate through the second lead 5. The first lead 4 and the second lead 5 both pass through the first end surface 11 and the second end surface 12. Through this structure, the light-emitting element 2 can be connected to the circuit on the external substrate, so that the structure of the tube seat 1 is simple, and the lead sintering process is mature, which can reduce the cost of the light-emitting module.

[0038] Specifically, the light emitting element 2 is fixed on the tube holder 1 , and the tube cap 3 is connected with the tube holder 1 to define a receiving space, which can receive the light emitting element 2 , the first connecting portion of the first lead 4 , and the second connecting portion of the second lead 5 .

[0039] It should be noted that the light emitting element 2 may be a laser chip, and when the light emitting element 2 is powered on, the light emitting element 2 may emit light. The performance of the laser is strongly related to its packaging method, and packaging differences have a great impact on the brightness and life of the laser. The laser chip packaging needs to meet heat dissipation requirements and airtightness requirements.

[0040] As an example, the connection between the tube cap 3 and the tube base 1 is a sealed connection, and the tube cap 3 and the tube base 1 can be integrated by resistance welding, so that the accommodating space meets the airtightness requirement.

[0041] As an example, the positive electrode of the light-emitting element 2 is connected to the first connecting part of the first lead 4 through the wire 23. Specifically, one end of the wire 23 is welded to the positive electrode of the light-emitting element 2, and the other end of the wire 23 is welded to the first connecting part of the first lead 4. The second connecting part of the first lead 4 is used to connect to the positive electrode of the circuit on the substrate. Similarly, the negative electrode of the light-emitting element 2 is connected to the first connecting part of the second lead 5 through the wire 23, and the second connecting part of the second lead 5 is used to connect to the negative electrode of the circuit on the substrate. In this way, the light-emitting element 2 can be connected to the circuit on the external substrate to form a power supply circuit.

[0042] It should be noted that the present application may have multiple light-emitting elements 2, and the multiple light-emitting elements 2 are connected together according to needs, have a common positive electrode and a common negative electrode, and connect the common positive and negative electrodes to corresponding leads to form a power supply circuit.

[0043] The first lead 4 and the second lead 5 both pass through the first end surface 11 and the second end surface 12 , and the first lead 4 , the second lead 5 are sealed and connected to the outer frame 14 , so that the accommodating space meets the airtightness requirement.

[0044] It should be noted that the light emitting element 2 is fixed on the tube holder 1 , and can be fixed to the tube holder 1 by welding, or can be fixed to the tube holder 1 by bonding.

[0045] For further information, see Figure 1-Figure 4 The tube seat 1 includes a copper bottom plate 13 and an outer frame 14 . The outer frame 14 surrounds the copper bottom plate 13 and is sealed and welded to the copper bottom plate 13 .

[0046] The light emitting element 2 is fixed on the copper base plate 13 , the first lead 4 and the second lead 5 both pass through the outer frame 14 , the outer frame 14 has a third surface and a fourth surface arranged oppositely, the third surface is the first end surface 11 , and the fourth surface is the second end surface 12 .

[0047] Compared with the prior art of dissipating heat from the light-emitting element through a refrigerator, the light-emitting element 2 of the present application is fixed on the copper base plate 13, and the heat generated by the light-emitting element 2 can be directly transmitted through the copper base plate 13. Not only is the heat dissipation efficiency higher, but the present application does not require an additional cooling circuit, the light-emitting module structure is simpler, and the cost is lower.

[0048] Specifically, the outer frame 14 surrounds the copper bottom plate 13 and is sealed and welded to the copper bottom plate 13 to meet the airtightness requirement of the accommodation space.

[0049] The outer frame 14 has a third surface and a fourth surface that are arranged opposite to each other. The third surface is the first end surface 11, and the fourth surface is the second end surface 12. The first lead 4 and the second lead 5 both pass through the outer frame 14, making the connection between the light-emitting element 2 and the external circuit simpler.

