A gripping mechanism compatible with multi-size wafer boxes

Abstract

The utility model provides a gripping mechanism compatible with wafer boxes of multiple sizes, which is arranged on a robot and includes a connecting crossbeam, which is arranged on the robot's mechanical arm, and a clamping structure is arranged at both ends of the connecting crossbeam, and at least one set of gripping guide blocks is arranged on the clamping structure. The beneficial effect of the utility model is that by setting a double clamping structure, two tasks of one picking and one putting can be completed in one handling process, the continuity of the unloading and loading processes is achieved, and the work efficiency is improved. When the gripping stroke is consistent, the gripping of wafer boxes of multiple sizes can be achieved, and the structure is simple and easy to use.

Description

Technical Field

[0001] The utility model belongs to the technical field of automatic wafer box transportation, and in particular relates to a grabbing mechanism compatible with wafer boxes of multiple sizes. Background Art

[0002] In the existing single crystal silicon wafer production workshop, wafer boxes are the main carriers of wafers in the substrate factory and are widely used in various process equipment. The automatic handling of wafer boxes is the core of realizing the automation of the whole factory. In order to ensure the quality and integrity of the wafers, a handling robot is usually used. The grasping mechanism set on the robot usually has only one clamping claw structure, which can only complete the handling of one wafer box at a time. It can only load or unload materials during one handling process. In addition, when the grasping stroke is consistent, it can only complete the handling of wafer boxes of the same specification. It is not compatible with wafer boxes of various sizes, and the work efficiency is low. Utility Model Content

[0003] In order to solve the above technical problems, the utility model provides a gripping mechanism compatible with wafer boxes of multiple sizes, which effectively solves the problems of low efficiency in wafer box handling and incompatibility with wafer boxes of multiple sizes, and overcomes the shortcomings of the prior art.

[0004] The technical solution adopted by the utility model is: a grasping mechanism compatible with multi-size wafer boxes, which is arranged on a robot and includes a connecting beam, which is arranged on the mechanical arm of the robot, and claw structures are provided at both ends of the connecting beam, and at least one group of grasping guide blocks are provided on the claw structure.

[0005] Further, the clamping jaw structure includes:

[0006] A driving device, arranged at the end of the connecting beam;

[0007] The clamping jaws are arranged opposite to each other and are arranged on the driving device. The clamping side of the clamping jaws is provided with the grabbing guide block. The driving device can drive the clamping jaws to open and close.

[0008] Furthermore, the driving device is provided with a connecting plate, and the clamping claw is provided on the connecting plate.

[0009] Furthermore, the grabbing guide blocks are provided in a plurality of groups and are arranged along the length direction of the clamping jaws for clamping wafer boxes of different sizes.

[0010] Furthermore, a stepped groove is provided on the clamping side of the clamping jaw, which is arranged along the length direction of the clamping jaw and is used to set the grabbing guide block.

[0011] Furthermore, a pair of stoppers are provided on one side of the clamping jaws, the stoppers are arranged on a mounting base of the driving device, and the stoppers are located on the outer side of the side wall of the wafer box.

[0012] Furthermore, a detection sensor is provided at the bottom of the clamping jaw for detecting the position of the wafer box.

[0013] Furthermore, a connecting beam is provided on the connecting crossbeam, and the connecting beam is connected to the mechanical arm.

[0014] Furthermore, a mounting flange is provided at one end of the connecting beam close to the mechanical arm, and the mounting flange is connected to the mechanical arm.

[0015] Furthermore, a connecting piece is provided between the connecting cross beam and the connecting beam.

[0016] The advantages and positive effects of the utility model are as follows: due to the adoption of the above technical scheme, by setting up a double-claw structure, two tasks of one picking up and one placing can be completed during one transportation process, the continuity of the unloading and loading processes can be achieved, and the work efficiency is improved. When the grasping stroke is consistent, the grasping of wafer boxes of various sizes can be achieved, the structure is simple, and it is easy to use. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the installation of a grabbing mechanism compatible with wafer boxes of multiple sizes according to an embodiment of the utility model.

[0018] Figure 2 It is a schematic diagram of a gripping mechanism clamping method compatible with wafer boxes of multiple sizes according to an embodiment of the utility model.

[0019] Figure 3 It is a schematic diagram of the structure of the gripping mechanism claws of an embodiment of the utility model that is compatible with wafer boxes of multiple sizes.

[0020] In the figure:

[0021] 1. Connecting beam 2. Driving device 3. Gripping jaws

[0022] 4. First connecting plate 5. First grabbing guide block 6. Second grabbing guide block

[0023] 7. Third grab guide block 8. First step groove 9. Second step groove

[0024] 10. third stepped groove 11. stopper 12. second connecting plate

[0025] 13. Detection sensor 14. Connecting beam 15. Connecting piece

[0026] 16. Mounting flange 17. Robot 18. Robotic arm

[0027] 19. Wafer box DETAILED DESCRIPTION

[0028] An embodiment of the utility model provides a gripping mechanism compatible with wafer boxes of multiple sizes. The embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0029] In the description of the embodiments of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "set" and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected, or indirectly connected through an intermediate medium, or it can be a connection between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood by specific circumstances.

