A GPU chip split heat dissipation module
By designing a GPU chip split cooling module, the fin set and thermal conduction components form a heat dissipation channel, the problem of large space and low efficiency of the memory heat dissipation structure of the GPU chip and graphics card in the prior art is solved, and a compact and efficient heat dissipation effect is achieved.
Patent Information
- Application Number
- CN202421184632.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-28
- Publication Date
- 2025-04-01
- Estimated Expiration
- 2034-05-28
AI Technical Summary
The common cooling structure of existing GPU chips and graphics card memory occupies a large space and cannot effectively and promptly dissipate heat, affecting the normal operation of GPU chips and graphics card memory.
A GPU chip split-type heat dissipation module is designed, and a heat dissipation channel is formed between the first fin group and the second fin group. The graphics card memory sleeve is arranged on the outside of the GPU chip, and components such as the heat conduction tube group and thermal paste are improved.
It realizes a compact structure and small space-consuming heat dissipation module, meets the needs of lightweight design, significantly improves the heat dissipation efficiency, and ensures the separate and efficient heat dissipation of GPU chips and graphics card memory.
Smart Images
Figure CN222706847U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heat dissipation modules, in particular to a GPU chip split heat dissipation module. Background Art
[0002] With the increasing maturity and development of the electronic technology industry, users' demand for computer power usage is constantly increasing, and software and hardware are constantly upgrading. While requiring high power usage, according to the energy conservation principle in physics, graphics cards are prompted to release more heat. The current GPU chip, also known as a graphics processor, display core, visual processor, and display chip, is a microprocessor that specializes in image and graphics related calculations on personal computers, workstations, game consoles, and some mobile terminals. However, the GPU chips and graphics card memory on the market are generally designed with a common heat dissipation structure, which occupies a large installation space, is not conducive to the requirements of lightweight design, and the large number of working parts involved cannot effectively and timely dissipate heat, affecting the normal operation of the GPU chip and graphics card memory. Utility Model Content
[0003] The purpose of the utility model is to provide a GPU chip split heat dissipation module in view of the deficiencies in the prior art, which has a compact structure and a reasonable design, occupies a small space, meets the requirements of lightweight design, and improves heat dissipation efficiency.
[0004] To achieve the above-mentioned purpose, the utility model provides a split-type heat dissipation module for a GPU chip, comprising a first fin group, a GPU chip arranged in the first fin group, a second fin group embedded in the first fin group, and a graphics card memory arranged in the second fin group, wherein the graphics card memory is sleeved on the outside of the GPU chip so that a heat dissipation channel is formed between the second fin group and the first fin group, and the heat dissipation channel extends along the length direction of the first fin group and the second fin group.
[0005] Preferably, the first fin group is provided with a bearing platform, the bearing platform is provided with a receiving groove and a heat conducting pipe group arranged in the receiving groove, and a plurality of the receiving grooves are provided, and the plurality of receiving grooves are arranged along the width direction of the bearing platform.
[0006] Preferably, the first fin group is penetrated by a through hole, and a plurality of the through holes are provided, and the plurality of through holes are arranged at intervals along the width direction of the first fin group, and the heat conduction pipe group passes through the plurality of through holes and protrudes out of the first fin group.
[0007] Preferably, the GPU chip is provided with thermal paste, first connecting screws are provided around the GPU chip, first connecting holes are provided around the supporting platform, and the GPU chip is threadedly connected to the first connecting holes through the first connecting screws.
[0008] Preferably, a through slot is provided through the middle of the graphics card memory, and the GPU chip is accommodated in the through slot so that the graphics card memory is arranged around the GPU chip, second connecting screws are provided around the graphics card memory, and second connecting holes are provided around the supporting platform, and the graphics card memory is threadedly connected to the second connecting holes through the second connecting screws.
[0009] Preferably, the graphics card memory is provided with thermal conductive adhesive, and a plurality of thermal conductive adhesives are provided, and the plurality of thermal conductive adhesives are arranged at intervals along the circumference of the graphics card memory.
[0010] Preferably, a mounting bracket is provided at the bottom of the first fin group, and the mounting bracket is provided with a mounting hole.
[0011] The beneficial effects of the utility model are as follows: the structure is compact and the design is reasonable, the space occupied is small, the requirements for lightweight design are met, and the heat dissipation efficiency is improved. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 It is a structural schematic diagram of the utility model.
