Inverter brick assembly

By integrating filters and boost converters in the inverter brick assembly, the matching problem between the 800V inverter brick and 400V charging pile is solved, reducing EMC interference and improving the reliability and stability of the system.

CN222706391UActive Publication Date: 2025-04-01UNITED AUTOMOTIVE ELECTRONICS SYST
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Patent Information

Application Number
CN202420781876.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-04-16
Publication Date
2025-04-01
Estimated Expiration
2034-04-16

AI Technical Summary

Technical Problem

The existing inverter brick products are mainly 400V, which cannot meet the needs of 800V voltage platform electric vehicles, and are not matched with most of the 400V charging piles on the market, resulting in voltage mismatch and EMC interference.

Method used

An inverter brick assembly is designed to integrate the filter and boost converter in the housing to achieve integration of boost function, adapt to existing charging piles, and reduce EMC interference through the filter.

Benefits of technology

The adaptation of inverter brick components to 800V is achieved, reducing EMC interference, improving system reliability and stability, and simplifying product structure, improving reliability and reducing volume.

✦ Generated by Eureka AI based on patent content.

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Abstract

The embodiment of the utility model discloses an inversion brick assembly, and relates to the technical field of inversion bricks. The inversion brick assembly comprises a housing and an integrated capacitor. The integrated capacitor comprises a bus capacitor, a filter and a boost converter; wherein the filter and the boost converter are electrically connected to the bus capacitor respectively, and the filter, the bus capacitor and the boost converter are all installed in the shell. According to the inverter brick assembly, by adding the filter and the boost converter, the integration requirement of the inverter brick assembly for the boost function can be met so that the inverter brick assembly can adapt to charging piles in the existing market, meanwhile, EMC interference after voltage boosting can be reduced through the arrangement of the filter, and the reliability and stability of a system are improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of inverter bricks, in particular to an inverter brick assembly. Background Art

[0002] An inverter brick is a power electronics module that typically contains a complete inverter circuit, integrating the various components and functions required for an inverter in a compact package.

[0003] 800V voltage platform electric vehicles are the future development trend. Under the same current capacity, 800V charging voltage can charge the car battery faster. However, the inverter brick products in the existing related technologies are mostly 400V and do not have additional integrated functions, so an 800V inverter brick is urgently needed. In addition, since most of the charging piles on the market are 400V, it is necessary to solve the adaptation problem between the 800V inverter brick and the existing charging piles on the market to avoid voltage mismatch and electromagnetic compatibility (EMC) interference. Summary of the invention

[0004] In view of the above shortcomings of the prior art, the purpose of the utility model is to provide an inverter brick assembly, which can realize the integration requirement of the inverter brick assembly for the boost function by adding a filter and a boost converter, so as to adapt to the existing charging piles on the market. At the same time, the setting of the filter can reduce the EMC interference caused by the voltage boost and improve the reliability and stability of the system.

[0005] The utility model embodiment discloses an inverter brick assembly, comprising a housing and an integrated capacitor;

[0006] Integrated capacitors include bus capacitors, filters and boost converters;

[0007] The filter and the boost converter are electrically connected to the bus capacitor respectively, and the filter, the bus capacitor and the boost converter are all installed in the shell.

[0008] Furthermore, the filter, bus capacitor and boost converter are packaged in the housing by potting glue.

[0009] Furthermore, it also includes an inverter module and a heat sink, wherein the heat sink is located between the inverter module and the bus capacitor to dissipate heat from the inverter module and the bus capacitor.

[0010] Furthermore, it also includes a boost conversion copper busbar, which is used to connect the motor, and a part of the boost conversion copper busbar is encapsulated in the shell.

[0011] Furthermore, the heat sink is a heat sink, and the heat sink is fixedly connected to the bus capacitor.

[0012] Furthermore, a side of the bus capacitor facing the heat sink has a heat dissipation medium.

[0013] Furthermore, it also includes a fixing bracket, which is fixedly connected to the heat sink by bolts, and the fixing bracket abuts against the inverter module to press the inverter module so that the inverter module fits the heat sink.

[0014] Furthermore, it also includes a driving circuit board, which is fixed to a side of the bracket away from the inverter module.

[0015] Furthermore, a relay is included, the relay is electrically connected to the integrated capacitor, and the relay is fixedly connected to the housing.

[0016] Further, the relay includes a horizontal relay.

[0017] Furthermore, a current sensor for current detection is also included.

