A multilayer ceramic capacitor

Abstract

The utility model relates to the technical field of capacitors, and discloses a laminated ceramic capacitor, including a chassis and a lower laminated ceramic dielectric, wherein a first metal electrode layer is arranged at the bottom of the lower laminated ceramic dielectric, a second metal electrode layer is arranged at the top of the lower laminated ceramic dielectric, a third metal electrode layer is arranged at the top of the upper laminated ceramic dielectric, and a fourth metal electrode layer is arranged at the top of the upper laminated ceramic dielectric. The laminated ceramic capacitor is provided with an upper laminated ceramic dielectric laterally arranged on the top of the lower laminated ceramic dielectric, wherein the first metal electrode layer, the second metal electrode layer, the third metal electrode layer and the fourth metal electrode layer are all thin films of copper, silver or gold materials, and the upper laminated ceramic dielectric and the lower laminated ceramic dielectric are both horizontal circular sheets, and these components can improve the conductivity and temperature stability of the electrode layer when they are attached and contacted to each other, and well solve the problem of limited capacitance of single-layer ceramic capacitors.

Description

Technical Field

[0001] The utility model relates to the technical field of capacitors, in particular to a multilayer ceramic capacitor. Background Art

[0002] At present, ceramic dielectric capacitors account for about 70% of the capacitor market and have become an indispensable component in electronic equipment. They mainly include single-layer ceramic capacitors and multilayer ceramic capacitors. Single-layer ceramic capacitors have good high-frequency characteristics and a capacity range from 0.05pF to 10000pF, while the capacity range of multilayer ceramic capacitors is wider than that of single-layer capacitors.

[0003] Single-layer capacitors and multilayer ceramic capacitors made of the same dielectric material have almost no obvious differences except for the size of capacitance, capacitance, and rated working voltage; the SMD packaging of single-layer ceramic capacitors can only meet horizontal assembly requirements; traditional plug-in packaging can only meet vertical assembly requirements, but its size is large and inconvenient to assemble; today, most of the multilayer ceramic capacitors circulating on the market can only meet one assembly requirement, which is very limited.

[0004] Now, a new type of multilayer ceramic capacitor is proposed to solve the above problems. Utility Model Content

[0005] The utility model aims to provide a multilayer ceramic capacitor to solve the problem of limited capacitance of a single-layer ceramic capacitor mentioned in the background art.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a laminated ceramic capacitor, comprising a chassis and a lower laminated ceramic dielectric, wherein the lower laminated ceramic dielectric is arranged inside the chassis, and an upper laminated ceramic dielectric is arranged laterally on the top of the lower laminated ceramic dielectric, a first metal electrode layer is arranged at the bottom of the lower laminated ceramic dielectric, a second metal electrode layer is arranged on the top of the lower laminated ceramic dielectric, a third metal electrode layer is arranged on the top of the upper laminated ceramic dielectric, and a fourth metal electrode layer is arranged on the top of the upper laminated ceramic dielectric, a connecting portion B is arranged at the center between the lower laminated ceramic dielectric and the upper laminated ceramic dielectric, and a first extension portion is fixed to one side of the connecting portion B, a connecting portion A is attached to the center of the top of the upper laminated ceramic dielectric, and a connecting portion C is attached to the center of the bottom of the lower laminated ceramic dielectric.

[0007] Furthermore, the diameters of the lower laminated ceramic dielectric and the upper laminated ceramic dielectric are equal, and the second metal electrode layer and the fourth metal electrode layer are respectively attached to the connecting portion B.

[0008] Furthermore, the lower laminated ceramic dielectric and the upper laminated ceramic dielectric are sandwiched between the connecting portion A, the connecting portion B and the connecting portion C, and the connecting portion A and the connecting portion C are symmetrically arranged at the top and bottom of the connecting portion B.

[0009] Preferably, a third extension portion is fixed to one side of the connection portion A, and a jumper is fixedly connected to the bottom of the third extension portion, a welding part is fixed below the jumper, a second extension portion is fixed to one side of the connection portion C, and a rear metal pin is fixed to one side of the second extension portion, a front metal pin is fixed to one side of the connection portion B, and welding portions are fixed to the bottoms of the rear metal pin and the front metal pin.

[0010] Furthermore, the front metal pin and the rear metal pin are electrically connected to the first metal electrode layer and the second metal electrode layer respectively.

[0011] Furthermore, the rear metal pin and the jumper are electrically connected to the third metal electrode layer and the fourth metal electrode layer respectively, and the front metal pin is connected in parallel with the jumper.