[0013] Figure 2 This is a schematic structural diagram of the utility model from another angle.
[0014] Figure 3 It is a schematic diagram of the exploded structure of the utility model.
[0015] Reference numerals include:
[0016] 1——first fin group 11——carrying platform 12——accommodation groove
[0017] 13——heat pipe group 14——through hole 15——first connecting hole
[0018] 16——Second connection hole
[0019] 2——GPU chip 21——thermal paste 22——first connecting screw
[0020] 3——Second fin group
[0021] 4——Graphics card memory 41——Through slot 42——Second connecting screw
[0022] 43——Thermal conductive adhesive
[0023] 5——Heat dissipation channel
[0024] 6——Mounting bracket 61——Mounting hole. DETAILED DESCRIPTION
[0025] The utility model is described in detail below with reference to the accompanying drawings.
[0026] like Figures 1 to 3 As shown, a GPU chip split heat dissipation module of the utility model includes a first fin group 1, a GPU chip 2 arranged in the first fin group 1, a second fin group 3 embedded in the first fin group 1, and a graphics card memory 4 arranged in the second fin group 3, the graphics card memory 4 is arranged on the outside of the GPU chip 2, so that a heat dissipation channel 5 is formed between the second fin group 3 and the first fin group 1, and the heat dissipation channel 5 is extended along the length direction of the first fin group 1 and the second fin group 3.
[0027] The GPU chip 2 occupies most of the heat generation, and a large amount of heat is dissipated by means of the first fin group 1. The graphics card memory 4 dissipates the heat through the second fin group 3. The graphics card memory 4 is set on the outside of the GPU chip 2 in terms of structural design. The graphics card memory 4 is distributed around the GPU chip 2 in a semi-enclosed structure, and the structure is compact. The second fin group 3 and the first fin group 1 are arranged up and down, and a heat dissipation channel 5 is formed between the second fin group 3 and the first fin group 1. The heat dissipation channel 5 extends along the length direction of the first fin group 1 and the second fin group 3, further accelerating the dissipation of heat, and the heat dissipation effect is significant. The heat dissipation channel 5 completely separates the first fin group 1 from the second fin group 3, and the graphics card memory 4 will not be affected by the heat conducted by the GPU chip 2, meeting the separate and efficient heat dissipation requirements of the GPU chip 2 and the graphics card memory 4. The utility model has a compact structure and a reasonable design, occupies a small space, meets the requirements of lightweight design, and improves heat dissipation efficiency.
[0028] The first fin group 1 of this embodiment is provided with a carrying platform 11, the carrying platform 11 is provided with a receiving groove 12 and a heat conducting pipe group 13 provided in the receiving groove 12, the receiving groove 12 is provided with a plurality of, and the plurality of receiving grooves 12 are arranged along the width direction of the carrying platform 11. Specifically, the heat conducting pipe group 13 is formed by a plurality of heat conducting pipe groups 13, and the plurality of receiving grooves 12 are arranged along the width direction of the carrying platform 11, so that the plurality of heat conducting pipes are respectively placed in the plurality of receiving grooves 12, thereby improving the placement stability of the heat conducting pipe group 13 on the carrying platform 11.
[0029] The first fin group 1 of this embodiment is provided with a through hole 14, and the through hole 14 is provided in plurality, and the plurality of through holes 14 are arranged at intervals along the width direction of the first fin group 1, and the heat pipe group 13 passes through the plurality of through holes 14 and protrudes out of the first fin group 1. Specifically, the heat pipe group 13 passes through the plurality of through holes 14 and protrudes out of the first fin group 1, and the heat generated by the GPU chip 2 when working is effectively discharged to the external environment quickly by means of the heat conduction effect of the heat pipe group 13 and the heat dissipation effect of the first fin group 1, and the heat dissipation efficiency is high.
[0030] The GPU chip 2 of this embodiment is provided with a thermal paste 21, and first connecting screws 22 are provided around the GPU chip 2, and first connecting holes 15 are provided around the carrier platform 11, and the GPU chip 2 is threadedly connected to the first connecting holes 15 through the first connecting screws 22. Specifically, the thermal paste 21 is coated and attached to the surface of the GPU chip 2, effectively and quickly conducts the heat accumulated in the GPU chip 2 to the external environment, has a good heat conduction effect, and avoids the rapid heating of the GPU chip 2. The GPU chip 2 is threadedly connected to the first connecting hole 15 through the first connecting screws 22, thereby realizing the installation connection between the GPU chip 2 and the carrier platform 11, and the connection is stable and reliable.
