Image acquisition device, endoscope and laparoscopic surgical robot

Abstract

The present application provides an image acquisition device, an endoscope and a laparoscope surgical robot, wherein the image acquisition device comprises: a mirror tube; a lens, which is arranged in the mirror tube and is located at the front end of the mirror tube, and the lens is configured to receive reflected light from a target object; an image sensor, which is arranged in the mirror tube and is located at the rear end of the lens, and the image sensor is configured to capture the light received by the lens and generate an electrical signal; a first circuit board, which is located on the side of the image sensor facing away from the lens, the image sensor is arranged on the first circuit board, the image sensor is connected to the first circuit board by electrical signals, the first circuit board is configured to extend along the radial direction of the mirror tube and cooperate with the mirror tube for positioning; a second circuit board, which is located on the side of the first circuit board facing away from the image sensor, the second circuit board is relatively fixed to the first circuit board and connected to the electrical signals, and the second circuit board extends along the axial direction of the mirror tube. The manufacturing cost is reduced and the space occupation is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of medical devices, and in particular to an image acquisition device, an endoscope and a laparoscopic surgical robot. Background Art

[0002] With the continuous development of medical equipment, computer technology and control technology, minimally invasive surgery has been more and more widely used due to its advantages of small surgical trauma, short recovery time and less pain for patients. Among them, minimally invasive surgical robots can avoid operational limitations with their high dexterity, high control accuracy, intuitive surgical images, etc., such as hand tremors during filtering operations, and are widely used in surgical areas such as the abdomen, pelvis, and chest. The minimally invasive surgical robot includes a master control arm and a slave manipulator arm. The master control arm collects the doctor's operation signal and generates a control signal from the slave manipulator arm after processing by the control system, and the slave manipulator arm performs the surgical operation. During the operation, the slave manipulator arm clamps the surgical instrument and the endoscope. The surgical instrument enters the patient's body through the poke card inserted in the incision on the patient's body surface, and the endoscope provides monitoring images inside the patient's body. In order to ensure the molding quality of the endoscope, it is usually necessary to accurately position and reliably connect the objective lens, image sensor, and circuit board in the lens assembly, and it is also necessary to simplify the structural complexity to reduce the occupied volume of the components in the lens assembly.

[0003] In the related art, for example, Chinese invention patent CN101634749B discloses an endoscope, including a mirror tube, an objective lens, an image sensor, a circuit board and a connector; the image sensor and the circuit board are formed into a whole through the connector, and then the connector is fixed to a fixed frame, so as to achieve positioning between the image sensor and the circuit board, and other connecting components can be omitted, simplifying the structure of the entire endoscope.

[0004] However, in the related art, the connector needs to be produced by a separate mold, which increases the manufacturing cost and occupies a large space. Utility Model Content

[0005] The embodiments of the present application provide an image acquisition device, an endoscope, and a laparoscopic surgical robot, which can realize the connection and positioning between the image sensor and the circuit board without the need to separately open a mold to produce the connector, thereby reducing the production cost, reducing the space occupied, and facilitating the miniaturization of the image acquisition device of the endoscope.

[0006] According to a first aspect of an embodiment of the present application, there is provided an image acquisition device, comprising:

[0007] Mirror tube;

[0008] A lens is disposed in the mirror tube, and the lens is located at the front end of the mirror tube, and the lens is configured to receive reflected light from the target object;

[0009] An image sensor is disposed in the lens tube and at the rear end of the lens, the image sensor being configured to capture light received by the lens and generate an electrical signal;

[0010] A first circuit board is located on a side of the image sensor facing away from the lens, the image sensor is disposed on the first circuit board, the image sensor is electrically connected to the first circuit board, and the first circuit board is configured to extend along the radial direction of the lens tube and to be positioned in coordination with the lens tube;

[0011] The second circuit board is located on a side of the first circuit board facing away from the image sensor. The second circuit board is relatively fixed to the first circuit board and is electrically connected to the first circuit board. The second circuit board extends along the axial direction of the lens tube.

[0012] In an optional implementation, a first gold finger is provided on a surface of the first circuit board facing away from the image sensor, and a second gold finger is provided on an end of the second circuit board facing the first circuit board, and the second gold finger is electrically connected to the first gold finger.

[0013] In an optional implementation, a slot is provided on the first circuit board, the first gold finger extends to the slot, and one end of the second gold finger of the second circuit board is inserted into the slot so that the second gold finger is electrically connected to the first gold finger.

[0014] In an optional implementation, the second gold finger is fixed and connected to the first gold finger by welding.

[0015] In an optional implementation, the first circuit board has a solder joint, and the image sensor is electrically connected to the first gold finger through the solder joint.

[0016] In an optional implementation, the method further includes:

[0017] A lens cover is arranged on the outer periphery of the lens, and the lens cover is fixedly connected to the lens tube;

[0018] The first circuit board is connected to the lens cover so that the photosensitive surface of the image sensor matches the light emitting end of the lens.

[0019] In an optional implementation, a first hole segment and a second hole segment are provided in the lens hood, the second hole segment is located on the side of the lens hood facing away from the lens, and at least part of the aperture of the second hole segment is larger than the aperture of the first hole segment, so that an installation positioning portion is formed along the hole edge of the first hole segment facing one end of the first circuit board; the first circuit board installation positioning portion is connected to the lens hood so that the image sensor is inserted into the first hole segment, and the installation positioning portion is configured to position the image sensor.

[0020] In an optional implementation, the first circuit board is bonded to the lens cover, and a glue overflow groove is provided in the second hole section, and the glue overflow groove is configured to store the seeping glue when the first circuit board is bonded to the lens cover.

[0021] In an optional implementation, the overflow groove has a first groove portion, and the first groove portion is recessed in the side wall of the second hole section along the radial direction of the lens cover;

[0022] A plurality of first grooves are arranged along the circumference of the lens cover, and the plurality of first grooves are evenly spaced and arranged along the circumference of the lens cover;

[0023] The second groove portion extends through the hole edge of the second hole section;

[0024] The radial cross section of the second hole segment is a polygon, and the first groove portion is located at a corner of the polygon.

