A semiconductor chip test socket

Abstract

A semiconductor chip test seat, a semiconductor chip test seat, comprises a test seat body, a pushing structure and a pressurizing structure. The utility model relates to the technical field of chip test seats, wherein a test slot is provided in the middle of the top of the test seat body, pin slots are provided on both the left and right sides of the lower end of the test slot, and a T-shaped placement slot is provided in the middle of the lower end of the test slot; the device realizes the rapid removal of the semiconductor chip through the pushing structure, and the staff does not need to use tweezers or take the chip out of the test slot with bare hands, thereby reducing human errors and the time cost of manual operation; the device completes the pressurizing operation of the semiconductor chip through the pressurizing structure, ensures that the contact between the chip and the test seat body is firm and stable, and effectively dissipates the heat generated during the chip test process through the ventilation pipe; the device effectively closes the test slot through the setting of the connection box and the box door to prevent external debris or dust from entering.

Description

Technical Field

[0001] The utility model relates to the technical field of chip test sockets, in particular to a semiconductor chip test socket. Background Art

[0002] A semiconductor chip is an integrated circuit, usually made of semiconductor materials such as silicon, used to integrate a variety of electronic components such as transistors, resistors, capacitors, etc. in a tiny space. These components are connected together through tiny circuits to form a fully functional electronic device. Semiconductor chips are widely used in electronic devices such as computers, mobile phones, tablets, automotive electronic systems, communication equipment, etc., and are the core components of modern electronic technology. A semiconductor chip test socket is a device used to test and evaluate the performance of semiconductor chips. It usually consists of a socket and related circuits for inserting and connecting the chip to the test equipment or test system.

[0003] When testing an existing semiconductor chip test socket, it is necessary to place the semiconductor chip in a test slot and insert the chip pins into the pin slots. When the semiconductor chip needs to be taken out after the test, the staff usually needs to use tweezers or take the chip out of the test slot by hand, which is inconvenient. To solve the above problems, a semiconductor chip test socket is proposed in the present application. Utility Model Content

[0004] The utility model provides a semiconductor chip test socket to solve the technical problems existing in the background technology.

[0005] In order to solve the above problems, the utility model proposes a semiconductor chip test seat, a semiconductor chip test seat, comprising a test seat body, a pushing structure and a pressurizing structure, characterized in that a test slot is opened in the middle of the top of the test seat body, pin slots are opened on the left and right sides of the lower end of the test slot, a T-shaped placement slot is opened in the middle of the lower end of the test slot, a push plate is arranged inside the T-shaped placement slot, a pushing structure is arranged inside the test seat body, a connecting box is arranged at the upper end of the test seat body, and a pressurizing structure is arranged inside the connecting box. The pushing structure comprises positive and negative screw rods, a first guide rod, a first threaded sleeve, a first movable block, a linkage rod, a second movable block and a top plate. The positive and negative screw rods are arranged on the lower side of the test seat body, the first guide rod is arranged at the right end of the test seat body and located at the lower side of the positive and negative screw rods, the first threaded sleeves are threadedly connected on the left and right sides of the positive and negative screw rods, the first movable block is arranged on the upper end of the first threaded sleeve, the first movable block is rotatably connected with the linkage rod, the other end of the linkage rod is rotatably connected with the second movable block, and the top plate is arranged on the upper end of the second movable block.

[0006] Preferably, the pressurizing structure includes a threaded rod, a second guide rod, a second threaded sleeve, an inverted T-shaped pressure plate and a ventilation pipe, and a silicone pad. A threaded rod is arranged on the left side of the top inner part of the connecting box, a second guide rod is arranged on the right side of the top inner part of the connecting box, a second threaded sleeve is threadedly connected to the threaded rod, an inverted T-shaped pressure plate is arranged in the middle of the lower end of the second threaded sleeve, and a ventilation pipe is arranged inside the inverted T-shaped pressure plate, and a silicone pad is arranged in the middle of the lower end of the ventilation pipe.

[0007] Preferably, a protruding frame is provided in the middle of the top of the test seat body, and tension springs are provided on both the left and right sides of the bottom of the protruding frame, and the upper end of the tension spring is connected to the push plate.

[0008] Preferably, a connecting plate is provided in the middle of the lower end of the push plate, the top plate is U-shaped, and the connecting plate is slidably connected to the top plate.