[0030] like Figure 1-3 As shown, the embodiment of the utility model is a gripping mechanism compatible with multi-size wafer boxes, which is arranged on a robot 17 and includes a connecting crossbeam 1, which is arranged on a mechanical arm 18 of the robot 17, and a clamping structure is provided at both ends of the connecting crossbeam 1, and at least one set of gripping guide blocks is provided on the clamping structure. It is more convenient to clamp the wafer box 19 by setting the gripping guide block, and the gripping guide block can be inserted into the groove at the top of the wafer box 19. In this embodiment, the robot 17 is a six-axis robot, and by setting a double gripping structure, the six-axis robot 17 can complete two tasks of one taking and one putting of the wafer box 19 at a time. For example, when loading, the six-axis robot 17 can clamp the wafer box 19 loaded with unprocessed wafers to the processing equipment through one of the gripping structures, and the other vacant gripping structure can first clamp the wafer box loaded with processed wafers on the processing equipment for unloading, and then load the material, completing the two tasks of one taking and one putting, thereby maintaining the continuity of the process, saving working time, and improving work efficiency.

[0031] Specifically, the clamping jaw structure includes a driving device 2 and a clamping jaw 3 that is arranged oppositely. The driving device 2 is arranged at the end of the connecting beam 1. The clamping jaw 3 that is arranged oppositely is arranged on the driving device 2, and the clamping side of the clamping jaw 3, that is, the opposite side, is provided with a grabbing guide block, and the driving device 2 can drive the clamping jaw 3 to open and close. The specific form of the driving device 2 is not limited. In this embodiment, the driving device 2 is a double-acting guide rod cylinder, that is, the two ends of the cylinder are movable ends, and the clamping jaw 3 is relatively arranged on the movable end, and the movable end can open and close the clamping jaw 3.

[0032] In order to facilitate the connection of the clamping jaw 3, the driving device 2 is provided with a first connecting plate 4 for mounting the clamping jaw 3. In this embodiment, the first connecting plates 4 are relatively fixed on the movable ends at both ends of the driving device 2, and the clamping jaw 3 is provided on the first connecting plate 4. The first connecting plate 4 and the clamping jaw 3 can be provided as one piece, or can be provided separately and fixedly connected.

[0033] Preferably, under the premise that the stroke of the driving device 2 is consistent, in order to enable the clamping jaws 3 to clamp wafer boxes 19 of various sizes, a plurality of groups of grabbing guide blocks are provided on the clamping jaws 3. In the present embodiment, three groups of grabbing guide blocks are provided on the clamping jaws 3, which are arranged along the length direction of the clamping jaws 3. The first grabbing guide block 5 close to the connecting plate is used to grab a 5-inch wafer box, the second grabbing guide block 6 in the middle is used to grab a 6-inch wafer box, and the third grabbing guide block 7 at the bottom of the clamping jaws 3 is used to grab an 8-inch wafer box. There is no restriction on the shape of the grabbing guide blocks. In the present embodiment, the first grabbing guide block 5 and the second grabbing guide block 6 are L-shaped, and the third grabbing guide block 7 is a rectangular protrusion.

[0034] Preferably, in order to facilitate the installation of the grab guide block, a stepped groove is provided on the clamping side of the clamping jaw 3, which is arranged along the length direction of the clamping jaw 3. In this embodiment, the first-level stepped groove 8 close to the connecting plate is used to install the first grab guide block 5, the middle second-level stepped groove 9 is used to install the second grab guide block 6, and the third-level stepped groove 10 at the bottom of the clamping jaw 3 is used to install the third grab guide block 7.

[0035] Preferably, in order to prevent the clamping jaws 3 from touching the side wall of the wafer box 19 and bringing the wafer box 19 down when releasing the side wall of the wafer box 19, a pair of stoppers 11 are provided on one side of the clamping jaws 3, and the stoppers 11 are arranged on the mounting base of the driving device 2 and located on the outside of the side wall of the wafer box 19. In this embodiment, a second connecting plate 12 is fixed on the mounting base of the driving device 2, and oppositely arranged stoppers 11 are fixed at both ends of the second connecting plate 12. The stoppers are arranged on one side of the clamping jaws 3. When the clamping jaws 3 clamp the wafer box 19, the stoppers 11 are located on the outside of the side wall of the wafer box 19. When the clamping jaws 3 release the wafer box 19 and touch the side wall of the wafer box 19, and the wafer box 19 falls toward one side of the side wall, the stoppers 11 located on the side can play a certain supporting role for the wafer box 19. The setting of the distance between the stoppers 11 should be careful not to affect the clamping of the wafer box 19 by the clamping jaws 3. When the clamping jaws 3 need to clamp wafer boxes 19 of various sizes, the distance between the stoppers 11 needs to be set according to the wafer box 19 of the largest size.