[0025] In an optional implementation, the glue overflow groove has a second groove portion, the second groove portion is connected to the first groove portion, and the second groove portion is recessed in the installation positioning portion along the axial direction of the second hole segment.

[0026] In an optional implementation, there are two lenses, which are arranged along the radial direction of the lens tube; there are two image sensors, which are matched with the two lenses in a one-to-one manner.

[0027] According to a second aspect of an embodiment of the present application, there is provided an endoscope, comprising:

[0028] An image acquisition device as provided in any optional implementation of the first aspect of the embodiments of the present application;

[0029] A handle connected to the proximal end of the image acquisition device;

[0030] An optical fiber connecting line and a data interface, one end of the optical fiber connecting line is connected to the proximal end of the handle, and the other end of the optical fiber connecting line is connected to the data interface, and the data interface is configured to be connected to a data processing device.

[0031] According to the third aspect of the embodiment of the present application, a laparoscopic surgical robot is provided, comprising an endoscope, a data processing device and a display as provided in the second aspect of the embodiment of the present application, the endoscope is communicatively connected to the data processing device, and the data processing device is communicatively connected to the display.

[0032] According to the image acquisition device, endoscope and laparoscopic surgical robot provided by the embodiments of the present application, a lens is arranged in the mirror tube, the lens can receive light reflected by the patient's tissue, and transmit it along the lens into the mirror tube, and is captured by the image sensor arranged at the rear end of the lens, and the image sensor can convert the light signal into an electrical signal; in the embodiments of the present application, a first circuit board is arranged on the side of the image sensor facing away from the lens, the image sensor is arranged on the first circuit board, the first circuit board extends along the radial direction of the mirror tube and is positioned in cooperation with the mirror tube; in this way, the image sensor can be supported and fixed by the first circuit board and the mirror tube; a second circuit board is arranged on the side of the first circuit board facing away from the image sensor, the second circuit board is relatively fixed to the first circuit board and is electrically connected with the first circuit board, and the second circuit board extends along the axial direction of the mirror tube; in this way, the second circuit board can be supported and fixed by the first circuit board and the mirror tube. In this way, after the image sensor converts the optical signal received by the lens into an electrical signal, the electrical signal is transmitted to the second circuit board through the first circuit board; the first circuit board is positioned in coordination with the lens tube, so that the image sensor and the second circuit board are conveniently positioned and fixed through the first circuit board; compared with the related art, it is equivalent to making the line that the image sensor needs to be pulled out and connected to the circuit board on the first circuit board, the first circuit board can be conveniently positioned in coordination with the lens tube, and the first circuit board and the second circuit board can be conveniently connected, so there is no need to open a mold separately to make a connector, and a conventional circuit board can be used to fix the image sensor, thereby reducing the production cost, saving the space required for the connector, reducing the volume of the image acquisition device, and saving the space required for the image acquisition device. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 is a schematic diagram of the overall structure of an image acquisition device provided in some embodiments of the present application;

[0035] Figure 2 is another overall structural schematic diagram of the image acquisition device provided in some embodiments of the present application;

[0036] Figure 3 It is a schematic diagram of the structure of the coordination of a lens, an image sensor, a first circuit board, and a second circuit board in an image acquisition device provided in some embodiments of the present application;

[0037] Figure 4It is a schematic diagram of the structure of the image sensor, the first circuit board and the second circuit board in the image acquisition device provided in some embodiments of the present application;

[0038] Figure 5 is a front view of a first circuit board in an image acquisition device provided in some embodiments of the present application;

[0039] Figure 6 is a rear view of a first circuit board in an image acquisition device provided in some embodiments of the present application;

[0040] Figure 7 It is a schematic diagram of the structure of the cooperation between the lens cover, the first circuit board and the second circuit board in the image acquisition device provided in some embodiments of the present application;

[0041] Figure 8 is a schematic structural diagram of a lens cover in an image acquisition device provided in some embodiments of the present application;

[0042] Fig. 9 yes Figure 8 A local enlarged schematic diagram of the middle A;

[0043] Fig.10 It is a schematic diagram of the structure of an endoscope provided in some embodiments of the present application.

[0044] Description of reference numerals:

[0045] 10-Endoscope;

[0046] 100-image acquisition device; 200-handle; 300-optical fiber connecting line; 400-data interface;

[0047] 110-mirror tube; 120-lens; 130-image sensor; 140-first circuit board; 150-second circuit board; 160-lens cover; 170-lens base;

[0048] 141-first gold finger; 142-slot; 143-soldering point; 151-second gold finger; 161-first hole section; 162-second hole section; 163-installation positioning part; 164-overflow glue groove;

[0049] 1641 - first groove portion; 1642 - second groove portion. DETAILED DESCRIPTION

[0050] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0051] In this specification, many specific technical details are described in some places. However, it should be understood that the embodiments of the present application can be implemented without these specific technical details. Such detailed descriptions should not be regarded as limiting, and the scope of protection of the present application is limited only by the claims. In other places, well-known structures, circuits and other details are not shown in detail to avoid misunderstandings of the main points of the present application by the public.

[0052] In this specification, the drawings show schematic diagrams of several embodiments of the present application. However, the drawings are only schematic, and it should be understood that other embodiments or combinations may be used, and that mechanical structures, physical components, electrical and step changes may be made without departing from the spirit and scope of the present application.

[0053] The following terms used herein are only used to describe specific embodiments and are not intended to limit the present application. Spatially relative terms, such as "below", "lower", "above", "upper", etc., can be used to describe the relationship between an element or feature illustrated in the figure and another element or feature for the convenience of explanation. It should be understood that spatially relative terms are intended to cover different orientations of the device in use or operation except the orientation depicted in the figure. For example, if the device in the figure is turned over, the element described as being "below" other elements or features will become "above" other elements or features. Therefore, the exemplary term "below" can cover the orientation of the top and bottom. And the device can be oriented in other ways (for example, rotated 90 ° or in other orientations), and the spatially relative descriptors used here are interpreted accordingly.