[0050] Preferably, the copper bottom plate 13 may be made of copper material with high thermal conductivity, such as oxygen-free copper or red copper, and the outer frame 14 may be made of iron or stainless steel, such as SPCC steel or carbon steel.

[0051] Furthermore, the first lead 4 and the second lead 5 are sintered integrally with the outer frame 14 via the first insulator 8 to penetrate the outer frame 14 .

[0052] It is important to know that if the expansion coefficients of the objects do not match, inconsistent stress will easily occur during high-temperature welding or sintering, which will lead to breakage after sintering or substandard airtightness.

[0053] To this end, the first lead 4 and the second lead 5 of the present application are sintered integrally with the outer frame 14 through the first insulator 8, so that the first lead 4 and the second lead 5 are both sealed and connected to the outer frame 14, and can still maintain stable performance in a thermal expansion and contraction environment, meeting the airtightness requirements. The present application is not only simple in processing technology, easy to implement, but also low in cost.

[0054] Preferably, the first insulator 8 may be made of glass or ceramic, and the first lead 4 or the second lead 5 may be made of copper, aluminum or an alloy.

[0055] It should be noted that, taking the first lead 4 as an example, the outer frame 14 has a hole for sintering, the first insulator 8 is annular, the first insulator 8 surrounds the first lead 4, passes through the hole of the outer frame 14, the first lead 4 and the hole through the first insulator 8 and the outer frame 14 are sintered as one, and after sintering, the first lead 4 and the outer frame 14 are insulated. The same is true for the second lead, which will not be repeated here.

[0056] Furthermore, the material of the outer frame 14 is the same as the material of the copper bottom plate 13 .

[0057] The first lead 4 and the second lead 5 are sintered integrally with the outer frame 14 through the transition piece 10, the second insulator 9, and the outer frame 14 to penetrate the outer frame 14, wherein the thermal expansion coefficient of the transition piece 10 is between the first coefficient and the second coefficient, the first coefficient is the thermal expansion coefficient of the outer frame 14, and the second coefficient is the thermal expansion coefficient of the second insulator 9.

[0058] The material of the outer frame 14 of the present application is the same as that of the copper base plate 13 , that is, the entire tube base is made of copper, which increases the heat dissipation area of ​​the light-emitting element 2 , thereby improving the heat dissipation efficiency of the light-emitting element 2 .

[0059] Since the thermal expansion coefficient of the second insulator does not match that of the outer frame, directly sintering the second insulator and the outer frame may lead to inconsistent stress, which may cause breakage after sintering or substandard airtightness.

[0060] To this end, the first lead 4 and the second lead 5 of the present application are sintered integrally with the outer frame 14 through the transition piece 10, the second insulator 9, and the outer frame 14 to penetrate the outer frame 14, wherein the thermal expansion coefficient of the transition piece 10 is between the thermal expansion coefficient of the second insulator 9 and the thermal expansion coefficient of the outer frame 14. The first lead 4 and the second lead 5 can be sealed and connected to the outer frame 14, and can still meet the airtightness requirements in a thermal expansion and contraction environment.

[0061] Taking the first lead as an example, the outer frame 14 and the transition piece 10 may be welded together first, and then sintered together with the second insulator 9 and the first lead 4 , thereby ensuring the airtightness and insulation requirements of the first lead 4 and the outer frame 14 .

[0062] Preferably, the material of the transition piece 10 may be iron, steel, titanium or nickel, and the second insulator 9 may be glass or ceramic.

[0063] It should be noted that, taking the first lead as an example, the outer frame 14 has a hole for sintering, the transition piece 10 is annular, the second insulator 9 is annular, the second insulator 9 surrounds the first lead 4, the transition piece 10 surrounds the second insulator 9, passes through the hole of the outer frame 14, and the hole of the outer frame 14 and the transition piece 10 are first welded into one, and then sintered into one with the second insulator 9 and the first lead 4. After sintering, the first lead 4 and the outer frame 14 are insulated, and the second lead is the same, which will not be repeated here.

