CHIP LED 2-in-1 lamp beads and display screen

Abstract

The utility model discloses a CHIP LED two-in-one lamp bead and a display screen, and relates to the field of semiconductor optoelectronic devices. The CHIP LED two-in-one lamp bead includes a first insulating substrate, a second insulating substrate, an LED chip and a packaging adhesive layer. The front of the first insulating substrate is provided with a first solid crystal area, a second solid crystal area, a common polarity welding wire area, a first welding wire area, a second welding wire area and a third welding wire area; the back of the second insulating substrate is provided with a common polarity pad area, a first pad area, a second pad area and a third pad area; wherein the number of any light-emitting chips is two, the number of the remaining light-emitting chips is one, and the number of two light-emitting chips is fixed to the second solid crystal area, and the remaining light-emitting chips are fixed to the first solid crystal area; the front of the first insulating substrate or the back of the second insulating substrate is also provided with a heat dissipation functional area; the heat dissipation functional area includes a first heat dissipation area, a second heat dissipation area, a third heat dissipation area and a fourth heat dissipation area respectively arranged corresponding to the common polarity welding wire area, the first welding wire area, the second welding wire area and the third welding wire area. The implementation of the utility model can improve the reliability of the CHIP LED two-in-one lamp bead.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor optoelectronic devices, in particular to a CHIP LED two-in-one lamp bead and a display screen. Background Art

[0002] Traditional display screens use RGB lamp beads, which are generally three-color LED chips, one each packaged on a substrate, and then soldered to a PCB to form a display screen. However, there are usually gaps during the soldering process, which makes it difficult to increase the density of RGB lamp bead-based displays, resulting in fewer display pixels and poor clarity. Currently, a common method is to reduce the size of LED chips and develop new chips such as miniLED and MicoLED, but these chips often have problems with high transfer difficulty and low production yield. Another common method is to package six LED chips (two each for RGB) on the same substrate to form a two-in-one lamp bead. Figure 1 In order to realize the separate control of each lamp bead, it is necessary to arrange more leads 1a and through holes 2a on the front side of the substrate. In order to prevent the adjacent through holes from short-circuiting, it is also necessary to cover them with insulating green oil 3a. The insulating green oil 3a has poor adhesion with the packaging glue, and it is easy to form a water vapor channel during use, causing the lamp bead to die and weaken the display effect. Utility Model Content

[0003] The technical problem to be solved by the utility model is to provide a CHIP LED two-in-one lamp bead, which can improve the reliability of the two-in-one lamp bead and extend the service life.

[0004] The technical problem that the utility model needs to solve is to provide a display screen.

[0005] In order to solve the above problems, the utility model discloses a CHIP LED two-in-one lamp bead, which includes:

[0006] A first insulating substrate, wherein a front functional area is provided on the front side of the first insulating substrate, wherein the front functional area includes a first crystal bonding area provided in the middle of the front side of the first insulating substrate, two second crystal bonding areas symmetrically distributed on both sides of the first crystal bonding area, a common polarity welding line area provided between one second crystal bonding area and the first crystal bonding area, a first welding line area and a second welding line area provided between another second crystal bonding area and the first crystal bonding area, and two third welding line areas symmetrically distributed on both sides of the first crystal bonding area and coaxially arranged with the second crystal bonding area;

[0007] A second insulating substrate is disposed below the first insulating substrate; a back functional area is disposed on the back of the second insulating substrate; the back functional area includes a common polarity pad area, a first pad area, a second pad area and a third pad area which are respectively disposed corresponding to and electrically connected to the common polarity bonding wire area, the first bonding wire area, the second bonding wire area and the third bonding wire area;

[0008] A light-emitting chip fixed in the first solid crystal area and the second solid crystal area; the light-emitting chip includes a red LED chip, a green LED chip and a blue LED chip; and

[0009] A packaging adhesive layer, disposed above the first insulating substrate and the light-emitting chip;

[0010] Wherein, the number of any one of the light-emitting chips is two, the number of the other light-emitting chips is one, and the two light-emitting chips are fixed to the second crystal-bonding area, and the other light-emitting chips are fixed to the first crystal-bonding area;

[0011] A heat dissipation functional area is also provided on the front side of the first insulating substrate or the back side of the second insulating substrate; the heat dissipation functional area includes a first heat dissipation area, a second heat dissipation area, a third heat dissipation area and a fourth heat dissipation area which are respectively arranged corresponding to the common polarity welding wire area, the first welding wire area, the second welding wire area and the third welding wire area.

[0012] As an improvement of the above technical solution, the second crystal-fixing area, the first wire bonding area, the second wire bonding area, and the third wire bonding area are all provided with a first through hole penetrating the first insulating substrate;

[0013] The first heat dissipation area, the second heat dissipation area, the third heat dissipation area, and the fourth heat dissipation area are all provided with a second through hole penetrating through the second insulating substrate;

[0014] A third through hole is further provided in the area of ​​the second insulating substrate corresponding to the third wire bonding area;

[0015] The first through hole, the second through hole and the third through hole are all filled with conductive copper.

[0016] As an improvement of the above technical solution, the apertures of the first through hole, the second through hole and the third through hole are all ≤0.02 mm, so as to form solid conductive copper through a copper deposition process.

[0017] As an improvement of the above technical solution, the second through holes located in the first heat dissipation area, the second heat dissipation area, the third heat dissipation area, and the fourth heat dissipation area are coaxially arranged with the first through holes located in the second crystal bonding area, the first bonding wire area, and the second bonding wire area respectively;

[0018] The first through hole and the third through hole located in the third wire bonding area are coaxially arranged.