[0012] Preferably, a shell is arranged around the top of the chassis, and a top cover is arranged transversely on the top of the shell, and slots are arranged at both the front and rear ends of the right side of the bottom of the chassis.

[0013] Furthermore, the chassis and the top cover are symmetrically fixed at the upper and lower positions of the shell, and the chassis, the top cover and the shell are in the same vertical plane.

[0014] Compared with the prior art, the utility model has the following beneficial effects: the multilayer ceramic capacitor not only realizes the enrichment of the functions of the ceramic capacitor, realizes the stability of the internal structure, but also realizes the convenience of disassembly and installation;

[0015] (1) By arranging an upper laminated ceramic dielectric laterally on top of the lower laminated ceramic dielectric, the second extension part and the third extension part are both in the shape of a plate, and the first extension part connected to the rear metal pin and the jumper wire is also in the shape of a plate, it is convenient to perform maintenance and testing through the various extension parts protruding from the plastic package body, and there is a gap between these components and the plastic package body, which can further form air convection and enhance the heat dissipation effect; in addition, in some special occasions, welding is not required, and a simple electrical connection can be conveniently performed by passing the wire through the gap for twisting;

[0016] The first metal electrode layer, the second metal electrode layer, the third metal electrode layer and the fourth metal electrode layer are all thin films of copper, silver or gold, and are all welded and fixed on the surface of the upper laminated ceramic dielectric and the lower laminated ceramic dielectric. The upper laminated ceramic dielectric and the lower laminated ceramic dielectric are both horizontal circular thin sheets. When these components are attached and contacted to each other, the conductivity and temperature stability of the electrode layer can be improved, and the capacitance of the capacitor can be further improved, so that the application range of the capacitor is wider;

[0017] (2) By fixing a third extension part on one side of the connection part A, the side of the connection part A is fixedly connected through the third extension part, the jumper, the welding part and the front metal pin, and the connection part B is fixedly connected to the rear metal pin through the first extension part, and the connection part C and the second extension part at the bottom can be symmetrically attached between the upper laminated ceramic dielectric and the lower laminated ceramic dielectric to form a stable structure between the chassis and the shell, thereby preventing the loosening and displacement of various accessories;

[0018] (3) A shell is arranged around the top of the chassis, and the shell can be longitudinally inserted around the outer side of the top of the chassis. The top cover of the shell and the shell together form a metal mold cavity, which can be directly pressed onto the chassis by equipment for locking and fixing. The two are inseparable, thereby sealing the capacitor, and the inner walls of the shell and the top cover are filled with epoxy resin for shaping and reinforcement. The two sets of grooves on the right side of the chassis can accommodate the welding parts of the front metal pins and the rear metal pins, which will not affect the assembly and connection of the device and can also carefully protect the ceramic structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a front view structural schematic diagram of the utility model;

[0020] Figure 2 It is a rear cross-sectional structural schematic diagram of the utility model;

[0021] Figure 3 This is a schematic diagram of the three-dimensional structure of the chassis of the utility model from top view;

[0022] Figure 4 This is a schematic diagram of the front view structure of the housing of the utility model;

[0023] Figure 5 This is a bottom-up three-dimensional structural schematic diagram of the utility model;

[0024] Figure 6 It is a top view of the three-dimensional structure of the utility model.

[0025] In the figure: 1, chassis; 2, first metal electrode layer; 3, second metal electrode layer; 4, front metal pin; 5, jumper; 6, third metal electrode layer; 7, fourth metal electrode layer; 8, upper laminated ceramic dielectric; 9, lower laminated ceramic dielectric; 10, first extension part; 11, welding part; 12, connection part A; 13, connection part B; 14, second extension part; 15, third extension part; 16, welding part; 17, rear metal pin; 18, shell; 19, top cover; 20, slot; 21, connection part C. DETAILED DESCRIPTION

[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0027] Example 1: Please refer to Figure 1-6 A laminated ceramic capacitor comprises a chassis 1 and a lower laminated ceramic dielectric 9, wherein the lower laminated ceramic dielectric 9 is arranged inside the chassis 1, and an upper laminated ceramic dielectric 8 is arranged laterally on the top of the lower laminated ceramic dielectric 9, a first metal electrode layer 2 is arranged on the bottom of the lower laminated ceramic dielectric 9, a second metal electrode layer 3 is arranged on the top of the lower laminated ceramic dielectric 9, a third metal electrode layer 6 is arranged on the top of the upper laminated ceramic dielectric 8, a fourth metal electrode layer 7 is arranged on the top of the upper laminated ceramic dielectric 8, a connecting portion B13 is arranged at the center between the lower laminated ceramic dielectric 9 and the upper laminated ceramic dielectric 8, and a first extension portion 10 is fixed to one side of the connecting portion B13, a connecting portion A12 is attached to the center of the top of the upper laminated ceramic dielectric 8, and a connecting portion C21 is attached to the center of the bottom of the lower laminated ceramic dielectric 9;

