Substrate fixing tool

Abstract

The present application provides a substrate fixing tool, which includes two side vertical plates, a plurality of first connecting plates and two groups of second connecting plates; the two side vertical plates are used to be arranged in parallel in the inner cavity of the plasma glue sweeper in the front-to-back direction; the plurality of first connecting plates are arranged between the two side vertical plates, and are arranged in parallel in the left-right direction, and each first connecting plate has a first slot distributed at equal intervals; the two groups of second connecting plates are arranged between the two side vertical plates, and each group of second connecting plates includes a plurality of second connecting plates distributed at intervals in the up-down direction. Compared with the prior art, the substrate fixing tool provided by the present application can accommodate multiple substrates at a time, so that the internal space of the plasma glue sweeper cavity is fully utilized, the glue sweeping processing efficiency is improved, and the substrate is placed obliquely to prevent residual glue from falling back onto the substrate surface.

Description

Technical Field

[0001] The utility model belongs to the technical field of substrate processing, and more specifically relates to a substrate fixing tool. Background Art

[0002] In semiconductor processing, the substrate that has completed photolithography must be subjected to plasma scanning to remove residual adhesive on the surface before electroplating or vacuum coating, so as to clean and activate the substrate surface, thereby enhancing the surface bonding force and preventing the electroplating layer or coating layer from falling off.

[0003] The common plasma glue sweeping machine in the prior art makes the glue lose its stickiness and then peel off by reacting the plasma gas (generated by high-frequency current) with the collagen molecules (in the glue). Specifically: first, lay the substrate flat in the inner cavity of the machine with the side of the substrate with residual glue facing up; then, turn on the plasma glue sweeping machine to carry out the glue sweeping operation.

[0004] The inventors found that since the substrates are laid flat in the inner cavity of the plasma scanning machine, the inner space of the cavity is not fully utilized, which leads to the technical defects of limited number of substrates involved in scanning each time and low efficiency of the scanning operation. Utility Model Content

[0005] The purpose of the present application is to provide a substrate fixing tool to solve the problem of low efficiency of substrate glue scanning processing in the prior art.

[0006] In order to achieve the above-mentioned purpose, the technical solution adopted in this application is: to provide a substrate fixing tool, including:

[0007] Two side panels are used to be arranged in parallel in the inner cavity of the plasma glue sweeper along the front-to-back direction;

[0008] A plurality of first connecting plates, each of which is arranged between the two side vertical plates and arranged in parallel along the left-right direction; each of the first connecting plates extends along the front-back direction, and its two ends are respectively connected to the two side vertical plates; and each of the first connecting plates has a plurality of first slots distributed at equal intervals along the front-back direction; each of the first slots penetrates the first connecting plate along the left-right direction, and each of the first slots adopts a structure inclined from bottom to top toward the front-back direction; and

[0009] Two groups of second connecting plates are arranged between the two side vertical plates, and are respectively located on the left and right sides of the first connecting plate, and are both located on the upper side of the first connecting plate; each group of second connecting plates includes a plurality of second connecting plates spaced apart along the up and down directions; each second connecting plate extends along the front and back directions, and its two ends are respectively connected to the two side vertical plates.

[0010] Preferably, each of the second connecting plates is provided with a plurality of second slots on one side facing the first connecting plate; each of the second slots penetrates the second connecting plate in the up-down direction and adopts a structure inclined from bottom to top in the front-rear direction.

[0011] Preferably, the second slots are distributed at equal intervals along the front-to-back direction.

[0012] Preferably, a buffer layer is provided inside each of the first slots and each of the second slots.

[0013] Preferably, the first slot and the second slot have the same inclination direction and the same inclination angle.

[0014] Preferably, the inclination angle of the first slot and the second slot ranges from 10 degrees to 30 degrees.

[0015] Preferably, the plurality of first slots on each of the first connecting plates correspond one-to-one to the plurality of second slots on each of the second connecting plates.

[0016] Preferably, the bottom surface of the side vertical plate is provided with a plurality of first mounting grooves which penetrate along the front-to-back direction; the plurality of first mounting grooves correspond one-to-one to the plurality of first connecting plates, and the ends of the first connecting plates are inserted into the corresponding first mounting grooves so that the bottom surface of the first connecting plates is arranged higher than the bottom surface of the side vertical plate.