[0009] Preferably, a second bevel gear is arranged on the left side of the outside of the forward and reverse screw rods, and the lower end of the threaded rod passes through the inside of the test seat body where a first bevel gear is arranged, and the first bevel gear is meshedly connected with the second bevel gear.

[0010] Preferably, an installation box is arranged on the left side of the upper end of the connection box, a motor is arranged inside the installation box, and the upper end of the threaded rod passes through the connection box and is connected to the output end of the motor.

[0011] Preferably, a box door is hinged at the front end of the connection box, a glass window is arranged inside the box door, and a handle is arranged on the left side of the front end of the box door.

[0012] The above technical solution of the utility model has the following beneficial technical effects:

[0013] 1. The device realizes the rapid removal of semiconductor chips by setting a pushing structure. The two first movable blocks are driven to approach each other by the rotation of the positive and negative screw rods. With the help of the mutual cooperation of the first movable block, the linkage rod and the second movable block, the U-shaped top plate is driven to move upward. When the top plate moves to abut against the connecting plate, it will push the connecting plate, the pushing plate and the semiconductor chip upward to remove the semiconductor chip from the inside of the test slot. The staff does not need to use tweezers or take the chip out of the test slot with bare hands, which reduces human errors and reduces the time cost of manual operation.

[0014] 2. This device completes the pressurization operation of the semiconductor chip by setting up a pressurization structure. The motor drives the threaded rod to rotate, and then drives the second threaded sleeve and the inverted T-shaped pressure plate to move downward, so that the silicone pad contacts the semiconductor chip and applies appropriate force to ensure that the contact between the chip and the test seat body is firm and stable. The heat generated during the chip test can be effectively dissipated by setting up a ventilation pipe to prevent the chip from overheating and affecting the test results.

[0015] 3. With the help of the mutual cooperation of the first bevel gear and the second bevel gear, the device drives the top plate to move downward when the threaded rod drives the inverted T-shaped pressure plate to move downward. During this process, the push plate is firmly fixed in the T-shaped placement groove under the action of two tension springs. When the inverted T-shaped pressure plate moves upward after being pressurized, the forward and reverse screws drive the top plate to push the push plate and the semiconductor chip upward. The tester only needs to operate a part of the mechanical device to complete the removal of the semiconductor chip, without the need for additional tools or complicated operations, which simplifies the operation process and improves the convenience of operation.

[0016] 4. This device can effectively seal the test slot by connecting the box, the box door and the glass window to prevent external debris or dust from entering, thereby protecting the test seat body and the semiconductor chip therein from contamination or damage. Through the setting of the glass window, the operator can clearly observe the situation inside the test slot from the outside, monitor the test process and discover abnormal situations in time. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The present invention is a three-dimensional diagram of a semiconductor chip test socket.

[0018] Figure 2 The present invention is a schematic structural diagram of a semiconductor chip test socket.

[0019] Figure 3 This is an enlarged view of A in a semiconductor chip test socket proposed by the utility model.

[0020] Figure 4 This is an enlarged view of B in a semiconductor chip test socket proposed by the utility model.

[0021] 1. Test socket body; 2. Test slot; 3. Pin slot; 4. T-shaped placement slot; 5. Protruding frame; 6. Tension spring; 7. Push plate; 8. Connecting plate; 9. Forward and reverse screw rods; 10. First guide rod; 11. First threaded sleeve; 12. First movable block; 13. Linking rod; 14. Second movable block; 15. Top plate; 16. Connecting box; 17. Threaded rod; 18. Installation box; 19. Motor; 20. Second guide rod; 21. Second threaded sleeve; 22. Inverted T-shaped pressure plate; 23. Ventilation duct; 24. Silicone pad; 25. Box door; 26. Glass window; 27. Handle; 28. First bevel gear; 29. ​​Second bevel gear. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be understood that these descriptions are only exemplary and are not intended to limit the scope of the utility model. In addition, in the following description, the description of well-known structures and technologies is omitted to avoid unnecessary confusion of the concept of the utility model.