[0064] For further information, see Figure 1 , the light emitting module also includes: a reflective element 23.

[0065] The reflective element 23 is fixed on the tube base 1 and is located in the accommodating space, and is used to change the direction of the light emitted by the light emitting element 2 .

[0066] It should be noted that the reflective element 23 is fixed to the tube holder 1 and can be fixed to the tube holder by welding, during which it is necessary to ensure that the relative position and angle of the light-emitting element and the reflective element meet the requirements. It can also be fixed to the tube holder by bonding, during which it is also necessary to ensure that the relative position and angle of the light-emitting element and the reflective element meet the requirements.

[0067] Preferably, the reflective element can convert the light emitted by the light emitting element and parallel to the first end surface into light perpendicular to the first end surface.

[0068] Preferably, the light reflected by the reflective element is perpendicular to the first end face.

[0069] Furthermore, the reflective element 23 is arranged opposite to the plurality of light emitting elements 2 to change the direction of light emitted by the plurality of light emitting elements 2. The present application has a small number of materials, which can reduce the number of patches of the reflective element, thereby reducing the cost of the light emitting module.

[0070] For further information, see Figure 1 , the light emitting module also includes: a light window 6.

[0071] A through hole 31 is provided on the side wall of the tube cap 3 , and the through hole 31 is connected to the accommodating space. The light window 6 is sealed and connected to the through hole 31 , and is arranged opposite to the reflective element 23 , so that the light reflected by the reflective element 23 passes through the light window 6 .

[0072] It should be noted that the light window 6 is made of transparent material and can be used to transmit the light reflected by the reflective element 23 or the light emitted by the light emitting element 2. Different anti-reflection films can be plated on the light window 6 according to the laser beams of different wavelengths generated by the light emitting element to ensure the transmittance requirements.

[0073] The light window 6 may be made of glass, and the light window 6 may be integrally sintered with the through hole 31 of the tube cap 3 by glass welding, which may meet the airtightness requirement of the accommodation space.

[0074] Specifically, the light window 6 is welded to the inner side surface of the tube cap 3 using a simple, mature, and low-cost low-temperature glass welding process.

[0075] For further information, see Figure 1 The light emitting module further includes: a lens 7 , which is fixed to the tube cap 3 via a fixing member 71 , and is used to allow the light reflected by the reflecting element 23 to pass through the lens 7 .

[0076] The lens 7 is used to collimate the light reflected by the reflective element 23 , that is, by adjusting the lens 7 , the light reflected by the reflective element 23 can be made parallel.

[0077] After the relative positions of the lens 7 and the tube cap 3 are adjusted as required, the lens 7 can be bonded to the tube cap 3 or welded to the tube cap 3 to ensure that the lens 7 can collimate the light reflected by the reflective element 23 during use.

[0078] See also Figure 5-Figure 6 , a single light emitting module is welded on the substrate 21 to form a laser single module 200, please refer to Figure 7-Figure 8The two light-emitting modules are welded on the substrate 21 to form a laser dual module 300. The light-emitting module 100 of the present application can be used as a standard module and can be mass-produced. When used, a single module, dual module, multi-module, etc. can be selected according to needs to match the needs of different products with high flexibility.

[0079] An embodiment of the present application provides a carrier system, which includes: a main body and the aforementioned light-emitting module.

[0080] The main body has an installation position, and the installation position is used to install at least one of the light-emitting modules.

[0081] The carrier system may be a laser radar, a laser projector, a laser engraving machine, etc., which is not specifically limited here.