[0018] The inverter brick assembly provided by the utility model has the following beneficial effects, including but not limited to:

[0019] 1) The inverter brick assembly can realize the integration requirement of the inverter brick assembly for the boost function by adding a filter and a boost converter, so as to adapt to the existing charging piles on the market. At the same time, the setting of the filter can reduce the EMC interference caused by the voltage boost and improve the reliability and stability of the system;

[0020] 2) The inverter brick assembly reduces the cumbersome installation steps, improves product reliability and reduces product size by encapsulating the filter, bus capacitor and boost converter in the shell;

[0021] 3) The heat sink provided between the bus capacitor and the inverter module of the inverter brick assembly can dissipate heat for both the inverter module and the bus capacitor, thereby greatly improving the heat dissipation effect of the bus capacitor while avoiding an increase in heat dissipation costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] This specification will be further described in the form of exemplary embodiments, which will be described in detail by the accompanying drawings. These embodiments are not restrictive, and in these embodiments, the same number represents the same structure, wherein:

[0023] Figure 1 An exploded view of an inverter brick assembly provided in an embodiment of the utility model;

[0024] Figure 2 A schematic diagram of the structure of an inverter brick assembly provided in an embodiment of the utility model;

[0025] Figure 3A circuit topology diagram provided for an embodiment of the utility model.

[0026] Icon: 100-inverter brick assembly; 10-housing; 111-bus capacitor; 112-filter; 113-boost converter; 12-inverter module; 13-heat sink; 14-fixing bracket; 15-drive circuit board; 16-relay; 17-boost conversion copper busbar. DETAILED DESCRIPTION

[0027] The following describes the implementation of the present invention through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific implementations, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0028] It should be noted that the illustrations provided in the following embodiments are only used to schematically illustrate the basic concept of the present invention, and thus the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0029] Example

[0030] like Figure 1-Figure 3 As shown, the utility model provides an inverter brick assembly 100, which includes a shell 10 and an integrated capacitor; the integrated capacitor includes a bus capacitor 111, a filter 112 and a boost converter 113; wherein the filter 112 and the boost converter 113 are electrically connected to the bus capacitor 111 respectively, and the filter 112, the bus capacitor 111 and the boost converter 113 are all installed in the shell 10.

[0031] It is worth noting that the inverter brick assembly 100 can realize the integration requirement of the inverter brick assembly 100 for the boost function by adding a filter 112 and a boost converter 113, so as to adapt to the existing charging piles on the market. At the same time, the setting of the filter 112 can reduce the EMC interference caused by the voltage boost and improve the reliability and stability of the system.

[0032] It is also worth noting that the boost converter 113 also includes a boost module and a filter module, thereby further reducing the EMC interference caused by the voltage boost.

[0033] In one implementation of this embodiment, the filter 112, the bus capacitor 111 and the boost converter 113 can be encapsulated in the housing 10 by potting glue. It is worth noting that the inverter brick assembly 100 reduces the cumbersome installation steps, improves product reliability and reduces the product volume by potting the filter 112, the bus capacitor 111 and the boost converter 113 in the housing 10.

[0034] It can also be understood that in another implementation of this embodiment, the filter 112, the bus capacitor 111 and the boost converter 113 can also be fixed separately on the housing 10 by mechanical installation (such as threaded connection, clamping, etc.). Fixing these components on the base plate as separate parts can make the maintenance and repair process more convenient. If one of the components needs to be replaced or repaired, it can be more easily disassembled and replaced without the destructive disassembly of the entire component by potting glue fixation. In addition, fixing the filter 112, the bus capacitor 111 and the boost converter 113 as separate parts contributes to modular design. Modular design can improve the flexibility and maintainability of the product, making it easier to replace, upgrade or customize different modules. At the same time, fixing these components separately can be more flexible for thermal management. Depending on the specific implementation environment, a more effective heat dissipation structure can be used on the base plate of the housing 10 to ensure that the temperature of each component is kept within a safe range and improve the stability and reliability of the product.

[0035] Please refer again Figure 1 The inverter brick assembly also includes a boost conversion copper bar 17, which is used to connect the motor, and a portion of the boost conversion copper bar 17 is encapsulated in the housing 10.

[0036] Please refer again Figure 1 The inverter brick assembly 100 further includes an inverter module 12 and a heat sink. The heat sink is located between the inverter module 12 and the bus capacitor 111 to dissipate heat from the inverter module 12 and the bus capacitor 111 .