[0023] like Figure 1-4 As shown, a semiconductor chip test seat proposed by the utility model includes a test seat body 1, a pushing structure and a pressurizing structure, characterized in that a test slot 2 is opened in the middle of the top of the test seat body 1, pin slots 3 are opened on both sides of the lower end of the test slot 2, a T-shaped placement slot 4 is opened in the middle of the lower end of the test slot 2, a push plate 7 is arranged inside the T-shaped placement slot 4, a pushing structure is arranged inside the test seat body 1, a connection box 16 is arranged at the upper end of the test seat body 1, and a pressurizing structure is arranged inside the connection box 16, and the pushing structure includes positive and negative screw rods 9, a first guide rod 10, a first threaded sleeve 11, a first movable block 12, and a linkage Rod 13, second movable block 14 and top plate 15, the lower side of the inner part of the test seat body 1 is provided with forward and reverse screw rods 9, the right end of the inner part of the test seat body 1 and the lower side of the forward and reverse screw rods 9 is provided with a first guide rod 10, the left and right sides of the forward and reverse screw rods 9 are both threadedly connected with the first threaded sleeve 11, the upper end of the first threaded sleeve 11 is provided with a first movable block 12, the first movable block 12 is rotatably connected with a linkage rod 13, the other end of the linkage rod 13 is rotatably connected with the second movable block 14, the upper end of the second movable block 14 is provided with a top plate 15, the middle part of the lower end of the push plate 7 is provided with a connecting plate 8, the top plate 15 is U-shaped, and the connecting plate 8 is slidably connected with the top plate 15.

[0024] In an optional embodiment, the pressurizing structure includes a threaded rod 17, a second guide rod 20, a second threaded sleeve 21, an inverted T-shaped pressure plate 22, a ventilation pipe 23, and a silicone pad 24. The threaded rod 17 is arranged on the left side of the top end of the connecting box 16, and the second guide rod 20 is arranged on the right side of the top end of the connecting box 16. The second threaded sleeve 21 is threadedly connected to the threaded rod 17, and an inverted T-shaped pressure plate 22 is arranged in the middle of the lower end of the second threaded sleeve 21, and a ventilation pipe 23 is arranged inside the inverted T-shaped pressure plate 22, and a silicone pad 24 is arranged in the middle of the lower end of the ventilation pipe 23. A protruding frame 5 is arranged in the middle of the top end of the test seat body 1, and tension springs 6 are arranged on the left and right sides of the bottom end of the protruding frame 5. The upper end of the tension spring 6 is connected to the push plate 7. An installation box 18 is arranged on the left side of the upper end of the connecting box 16, and a motor 19 is arranged inside the installation box 18. The upper end of the threaded rod 17 passes through the connecting box 16 and is connected to the output end of the motor 19.

[0025] In an optional embodiment, a second bevel gear 29 is provided on the left side of the outer side of the forward and reverse screw rods 9 , and the lower end of the threaded rod 17 passes through the test seat body 1 and a first bevel gear 28 is provided inside, and the first bevel gear 28 is meshed and connected with the second bevel gear 29 .

[0026] In an optional embodiment, a box door 25 is hinged at the front end of the connection box 16 , and a glass window 26 is arranged inside the box door 25 . A handle 27 is arranged on the left side of the front end of the box door 25 .

[0027] The working principle of the utility model is as follows: when in use, a semiconductor chip is placed in the test slot 2, the chip pin is inserted into the pin slot 3, and then the motor 19 is started, the threaded rod 17 is driven to rotate by the motor 19, and then the second threaded sleeve 21 and the inverted T-shaped pressing plate 22 are driven to move downward, the silicone pad 24 is brought into contact with the semiconductor chip and appropriate force is applied to ensure that the contact between the chip and the test seat body 1 is firm and stable, and the heat generated during the chip test process can be effectively dissipated through the setting of the ventilation pipe 23 to prevent the chip from overheating and affecting the test results, and the first bevel gear 28 and the second bevel gear 29 cooperate with each other. In the process of the threaded rod 17 driving the inverted T-shaped pressing plate 22 to move downward, the two first threaded sleeves 11 are driven to approach each other through the rotation of the positive and negative screw rods, and then the two first movable blocks 12 are driven to approach each other. With the help of the mutual cooperation of the first movable block 12, the linkage rod 13 and the second movable block 14, the U-shaped top plate 15 is driven to move upward. When the top plate 15 moves to abut against the connecting plate 8, it will push the connecting plate 8, the push plate 7 and The semiconductor chip moves upward and is removed from the test slot 2. The staff does not need to use tweezers or take the chip out of the test slot 2 with their bare hands, which reduces human errors and the time cost of manual operation. In this process, the push plate 7 is firmly fixed in the T-shaped placement slot 4 under the action of two tension springs 6. After the inverted T-shaped pressure plate 22 is pressurized and moves upward, the positive and negative screws 9 will drive the top plate 15 to move upward, thereby pushing the push plate 7 and the semiconductor chip upward. The tester only needs to operate a part of the mechanical device to complete the removal of the semiconductor chip. No additional tools or complicated operations are required, which simplifies the operation process and improves the convenience of operation. In addition, the device can effectively close the test slot 2 by connecting the box 16, the box door 25 and the glass window 26 to prevent external debris or dust from entering, thereby protecting the test seat body 1 and the semiconductor chip therein from contamination or damage. Through the setting of the glass window 26, the operator can clearly observe the situation inside the test slot 2 from the outside, monitor the test process and detect abnormal conditions in time.

