Integrated circuit chip processing device

Abstract

The utility model discloses a processing device for integrated circuit chips, which relates to the field of chip processing technology. The processing device for integrated circuit chips includes a base, a conveyor A, a conveyor B, a conveyor C, a guide mechanism, a welding mechanism and a mechanical arm; the conveyor A, the conveyor B and the conveyor C are all mounted on the base, the conveyor A and the conveyor B are arranged horizontally in a straight line, one end of the conveyor C is located between the conveyor A and the conveyor B, and the conveyor C is vertically distributed with the conveyor A and the conveyor B. The processing device for integrated circuit chips can complete automatic loading and unloading and welding operations through the coordinated design of the conveyor A, the conveyor B, the conveyor C, the return support bracket and the mechanical arm, and can be carried out continuously, shortening the loading and unloading clamping and disassembly time, which is conducive to improving the chip welding operation efficiency, meeting the needs of the chip processing industry, and is suitable for promotion and use.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a processing device for integrated circuit chips. Background Art

[0002] An integrated circuit chip processing device with publication number CN220606182U includes a workbench, a through groove is opened inside the workbench, a first motor is connected to the bottom of the through groove, the output shaft surface of the first motor is fixedly connected to a threaded rod through a coupling, the surface of the threaded rod is threadedly connected to a lifting block through a threaded groove, and the third slider on one side of the connecting block slides in the third sliding groove so that the adsorption block at the bottom of the connecting block can be guided vertically by the guide plate during the downward extension and retraction process, thereby ensuring the stability and accuracy of the welding of the adsorbed chip at the bottom of the adsorption block, thereby solving the problem that the processing of traditional integrated circuit chips is often done by manually holding the chip for special electrical welding on the integrated circuit board, which makes it easy for the chip to deviate from the installation position during the welding and installation process.

[0003] The above-mentioned integrated circuit chip processing device needs to clamp and fix the chip during processing, which is inconvenient for continuous welding operations, affecting the actual processing efficiency. In addition, loading and unloading are inconvenient and the practicality is poor, which is not conducive to the actual application of chip processing operations. For this reason, a new type of integrated circuit chip processing device is now provided to solve the above problems. Utility Model Content

[0004] The utility model aims to provide a processing device for integrated circuit chips, which can solve the problems of inconvenient loading and unloading and low efficiency of some integrated circuit chip processing devices.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a processing device for integrated circuit chips, comprising a base, a conveyor A, a conveyor B, a conveyor C, a guide mechanism, a welding mechanism and a mechanical arm;

[0006] Conveyor A, conveyor B and conveyor C are all installed on the base. Conveyor A and conveyor B are horizontally arranged opposite to each other. One end of conveyor C is located between conveyor A and conveyor B. Conveyor C is vertically distributed with conveyor A and conveyor B. Conveyor A and conveyor B are used to transport circuit boards and chips to be welded respectively, and conveyor C is used to transport circuit boards after welding chips.

[0007] The guiding mechanism is arranged on conveyor A and can sort the conveyed circuit boards. The welding mechanism is arranged above the ends of conveyor C close to conveyor A and conveyor B. The welding mechanism is used to weld the circuit boards and chips. The robotic arm is arranged on the side of conveyor B and can move the chips conveyed on conveyor B.

[0008] Preferably, a circular support bracket is installed on the top of the base, and the circular support bracket is located between conveyor A and conveyor B and above conveyor C. Conveyor A, conveyor B and the circular support bracket are at the same height, the circular support bracket does not contact conveyor C, and the belt surface of conveyor C is integrally formed with dense rubber protrusions.

[0009] Preferably, the top of the rubber protrusion can pass through the center of the circular support bracket and be flush with the circular support bracket, and the rubber protrusion can also pass through the gap between the conveyor C and the circular support bracket; a horizontally arranged support is fixedly installed on the side of the conveyor B, and the mechanical arm is arranged on the support.

[0010] Preferably, the guide mechanism includes a bracket plate, a guide plate, a connecting piece and bolts. A bracket plate is installed at the top of conveyor A near conveyor C. A slide groove perpendicular to and passing through the conveying direction of conveyor A is opened on the top of the bracket plate. Two groups of guide plates symmetrically distributed in an eight-shaped shape are slidably installed in the slide groove on the bracket plate. The guide plate is located at the top end surface of the slide groove on the bracket plate, and is connected to a connecting piece extending straight above the bracket plate. A bolt perpendicular to the bracket plate and capable of contacting the top of the bracket plate is threadedly connected to the connecting piece.