[0017] Preferably, a shock-absorbing pad is provided on the bottom surface of the first connecting plate; when the end of the first connecting plate is inserted into the first mounting groove, the bottom surface of the shock-absorbing pad is coplanar with the bottom surface of the side vertical plate.

[0018] Preferably, each of the side panels is provided with a transfer trough.

[0019] The substrate fixing tooling proposed in the present application is composed of two side vertical plates, multiple first connecting plates and two groups of second connecting plates; when in use, multiple substrates with residual glue are placed between the two side vertical plates, and the multiple substrates are supported by multiple first connecting plates and two groups of second connecting plates. The substrate fixing tooling can simultaneously accommodate multiple substrates placed vertically and tilted at intervals, and then the tooling is placed in the cavity of a plasma glue sweeping machine for glue sweeping treatment.

[0020] Compared with the prior art, the substrate fixing tooling proposed in the present application can accommodate multiple substrates at a time, so that the internal space of the plasma scanning machine cavity is fully utilized, thereby improving the scanning processing efficiency; in addition, the substrate is tilted so that the photoresist side faces downward, so that the residual glue is easier to peel off due to its own gravity; at the same time, the tilted placement of the substrate can better prevent the residual glue from falling back onto the substrate surface, thereby allowing the residual glue on the substrate to be thoroughly processed. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0022] Figure 1 A schematic diagram of the three-dimensional structure of a substrate fixing tool provided in an embodiment of the present application;

[0023] Figure 2 A schematic diagram of the front view structure of the substrate fixing tool provided in an embodiment of the present application;

[0024] Figure 3 A schematic diagram of the side structure of the substrate fixing tool provided in an embodiment of the present application;

[0025] Figure 4 For along Figure 3 Schematic diagram of the cross-section structure along line AA;

[0026] Figure 5 for Figure 4 Schematic diagram of the enlarged structure of area A in the middle.

[0027] Among them, the reference numerals in the figure are:

[0028] 1. Side plate; 11. First installation slot; 12. Transfer slot; 2. First connecting plate; 21. First slot; 3. Second connecting plate; 31. Second slot; 4. Buffer layer; 5. Shock-absorbing pad; 6. Base plate. DETAILED DESCRIPTION

[0029] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0031] It should be understood that the orientation or position relationship indicated by terms such as "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0033] Please also read Figures 1 to 3 The substrate fixing tool provided in the present application is now described. The substrate fixing tool comprises two side vertical plates 1, a plurality of first connecting plates 2 and two groups of second connecting plates 3.

[0034] The two side plates 1, the multiple first connecting plates 2 and the second connecting plates 3 are all made of polytetrafluoroethylene material; polytetrafluoroethylene (Polytetrafluoroethylene, abbreviated as PTFE), commonly known as the "king of plastics", is a high molecular polymer prepared by polymerization of tetrafluoroethylene as a monomer, with a chemical formula of (C2F4)n, and has excellent heat and cold resistance, and can be used for a long time at -180 to 260°C; this material has excellent electrical insulation properties, and can ensure that the two side plates 1, the multiple first connecting plates 2 and the second connecting plates 3 are not deformed under the high voltage and high temperature environment of the plasma glue sweeper.

[0035] The two side panels 1 are used to be arranged side by side in the inner cavity of the plasma glue sweeping machine along the front-to-back direction.

[0036] Multiple first connecting plates 2 are arranged between two side vertical plates 1, and multiple first connecting plates 2 are arranged in parallel along the left-right direction; each first connecting plate 2 extends along the front-to-back direction, and the two ends of each first connecting plate 2 are respectively connected to the two side vertical plates 1; and each first connecting plate 2 has multiple first slots 21 evenly distributed along the front-to-back direction; each first slot 21 penetrates the first connecting plate 2 along the left-to-right direction, and each first slot 21 adopts a structure inclined from bottom to top toward the front-to-back direction.

[0037] The two groups of second connecting plates 3 are both arranged between the two side vertical plates 1, and the two groups of second connecting plates 3 are respectively located on the left and right sides of the first connecting plate 2, and the two groups of second connecting plates 3 are both located on the upper side of the first connecting plate 2; each group of second connecting plates 3 includes a plurality of second connecting plates 3 spaced apart along the up and down directions; each second connecting plate 3 extends along the front and back directions, and the two ends of each second connecting plate 3 are respectively connected to the two side vertical plates 1.