[0031] In this embodiment, a through slot 41 is provided through the middle of the graphics card memory 4, and the GPU chip 2 is accommodated in the through slot 41, so that the graphics card memory 4 is arranged around the GPU chip 2, and second connecting screws 42 are provided around the graphics card memory 4, and second connecting holes 16 are provided around the carrying platform 11, and the graphics card memory 4 is threadedly connected to the second connecting holes 16 through the second connecting screws 42. Specifically, the graphics card memory 4 is arranged around the GPU chip 2 through the through slot 41, and the structure is compact and ingenious and occupies little space. The graphics card memory 4 is threadedly connected to the second connecting hole 16 through the second connecting screws 42, thereby realizing the installation connection between the graphics card memory 4 and the carrying platform 11, and the connection is stable and reliable.
[0032] The graphics card memory 4 of this embodiment is provided with a heat-conducting adhesive 43, and a plurality of the heat-conducting adhesives 43 are provided, and the plurality of heat-conducting adhesives 43 are arranged at intervals along the circumference of the graphics card memory 4. Specifically, the plurality of heat-conducting adhesives 43 are arranged at intervals along the circumference of the graphics card memory 4, which effectively and quickly conducts the heat accumulated in the graphics card memory 4 to the external environment, has a good heat conduction effect, and avoids the graphics card memory 4 from heating up quickly.
[0033] In this embodiment, a mounting bracket 6 is provided at the bottom of the first fin group 1, and the mounting bracket 6 is provided with a mounting hole 61. Specifically, external screws are passed through the mounting hole 61 and connected and fixed at the working position, thereby realizing the overall mounting and fixing of the first fin group 1 at a suitable working position, and the mounting is stable and reliable.
[0034] The above contents are only preferred embodiments of the present invention. For ordinary technicians in this field, according to the concept of the present invention, there will be changes in the specific implementation methods and application scopes. The contents of this specification should not be understood as limiting the present invention.
Claims
1. A GPU chip split heat dissipation module, characterized in that: It includes a first fin group, a GPU chip arranged in the first fin group, a second fin group embedded in the first fin group, and a graphics card memory arranged in the second fin group. The graphics card memory is arranged on the outside of the GPU chip so that a heat dissipation channel is formed between the second fin group and the first fin group. The heat dissipation channel extends along the length direction of the first fin group and the second fin group.
2. The GPU chip split heat dissipation module according to claim 1, characterized in that: The first fin group is provided with a bearing platform, the bearing platform is provided with a receiving groove and a heat conduction pipe group arranged in the receiving groove, and the receiving groove is provided with a plurality of grooves, and the plurality of grooves are arranged along the width direction of the bearing platform.
3. The GPU chip split heat dissipation module according to claim 2, characterized in that: The first fin group is penetrated by a through hole, and a plurality of the through holes are provided. The plurality of through holes are arranged at intervals along the width direction of the first fin group. The heat conduction pipe group passes through the plurality of through holes and protrudes out of the first fin group.
4. The GPU chip split heat dissipation module according to claim 2, characterized in that: The GPU chip is provided with thermal conductive paste, first connecting screws are provided around the GPU chip, first connecting holes are provided around the carrying platform, and the GPU chip is threadedly connected to the first connecting holes through the first connecting screws.
5. The GPU chip split heat dissipation module according to claim 2, characterized in that: A through slot is provided through the middle of the graphics card memory, and the GPU chip is accommodated in the through slot so that the graphics card memory is arranged around the GPU chip. Second connecting screws are provided around the graphics card memory, and second connecting holes are provided around the supporting platform. The graphics card memory is threadedly connected to the second connecting holes through the second connecting screws.
6. The GPU chip split heat dissipation module according to claim 5, characterized in that: The graphics card memory is provided with a thermal conductive adhesive, and a plurality of thermal conductive adhesives are provided, and the plurality of thermal conductive adhesives are arranged at intervals along the circumference of the graphics card memory.
7. The GPU chip split heat dissipation module according to claim 1, characterized in that: A mounting bracket is provided at the bottom of the first fin group, and the mounting bracket is provided with a mounting hole.