[0054] As used herein, "several", the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context indicates otherwise. It should be further understood that the terms "include" and / or "comprise" specify the presence of stated features, steps, operations, elements, and / or components, but do not exclude the presence of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0055] The term "object" generally refers to a component or a group of components. Throughout the specification and claims, the terms "object", "component", "portion", "part" and "item" are used interchangeably.

[0056] The terms "instrument", "surgical instrument" and "surgical instrument" are used herein to describe a medical device, including an end effector, that is configured to be inserted into a patient and used to perform a surgical or diagnostic procedure. An end effector can be a surgical tool associated with one or more surgical tasks, such as forceps, needle holders, scissors, bipolar cauterizers, tissue stabilizers or retractors, clip appliers, stapling devices, imaging devices (e.g., endoscopes or ultrasound probes), and the like. Some instruments used in embodiments of the present application further provide an articulated support (sometimes referred to as a "wrist") for the surgical tool so that the position and orientation of the end effector can be manipulated with one or more mechanical degrees of freedom relative to the instrument axis. Further, many end effectors include functional mechanical degrees of freedom, such as jaws that open or close or a knife that translates along a path. The instrument may also contain stored (e.g., on a PCBA board within the instrument) information that is permanent or updateable by the surgical system. Accordingly, the system may provide one-way or two-way information communication between the instrument and one or more system components.

[0057] The term "matching" can be broadly understood as any situation in which two or more objects are connected in a manner that allows the matched objects to operate in conjunction with each other. It should be noted that matching does not require a direct connection (e.g., a direct physical or electrical connection), but many objects or components can be used to match two or more objects. For example, objects A and B can be matched using object C. In addition, the terms "removably connected" or "removably matched" can be interpreted as meaning a non-permanent connection or matching situation between two or more objects. This means that the objects that are removably connected can be unconnected and separated so that they no longer operate in conjunction.

[0058] Finally, the terms "or" and "and / or" as used herein should be interpreted as inclusive or meaning any one or any combination. Thus, "A, B, or C" or "A, B and / or C" means any one of the following: A; B; C; A and B; A and C; B and C; A, B, and C. An exception to this definition will only occur when a combination of elements, functions, steps, or actions are inherently mutually exclusive in some way.

[0059] Overview of Master-Slave Teleoperated Laparoscopic Surgical Robot

[0060] Laparoscopic surgical robots usually include a doctor control platform, a patient surgical platform, and an image platform. The surgeon sits on the doctor control platform to view the two-dimensional or three-dimensional image of the surgical area transmitted by the laparoscope placed in the patient's body, and to control the movement of the robotic arm on the patient surgical platform, as well as the surgical instruments or laparoscopes attached to the robotic arm. The robotic arm simulates the human arm, and the surgical instrument simulates the human hand. Both provide surgeons with a series of movements that simulate the human wrist, while filtering out the tremor of the human hand itself.

[0061] The patient surgical platform includes a chassis, a column, a mechanical arm connected to the column, and one or more surgical instrument manipulators at the end of the support assembly of each mechanical arm. Surgical instruments and / or laparoscopes are detachably attached to the surgical instrument manipulators. Each surgical instrument manipulator supports one or more surgical instruments and / or laparoscopes operated at the surgical site in the patient's body. The relevant surgical instruments can be provided in various forms that allow each surgical instrument manipulator to move with one or more mechanical degrees of freedom (e.g., all six Cartesian degrees of freedom, five or less Cartesian degrees of freedom, etc.). Typically, each surgical instrument manipulator is limited by mechanical or software constraints to rotate the relevant surgical instrument around the center of motion on the surgical instrument that remains stationary relative to the patient, and the center of motion is usually located at the position where the surgical instrument enters the body, and the center of motion is called the "telecentric point".

[0062] The image platform usually includes a video image capture function (commonly an endoscope) and one or more video displays for displaying surgical instruments in the captured images. In some laparoscopic surgical robots, the laparoscope includes an optical device that transmits images from the patient's body 122 to one or more imaging sensors (also referred to as image sensors, such as CCD or CMOS sensors) at the distal end of the endoscope, and then transmits the video image to the host of the image platform through steps such as photoelectric conversion. Subsequently, through image processing, the processed image is displayed on the video display for observation by the assistant.

[0063] The doctor control platform may be at a single location in the surgical system consisting of a laparoscopic surgical robot or it may be distributed at two or more locations in the system. Remote control master / slave operation can be performed according to a preset control degree. In some embodiments, the doctor control platform includes one or more manually operated input devices, such as a joystick, an exoskeleton glove, a power and gravity compensation manipulator, etc. These input devices collect the surgeon's operating signals, and after processing by the control system, generate control signals for the robotic arm and the surgical instrument manipulator, thereby controlling the remote control motor on the surgical instrument manipulator, which in turn controls the movement of the surgical instrument.

[0064] Typically, the force generated by the remote motor is transmitted via a transmission system that transmits the force from the remote motor to the end effector of the surgical instrument. In some telesurgery embodiments, the input device for controlling the manipulator may be located remotely from the patient, in or outside the room where the patient is located, or even in a different city. The input signal from the input device is then transmitted to the control system. Those familiar with telemanipulation, telecontrol, and telepresentation surgery will be familiar with such systems and their components.

[0065] Figure 1is a schematic diagram of the overall structure of an image acquisition device provided in some embodiments of the present application, Figure 2 is another overall structural diagram of the image acquisition device provided in some embodiments of the present application, Figure 3 It is a schematic diagram of the structure of the coordination of a lens, an image sensor, a first circuit board, and a second circuit board in an image acquisition device provided in some embodiments of the present application.

[0066] Reference Figure 1-Figure 3 As shown, in some examples of the embodiments of the present application, an image acquisition device 100 is provided.

[0067] In some examples, the image acquisition device 100 may include a mirror tube 110 .

