An I-shaped heat dissipation patch attachment fixture
By designing an I-shaped heat dissipation patch attachment fixture, using the structure of the avoidance groove and adsorption hole, combined with the vacuum negative pressure adsorption method, the problem of the heat dissipation patch fixture in the prior art is solved, and safe and efficient heat dissipation patch attachment is achieved.
Patent Information
- Application Number
- CN202420809330.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-18
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-04-18
AI Technical Summary
The flat surface of existing heat dissipation patches is likely to crush the IC chip and cause damage when the heat dissipation patch is attached.
A I-shaped heat dissipation patch attachment fixture is designed, including an installation part and an adsorption part. The bottom of the adsorption part is equipped with a relief groove and an adsorption hole. The heat dissipation patch is adsorbed through a vacuum negative pressure, and the IC is staggered through the relief groove to avoid compression.
It effectively avoids the crushing problem of IC chips when attaching heat dissipation patches, ensures the integrity of the IC, and improves the adhesion efficiency of heat dissipation patches.
Smart Images
Figure CN222706837U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the field of heat dissipation patches, and particularly relates to an I-shaped heat dissipation patch attaching fixture. Background Art
[0002] COF packaging is a semiconductor packaging process that fixes multiple IC chips at intervals on a flexible circuit board (material strip). In order to improve the heat dissipation performance of the IC (integrated circuit) chip, it is necessary to stick a heat dissipation sticker corresponding to the IC chip on the material strip.
[0003] In the prior art, semiconductor factories currently use a heat sink machine in conjunction with a heat sink fixture to attach heat sinks to IC chips on a tape during production. The disadvantage is that the surface of the current heat sink fixture is flat. When the flat heat sink fixture is used to attach the heat sink to the IC chip, the surface of the heat sink fixture will press the IC when it contacts the IC, causing damage. Utility Model Content
[0004] The purpose of the utility model is to provide an I-shaped heat sink attachment fixture, which can solve the problem of IC crushing when the IC of a flexible circuit board product faces upward when the heat sink is attached, and the purpose of protecting the product is achieved by improving the heat sink attachment fixture.
[0005] The purpose of the utility model is achieved as follows: an I-shaped heat dissipation patch attachment fixture, including a fixture base, the fixture base including a mounting portion located on the upper side and an adsorption portion located on the lower side, the width of the mounting portion is smaller than the width of the adsorption portion, the bottom surface of the adsorption portion is respectively provided with an avoidance groove 1 and an avoidance groove 2 arranged along the length direction, the avoidance groove 1 is located at one side edge of the adsorption portion, a plurality of adsorption holes are provided on the adsorption portion on both sides of the avoidance groove 2, the lower ends of the adsorption holes are flush with the bottom surface of the adsorption portion, the hole depths of the adsorption holes are smaller than the height of the adsorption portion, two connecting grooves arranged along the length direction are respectively provided on the adsorption holes corresponding to the left and right sides of the avoidance groove 2 in the adsorption portion, and connecting holes are provided on the side surfaces of the adsorption portion of the fixture base corresponding to the connecting grooves along the width direction.
[0006] The utility model is installed on a heat sink machine. When the machine is working, the heat sink is adsorbed and attached to the IC of the material strip through the fixture seat. The mounting part is connected and fixed to the machine. The connecting hole is connected to the air pipeline. The air pipeline transmits vacuum negative pressure through the connecting groove to the adsorption hole. The hole depth of the adsorption hole is 3mm and the diameter is 1mm. The heat sink is adsorbed through each adsorption hole. The avoidance groove 1 and the avoidance groove 2 can stagger the IC to prevent the IC from being crushed. The distance between the avoidance groove 2 and the edge of the adsorption part is 9-10mm. Compared with the prior art, the beneficial effect of the utility model is that the bottom length and width of the fixture seat are 38mm*30mm, which can be used to pick up heat sinks with a length and width of 30mm*19mm, and prevent the heat sink fixture from crushing the IC. The material of the utility model is aluminum, and the surface treatment is black oxidation. It is suitable for the Xiangsheng heat sink CPM1460 (HS) model machine.
[0007] As a further improvement of the present invention, the height of the fixture seat is 27.8-28.2 mm, the height of the adsorption part is 14.5-15.5 mm, the length of the adsorption part is 38 mm, and the width is 30 mm.
