Packaging cutting structure

Abstract

The utility model discloses a packaging and cutting structure, which comprises a packaging substrate and a thermal viscosity reduction film, the packaging substrate is provided with a plurality of block-shaped segmentation areas, and the adjacent block-shaped segmentation areas are provided with base layer cutting lines. And the thermal viscosity reducing film is adhered to the packaging substrate, and the thermal viscosity reducing film is provided with an adhesive layer cutting line matched with the base layer cutting line. According to the packaging substrate cutting device, the electronic chip and the peripheral circuit on the surface of the packaging substrate are protected through the thermal adhesive-reducing film, the thermal adhesive-reducing film is separated from the packaging substrate through heating after cutting is completed, the adhesive residue phenomenon is reduced, and the cutting efficiency and the cutting quality of the packaging substrate are greatly improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor packaging, in particular to a packaging cutting structure. Background Art

[0002] Cutting the package substrate is an important step in the packaging process. In the previous step of the packaging process, after the electronic chip is mounted on the substrate and the circuit is connected, the substrate needs to be cut into small pieces of the required size in order to be assembled into the final electronic product. In the process of cutting the package substrate, it is necessary to ensure the consistency of the cutting size and accuracy to avoid damaging the chip or affecting the connection of the circuit. At the same time, in order to improve work efficiency and reduce manufacturing costs, it is usually necessary to consider issues such as the utilization rate and material waste rate between different substrates.

[0003] At present, UV film is used for positioning cutting of package substrates. Specifically, the substrate is attached to the UV film and placed on a cutting machine for cutting, which can cut the substrate and UV film into corresponding shapes and sizes. After cutting, the block substrate with UV film is placed in a UV exposure machine for exposure for a period of time. After the UV film is hardened by irradiation, it is placed on a cutting machine for cutting the hardened UV film. Finally, the cut substrate is cleaned by a cleaning machine to remove the residue generated during the cutting process.

[0004] However, due to a certain height difference between the electronic chip and the substrate, when the UV film is attached to the substrate, there is a certain gap between the UV film and the substrate and the electronic chip, resulting in residual air, which in turn causes residual glue on the UV film. Utility Model Content

[0005] The utility model aims to provide a packaging cutting structure to reduce the occurrence of residual glue on the packaging substrate and improve the cutting quality of the packaging substrate.

[0006] In order to solve the above technical problems, the utility model provides a packaging cutting structure, including a packaging substrate and a thermal viscosity reduction film;

[0007] The packaging substrate has a plurality of block-shaped partitioning areas, and adjacent block-shaped partitioning areas are all provided with base layer cutting lines;

[0008] The thermal adhesive reduction film is adhered to the packaging substrate, and an adhesive layer cutting line matching the base layer cutting line is arranged on the thermal adhesive reduction film.

[0009] Furthermore, the block segmentation areas are distributed in a rectangular shape.

[0010] Furthermore, the block-shaped partition area includes a substrate, an electronic chip and a peripheral circuit;

[0011] The electronic chip and the peripheral circuit are both arranged on the substrate;

[0012] The electronic chip is electrically connected to the peripheral circuit.

[0013] Furthermore, the thermal viscosity-reducing film includes an adhesive layer and a substrate;

[0014] One side of the adhesive layer is adsorbed and adhered to the base material, and the other side of the adhesive layer is adsorbed and adhered to the packaging substrate.

[0015] Compared with the prior art, the utility model has at least the following beneficial effects:

[0016] The utility model utilizes the thermal anti-adhesion film to protect the electronic chip and the peripheral circuit on the surface of the packaging substrate, and separates the thermal anti-adhesion film from the packaging substrate by heating after the cutting is completed, thereby reducing the occurrence of residual glue and greatly improving the cutting efficiency and cutting quality of the packaging substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the packaging cutting structure of the utility model;

[0018] Figure 2 This is a schematic diagram of the packaging substrate structure of the packaging cutting structure of the utility model. DETAILED DESCRIPTION

[0019] The packaging cutting structure of the present invention will be described in more detail below in conjunction with the schematic diagram, wherein the preferred embodiment of the present invention is shown. It should be understood that those skilled in the art can modify the present invention described herein and still achieve the beneficial effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art and not as a limitation to the present invention.