[0068] In some examples, the mirror tube 110 may also be referred to as a shell, a sleeve, or a tube shell. The mirror tube 110 may be made of metal, inorganic non-metal, or plastic. For example, the mirror tube 110 may be made of 316 stainless steel, fiberglass, or medical grade plastic. It is understood that the mirror tube 110 may also be made of other types of materials, and the embodiment of the present application does not limit the material of the mirror tube 110.

[0069] In some examples, the image acquisition device 100 may include a lens 120 .

[0070] In some examples, the lens 120 may also be referred to as an optical lens 120 .

[0071] In some examples, the lens 120 may be located at the front end of the mirror tube 110. The front end of the mirror tube 110 may refer to the end of the mirror tube 110 inserted into the patient's body, and the rear end of the mirror tube 110 may refer to the end of the mirror tube 110 away from the patient.

[0072] In some examples, lens 120 may be configured to receive reflected light from a target object.

[0073] In some examples, the target object may be a patient tissue or a lesion tissue. That is, the lens 120 may be configured to receive light reflected by the patient tissue or the lesion tissue. It is understood that these lights may be generated by a separate illumination of the image acquisition device, such as a common LED cold light source.

[0074] In some examples, the image acquisition device 100 may include an image sensor 130 .

[0075] In some examples, the image sensor 130 may be disposed in the lens tube 110 . The image sensor 130 may be located at the rear end of the lens 120 .

[0076] In some examples, the image sensor 130 may be the CCD described in the previous embodiments of the present application.

[0077] In some examples, the image sensor 130 may be the CMOS described in the previous embodiments of the present application.

[0078] In some examples, image sensor 130 may be configured to capture light received by lens 120 and generate an electrical signal.

[0079] That is, in some examples of the embodiments of the present application, the lens 120 can transmit the received light to the image sensor 130, so that the image sensor 130 is excited and generates an electrical signal.

[0080] In some examples, the image acquisition device 100 may include a first circuit board 140. The first circuit board 140 may be disposed on a side of the image sensor 130 that is away from the lens 120.

[0081] In some examples, the first circuit board 140 may be an integrated circuit board.

[0082] In some examples, the first circuit board 140 may be a printed circuit board (PCB).

[0083] In some examples, the image sensor 130 may be disposed on the first circuit board 140. The image sensor 130 may be disposed on a surface of the first circuit board 140 facing the lens 120.

[0084] In some examples, the image sensor 130 may be disposed on the first circuit board 140 in a patch manner. The image sensor 130 may be electrically connected to the first circuit board 140 .

[0085] In some examples, after the image sensor 130 receives the light received by the lens 120 , the electrical signal generated can be transmitted to the first circuit board 140 .

[0086] In some examples, electronic components may be disposed on the first circuit board 140 , and the electronic components may process the electrical signals transmitted on the first circuit board 140 .

[0087] In some examples, the first circuit board 140 may have a printed circuit thereon. The image sensor 130 may be electrically connected to the printed circuit on the first circuit board 140 .

[0088] In some examples, the substrate of the first circuit board 140 may be a ceramic substrate.

[0089] In some examples, the first circuit board 140 may extend in the radial direction of the mirror tube 110. For example, the extension direction of the first circuit board 140 may be parallel or approximately parallel to the radial direction of the mirror tube 110.

[0090] In some examples, the first circuit board 140 may be positioned in cooperation with the mirror tube 110 .

[0091] In some examples, the first circuit board 140 may be fixed to the inner wall of the mirror tube 110. For example, a mounting step may be provided on the inner wall of the mirror tube 110, and the first circuit board 140 is fixed to the mounting step.

[0092] In some examples, the first circuit board 140 can be connected to the inner wall of the mirror tube 110 by a snap. For example, a snap can be set on the inner wall of the mirror tube 110, and a slot can be set on the first circuit board 140; the first circuit board 140 is positioned in coordination with the mirror tube 110 through the coordination of the snap and the slot.

[0093] In some examples, a slot may be provided on the inner wall of the mirror tube 110 , and a buckle may be provided on the side wall of the first circuit board 140 ; ​​the first circuit board 140 is positioned in cooperation with the mirror tube 110 through the cooperation between the buckle and the slot.

[0094] In some examples, the first circuit board 140 may be fixed to the inner wall of the mirror tube 110 by bonding.

[0095] In some examples of the embodiments of the present application, the first circuit board 140 is positioned in cooperation with the mirror tube 110 , thereby facilitating the positioning of the image sensor 130 relative to the mirror tube 110 .

[0096] In some examples, the image acquisition device 100 may include a second circuit board 150 . The second circuit board 150 may be located on a side of the first circuit board 140 facing away from the image sensor 130 .

[0097] In some examples, the second circuit board 150 may be an integrated circuit board.

[0098] In some examples, the second circuit board 150 may be a PCB.

[0099] In some examples, electronic components may be disposed on the second circuit board 150 , and the electronic components may process electrical signals on the second circuit board 150 .

[0100] In some examples, the second circuit board 150 can be fixed relative to the first circuit board 140 and connected to the first circuit board 140 by electrical signals.

[0101] In some examples, the second circuit board 150 may extend along the axial direction of the mirror tube 110 . For example, the extension direction of the second circuit board 150 may be parallel or approximately parallel to the circumferential direction of the mirror tube 110 .

[0102] In some examples, the extension direction of the second circuit board 150 may be perpendicular or approximately perpendicular to the extension direction of the first circuit board 140 .

[0103] In some examples of the embodiments of the present application, the second circuit board 150 is electrically connected to the first circuit board 140 , and the first circuit board 140 is positioned by the cooperation with the mirror tube 110 , thereby facilitating the positioning of the second circuit board 150 .