[0008] As a further improvement of the present invention, the depth of the avoidance groove 1 is 0.5 mm, the depth of the avoidance groove 2 is 1 mm, and the widths of the avoidance groove 1 and the avoidance groove 2 are both 3 mm. Grooving is made on the attachment surface of the fixture seat to avoid the IC position, which can effectively prevent the IC product from being crushed.
[0009] As a further improvement of the utility model, the length of the connecting groove is less than the length of the adsorption part, a plug is provided at the end of the adsorption part, and the adsorption holes on the left and right sides of the second avoidance groove are respectively connected to the two connecting grooves, and two connecting holes are provided, and the two connecting holes are respectively located on the left and right sides of the adsorption part, and the two connecting holes are respectively connected to the two connecting grooves, and each connecting hole end is connected to an air pipeline. The inner wall of the connecting hole is provided with an internal thread, and the internal thread is connected to the air pipeline. The two vacuum air pipelines provide vacuum negative pressure to the adsorption holes on both sides, and the adsorption effect is better.
[0010] As a further improvement of the present invention, a mounting groove is provided in the middle of the top of the mounting part, a threaded connection hole 1 is provided on the inner wall of the mounting groove, and a threaded connection hole 2 is provided on both sides of the mounting groove on the mounting part. The moving arm of the heat sink machine is embedded in the mounting groove, and then connected to the moving arm of the heat sink machine through the threaded connection hole, so that the installation is more secure. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 It is a three-dimensional structural diagram of the utility model.
[0012] Figure 2 It is a schematic diagram of the bottom structure of the utility model.
[0013] Figure 3 It is a schematic diagram of the top surface structure of the utility model.
[0014] Figure 4 It is a schematic diagram of the front structure of the utility model.
[0015] Figure 5 It is a schematic diagram of the left structure of the utility model.
[0016] Among them, 1 is a mounting part, 2 is an adsorption part, 3 is an avoidance groove one, 4 is an avoidance groove two, 5 is an adsorption hole, 6 is a connecting groove, 7 is a connecting hole, 8 is a plug, 9 is a mounting groove, 10 is a threaded connection hole one, and 11 is a threaded connection hole two. DETAILED DESCRIPTION
[0017] like Figure 1-5 As shown, an I-shaped heat dissipation patch attachment fixture includes a fixture base, the fixture base includes a mounting portion 1 located on the upper side and an adsorption portion 2 located on the lower side, the mounting portion 1 has a width smaller than the adsorption portion 2, the height of the fixture base is 27.8-28.2 mm, the height of the adsorption portion 2 is 14.5-15.5 mm, the length of the adsorption portion 2 is 38 mm, and the width is 30 mm; the bottom surface of the adsorption portion 2 is respectively provided with an avoidance groove 1 3 and an avoidance groove 2 4 arranged along the length direction, the avoidance groove 1 3 is located at one side edge of the adsorption portion 2, and the depth of the avoidance groove 1 3 is 0.5 mm, The depth of the avoidance groove 2 4 is 1 mm, and the widths of the avoidance groove 1 3 and the avoidance groove 2 4 are both 3 mm. Grooves are opened on the attachment surface of the fixture seat to avoid the IC position, which can effectively prevent the IC product from being crushed. A number of adsorption holes 5 are opened on the adsorption part 2 on both sides of the avoidance groove 2 4. The lower end of the adsorption hole 5 is flush with the bottom surface of the adsorption part 2, and the hole depth of the adsorption hole 5 is less than the height of the adsorption part 2. The adsorption holes 5 on the left and right sides of the avoidance groove 2 4 in the adsorption part 2 are respectively provided with two connecting grooves 6 arranged along the length direction, and the connecting holes 7 are opened on the side of the adsorption part 2 of the fixture seat corresponding to the connecting groove 6 along the width direction.
[0018] The length of the connecting groove 6 is less than the length of the adsorption part 2, and a plug 8 is provided at the end of the adsorption part 2. The adsorption holes 5 on the left and right sides of the avoidance groove 2 4 are respectively connected to the two connecting grooves 6. There are two connecting holes 7, which are respectively located on the left and right sides of the adsorption part 2. The two connecting holes 7 are respectively connected to the two connecting grooves 6, and an air pipeline is connected to the end of each connecting hole 7. The inner wall of the connecting hole 7 is provided with an internal thread, which is connected to the air pipeline. The two vacuum air pipelines provide vacuum negative pressure to the adsorption holes 5 on both sides, and the adsorption effect is better.
