A 3D special-shaped temperature plate

Abstract

The utility model belongs to the technical field of heat dissipation equipment, and specifically relates to a 3D special-shaped temperature equalizing plate, including a plate body, the plate body including two relatively arranged covers, a sealed cavity between the two covers, the opposite sides of the two covers corresponding to the surroundings of the cavity are sealed and connected, a copper mesh is provided on the inner side of one of the covers corresponding to the cavity position, a support for supporting the cavity is provided on the inner side of the other cover corresponding to the cavity position, and at least one of the covers has at least one convex hull on the outer side corresponding to the cavity position, the purpose of which is that, through the setting of the convex hull, it is possible to easily achieve the fit with the electronic device with uneven surface, without introducing additional intermediate components, reducing costs and improving the heat dissipation effect. At the same time, the design of the convex hull structure also increases the contact area between the temperature equalizing plate and the electronic device, adds a three-dimensional heat conduction dimension, improves the heat conduction efficiency, and further improves the heat dissipation performance.

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation equipment, and specifically relates to a 3D special-shaped temperature equalizing plate. Background Art

[0002] The technical principle of the heat spreader is similar to that of the heat pipe, but there is a difference in the conduction method. The heat pipe is a one-dimensional linear heat conduction, while the heat in the vacuum chamber heat spreader is conducted on a two-dimensional surface, so it is more efficient. Specifically, the heat spreader mainly includes a cavity and a capillary structure. There is a hollow chamber inside the cavity, and the hollow chamber is used to fill a working fluid. The capillary structure is arranged in the hollow chamber. The heated part of the cavity is called the evaporation zone. The part of the cavity that dissipates heat is called the condensation zone. The working fluid absorbs heat in the evaporation zone and vaporizes and rapidly expands to the entire cavity. Heat is released in the condensation zone and condenses into liquid. Then, the liquid working fluid returns to the evaporation zone through the capillary structure to form a cooling cycle.

[0003] In the prior art, the temperature equalizer is usually a flat vacuum cavity, which needs to be attached to the electronic device when used. However, in some usage environments, the surface of the electronic device is not necessarily flat, resulting in the flat temperature equalizer being unable to directly fit with the electronic device. An intermediate element needs to be set between the electronic device and the temperature equalizer for heat conduction, which not only increases the number of components and costs, but more importantly, reduces the heat dissipation effect to a certain extent. Utility Model Content

[0004] In view of this, the utility model provides a 3D special-shaped temperature averaging plate, the purpose of which is to facilitate the fitting of electronic devices with uneven surfaces through the setting of convex hulls, without the need to introduce additional intermediate components, thereby reducing costs and improving heat dissipation effects. At the same time, the design of the convex hull structure also increases the contact area between the temperature averaging plate and the electronic device, adds a three-dimensional heat conduction dimension, improves heat conduction efficiency, and further improves heat dissipation performance.

[0005] The technical solution adopted by the utility model is as follows:

[0006] A 3D special-shaped temperature equalizing plate comprises a plate body, wherein the plate body comprises two relatively arranged cover bodies, a sealed cavity is provided between the two cover bodies, the opposite sides of the two cover bodies are sealed and connected corresponding to the four sides of the cavity, a copper mesh is provided on the inner side of one of the cover bodies corresponding to the cavity position, a support member for supporting the cavity is provided on the inner side of the other cover body corresponding to the cavity position, at least one of the cover bodies has at least one convex hull on the outer side corresponding to the cavity position, and a groove formed on the inner side of the convex hull is connected to the sealed cavity.

[0007] As a preferred technical solution, the copper mesh is laid in a cavity of one of the cover bodies provided with a convex hump, and the copper mesh extends along the cavity into a groove of the convex hump.

[0008] Furthermore, one end of the support member is in contact with the copper mesh.

[0009] Furthermore, the support member is a column formed by etching the inner side of the cover body.

[0010] Furthermore, the support member is an inward protrusion formed by stamping the cover body.

[0011] Furthermore, an etching capillary is also provided on the inner side wall of the cover body with a copper mesh on the inner side.