[0082] In an exemplary embodiment, the tube holder includes a copper base plate and an outer frame, the outer frame surrounds the copper base plate, and is sealed and welded with the copper base plate, which can improve the heat dissipation efficiency of the light-emitting element. The positive electrode of the light-emitting element is connected to the first connection part of the first lead through a wire, and the second connection part of the first lead is used to connect to the positive electrode of the circuit on the substrate. The negative electrode of the light-emitting element is connected to the first connection part of the second lead through a wire, and the second connection part of the second lead is used to connect to the negative electrode of the circuit on the substrate. The light-emitting module can be connected to the circuit on the external substrate through this structure to form a power supply circuit. The structure of the tube holder is simple, which can reduce the manufacturing cost of the light-emitting module. The tube holder and the tube cap are connected to define a storage space, and the storage space has good sealing, heat dissipation and airtightness. The present application not only reduces the manufacturing cost of the light-emitting module, but also meets the requirements of the light-emitting module packaging, and can be mass-produced.

[0083] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light emitting module, characterized in that: The light emitting module comprises: A tube base, a light emitting element, a first lead, a second lead and a tube cap; The tube base has a first end face and a second end face which are arranged opposite to each other, the light emitting element is fixed on the tube base for emitting light, and the second end face is used for connecting with the substrate; The first lead and the second lead both pass through the first end surface and the second end surface, and both include a first connecting portion located at the first end surface and a second connecting portion located at the second end surface; The first connection portion of the first lead is connected to the positive electrode of the light-emitting element, the second connection portion of the first lead is used to connect to the positive electrode of the circuit on the substrate, the first connection portion of the second lead is connected to the negative electrode of the light-emitting element, and the second connection portion of the second lead is used to connect to the negative electrode of the circuit on the substrate; The tube cap has an inner cavity, and the tube cap and the tube base are connected to define a receiving space together, and the receiving space receives the light emitting element, the first connecting portion of the first lead wire, and the first connecting portion of the second lead wire.

2. The light emitting module according to claim 1, characterized in that: The tube seat comprises a copper bottom plate and an outer frame, wherein the outer frame surrounds the copper bottom plate and is sealed and welded to the copper bottom plate; The light emitting element is fixed on the copper bottom plate, the first lead and the second lead both pass through the outer frame, the outer frame has a third surface and a fourth surface arranged oppositely, the third surface is the first end surface, and the fourth surface is the second end surface.

3. The light emitting module according to claim 2, characterized in that: The first lead wire and the second lead wire are sintered integrally with the outer frame through a first insulator to penetrate the outer frame.

4. The light emitting module according to claim 2, characterized in that: The material of the outer frame is the same as that of the copper bottom plate.

5. The light emitting module according to claim 4, characterized in that: The first lead and the second lead are sintered integrally with the outer frame through a transition piece, a second insulator, and penetrate the outer frame, wherein the thermal expansion coefficient of the transition piece is between a first coefficient and a second coefficient, the first coefficient is the thermal expansion coefficient of the outer frame, and the second coefficient is the thermal expansion coefficient of the second insulator.

6. The light emitting module according to claim 1, characterized in that: The light emitting module further comprises: Reflective element; The reflective element is fixed on the tube holder, located in the accommodating space, and is used to change the direction of the light emitted by the light emitting element.

7. The light emitting module according to claim 6, characterized in that: The reflective element is arranged opposite to the plurality of light emitting elements and is used for changing the directions of the light emitted by the plurality of light emitting elements.

8. The light emitting module according to claim 6, characterized in that: The light emitting module further comprises: a light window, A via hole is provided on the side wall of the tube cap, the via hole is connected to the accommodating space, the light window is sealed and connected to the via hole, and is arranged opposite to the reflective element so as to allow the light reflected by the reflective element to pass through the light window.

9. The light emitting module according to claim 6, characterized in that: The light emitting module further comprises: A lens is fixed on the tube cap through a fixing piece and is used to allow the light reflected by the reflecting element to pass through the lens.

10. A carrier system, characterized in that: The carrier system comprises: A main body and a light-emitting module as described in any one of claims 1 to 9; The main body has an installation position, and the installation position is used to install at least one of the light-emitting modules.

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