[0036] Preferably, a detection sensor 13 is provided at the bottom of the clamping jaws 3 for detecting the position of the wafer box 19. In this embodiment, the detection sensor 13 is a through-beam sensor installed at the bottom of the clamping jaws 3. When the light of the through-beam sensor is blocked by the wafer box 19, it indicates that the wafer box 19 is between the two clamping jaws 3, and the wafer box 19 can be clamped at this time.

[0037] Preferably, a connecting beam 14 is provided on the connecting beam 1, and the connecting beam 14 is connected to the mechanical arm 18. In this embodiment, in order to facilitate the installation of the connecting beam 1 on the mechanical arm 18, a connecting beam 14 is vertically provided in the middle of the mechanical arm 18, and the connecting beam 14 is fixedly connected to the connecting beam 1. One end of the connecting beam 14 away from the connecting beam 1 is connected to the mechanical arm 18.

[0038] Specifically, a connecting member 15 is provided between the connecting beam 1 and the connecting beam 14. In this embodiment, triangular connecting members 15 are symmetrically provided on both sides of one end of the connecting beam 14 close to the connecting beam 1, which play both a connecting role and a reinforcing role.

[0039] Specifically, a mounting flange 16 is fixed to one end of the connecting beam 14 close to the mechanical arm 18 , and the mounting flange 16 is fixedly connected to the end of the mechanical arm 18 .

[0040] The advantages and positive effects of the utility model are:

[0041] 1. By setting up a double-claw structure, two tasks of picking up and placing can be completed in one handling process, realizing the continuity of unloading and loading processes and improving work efficiency;

[0042] 2. Under the condition of consistent grabbing stroke, it can realize the grabbing of wafer boxes of various sizes, with simple structure and convenient use;

[0043] 3. By setting a stopper, the wafer box is prevented from tipping over, reducing the damage to the wafer.

[0044] The above is a detailed description of the embodiments of the utility model, but the contents are only preferred embodiments of the utility model and cannot be considered to limit the scope of implementation of the utility model. All equivalent changes and improvements made within the scope of application of the utility model should still fall within the scope of the patent coverage of the utility model.

Claims

1. A gripping mechanism compatible with multi-size wafer boxes, arranged on a robot, characterized in that: It comprises a connecting crossbeam which is arranged on the mechanical arm of the robot. Both ends of the connecting crossbeam are provided with clamping claw structures, and the clamping claw structures are provided with at least one group of grabbing guide blocks.

2. The gripping mechanism compatible with multi-size wafer boxes according to claim 1, characterized in that: The clamping jaw structure comprises: A driving device, arranged at the end of the connecting beam; The clamping jaws are arranged opposite to each other and are arranged on the driving device. The clamping side of the clamping jaws is provided with the grabbing guide block. The driving device can drive the clamping jaws to open and close.

3. The gripping mechanism compatible with multi-size wafer boxes according to claim 2, characterized in that: The driving device is provided with a connecting plate, and the connecting plate is provided with the clamping claw.

4. The gripping mechanism compatible with multi-size wafer boxes according to claim 3, characterized in that: The number of the grabbing guide blocks is multiple and they are arranged along the length direction of the clamping jaws for clamping wafer boxes of different sizes.

5. The gripping mechanism compatible with multi-size wafer boxes according to claim 4, characterized in that: The clamping side of the clamping jaw is provided with a stepped groove, which is arranged along the length direction of the clamping jaw and is used to set the grabbing guide block.

6. A gripping mechanism compatible with multi-size wafer boxes according to any one of claims 2 to 5, characterized in that: One side of the clamping jaw is provided with a pair of stoppers, the stoppers are arranged on the mounting base of the driving device, and the stoppers are located on the outer side of the side wall of the wafer box.

7. The gripping mechanism compatible with multi-size wafer boxes according to claim 6, characterized in that: A detection sensor is provided at the bottom of the clamping jaw for detecting the position of the wafer box.

8. A gripping mechanism compatible with multi-size wafer boxes according to any one of claims 1-5 and 7, characterized in that: A connecting beam is provided on the connecting crossbeam, and the connecting beam is connected to the mechanical arm.

9. The gripping mechanism compatible with multi-size wafer boxes according to claim 8, characterized in that: A mounting flange is provided at one end of the connecting beam close to the mechanical arm, and the mounting flange is connected to the mechanical arm.

10. The gripping mechanism compatible with multi-size wafer boxes according to claim 8, characterized in that: A connecting piece is provided between the connecting cross beam and the connecting beam.

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