[0104] According to the image acquisition device 100 provided in the embodiment of the present application, a lens 120 is arranged in the mirror tube 110, and the lens 120 can receive the light reflected by the patient's tissue, and transmit it along the lens 120 to the mirror tube 110, and is captured by the image sensor 130 arranged at the rear end of the lens 120, and the image sensor 130 can convert the optical signal into an electrical signal; in the embodiment of the present application, a first circuit board 140 is arranged on the side of the image sensor 130 facing away from the lens 120, and the image sensor 130 is arranged on the first circuit board 140, and the first circuit board 140 is arranged along the mirror tube 110. The image sensor 130 is supported and fixed by the first circuit board 140 and the mirror tube 110. The second circuit board 150 is arranged on the side of the first circuit board 140 facing away from the image sensor 130. The second circuit board 150 is relatively fixed to the first circuit board 140 and is electrically connected to the second circuit board 150. The second circuit board 150 extends along the axial direction of the mirror tube 110. In this way, the second circuit board 150 can be supported and fixed by the first circuit board 140 and the mirror tube 110. In this way, after the image sensor 130 converts the optical signal received by the lens 120 into an electrical signal, the electrical signal is transmitted to the second circuit board 150 through the first circuit board 140; the first circuit board 140 and the lens tube 110 are positioned in cooperation, so that the image sensor 130 and the second circuit board 150 are conveniently positioned and fixed by the first circuit board 140; compared with the related art, it is equivalent to making the line that the image sensor 130 needs to be pulled out and connected to the circuit board on the first circuit board 140, the first circuit board 140 can be conveniently positioned in cooperation with the lens tube 110, and the first circuit board 140 and the second circuit board 150 can be conveniently connected, so there is no need to open a mold separately to make a connector, and a conventional circuit board can be used to fix the image sensor 130, thereby reducing the production cost, saving the space required for the connector, reducing the volume of the image acquisition device 100, and saving the space required for the image acquisition device 100.

[0105] Figure 4 is a schematic diagram of the structure of the image sensor, the first circuit board and the second circuit board in the image acquisition device provided in some embodiments of the present application, Figure 5 This is a front view of the first circuit board in the image acquisition device provided in some embodiments of the present application.

[0106] Reference Figure 4 and Figure 5As shown, in some examples of the embodiments of the present application, a surface of the first circuit board 140 on one side facing away from the image sensor 130 may have a first gold finger 141 .

[0107] In some examples, the first gold finger 141 can be electrically connected to a printed circuit on the first circuit board 140 .

[0108] In some examples, the first gold finger 141 may be electrically connected to the image sensor 130 . The electrical signal generated by the image sensor 130 after receiving the optical signal transmitted by the lens 120 may be transmitted to the first gold finger 141 .

[0109] In some examples, the second circuit board 150 may have a second gold finger 151 at one end facing the first circuit board 140 . The second gold finger 151 may be electrically connected to the first gold finger 141 .

[0110] In some examples, the second gold finger 151 may be wire-bonded to the first gold finger 141 .

[0111] In some examples, the electrical signal generated by the image sensor 130 after receiving the optical signal transmitted by the lens 120 can be transmitted to the second circuit board 150 through the first gold finger 141 and the second gold finger 151 .

[0112] In some examples of the embodiments of the present application, a first gold finger 141 is set on the surface of the side of the first circuit board 140 facing away from the image sensor 130, and a second gold finger 151 is set on the end of the second circuit board 150 facing the first circuit board 140, and the first gold finger 141 and the second gold finger 151 are electrically connected; in this way, the electrical signal of the image sensor 130 is transmitted to the first circuit board 140 through the first gold finger 141 and the second gold finger 151, and after being converted into an optical signal on the first circuit board 140, it is transmitted to the data processing device through the optical fiber.

[0113] For some examples, refer to Figure 5 As shown, a slot 142 may be provided on the first circuit board 140. The slot 142 may be provided on a side of the first circuit board 140 facing the second circuit board 150.

[0114] In some examples, the first gold finger 141 may extend to the slot 142 .

[0115] In some examples, the first gold finger 141 may extend to an inner wall of the slot 142 .

[0116] In some examples, one end of the second gold finger 151 of the second circuit board 150 can be inserted into the slot 142. The second gold finger 151 is electrically connected to the first gold finger 141.

[0117] In some examples of the embodiments of the present application, a slot 142 is set on the first circuit board 140, and the first gold finger 141 extends to the slot 142; the second circuit board 150 is inserted into the slot 142, so that the second gold finger 151 is electrically connected to the first gold finger 141; in this way, the connection between the first circuit board 140 and the second circuit board 150 is facilitated, and the stability of the electrical signal connection between the second gold finger 151 and the first gold finger 141 is improved.

[0118] For some examples, refer to Figure 5 As shown, first gold fingers 141 may be provided on both sides of the slot 142. In this way, the second gold fingers 151 may be electrically connected to the first gold fingers 141 on both sides of the slot 142, thereby improving the stability of the electrical signal connection between the first gold fingers 141 and the second gold fingers 151.

[0119] In some examples, the second gold finger 151 and the first gold finger 141 can be fixed and electrically connected by welding, so as to improve the stability of the electrical signal connection between the second gold finger 151 and the first gold finger 141. In addition, the stability of the connection between the second circuit board 150 and the first circuit board 140 can be improved.

[0120] Figure 6 This is a rear view of the first circuit board in the image acquisition device provided in some embodiments of the present application.

[0121] Reference Figure 6 As shown, in some examples of the embodiments of the present application, the first circuit board 140 may have solder joints 143. Since there are soldered balls (BGA) on the back of the image sensor 130, there are solder joints at corresponding positions (corresponding to the positions of the balls) on the first circuit board 140. The image sensor 130 can be soldered to the first circuit board 140 through a series of processes such as reflow soldering, thereby connecting the image sensor 130 to the first circuit board 140 by electrical signals.

[0122] In some examples, the first gold finger 141 can be electrically connected to the first circuit board 140 through surface mount technology (SMT for short).