[0020] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description. It should be noted that the accompanying drawings are in very simplified form and in non-precise proportions, and are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0021] like Figure 1 and Figure 2 As shown, the utility model discloses a packaging cutting structure, including a packaging substrate 1 and a thermal viscosity reducing film 2.

[0022] Specifically, the packaging substrate 1 has a plurality of block-shaped dividing areas 3 , and adjacent block-shaped dividing areas 3 are provided with base layer cutting lines 4 .

[0023] The thermal adhesive reduction film 2 is adhered to the packaging substrate 1 , and an adhesive layer cutting line 5 matching the base layer cutting line 4 is provided on the thermal adhesive reduction film 2 .

[0024] In this embodiment, the thermal adhesive reduction film 2 is pasted on the packaging substrate 1, which can effectively protect the packaging substrate 1 and the electronic circuit. In subsequent cutting, cutting can be performed along the base layer cutting line 4 and the adhesive layer cutting line 5 to obtain a block substrate.

[0025] It should be noted that the block-shaped partitions 3 are distributed in a rectangular shape. Each block-shaped partition 3 is a complete circuit unit. After the package substrate 1 is cut, the multiple block-shaped partitions 3 on the package substrate 1 can be cut and separated to form a single circuit module.

[0026] Furthermore, the block-shaped partition area 3 includes a substrate, an electronic chip and a peripheral circuit.

[0027] Specifically, the electronic chip and the peripheral circuit are both arranged on the substrate.

[0028] The electronic chip is electrically connected to the peripheral circuit.

[0029] In this embodiment, the substrate is a carrier, and the electronic chip and the peripheral circuit are electrically connected and arranged on the substrate, and as a whole constitute a circuit unit.

[0030] Furthermore, the thermal viscosity-reducing film 2 includes an adhesive layer 6 and a substrate 7 .

[0031] Specifically, one side of the adhesive layer 6 is adsorbed and adhered to the base material 7 , and the other side of the adhesive layer 6 is adsorbed and adhered to the packaging substrate 1 .

[0032] In this embodiment, heat energy can change the adhesion of the adhesive layer surface, thereby reducing its interaction with other objects. When the temperature of the object surface increases, the strength of the adhesion force will decrease, so that the repulsive force of the object surface increases, thereby offsetting the attraction to the adhered object. In this way, the adhesion between the substrate and the electronic chip can be reduced, and the occurrence of residual adhesive can be reduced.

[0033] When cutting the package cutting structure, the cutting operation of the package cutting structure is performed in the following manner, specifically:

[0034] S100 , at a first temperature, pasting a thermal adhesion-reducing film onto a packaging substrate.

[0035] Specifically, Figure 1As shown in the figure, there is a height gap h of 7 to 10 μm between the electronic chip and the substrate. When UV film is used for pasting, a small amount of air will remain at the height gap between the UV film, the substrate and the electronic chip. During the curing process of the UV film, due to the oxygen inhibition phenomenon of UV film curing, the UV film is prone to residual glue on the substrate and the electronic chip.

[0036] Among them, oxygen inhibition is also called oxygen suppression. The radiation curing reaction of almost all radiation curing materials will be affected by oxygen in the air. Since the concentration of oxygen is highest in the surface layer, the inhibition of oxygen often causes the lower layer to be cured, but the surface is still uncured and sticky.

[0037] In this embodiment, the UV film is replaced with a thermal viscosity-reducing film, and the thermal viscosity-reducing film does not need to be irradiated with light during the curing process, but only needs to be heated to reduce viscosity. In addition, the thermal viscosity-reducing film does not cause residual adhesive due to oxygen inhibition during the curing process, which can effectively improve the cutting quality of the packaging substrate.