[0012] In summary, due to the adoption of the above technical solution, the beneficial effects of the utility model are:

[0013] The convex hull design can easily fit electronic devices with uneven surfaces without the need for additional intermediate components, thus reducing costs and improving heat dissipation. At the same time, the convex hull design also increases the contact area between the temperature spreader and the electronic device, adds a three-dimensional thermal conductivity dimension, improves heat conduction efficiency, and further enhances heat dissipation performance. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention will be described by way of examples with reference to the accompanying drawings, in which:

[0015] Figure 1 This is a structural schematic diagram of a 3D special-shaped temperature equalizing plate provided by the utility model;

[0016] Figure 2 It is a schematic diagram of the internal structure of the etching plate provided by the utility model;

[0017] Figure 3 It is a schematic diagram of the cover stamping structure of the plate body provided by the utility model;

[0018] Figure 4 It is a schematic diagram of the internal structure of the stamping plate body provided by the utility model;

[0019] Plate body-1; convex hull-2; support column-3; copper mesh-4; etching capillary-5. DETAILED DESCRIPTION

[0020] The following is a clear and complete description of the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Embodiment 1

[0022] In the prior art, the temperature plate is a flat vacuum chamber that needs to fit tightly with the electronic device during use. However, in some application scenarios, the surface of the electronic device may not be flat, making it difficult for the flat temperature plate to fit directly with it. To solve this problem, it is necessary to introduce an intermediate element between the electronic device and the temperature plate to achieve heat conduction. This not only increases the number of components, but also increases the cost and reduces the heat dissipation effect to a certain extent.

[0023] Therefore, in order to solve the problem that the existing temperature averaging plate is difficult to directly fit with the electronic device with uneven surface, and an intermediate component needs to be introduced to achieve heat conduction, which is costly and has a reduced heat dissipation effect, and to achieve the function of increasing the fit between the temperature averaging plate and the electronic device, reducing costs and increasing efficiency, the utility model discloses a 3D special-shaped temperature averaging plate, see Figure 1-Figure 4 , comprising a plate body 1 with a convex bulge 2, specifically, the plate body 1 comprises two relatively arranged covers, a sealed cavity is provided between the two covers, the opposite sides of the two covers are sealed and connected corresponding to the surroundings of the cavity, a copper mesh 4 is provided on the inner side of one of the covers at a position corresponding to the cavity, a support member 3 for supporting the cavity is provided on the inner side of the other cover at a position corresponding to the cavity, at least one of the covers has at least one convex bulge 2 on the outer side corresponding to the cavity, and a groove formed on the inner side of the convex bulge 2 is connected to the sealed cavity;

[0024] When the 3D special-shaped temperature plate needs to fit with an electronic device with an uneven surface, the user can form a convex 2 on the surface of a certain cover of the plate body 1 according to the concave-convex shape of the electronic device surface by stamping or etching, and then weld the two covers to make a plate body 1 corresponding to the shape of the electronic device, so that the plate body 1 can fit with the corresponding electronic device. For example, when the surface of the electronic device is a stepped shape with one side raised, the user can stamp or etch a convex 2 on one side of the plate body 1 to form a stepped structure corresponding to the surface of the electronic device, so that the plate body 1 can fit on the surface of the electronic device to achieve effective heat conduction. This reduces the use of intermediate components, reduces costs, and improves the thermal conductivity effect.

[0025] At the same time, due to the setting of the convex hump 2, the contact surface between the plate body 1 and the electronic device is transformed from a flat plane into a three-dimensional geometric body with protrusions or depressions. Therefore, the 3D special-shaped temperature equalizing plate retains the original two-dimensional heat conduction (i.e., x and y axes) and adds a dimension (i.e., z-axis) of heat conduction, so that the plate body 1 can perform three-dimensional heat conduction, further improving the heat dissipation efficiency of the electronic device.

[0026] In summary, the 3D special-shaped heat spreader can easily fit with electronic devices with uneven surfaces by adopting a convex hull special-shaped structure, without the need to introduce additional intermediate components, thus reducing costs and improving heat dissipation effects. At the same time, the convex hull structure design also increases the contact area between the heat spreader and the electronic device, adds a three-dimensional heat conduction dimension, improves heat conduction efficiency, and further improves heat dissipation performance;

[0027] At the same time, the shape and size of the convex hull 2 ​​can be adjusted according to actual needs to adapt to electronic devices of different shapes and sizes. In addition, the material of the plate body 1 can also be selected as needed, for example, a metal material with good thermal conductivity can be selected as the material of the plate body 1, such as copper, aluminum, stainless steel, titanium, composite materials or non-metallic materials.

[0028] In this embodiment, in order to smoothly splice and fix the two cover bodies, a brazing material for welding the plate body 1 is provided at the splicing position of the two cover bodies.

[0029] In this embodiment, a copper mesh 4 is also included for promoting the circulation of the working fluid in the internal cavity of the plate body 1 and providing structural support. Specifically, the copper mesh 4 is laid in a cavity of a cover body provided with a convex hump 2, and the copper mesh 4 extends along the cavity to the groove of the convex hump 2.

[0030] In another embodiment, an etching capillary 5 is further provided on the inner side wall of the cover body with the copper mesh 4 on the inner side, wherein the etching capillary is composed of a plurality of grooves arranged side by side, which can accelerate the flow rate of the fluid in the plate body 1.