[0037] In this embodiment, the heat sink is a heat sink 13 , and the heat sink 13 is fixedly connected to the bus capacitor 111 by bolts.

[0038] It is worth noting that the heat sink disposed between the bus capacitor 111 and the inverter module 12 of the inverter brick assembly 100 can dissipate heat for the inverter module 12 while also dissipating heat for the bus capacitor 111, thereby greatly improving the heat dissipation effect of the bus capacitor 111 while avoiding an increase in heat dissipation cost. Compared with the arrangement of the bus capacitor 111 and the inverter module 12 placed side by side in the related art, it can more easily dissipate heat for the bus capacitor 111 using the cooling liquid of the inverter unit.

[0039] In this embodiment, the bus capacitor 111 has a heat dissipation medium on one side facing the heat dissipation plate 13. It is understandable that in this embodiment, heat dissipation mud is applied to the side of the bus capacitor facing the heat dissipation plate. Depending on the specific implementation environment, other heat dissipation media can also be used to improve the heat dissipation effect.

[0040] It is also worth noting that the heat dissipation mud coated on the bus capacitor 111 can fill the small gap between the bus capacitor 111 and the heat sink 13, thereby improving the heat conduction efficiency of the heat sink 13 to the bus capacitor 111. By enhancing heat conduction, the heat generated by the bus capacitor 111 can be effectively transferred to the heat sink 13, thereby accelerating the heat dissipation process, helping to keep the operating temperature of the equipment within a safe range, thereby extending the service life of the components, reducing the failure rate of the system, and simplifying the maintenance and repair process.

[0041] Please refer again Figure 1 The inverter brick assembly 100 also includes a fixing bracket 14 , which is fixedly connected to the heat sink 13 by bolts, and the fixing bracket 14 abuts against the inverter module 12 to press the inverter module 12 so that the inverter module fits the heat sink 13 .

[0042] It is understandable that the fixing bracket 14 is fixedly connected to the heat sink 13 by bolts. The fixing bracket 14 can provide additional support and fixing structure to increase the stability of the entire assembly. At the same time, the fixing bracket 14 abuts against the inverter module 12 to press the inverter module 12 and make it fit the heat sink 13, which can ensure good thermal contact between the inverter module 12 and the heat sink 13, which is conducive to heat dissipation and maintains a stable operating temperature of the inverter module 12.

[0043] In this embodiment, the inverter brick assembly 100 further includes a driving circuit board 15 , which is fixed to a side of the bracket away from the inverter module 12 by bolts.

[0044] In addition, the inverter brick assembly 100 also includes a relay 16, which is electrically connected to the integrated capacitor, and the relay 16 is fixedly connected to the housing 10 by bolts. It is worth noting that the relay 16 can realize the switch control and protection functions of the circuit in the inverter brick assembly 100, and can also realize other control logics and functions as needed to improve the performance and reliability of the inverter brick assembly 100. Exemplarily, the relay 16 can be a horizontal relay. It can be understood that the horizontal relay can improve the vibration risk of the relay 16, thereby further improving the reliability of the inverter brick assembly 100.

[0045] In this embodiment, the inverter brick assembly 100 further includes a current sensor. It is understood that the provision of the current sensor can realize functions such as current monitoring, overload protection, power control, energy management and fault diagnosis, and improve the performance, safety and reliability of the inverter system.

[0046] In one implementation of this embodiment, the production process of the inverter brick assembly 100 may be as follows:

[0047] 1) The filter 112, the bus capacitor 111 and the boost converter 113 are potted in a housing 10 using potting glue to form an integrated capacitor;

[0048] 2) Apply heat dissipation mud on the bus capacitor 111, and then install the heat dissipation plate 13, and fix the two together with bolts;

[0049] 3) Place the inverter module 12 and the fixing bracket 14 in sequence, fix the fixing bracket 14 on the heat sink 13 with screws, and press the inverter module 12 with the bracket;

[0050] 4) Put in the driver circuit board 15 and fix it on the bracket with screws;

[0051] 5) Install relay 16 and fix it on the integrated capacitor with screws.

[0052] Therefore, the inverter brick assembly 100 also has the effect of convenient production, which is conducive to controlling production costs.

[0053] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the technology may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed in the present invention shall still be covered by the claims of the present invention.

[0054] In the description herein, many specific details, such as examples of components and / or methods, are provided to provide a complete understanding of the embodiments of the present invention. However, those skilled in the art will recognize that embodiments of the present invention may be practiced without one or more specific details or by other devices, systems, components, methods, components, materials, parts, etc. In other cases, well-known structures, materials, or operations are not specifically shown or described in detail to avoid obscuring aspects of the embodiments of the present invention.