[0011] Preferably, a support frame is installed on the top of the base, and the support frame is located between conveyor A and conveyor B. The welding mechanism includes a cylinder, a mounting seat and a multi-axis welding machine. A cylinder with a free end vertically downward is provided on the top of the support frame, and the free end of the cylinder extends to the inner side of the support frame and is fixedly connected to the mounting seat. A multi-axis welding machine is provided at the bottom of the mounting seat, and the multi-axis welding machine is located directly above the circular support bracket.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] (1) The processing device for integrated circuit chips can complete automatic loading and unloading and welding operations through the coordinated design of conveyor A, conveyor B, conveyor C, return support frame and mechanical arm, and can be carried out continuously, shortening the loading and unloading, clamping and disassembly time, which is conducive to improving the efficiency of chip welding operations, meeting the needs of the chip processing industry, and is suitable for promotion and use.

[0014] (2) The processing device for integrated circuit chips can organize and guide the circuit boards and chips sent to the return support for welding through the coordinated design of conveyor A, conveyor B, guide mechanism and robot arm, so as to ensure accurate welding and guarantee welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a left-side stereogram of the utility model;

[0016] Figure 2 It is a right side perspective view of the present utility model;

[0017] Figure 3 It is an enlarged view of part A of the utility model;

[0018] Figure 4 It is an enlarged view of part B of the utility model;

[0019] Figure 5 It is a front view of the utility model.

[0020] In the figure: 1. base; 2. conveyor A; 3. conveyor B; 4. conveyor C; 5. circular support bracket; 6. rubber bumps; 7. guide mechanism; 71. bracket plate; 72. guide plate; 73. connecting piece; 74. bolt; 8. support frame; 9. welding mechanism; 91. cylinder; 92. mounting seat; 93. multi-axis welding machine; 10. support; 11. robotic arm. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] See also Figure 1-5 The utility model provides a technical solution: a processing device for integrated circuit chips, including a base 1, a conveyor A2, a conveyor B3, a conveyor C4, a guide mechanism 7, a welding mechanism 9 and a mechanical arm 11; the conveyor A2, the conveyor B3 and the conveyor C4 are all mounted on the base 1, the conveyor A2 and the conveyor B3 are arranged horizontally in a straight line, one end of the conveyor C4 is located between the conveyor A2 and the conveyor B3, the conveyor C4 is vertically distributed with the conveyor A2 and the conveyor B3, the conveyor A2 and the conveyor B3 are respectively used to transport the circuit board and the chip to be welded, and the conveyor C4 is used to transport the circuit board after the chip is welded; the guide mechanism 7 is arranged on the conveyor A2 and can sort the transported circuit board, the welding mechanism 9 is arranged above the end of the conveyor C4 close to the conveyor A2 and the conveyor B3, the welding mechanism 9 is used to weld the circuit board and the chip, and the mechanical arm 11 is arranged on the side of the conveyor B3 and can move the chip transported on the conveyor B3.

[0023] Among them, a circular support bracket 5 is installed on the top of the base 1, and the circular support bracket 5 is located between the conveyor A2 and the conveyor B3 and above the conveyor C4. The heights of the conveyors A2, B3 and the circular support bracket 5 are level, and the circular support bracket 5 does not contact the conveyor C4. The surface of the belt body of the conveyor C4 is integrally formed with dense rubber protrusions 6. The top of the rubber protrusions 6 can pass through the center of the circular support bracket 5 and be level with the circular support bracket 5. The rubber protrusions 6 can also pass through the gap between the conveyor C4 and the circular support bracket 5; a horizontally arranged support 10 is fixedly installed on the side of the conveyor B3, and a mechanical arm 11 is arranged on the support 10, which can complete automatic loading and unloading and welding operations, and can be carried out continuously, shortening the loading and unloading, clamping and disassembly time, which is conducive to improving the efficiency of chip welding operations and meeting the needs of the chip processing industry.

[0024] Secondly, the guide mechanism 7 includes a bracket plate 71, a guide plate 72, a connecting piece 73 and a bolt 74. The bracket plate 71 is installed at the top of the conveyor A2 near the conveyor C4. The top of the bracket plate 71 is provided with a slide groove that is perpendicular to and penetrates the conveying direction of the conveyor A2. Two groups of guide plates 72 symmetrically distributed in an eight-shaped shape are slidably installed in the slide groove on the bracket plate 71. The guide plate 72 is located at the top end surface of the slide groove on the bracket plate 71 and is connected to a connecting piece 73 extending straight above the bracket plate 71. The connecting piece 73 is threadedly connected with a bolt 74 that is perpendicular to the bracket plate 71 and can contact the top of the bracket plate 71. The top of the base 1 A support frame 8 is installed and located between conveyor A2 and conveyor B3. A welding mechanism 9 includes a cylinder 91, a mounting seat 92 and a multi-axis welding machine 93. A cylinder 91 with a free end vertically downward is arranged on the top of the support frame 8. The free end of the cylinder 91 extends to the inner side of the support frame 8 and is fixedly connected to the mounting seat 92. A multi-axis welding machine 93 is arranged at the bottom of the mounting seat 92. The multi-axis welding machine 93 is located directly above the circular support bracket 5, and can organize and guide the circuit boards and chips sent to the circular support bracket 5 for welding.