[0028] The diameters of the lower laminated ceramic dielectric 9 and the upper laminated ceramic dielectric 8 are equal, the second metal electrode layer 3 and the fourth metal electrode layer 7 are respectively attached to the connection portion B13, the lower laminated ceramic dielectric 9 and the upper laminated ceramic dielectric 8 are sandwiched between the connection portion A12, the connection portion B13 and the connection portion C21, and the connection portion A12 and the connection portion C21 are symmetrically arranged at the top and bottom of the connection portion B13;

[0029] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, the first metal electrode layer 2, the second metal electrode layer 3, the third metal electrode layer 6 and the fourth metal electrode layer 7 are all thin films of copper, silver or gold materials, and the upper laminated ceramic dielectric 8 and the lower laminated ceramic dielectric 9 are both horizontal circular thin sheets. When these components are bonded and contacted to each other, the conductivity and temperature stability of the electrode layer can be improved, and the capacitance of the capacitor can be further improved, so that the capacitor has a wider range of applications.

[0030] Embodiment 2: A third extension portion 15 is fixed to one side of the connection portion A12, and a jumper 5 is fixedly connected to the bottom of the third extension portion 15, a welding piece 11 is fixed below the jumper 5, a second extension portion 14 is fixed to one side of the connection portion C21, and a rear metal pin 17 is fixed to one side of the second extension portion 14, a front metal pin 4 is fixed to one side of the connection portion B13, and a welding portion 16 is fixed to the bottoms of the rear metal pin 17 and the front metal pin 4;

[0031] The front metal pin 4 and the rear metal pin 17 are electrically connected to the first metal electrode layer 2 and the second metal electrode layer 3 respectively, the rear metal pin 17 and the jumper 5 are electrically connected to the third metal electrode layer 6 and the fourth metal electrode layer 7 respectively, and the front metal pin 4 is connected in parallel with the jumper 5;

[0032] Specifically, Figure 1 , Figure 2 and Figure 3 As shown, the side of the connection part A12 is fixedly connected through the third extension part 15, the jumper 5, the welding part 11 and the front metal pin 4, and the connection part B13 is fixedly connected to the rear metal pin 17 through the first extension part 10, and cooperates with the connection part C21 and the second extension part 14 at the bottom, so that it can be symmetrically fitted between the upper laminated ceramic medium 8 and the lower laminated ceramic medium 9 to form a stable structure between the chassis 1 and the shell 18.

[0033] Embodiment 3: A shell 18 is arranged around the top of the chassis 1, and a top cover 19 is arranged horizontally on the top of the shell 18. Slots 20 are arranged at both the front and rear ends of the right side of the bottom of the chassis 1. The chassis 1 and the top cover 19 are symmetrically fixed at the upper and lower parts of the shell 18. The chassis 1, the top cover 19 and the shell 18 are in the same vertical plane.

[0034] Specifically, Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, a shell 18 can be longitudinally inserted around the outer side of the top of the chassis 1. The top cover 19 of the shell 18 and the shell 18 together form a metal mold cavity, which can be directly pressed onto the chassis 1 by equipment for locking and fixing. The two are inseparable, thereby sealing the capacitor, and the inner walls of the shell 18 and the top cover 19 are filled with epoxy resin for shaping and reinforcement. The two groups of grooves 20 on the right side of the chassis can accommodate the welding part 16 of the front metal pin 4 and the rear metal pin 17, which does not affect the assembly and connection of the device and can also carefully protect the ceramic structure.