[0028] It should be understood that the above specific embodiments of the present invention are used to illustrate or explain the principles of the present invention, and do not constitute a limitation on the present invention. Therefore, any modifications, equivalent substitutions, improvements, etc. made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. In addition, the claims attached to the present invention are intended to cover all changes and modifications that fall within the scope and boundaries of the attached claims, or the equivalent forms of such scope and boundaries.

Claims

1. A semiconductor chip test socket, comprising a test socket body (1), a pushing structure and a pressurizing structure, characterized in that: A test slot (2) is provided in the middle of the top of the test seat body (1), pin slots (3) are provided on both the left and right sides of the lower end of the test slot (2), a T-shaped placement slot (4) is provided in the middle of the lower end of the test slot (2), a push plate (7) is provided inside the T-shaped placement slot (4), a pushing structure is provided inside the test seat body (1), a connection box (16) is provided at the upper end of the test seat body (1), and a pressurizing structure is provided inside the connection box (16); The pushing structure comprises a forward and reverse screw rod (9), a first guide rod (10), a first threaded sleeve (11), a first movable block (12), a linkage rod (13), a second movable block (14) and a top plate (15); the forward and reverse screw rod (9) is arranged at the lower side of the interior of the test seat body (1); the first guide rod (10) is arranged at the right end of the interior of the test seat body (1) and located at the lower side of the forward and reverse screw rod (9); the first threaded sleeve (11) is threadedly connected to the left and right sides of the forward and reverse screw rod (9); the first movable block (12) is arranged at the upper end of the first threaded sleeve (11); the first movable block (12) is rotatably connected to the linkage rod (13); the other end of the linkage rod (13) is rotatably connected to the second movable block (14); and the top plate (15) is arranged at the upper end of the second movable block (14).

2. A semiconductor chip test socket according to claim 1, characterized in that: The pressurizing structure comprises a threaded rod (17), a second guide rod (20), a second threaded sleeve (21), an inverted T-shaped pressure plate (22), a ventilation pipe (23), and a silicone pad (24); the threaded rod (17) is arranged on the left side of the top end inside the connection box (16); the second guide rod (20) is arranged on the right side of the top end inside the connection box (16); the threaded rod (17) is threadedly connected with the second threaded sleeve (21); an inverted T-shaped pressure plate (22) is arranged in the middle of the lower end of the second threaded sleeve (21); the ventilation pipe (23) is arranged inside the inverted T-shaped pressure plate (22); and the silicone pad (24) is arranged in the middle of the lower end of the ventilation pipe (23).

3. A semiconductor chip test socket according to claim 1, characterized in that: A protruding frame (5) is arranged in the middle of the top of the test seat body (1), and tension springs (6) are arranged on both sides of the bottom of the protruding frame (5), and the upper end of the tension spring (6) is connected to the push plate (7).

4. A semiconductor chip test socket according to claim 1, characterized in that: A connecting plate (8) is provided in the middle of the lower end of the push plate (7), the top plate (15) is in a U-shape, and the connecting plate (8) is slidably connected to the top plate (15).

5. The semiconductor chip test socket according to claim 1, characterized in that: A second bevel gear (29) is arranged on the left side of the outside of the forward and reverse screw rods (9), and the lower end of the threaded rod (17) passes through the inside of the test seat body (1) and a first bevel gear (28) is arranged, and the first bevel gear (28) is meshedly connected with the second bevel gear (29).

6. The semiconductor chip test socket according to claim 1, characterized in that: An installation box (18) is arranged on the left side of the upper end of the connection box (16), a motor (19) is arranged inside the installation box (18), and the upper end of the threaded rod (17) passes through the connection box (16) and is connected to the output end of the motor (19).

7. The semiconductor chip test socket according to claim 1, characterized in that: The front end of the connection box (16) is hinged with a box door (25), and a glass window (26) is arranged inside the box door (25). A handle (27) is arranged on the left side of the front end of the box door (25).

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