[0025] Working principle: Place the circuit board and chip to be welded on conveyor A2 and conveyor B3 respectively, control conveyor A2 and conveyor B3 to move toward each other, adjust the distance between two adjacent groups of guide plates 72 according to the specifications of the circuit board, guide the circuit board when passing between the two groups of guide plates 72, and then convey the circuit board to the circular support frame 5, control the robot arm 11 to clamp the chip on conveyor B3 to the corresponding position on the circuit board, control the welding mechanism 9 to weld the circuit board and the chip, and control the conveyor C4 to start after welding, and the rubber bump 6 will push the circuit board down from the circular support frame 5 to achieve separation and transportation.

[0026] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. An integrated circuit chip processing device, characterized in that: include: A base (1), a conveyor A (2), a conveyor B (3) and a conveyor C (4), wherein the conveyors A (2), B (3) and C (4) are all mounted on the base (1), the conveyors A (2) and B (3) are arranged horizontally in a line opposite to each other, one end of the conveyor C (4) is located between the conveyors A (2) and B (3), and the conveyor C (4) is vertically arranged with the conveyors A (2) and B (3), the conveyors A (2) and B (3) are respectively used to transport circuit boards and chips to be welded, and the conveyor C (4) is used to transport circuit boards after welding chips; A guide mechanism (7), a welding mechanism (9) and a mechanical arm (11), wherein the guide mechanism (7) is arranged on the conveyor A (2) and can sort the conveyed circuit boards, the welding mechanism (9) is arranged above the ends of the conveyor C (4) close to the conveyor A (2) and the conveyor B (3), the welding mechanism (9) is used to weld the circuit boards and chips, and the mechanical arm (11) is arranged on the side of the conveyor B (3) and can move the chips conveyed on the conveyor B (3).

2. The integrated circuit chip processing device according to claim 1, characterized in that: A circular support bracket (5) is mounted on the top of the base (1). The circular support bracket (5) is located between the conveyor A (2) and the conveyor B (3) and above the conveyor C (4). The heights of the conveyor A (2), the conveyor B (3) and the circular support bracket (5) are level. The circular support bracket (5) does not contact the conveyor C (4). The surface of the belt body of the conveyor C (4) is integrally formed with dense rubber protrusions (6).

3. The integrated circuit chip processing device according to claim 2, characterized in that: The top end of the rubber protrusion (6) can pass through the center of the circular support bracket (5) and be flush with the circular support bracket (5), and the rubber protrusion (6) can also pass through the gap between the conveyor C (4) and the circular support bracket (5).

4. The integrated circuit chip processing device according to claim 3, characterized in that: The guide mechanism (7) comprises a support plate (71), a guide plate (72), a connecting piece (73) and a bolt (74). The support plate (71) is mounted at a position near the top of the conveyor A (2) and the conveyor C (4). A sliding groove perpendicular to and penetrating the conveying direction of the conveyor A (2) is provided on the top of the support plate (71). Two groups of guide plates (72) symmetrically distributed in an eight-shaped shape are slidably installed in the sliding groove on the support plate (71). The top end surface of the guide plate (72) located in the sliding groove on the support plate (71) is connected to a connecting piece (73) extending straight above the support plate (71). A bolt (74) perpendicular to the support plate (71) and capable of contacting the top of the support plate (71) is threadedly connected to the connecting piece (73).

5. The integrated circuit chip processing device according to claim 4, characterized in that: A support frame (8) is mounted on the top of the base (1), and the support frame (8) is located between the conveyor A (2) and the conveyor B (3). The welding mechanism (9) comprises a cylinder (91), a mounting seat (92) and a multi-axis welding machine (93). The top of the support frame (8) is provided with a cylinder (91) with a free end vertically downwardly arranged, the free end of the cylinder (91) extends to the inner side of the support frame (8) and is fixedly connected to the mounting seat (92), and the bottom of the mounting seat (92) is provided with a multi-axis welding machine (93), and the multi-axis welding machine (93) is located directly above the return support bracket (5).

6. The integrated circuit chip processing device according to claim 5, characterized in that: A horizontally arranged support (10) is fixedly installed at the side of the conveyor B (3), and a mechanical arm (11) is arranged on the support (10).

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