[0038] The substrate fixing tooling proposed in the present application is composed of two side vertical plates 1, multiple first connecting plates 2 and two groups of second connecting plates 3; when in use, multiple substrates 6 with residual glue are placed between the two side vertical plates 1, and the multiple substrates 6 are supported by multiple first connecting plates 2 and two groups of second connecting plates 3. The substrate 6 fixing tooling can simultaneously accommodate multiple substrates 6 placed vertically and tilted at intervals, and then the tooling is placed in the cavity of a plasma glue sweeping machine for glue sweeping treatment.

[0039] Compared with the prior art, the substrate fixing tooling proposed in the present application can accommodate multiple substrates 6 at a time, so that the internal space of the plasma scanning machine cavity can be fully utilized, thereby improving the scanning processing efficiency; in addition, the substrate 6 is tilted so that the photoresist side faces downward, so that the residual glue is easier to peel off due to its own gravity; at the same time, the tilted placement of the substrate 6 can better prevent the residual glue from falling back onto the surface of the substrate 6, thereby allowing the residual glue on the substrate 6 to be thoroughly processed.

[0040] In some embodiments, please refer to Figures 1 to 4 As a specific implementation of the substrate fixing tooling provided in the present application, each second connecting plate 3 is provided with a plurality of second slots 31 on the side facing the first connecting plate 2; each second slot 31 penetrates the second connecting plate 3 in the up-down direction, and each second slot 31 adopts a structure inclined from bottom to top in the front-rear direction.

[0041] In some embodiments, please refer to Figures 1 to 5 As a specific implementation of the substrate fixing tool provided in the present application, a plurality of second slots 31 are distributed at equal intervals along the front-to-back direction.

[0042] In some embodiments, please refer to Figures 4 to 5 As a specific implementation of the substrate fixing tool provided in the present application, a buffer layer 4 is provided inside each first slot 21 and each second slot 31; the buffer layer 4 can protect the substrate 6 from being scratched when inserted into the first slot 21 and the second slot 31.

[0043] In some embodiments, please refer to Figures 1 to 5 As a specific implementation of the substrate fixing tool provided in the present application, the first slot 21 and the second slot 31 have the same inclination direction; and the first slot 21 and the second slot 31 have the same inclination angle.

[0044] In some embodiments, please refer to Figures 1 to 5 As a specific implementation of the substrate fixing tooling provided in the present application, the inclination angle range of the first slot 21 and the second slot 31 and the vertical direction is 10 degrees to 30 degrees; increasing the inclination angle of the first slot 21 and the second slot 31 will increase the inclination angle of the substrate 6, and increase the total front-to-back distance of the multiple substrates 6, so the number of substrates 6 that can be accommodated in the plasma glue sweeper will also decrease; reducing the inclination angle of the first slot 21 and the second slot 31 will reduce the inclination angle of the substrate 6, so that the residual glue on the multiple substrates 6 will easily fall back to the surface of the substrate after falling off; the slot inclination angle of 10 degrees to 30 degrees is the optimal angle range, at this time, more substrates 6 can be accommodated in the plasma glue sweeper, and the residual glue on the substrate 6 will not easily fall back to the surface of the substrate 6 after falling off.

[0045] In some embodiments, see Figures 1 to 5 As a specific implementation of the substrate fixing tooling provided in the present application, the multiple first slots 21 on each first connecting plate 2 correspond one-to-one with the multiple second slots 31 on each second connecting plate 3, ensuring that when the substrate 6 is inserted into the tooling, the substrate 6 is connected to the inner walls of the first slots 21 and the second slots 22, so that the substrate 6 can maintain a stable support state in the plasma machine.

[0046] In some embodiments, please refer to Figures 1 to 3 As a specific implementation of the substrate fixing tooling provided in the present application, the bottom surface of the side vertical plate 1 is provided with a plurality of first mounting grooves 11 which penetrate along the front-to-back direction; the plurality of first mounting grooves 11 correspond one-to-one to the plurality of first connecting plates 2, and the ends of the first connecting plates 2 are inserted into the corresponding first mounting grooves 11, so that the bottom surface of the first connecting plate 2 is higher than the bottom surface of the side vertical plate 1; the first connecting plate 2 is in a higher position to prevent the residual glue that falls off the substrate 6 from accumulating on the bottom surface of the first connecting plate 2.