[0019] A mounting groove 9 is provided in the middle of the top of the mounting part 1, a threaded connection hole 10 is provided on the inner wall of the mounting groove 9, and a threaded connection hole 2 11 is provided on both sides of the mounting groove 9 on the mounting part 1. The moving arm of the heat sink machine is inserted into the mounting groove 9, and then connected to the moving arm of the heat sink machine through the threaded connection hole, so that the installation is more secure.
[0020] The utility model is installed on a heat sink machine. When the machine is working, the heat sink is adsorbed and attached to the IC of the material strip through the fixture seat. The mounting part 1 is connected and fixed to the machine. The connecting hole 7 is connected to the air pipeline. The air pipeline transmits vacuum negative pressure through the connecting groove 6 to the adsorption hole 5. The hole depth of the adsorption hole 5 is 3mm and the diameter is 1mm. The heat sink is adsorbed through each adsorption hole 5. The avoidance groove 1 3 and the avoidance groove 2 4 can stagger the IC to prevent the IC from being crushed. The distance between the avoidance groove 2 4 and the edge of the adsorption part 2 is 9-10mm. The advantage of the utility model is that the length and width of the bottom of the fixture seat are 38mm*30mm, which can be used to pick up heat sinks with a length and width of 30mm*19mm, and avoid the heat sink fixture from crushing the IC. The material of the utility model is aluminum, and the surface treatment is black oxidation. It is suitable for the Xiangsheng heat sink CPM1460 (HS) model machine.
[0021] The present invention is not limited to the above-mentioned embodiments. On the basis of the technical solution disclosed in the present invention, technicians in this field can make some substitutions and deformations to some technical features therein according to the disclosed technical content without creative labor, and these substitutions and deformations are all within the protection scope of the present invention.
Claims
1. An I-shaped heat dissipation patch attachment fixture, comprising a fixture seat, characterized in that: The fixture seat body includes a mounting portion located at the top and an adsorption portion located at the bottom, the width of the mounting portion is smaller than the width of the adsorption portion, and the bottom surface of the adsorption portion is respectively provided with an avoidance groove 1 and an avoidance groove 2 arranged along the length direction, the avoidance groove 1 is located at one side edge of the adsorption portion, and a plurality of adsorption holes are respectively provided on the left and right sides of the avoidance groove 2 on the adsorption portion, the lower ends of the adsorption holes are flush with the bottom surface of the adsorption portion, and the hole depths of the adsorption holes are smaller than the height of the adsorption portion, and two connecting grooves arranged along the length direction are respectively provided on the adsorption holes corresponding to the left and right sides of the avoidance groove 2 in the adsorption portion, and connecting holes are provided on the side surfaces of the adsorption portion of the fixture seat body corresponding to the connecting grooves along the width direction.
2. The I-shaped heat dissipation patch attachment fixture according to claim 1, characterized in that: The height of the fixture seat is 27.8-28.2 mm, the height of the adsorption part is 14.5-15.5 mm, the length of the adsorption part is 38 mm, and the width is 30 mm.
3. The I-shaped heat dissipation patch attachment fixture according to claim 1 or 2, characterized in that: The depth of the avoidance groove 1 is 0.5 mm, the depth of the avoidance groove 2 is 1 mm, and the widths of the avoidance groove 1 and the avoidance groove 2 are both 3 mm.
4. The I-shaped heat dissipation patch attachment fixture according to claim 1 or 2, characterized in that: The length of the connecting groove is smaller than the length of the adsorption part, and a plug is provided at the end of the adsorption part. The adsorption holes on the left and right sides of the avoidance groove 2 are respectively connected with the two connecting grooves. There are two connecting holes, which are respectively located on the left and right sides of the adsorption part. The two connecting holes are respectively connected with the two connecting grooves, and an air duct is connected to the end of each connecting hole.
5. The I-shaped heat dissipation patch attaching fixture according to claim 1 or 2, characterized in that: A mounting groove is provided in the middle of the top of the mounting part, a threaded connection hole 1 is provided on the inner wall of the mounting groove, and a threaded connection hole 2 is provided on both sides of the mounting groove on the mounting part.