[0123] In some examples of the embodiments of the present application, the image sensor 130 is electrically connected to the first gold finger 141 on the side of the first circuit board 140 facing away from the image sensor 130 through the solder joint 143, so that the electrical signal generated by the image sensor 130 is transmitted to the second circuit board 150 through the first gold finger 141 and the second gold finger 151; in this way, the size of the first circuit board 140 can be close to the size of the image sensor 130 itself, which can save the space size required to be occupied by the first circuit board 140, reduce the overall size of the image acquisition device 100, and facilitate the miniaturization of the endoscope 10.

[0124] In some examples, the image sensor 130 is electrically connected to the gold finger on the side of the first circuit board 140 facing away from the image sensor 130 through the solder joint 143. In this way, the first circuit board 140 can be used to replace the connector in the related art. A general PCB can be directly used for soldering without the need for a separate mold, thereby reducing the manufacturing cost.

[0125] Figure 7 It is a schematic structural diagram of the coordination of a lens cover, a first circuit board, and a second circuit board in an image acquisition device provided in some embodiments of the present application.

[0126] Reference Figure 7 As shown, in some examples of the embodiments of the present application, the image acquisition device 100 may include a lens cover 160. The lens cover 160 may be arranged on the periphery of the lens 120.

[0127] In some examples, the lens cover 160 may be mounted on the outer periphery of the lens 120 .

[0128] In some examples, the lens cover 160 may be disposed in the lens tube 110 .

[0129] In some examples, the lens 120 may be fixed in the lens tube 110 via a lens cover 160 .

[0130] In some examples, the lens 120 may have a through hole extending along the axial direction of the lens tube 110. The lens 120 may be disposed in the through hole.

[0131] In some examples, the lens 120 and the lens cover 160 can be transitionally matched and glued, which can also be used to fine-tune and compensate for the optical path with installation deviations.

[0132] In some examples, the lens cover 160 may be fixedly connected to the lens tube 110. The lens cover 160 may be snap-fitted, bonded, or interference-fitted to the lens tube 110.

[0133] In some examples of the embodiments of the present application, a lens cover 160 is provided on the periphery of the lens 120 , and the lens cover 160 is fixedly connected to the lens tube 110 ; thus, the lens 120 is conveniently fixed in the lens tube 110 .

[0134] In some examples, the first circuit board 140 may be connected to the lens cover 160. The photosensitive surface of the image sensor 130 cooperates with the light-emitting end of the lens 120. The light captured by the lens 120 is transmitted from the light-emitting end to the photosensitive surface of the image sensor 130, so that the image sensor 130 excites an electrical signal.

[0135] In some examples, the photosensitive surface of the image sensor 130 may be aligned with or directly opposite to the light emitting end of the lens 120 .

[0136] In some examples, the central axis of the image sensor 130 may coincide with or approximately coincide with the axis of the lens 120 .

[0137] Figure 8 It is a schematic diagram of the structure of a lens cover in an image acquisition device provided in some embodiments of the present application.

[0138] For some examples, refer to Figure 8 As shown, the lens cover 160 may have a first hole section 161 therein. The first hole section 161 may penetrate both ends of the lens cover 160 along the axial direction of the lens cover 160.

[0139] In some examples, the lens 120 may be inserted into the first hole section 161 .

[0140] In some examples, the light emitting end of the lens 120 may be inserted into the first hole section 161 .

[0141] In some examples, the lens 120 may be interference fit with the lens cover 160 .

[0142] For some examples, refer to Figure 8 As shown, the lens cover 160 may have a second hole section 162. The second hole section 162 may be located on a side of the lens cover 160 facing away from the lens 120. Alternatively, the second hole section 162 may be located on a side of the lens cover 160 facing the image sensor 130.

[0143] In some examples, at least a portion of the second hole segment 162 may have a larger hole diameter than the first hole segment 161 , so that the hole edge of the first hole segment 161 facing one end of the first circuit board 140 forms a mounting positioning portion 163 .

[0144] In some examples, the installation positioning portion 163 may be a bottom wall of the second hole segment 162 .

[0145] In some examples, the first hole segment 161 and the second hole segment 162 may be coaxial.

[0146] In some examples, the first circuit board 140 may be connected to the lens cover 160 , so that the image sensor 130 may be inserted into the second hole section 162 . The mounting positioning portion 163 may be configured to position the image sensor 130 inserted into the second hole section 162 .

[0147] In some examples, a side of the image sensor 130 facing the lens 120 may abut against the mounting positioning portion 163 .

[0148] In some examples, the first circuit board 140 may be connected to the edge of the second hole section 162. That is, the side wall of the first circuit board 140 facing the image sensor 130 is connected to the edge of the second hole section 162, so as to position the image sensor 130.

[0149] In some examples, the cross-sectional area of ​​the first circuit board 140 along the radial direction of the lens cover 160 may be larger than the cross-sectional area of ​​the image sensor 130 , so that the side wall of the first circuit board 140 may protrude from the side wall of the image sensor 130 , thereby facilitating the fixing of the first circuit board 140 to the edge of the second hole section 162 .

[0150] In some examples, the first circuit board 140 can be connected to the inner wall of the second hole segment 162 .

[0151] In some examples, at least a portion of the first circuit board 140 may be inserted into the second hole section 162. The side wall of the first circuit board 140 and the inner wall of the second hole section 162 may be fixedly connected.

[0152] In some examples, the first circuit board 140 may be bonded to the edge of the second hole section 162 .

[0153] In some examples, the first circuit board 140 can be bonded to the edge of the second hole section 162 by a side dispensing process. In this way, the image sensor 130 can be firmly bonded to the lens 120 seat, the positioning accuracy between the image sensor 130 and the lens 120 can be improved, and the welding error between the image sensor 130 and the circuit board can be avoided to affect the imaging quality; thus, the imaging quality of the endoscope 10 is improved.

[0154] In some examples, the second hole section 162 may have a glue overflow groove 164. The glue overflow groove 164 may also be called a glue retention groove.