[0055] References throughout the specification to "one embodiment," "an embodiment," or "a specific embodiment" mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present invention, and not necessarily in all embodiments. Thus, various appearances of the phrases "in one embodiment," "in an embodiment," or "in a specific embodiment" in different places throughout the specification do not necessarily refer to the same embodiment. In addition, the particular features, structures, or characteristics of any specific embodiment of the present invention may be combined with one or more other embodiments in any suitable manner. It should be understood that other variations and modifications of the embodiments of the present invention described herein and shown may be based on the teachings herein and will be considered part of the spirit and scope of the present invention.

[0056] It should also be understood that one or more of the elements shown in the figures may also be implemented in a more separate or more integrated manner, or even removed because they are inoperable in certain circumstances or provided because they may be useful depending on the application.

[0057] In addition, unless otherwise explicitly indicated, any marking arrows in the drawings should be regarded as exemplary only and not limiting. In addition, unless otherwise indicated, the term "or" used herein is generally intended to mean "and / or". In the case where the term is not clear because it is anticipated that the ability to separate or combine is provided, the combination of components or steps will also be regarded as indicated.

[0058] As used in the description herein and throughout the claims that follow, "a", "an", and "the" include plural references unless otherwise indicated. Likewise, as used in the description herein and throughout the claims that follow, the meaning of "in" includes "in" and "on" unless otherwise indicated.

[0059] The above description of the illustrated embodiments of the present invention (including the contents in the abstract of the specification) is not intended to be an exhaustive list or to limit the present invention to the precise form disclosed herein. Although specific embodiments of the present invention and examples of the present invention are described herein for illustrative purposes only, various equivalent modifications are possible within the spirit and scope of the present invention as will be recognized and understood by those skilled in the art. As noted, these modifications may be made to the present invention in accordance with the above description of the embodiments of the present invention, and these modifications will be within the spirit and scope of the present invention.

[0060] Systems and methods have been generally described herein as details that are helpful for understanding the present invention. In addition, various specific details have been given to provide an overall understanding of the embodiments of the present invention. However, those skilled in the relevant art will recognize that the embodiments of the present invention can be practiced without one or more specific details, or practiced using other devices, systems, accessories, methods, components, materials, parts, etc. In other cases, well-known structures, materials, and / or operations are not specifically shown or described in detail to avoid confusion with various aspects of the embodiments of the present invention.

Claims

1. An inverter brick assembly, characterized in that: including a housing and an integrated capacitor; The integrated capacitor includes a bus capacitor, a filter and a boost converter; The filter and the boost converter are electrically connected to the bus capacitor respectively, and the filter, the bus capacitor and the boost converter are all installed in the housing.

2. The inverter brick assembly according to claim 1, characterized in that: The filter, the bus capacitor and the boost converter are packaged in the housing by potting glue.

3. The inverter brick assembly according to claim 1 or 2, characterized in that: It also includes a boost conversion copper bar, which is used to connect the motor, and a part of the boost conversion copper bar is encapsulated in the shell.

4. The inverter brick assembly according to claim 1, characterized in that: It also includes an inverter module and a heat sink, wherein the heat sink is located between the inverter module and the bus capacitor to dissipate heat from the inverter module and the bus capacitor.

5. The inverter brick assembly according to claim 4, characterized in that: The heat sink is a heat sink, and the heat sink is fixedly connected to the bus capacitor.

6. The inverter brick assembly according to claim 5, characterized in that: A side of the bus capacitor facing the heat sink is provided with a heat dissipation medium.

7. The inverter brick assembly according to claim 5, characterized in that: It also includes a fixing bracket, which is fixedly connected to the heat sink by bolts, and the fixing bracket abuts against the inverter module to press the inverter module so that the inverter module fits the heat sink.

8. The inverter brick assembly according to claim 7, characterized in that: It also includes a driving circuit board, which is fixed to a side of the bracket facing away from the inverter module.

9. The inverter brick assembly according to claim 1, characterized in that: A relay is also included. The relay is electrically connected to the integrated capacitor and is fixedly connected to the housing.

10. The inverter brick assembly according to claim 9, characterized in that: The relay comprises a horizontal relay.

11. The inverter brick assembly according to claim 1, characterized in that: A current sensor for current detection is also included.