[0038] It should be noted that the thermal anti-viscosity film is pasted at a first temperature of 20°C to 40°C. At this temperature, the thermal anti-viscosity film has good viscosity and can provide good protection for the substrate and the electronic chip. The first temperature can also be specifically 25°C, 30°C and 35°C.

[0039] S200, cutting the packaging substrate and the thermal viscosity reduction film according to cutting size requirements to obtain a block substrate.

[0040] Specifically, there are various cutting methods for the package substrate, and a suitable cutting method can be selected according to the characteristics of the package substrate itself, specifically:

[0041] 1. Laser cutting: Using the high energy of laser to cut the chip, it has the advantages of fast cutting speed and high precision, but the cost is relatively high.

[0042] 2. Mechanical cutting: Cutting the chip by mechanical means such as blades or grinding wheels. Although the cutting effect is not as good as laser cutting, the cost is lower and it is suitable for mass production.

[0043] 3. Grinding and cutting: Place the chip on the grinder and cut it by the high-speed rotation of the grinding wheel. This method is suitable for cutting harder chips, but the cutting speed is slow.

[0044] 4. Water jet cutting: Use high-pressure water jet to cut the chip. This method is suitable for cutting chips of various materials, but the equipment cost is relatively high.

[0045] 5. Vacuum suction cup cutting: The chip is adsorbed on the cutting table by a vacuum suction cup, and then cut using a blade or grinding wheel. This method is suitable for cutting thin chips, but the cutting speed is slow.

[0046] S300, heating the block substrate to a second temperature, and removing the thermal viscosity-reducing film.

[0047] Specifically, the block substrate is heated at a second temperature of 80°C to 125°C for 1 to 3 minutes. On the one hand, heating at this temperature can reduce the viscosity of the thermal viscosity reduction film, making it easier to remove the thermal viscosity reduction film attached to the substrate and the electronic chip. On the other hand, at this temperature, the substrate, the electronic chip, and the circuit will not be damaged.

[0048] S400: After the thermal viscosity-reducing film is removed, a cleaning machine is used to clean the block substrate.

[0049] Specifically, after the heat-reducing viscosity film on the surface of the block substrate is completely removed, the block substrate is placed in a cleaning machine for cleaning.

[0050] When IC is plastic encapsulated, the plastic encapsulation material must have good adhesion to various materials such as the chip, substrate, and metal bonding pins. If there is contamination or poor surface activity, it will cause the surface layer of the plastic encapsulation to peel off. If it is encapsulated after plasma cleaning, it can effectively improve the surface activity, improve adhesion, and improve the reliability of the encapsulation.

[0051] Compared with the prior art, the present invention has at least the following beneficial effects:

[0052] The utility model utilizes the thermal anti-adhesion film to protect the electronic chip and the peripheral circuit on the surface of the packaging substrate, and separates the thermal anti-adhesion film from the packaging substrate by heating after the cutting is completed, thereby reducing the occurrence of residual glue and greatly improving the cutting efficiency and cutting quality of the packaging substrate.

[0053] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A packaging cutting structure, characterized in that: Including packaging substrate and thermal anti-adhesion film; The packaging substrate has a plurality of block-shaped partitioning areas, and adjacent block-shaped partitioning areas are all provided with base layer cutting lines; The thermal adhesive reduction film is adhered to the packaging substrate, and an adhesive layer cutting line matching the base layer cutting line is arranged on the thermal adhesive reduction film.

2. The package cutting structure according to claim 1, characterized in that: The block-shaped segmented areas are distributed in a rectangular shape.

3. The package cutting structure according to claim 1, characterized in that: The block segmentation area includes a substrate, an electronic chip and a peripheral circuit; The electronic chip and the peripheral circuit are both arranged on the substrate; The electronic chip is electrically connected to the peripheral circuit.

4. The package cutting structure according to claim 1, characterized in that: The thermal viscosity-reducing film comprises an adhesive layer and a substrate; One side of the adhesive layer is adsorbed and adhered to the base material, and the other side of the adhesive layer is adsorbed and adhered to the packaging substrate.

Images