[0155] In some examples, when the first circuit board 140 and the lens cover 160 are connected by the side glue dispensing process, the overflow glue groove 164 can be configured to store the seeping glue between the first circuit board 140 and the lens cover 160. For example, in some examples, when the amount of glue used is large, the excess glue can seep into the overflow glue groove 164 for storage, which can improve the light collection effect of the surface of the image sensor 130 and prevent the seeping glue from overflowing to the surface of the image sensor 130 and interfering with the image sensor 130.

[0156] Fig. 9 yes Figure 8 A local enlarged schematic diagram of point A in the middle.

[0157] For some examples, refer to Figure 8 and Fig. 9 As shown, the overflowing glue groove 164 may have a first groove portion 1641. The first groove portion 1641 may be recessed in the side wall of the second hole section 162 along the radial direction of the lens cover 160.

[0158] In some examples, a plurality of first grooves 1641 may be provided along the circumference of the lens cover 160. The plurality of first grooves 1641 may be evenly spaced and arranged along the circumference of the lens cover 160. In this way, the glue may evenly infiltrate the plurality of first grooves 1641, so that the glue between the first circuit board 140 and the lens cover 160 is evenly distributed, the installation accuracy of the image sensor 130 is improved, and thus the imaging quality of the endoscope 10 is improved.

[0159] For some examples, refer to Figure 8 As shown, the radial cross section of the second hole segment 162 may be a polygon. In some examples of the embodiments of the present application, the radial cross section of the second hole segment 162 is a rectangle as a specific example for description.

[0160] In some examples, the first groove 1641 may be located at the corners of a polygon. For example, the first groove 1641 may be located at the four corners of a rectangle.

[0161] For some examples, refer to Fig. 9 As shown, the first groove 1641 may be recessed at the corner of the second hole section 162. In this way, the first groove 1641 may also avoid the corner of the image sensor 130, so that the image sensor 130 is inserted into the second hole section 162 for installation and positioning.

[0162] In some examples, the first groove 1641 may extend to the edge of the second hole section 162. In other words, the first groove 1641 may be connected to the external environment on the side of the lens cover 160 facing the first circuit board 140. In this way, it is easy for excess glue to seep into the first groove 1641, which can avoid affecting the image sensor 130 and improve the imaging quality of the image sensor 130.

[0163] In some examples, the overflowing glue groove 164 may have a second groove portion 1642. The second groove portion 1642 may be recessed in the installation positioning portion 163 along the axial direction of the second hole segment 162. The second groove portion 1642 may be connected to the first groove portion 1641. In some examples, the second groove portion 1642 may be spaced from the inner wall of the first hole segment 161. That is, when the second groove portion 1642 is recessed in the installation positioning portion 163, the second groove portion 1642 is not connected to the first hole segment 161.

[0164] In some examples, the side wall of the second groove 1642 may be an extension of the inner wall of the second hole section 162 along the axial direction of the lens cover 160. In other words, the second groove 1642 may be closely attached to the inner wall of the second hole section 162 and recessed in the installation positioning portion 163.

[0165] In some examples, along the radial direction of the lens cover 160 , the width dimension of the second groove portion 1642 may be smaller than the width dimension of the mounting positioning portion 163 .

[0166] In some examples, the second groove 1642 may extend along both sides of the corner. Fig. 9 As shown, a portion of the second groove portion 1642 may extend along one side of the corner, and another portion of the second groove portion 1642 may extend along the other side of the corner, so that the second groove portion 1642 forms a cross-sectional shape that is the same as or similar to the corner of the polygon.

[0167] In some examples of the embodiments of the present application, the cross-sectional shape of the second hole section 162 is set to a polygon, so that it is convenient to position and install the image sensor 130. The first circuit board 140 is fixed outside the second hole section 162, and the position of the first circuit board 140 can be flexibly adjusted, so as to avoid the welding error between the image sensor 130 and the first circuit board 140 affecting the imaging quality. The second groove 1642 is set at the corner of the polygon, and the second groove 1642 extends along both sides of the corner. In this way, the seeping glue on both sides of the corner can be conveniently and quickly infiltrated to the second groove 1642, avoiding the influence and interference of the seeping glue on the photosensitive surface of the image sensor 130, and improving the imaging quality of the image sensor 130.

[0168] In some examples, along the axial direction of the second hole segment 162 , the depth of the first groove portion 1641 may be greater than the depth of the second groove portion 1642 .

[0169] In some examples, the bottom wall of the second groove portion 1642 may be flush with the bottom wall of the first groove portion 1641 .

[0170] In some examples of the embodiments of the present application, refer to Figure 1 , Figure 2 and Figure 7As shown, the lens 120 may include two lenses, and the two lenses 120 may be arranged along the radial direction of the lens tube 110 .

[0171] In some examples, the image sensor 130 may include two. One of the two image sensors 130 may cooperate with one of the lenses 120. For example, it cooperates with one of the lenses 120 through a lens cover 160. The other of the two image sensors 130 may cooperate with another lens 120. For example, it cooperates with another lens 120 through another lens cover 160. In this way, the image acquisition device 100 can acquire a three-dimensional image of a target object (e.g., a patient's tissue or a lesion tissue), so that doctors can accurately determine the location of the lesion tissue.

[0172] Fig.10 It is a schematic diagram of the structure of an endoscope provided in some embodiments of the present application.

[0173] Reference Fig.10 As shown, in some examples of the embodiments of the present application, an endoscope 10 is provided. The endoscope 10 may include:

[0174] The image acquisition device 100, handle 200, optical fiber connecting line 300 and data interface 400 provided in any optional example of the aforementioned embodiments of the present application.

[0175] In some examples of the embodiments of the present application, the handle 200 is connected to the proximal end or rear end of the image acquisition device 100; wherein, the end of the image acquisition device 100 facing / toward the patient's tissue is called the distal end or front end, that is, the proximal end or rear end of the image acquisition device 100 is the end of the image acquisition device 100 that is away from the patient's tissue.