[0035] Working principle: When the utility model is in use, the outer side of the top of the chassis 1 can be longitudinally inserted with a housing 18, and then the top cover 19 is transversely inserted on the top to close the capacitor. The two sets of slots 20 on the right side of the chassis 1 can accommodate the welding part 16 of the front metal pin 4 and the rear metal pin 17, which does not affect the assembly and connection of the device. In the internal structure, the first metal electrode layer 2, the second metal electrode layer 3, the third metal electrode layer 6 and the fourth metal electrode layer 7 are all thin films of copper, silver or gold materials, and the upper laminated ceramic dielectric 8 and the lower laminated ceramic dielectric 9 are both horizontal circular sheets. When these components are fitted and contacted with each other, they can improve the conductivity and temperature stability of the electrode layer, further improve the capacitance of the capacitor, and connect The side of part A12 is fixedly connected through the third extension part 15, the jumper 5, the welding part 11 and the front metal pin 4, and the connecting part B13 is fixedly connected to the rear metal pin 17 through the first extension part 10, and cooperates with the connecting part C21 and the second extension part 14 at the bottom, so that it can be symmetrically fitted between the upper laminated ceramic medium 8 and the lower laminated ceramic medium 9, and a stable structure is formed between the chassis 1 and the shell 18. The shell 18 and the top cover 19 are interconnected as a whole, and the two form a cover that can cover the chassis 1 for protection, thereby preventing the internal electronic components from being damaged, and the side shell 18 can support the capacitor to stand vertically, and the bottom plate 1 and the top cover 19 can support the capacitor to be placed horizontally, so as to achieve installation diversity.

[0036] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

Claims

1. A multilayer ceramic capacitor, comprising a chassis (1) and a lower multilayer ceramic dielectric (9), characterized in that: A lower laminated ceramic medium (9) is arranged inside the chassis (1), and an upper laminated ceramic medium (8) is arranged transversely on the top of the lower laminated ceramic medium (9), a first metal electrode layer (2) is arranged at the bottom of the lower laminated ceramic medium (9), a second metal electrode layer (3) is arranged on the top of the lower laminated ceramic medium (9), a third metal electrode layer (6) is arranged on the top of the upper laminated ceramic medium (8), and a fourth metal electrode layer (7) is arranged at the bottom of the upper laminated ceramic medium (8), a connecting portion B (13) is arranged at the center between the lower laminated ceramic medium (9) and the upper laminated ceramic medium (8), and a first extension portion (10) is fixed to one side of the connecting portion B (13), a connecting portion A (12) is attached to the center of the top of the upper laminated ceramic medium (8), and a connecting portion C (21) is attached to the center of the bottom of the lower laminated ceramic medium (9).

2. A multilayer ceramic capacitor according to claim 1, characterized in that: The diameters of the lower laminated ceramic medium (9) and the upper laminated ceramic medium (8) are equal, and the second metal electrode layer (3) and the fourth metal electrode layer (7) are respectively attached to the connection portion B (13).

3. The multilayer ceramic capacitor according to claim 1, characterized in that: The lower laminated ceramic medium (9) and the upper laminated ceramic medium (8) are sandwiched between the connecting portion A (12), the connecting portion B (13) and the connecting portion C (21), and the connecting portion A (12) and the connecting portion C (21) are symmetrically arranged at the top and bottom of the connecting portion B (13).

4. The multilayer ceramic capacitor according to claim 1, characterized in that: A third extension portion (15) is fixed to one side of the connection portion A (12), and a jumper wire (5) is fixedly connected to the bottom of the third extension portion (15), and a welding piece (11) is fixed below the jumper wire (5); a second extension portion (14) is fixed to one side of the connection portion C (21), and a rear metal pin (17) is fixed to one side of the second extension portion (14); a front metal pin (4) is fixed to one side of the connection portion B (13), and welding portions (16) are fixed to the bottoms of the rear metal pin (17) and the front metal pin (4).

5. A multilayer ceramic capacitor according to claim 4, characterized in that: The front metal pin (4) and the rear metal pin (17) are electrically connected to the first metal electrode layer (2) and the second metal electrode layer (3) respectively.

6. A multilayer ceramic capacitor according to claim 4, characterized in that: The rear metal pin (17) and the jumper wire (5) are electrically connected to the third metal electrode layer (6) and the fourth metal electrode layer (7) respectively, and the front metal pin (4) is connected in parallel to the jumper wire (5).

7. The multilayer ceramic capacitor according to claim 1, characterized in that: A shell (18) is arranged around the top of the chassis (1), and a top cover (19) is arranged transversely on the top of the shell (18). Slots (20) are arranged at both the front and rear ends of the right side of the bottom of the chassis (1).

8. The multilayer ceramic capacitor according to claim 7, characterized in that: The chassis (1) and the top cover (19) are symmetrically fixed at the upper and lower positions of the shell (18); the chassis (1), the top cover (19) and the shell (18) are located in the same vertical plane.

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