[0031] In this embodiment, the working fluid may be pure distilled water, but is not limited thereto.

[0032] Embodiment 2

[0033] On the basis of the first embodiment, in order to further improve the anti-extrusion capability of the internal cavity of the plate body 1, refer to Figure 2-Figure 3 The utility model further includes a support member 3 for supporting the cavity. Specifically, one end of the support member 3 is in contact with the copper mesh 4.

[0034] In one embodiment, the support member 3 is a column etched on the inner side of the cover body. In this arrangement, a plurality of capillary grooves are provided at one end of the support member 3 that is attached to the copper mesh 4, and the plurality of capillary grooves extend from the top of the support member 3 along the length direction of the support member 3 to the surface of the support member 3, wherein the capillary grooves are arranged in strips. Through this structure, the working fluid in the cavity can flow along the capillary grooves on the end and surface of the support member 3, thereby reducing the obstruction of the support member 3 to the flow of the fluid in the cavity.

[0035] In another embodiment, the support member 3 is an inward protrusion formed by stamping the cover body. In this arrangement, the surface of the cover body formed by stamping the support member 3 will have a wavy structure, and a protrusion will be formed between two adjacent support members 3. The groove formed on the inner side of the protrusion is connected to the cavity of the plate body 1, which can play a role in circulating steam.

[0036] Embodiment 3

[0037] On the basis of the first and second embodiments, since the groove formed on the inner side of the convex bulge 2 is connected to the sealed cavity of the plate body 1, when the cover body with the convex bulge 2 is spliced ​​and closed, a step height difference will appear in the cavity of the cover body with the convex bulge 2, such as Figure 2-3 As shown, in order to avoid the convex hump 2 from being sunken toward the sealing cavity and to ensure the supporting strength of the convex hump 2, the existing solutions are either to increase the thickness of the cover and use etching to reduce the surface of the support member 3; or to directly punch the cover by stamping, so that the cover can be stretched toward the cavity of the plate body 1 until it fits with the groove on the inner side of the convex hump 2. However, in actual use of the above two methods, the former will increase the etching time, and thickening the cover will increase the overall cost of the 3D temperature equalizing plate. The latter will be limited by the tensile strength of the cover material. As the height of the step difference increases, it is easy to be broken by stamping and the tensile stress caused by the high local stretching height will be distorted, making the subsequent process impossible to operate.

[0038] Therefore, in order to solve the above problems, preferably, refer to Figure 2-4 , a support structure with a shape and depth consistent with the internal groove of the bulge 2 can be placed into the groove of the bulge 2 by etching, and one end of the support member 3 can be fitted with the support structure to achieve the purpose of supporting the bulge 2. At the same time, since the support structure is directly added to the cavity of the plate body 1 from the outside after etching, there is no need to stamp or thicken the cover of the plate body 1 to complete the support of the bulge 2, and the production personnel can also design different structural shapes of the support structure according to the heat flow diversion requirements.

[0039] In this embodiment, the etching support structure can be made of copper alloy, stainless steel, titanium, composite material or non-metallic material.

[0040] In this embodiment, the support structure can also be formed by stamping or laser molding.

[0041] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0042] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A 3D special-shaped temperature equalizing plate, comprising a plate body (1), wherein the plate body (1) comprises two covers arranged opposite to each other, a sealed cavity is provided between the two covers, the opposite sides of the two covers are sealed and connected at the periphery of the cavity, a copper mesh (4) is provided at the inner side of one of the covers at the position corresponding to the cavity, and a support member (3) for supporting the cavity is provided at the inner side of the other cover at the position corresponding to the cavity, wherein: At least one of the cover bodies has at least one convex hump (2) on its outer side at a position corresponding to the cavity, and a groove formed on the inner side of the convex hump (2) is connected to the sealed cavity.

2. The 3D special-shaped temperature equalizing plate according to claim 1, characterized in that: The copper mesh (4) is laid in a cavity of a cover body provided with a bulge (2), and the copper mesh (4) extends along the cavity into a groove of the bulge (2).

3. The 3D special-shaped temperature equalizing plate according to claim 1, characterized in that: One end of the support member (3) is in contact with the copper mesh (4).

4. The 3D special-shaped temperature equalizing plate according to claim 1, characterized in that: The support member (3) is a column formed by etching the inner side of the cover body.

5. The 3D special-shaped temperature equalizing plate according to claim 1, characterized in that: The support member (3) is an inward protrusion formed by stamping the cover body.

6. The 3D special-shaped temperature equalizing plate according to any one of claims 1 to 5, characterized in that: The inner wall of the cover body, on which a copper mesh (4) is provided, is also provided with an etching capillary (5).

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