[0047] In some embodiments, please refer to Figure 1 and Figure 2 As a specific implementation of the substrate fixing tooling provided in the present application, a shock-absorbing pad 5 is provided on the bottom surface of the first connecting plate 2; the shock-absorbing pad 5 is made of rubber material; when the end of the first connecting plate 2 is inserted into the first mounting groove 11, the bottom surface of the shock-absorbing pad 5 is coplanar with the bottom surface of the side plate 1; vibration will occur during the plasma glue sweeping operation, and the shock-absorbing pad 5 can reduce the vibration that the substrate 6 can be subjected to, thereby preventing the substrate 6 from running out of the slot.

[0048] In some embodiments, please refer to Figures 1 to 4As a specific implementation of the substrate fixing tooling provided in the present application, each side plate 1 is provided with a transfer groove 12, and the size of the transfer groove 12 is suitable for the operator's fingers to be inserted; after completing the glue sweeping process, the operator inserts both hands into the transfer grooves 12 on the two side plates 1 respectively, and then the operator lifts the tooling and transfers it to the next processing step; the setting of the transfer groove 12 makes the tooling transfer more convenient.

[0049] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present application should be included in the protection scope of the present application.

Claims

1. A substrate fixing tool, characterized in that: include: Two side panels (1) are used to be arranged in parallel in the inner cavity of the plasma glue sweeping machine along the front-to-back direction; A plurality of first connecting plates (2) are arranged between the two side upright plates (1) and are arranged in parallel along the left-right direction; each of the first connecting plates (2) extends along the front-back direction, and its two ends are respectively connected to the two side upright plates (1); and each of the first connecting plates (2) has a plurality of first slots (21) distributed at equal intervals along the front-back direction; each of the first slots (21) penetrates the first connecting plate (2) along the left-right direction, and each of the first slots (21) adopts a structure inclined from bottom to top toward the front-back direction; and Two groups of second connecting plates (3) are arranged between the two side upright plates (1), are located on the left and right sides of the first connecting plate (2), and are located on the upper side of the first connecting plate (2); each group of second connecting plates (3) comprises a plurality of second connecting plates (3) spaced apart in the up-down direction; each second connecting plate (3) extends in the front-back direction, and its two ends are connected to the two side upright plates (1) respectively.

2. The substrate fixing tool according to claim 1, characterized in that: A plurality of second slots (31) are provided on one side of each second connecting plate (3) facing the first connecting plate (2); each second slot (31) penetrates the second connecting plate (3) in the up-down direction and adopts a structure that is inclined from bottom to top in the front-rear direction.

3. The substrate fixing tool as claimed in claim 2, characterized in that: The second slots (31) are distributed at equal intervals along the front-to-back direction.

4. The substrate fixing tool as claimed in claim 2, characterized in that: A buffer layer (4) is provided inside each of the first slots (21) and each of the second slots (31).

5. The substrate fixing tool as claimed in claim 2, characterized in that: The first slot (21) and the second slot (31) have the same inclination direction and the same inclination angle.

6. The substrate fixing tool as claimed in claim 4, characterized in that: The inclination angle range of the first slot (21) and the second slot (31) is 10 degrees to 30 degrees.

7. The substrate fixing tool as claimed in claim 2, characterized in that: The plurality of first slots (21) on each of the first connecting plates (2) correspond one-to-one to the plurality of second slots (31) on each of the second connecting plates (3).

8. The substrate fixing tool as claimed in claim 1, characterized in that: The bottom surface of the side vertical plate (1) is provided with a plurality of first mounting grooves (11) penetrating in the front-to-back direction; the plurality of first mounting grooves (11) correspond one-to-one to the plurality of first connecting plates (2), and the ends of the first connecting plates (2) are inserted into the corresponding first mounting grooves (11), so that the bottom surface of the first connecting plates (2) is arranged higher than the bottom surface of the side vertical plate (1).

9. The substrate fixing tool as claimed in claim 8, characterized in that: A shock-absorbing pad (5) is provided on the bottom surface of the first connecting plate (2); when the end of the first connecting plate (2) is inserted into the first mounting groove (11), the bottom surface of the shock-absorbing pad (5) is arranged coplanar with the bottom surface of the side stand (1).

10. The substrate fixing tool according to claim 1, characterized in that: Each of the side panels (1) is provided with a transfer trough (12).

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