[0176] Exemplarily, the image sensor 130, such as the first image sensor 130 and the second image sensor 130, converts the optical signal into an electrical signal, which is transmitted on the circuit board and transmitted to the electrical signal processor on the handle 200, and the electrical signal processor on the handle 200 converts the electrical signal into an optical signal again.

[0177] In the embodiment of the present application, after the electrical signal processor on the handle 200 processes the electrical signal into an optical signal, the optical signal can be transmitted through the optical fiber connection line 300 connected to the proximal end of the handle 200, and the optical signal is transmitted to the data interface 400. The data interface 400 can be connected to a computer device to process the optical signal.

[0178] In some examples, the data interface 400 may be a Universal Serial Bus (USB). Of course, in other examples, the data interface 400 may also be other types of interfaces, such as a Type-C interface. In the embodiments of the present application, the specific type of the data interface 400 is not limited.

[0179] Some examples of the embodiments of the present application also provide a laparoscopic surgical robot, including the endoscope 10, a data processing device and a display provided in the aforementioned embodiments of the present application, the endoscope 10 is communicatively connected to the data processing device, and the data processing device is communicatively connected to the display.

[0180] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An image acquisition device, characterized in that: include: Mirror tube (110); A lens (120) is disposed in the mirror tube (110), and the lens (120) is located at the front end of the mirror tube (110), and the lens (120) is configured to receive reflected light from a target object; An image sensor (130) is disposed in the lens tube (110) and located at the rear end of the lens (120), wherein the image sensor (130) is configured to capture light received by the lens (120) and generate an electrical signal; a first circuit board (140) located on a side of the image sensor (130) facing away from the lens (120); the image sensor (130) is disposed on the first circuit board (140); the image sensor (130) is electrically connected to the first circuit board (140); the first circuit board (140) is configured to extend along a radial direction of the mirror tube (110) and to be positioned in coordination with the mirror tube (110); The second circuit board (150) is located on a side of the first circuit board (140) facing away from the image sensor (130); the second circuit board (150) is relatively fixed to the first circuit board (140) and is electrically signal connected to the second circuit board (150); and the second circuit board (150) extends along the axial direction of the mirror tube (110).

2. The image acquisition device according to claim 1, characterized in that: A first gold finger (141) is provided on a surface of the first circuit board (140) on one side facing away from the image sensor (130), and a second gold finger (151) is provided on an end of the second circuit board (150) facing the first circuit board (140), wherein the second gold finger (151) is electrically signal-connected to the first gold finger (141).

3. The image acquisition device according to claim 2, characterized in that: The first circuit board (140) is provided with a slot (142), the first gold finger (141) extends to the slot (142), and one end of the second gold finger (151) of the second circuit board (150) is inserted into the slot (142) so that the second gold finger (151) is electrically signal-connected to the first gold finger (141).

4. The image acquisition device according to claim 2, characterized in that: The second gold finger (151) and the first gold finger (141) are fixed and connected with electrical signals by welding.

5. The image acquisition device according to claim 2, characterized in that: The first circuit board (140) has a soldering point (143), and the image sensor (130) is electrically connected to the first gold finger (141) via the soldering point (143).

6. The image acquisition device according to claim 1, characterized in that: Also includes: A lens cover (160) is arranged on the outer periphery of the lens (120), and the lens cover (160) is fixedly connected to the lens tube (110); The first circuit board (140) is connected to the lens cover (160) so that the light-sensitive surface of the image sensor (130) matches the light-emitting end of the lens (120).

7. The image acquisition device according to claim 6, characterized in that: The lens cover (160) has a first hole section (161) and a second hole section (162), the second hole section (162) is located on a side of the lens cover (160) facing away from the lens (120), and at least a portion of the second hole section (162) has a larger hole diameter than the first hole section (161), so that the hole edge of the first hole section (161) facing one end of the first circuit board (140) forms a mounting positioning portion (163); The first circuit board (140) is connected to the lens cover (160) so that the image sensor (130) is inserted into the first hole section (161), and the installation positioning portion (163) is configured to position the image sensor (130).

8. The image acquisition device according to claim 7, characterized in that: The first circuit board (140) is bonded to the lens cover (160), and a glue overflow groove (164) is provided in the second hole section (162), and the glue overflow groove (164) is configured to store glue seeping when the first circuit board (140) is bonded to the lens cover (160).

9. The image acquisition device according to claim 8, characterized in that: The glue overflow groove (164) has a first groove portion (1641), and the first groove portion (1641) is recessed in the side wall of the second hole section (162) along the radial direction of the lens cover (160); A plurality of first grooves (1641) are provided along the circumference of the lens cover (160), and the plurality of first grooves (1641) are evenly spaced and arranged along the circumference of the lens cover (160); The first groove portion (1641) penetrates to the edge of the second hole section (162); The radial cross section of the second hole section (162) is a polygon, and the first groove portion (1641) is located at a corner of the polygon.

10. The image acquisition device according to claim 9, characterized in that: The glue overflow groove (164) has a second groove portion (1642), the second groove portion (1642) is connected to the first groove portion (1641), and the second groove portion (1642) is recessed into the installation positioning portion (163) along the axial direction of the second hole section (162).

11. The image acquisition device according to any one of claims 1 to 10, characterized in that: The lenses (120) include two, and the two lenses (120) are arranged along the radial direction of the lens tube (110); the image sensors (130) include two, and the two image sensors (130) are matched with the two lenses (120) in a one-to-one manner.

12. An endoscope, characterized in that: include: The image acquisition device (100) as claimed in any one of claims 1 to 11; A handle (200) connected to the proximal end of the image acquisition device; An optical fiber connecting line (300) and a data interface (400), wherein one end of the optical fiber connecting line (300) is connected to the proximal end of the handle (200), and the other end of the optical fiber connecting line (300) is connected to the data interface (400), and the data interface (400) is configured to be connected to a data processing device.

13. A laparoscopic surgical robot, characterized in that: It comprises an endoscope (10) as claimed in claim 12, a data processing device and a display, wherein the endoscope is communicatively connected to the data processing device, and the data processing device is communicatively connected to the display.

Images