[0019] As an improvement of the above technical solution, it includes two red light LED chips, which are of vertical structure, one electrode of which is fixed in the second solid crystal area by conductive glue, and the other electrode is electrically connected to the third wire bonding area by a wire bonding wire;

[0020] Wherein, a second solid crystal region is electrically connected to the common polarity bonding wire region.

[0021] As an improvement of the above technical solution, the first crystal-bonding region includes a first crystal-bonding sub-region and a second crystal-bonding sub-region separated and coaxially arranged;

[0022] The common polarity bonding wire area includes a first common polarity bonding wire sub-area and a second common polarity bonding wire sub-area which are coaxially arranged with the first crystal bonding sub-area and the second crystal bonding sub-area, respectively, and the two are electrically connected;

[0023] The first bonding wire area and the second bonding wire area are coaxially arranged with the first die-bonding sub-area and the second die-bonding sub-area respectively.

[0024] As an improvement of the above technical solution, it includes 2 red LED chips, 1 green LED chip and 1 blue LED chip;

[0025] The red LED chip is a vertical structure, one electrode of which is fixed in the second solid crystal area by a conductive adhesive, and the other electrode is electrically connected to the third wire bonding area by a wire bonding; and a second solid crystal area is electrically connected to the common polarity pad area;

[0026] The green LED chip is a horizontal structure, fixed to the first die-bonding sub-region by an insulating adhesive, one electrode of which is electrically connected to the first common-polarity bonding sub-region by a bonding wire, and the other electrode of which is electrically connected to the first bonding region by a bonding wire;

[0027] The blue LED chip is a horizontal structure, fixed to the second die-bonding sub-region by insulating glue, one electrode of which is electrically connected to the second common polarity bonding sub-region by a bonding wire, and the other electrode of which is electrically connected to the second bonding region by a bonding wire.

[0028] As an improvement of the above technical solution, the third heat dissipation area and the fourth heat dissipation area are connected through a lead.

[0029] As an improvement of the above technical solution, two third through holes located in the area of ​​the second insulating substrate corresponding to the third bonding wire area are connected through a lead wire.

[0030] Correspondingly, the utility model also discloses a display screen, which includes the above-mentioned CHIP LED two-in-one lamp bead.

[0031] The implementation of this utility model has the following beneficial effects:

[0032] The CHIP LED two-in-one lamp bead of the utility model comprises a first insulating substrate, a second insulating substrate, a light-emitting chip and a packaging adhesive layer, wherein the front of the first insulating substrate is provided with a first solid crystal area, a second solid crystal area, a common polarity welding wire area, a first welding wire area, a second welding wire area and a third welding wire area in a specific arrangement, which can effectively reduce the use of the front lead wires, optimize the use of the front graphic area, reduce the size of the insulating substrate, and do not need to use green oil, thereby improving the air tightness of the two-in-one LED lamp bead, improving its reliability and extending its service life. In addition, the CHIP LED two-in-one lamp bead of the utility model also reduces the number of light-emitting chips. Specifically, by setting any one of the RGB chips to 2 and the other chips to 1, the number of light-emitting chips is reduced, that is, the light-emitting chips of the number 2 share the other two light-emitting chips of the number 1 to form a virtual pixel. Based on this solution, the front leads are reduced and the reliability is improved. Furthermore, in the CHIP LED two-in-one lamp bead of the present invention, a heat dissipation functional area is introduced at the junction of the first insulating substrate and the second insulating substrate, which can improve the heat dissipation performance of the two-in-one LED lamp bead and further improve its reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 It is a schematic diagram of the front structure of a two-in-one LED lamp bead in the prior art;

[0034] Figure 2 This is a schematic diagram of the front structure of a CHIP LED two-in-one lamp bead in one embodiment of the utility model;

[0035] Figure 3 This is a schematic diagram of the back structure of a CHIP LED two-in-one lamp bead in one embodiment of the utility model;

[0036] Figure 4 This is a schematic diagram of the front structure of the first insulating substrate in one embodiment of the utility model;

[0037] Figure 5 This is a schematic diagram of the cross-sectional structure of a CHIP LED two-in-one lamp bead in one embodiment of the utility model;

[0038] In the figure, 1 is a second insulating substrate, 11 is a common polarity pad area, 12 is a first pad area, 13 is a second pad area, 14 is a third pad area, 15 is a second through hole, 16 is a third through hole, 2 is a first insulating substrate, 21 is a first solid crystal area, 211 is a first solid crystal sub-area, 212 is a second solid crystal sub-area, 22 is a second solid crystal area, 23 is a common polarity wire area, 231 is a first common polarity wire sub-area, 232 is a second common polarity wire area Welding wire sub-area, 24 is the first welding wire area, 25 is the second welding wire area, 26 is the third welding wire area, 27 is the first through hole, 3 is the light-emitting chip, 31 is the red light LED chip, 32 is the green light LED chip, 33 is the blue light LED chip, 4 is the packaging glue layer, 5 is the heat dissipation functional area, 51 is the first heat dissipation area, 52 is the second heat dissipation area, 53 is the third heat dissipation area, 54 is the fourth heat dissipation area, 6 is the welding wire, 7 is the lead, and 8 is conductive copper. DETAILED DESCRIPTION

[0039] In order to make the purpose, technical solutions and advantages of the utility model clearer, the utility model is further described in detail below.

[0040] See also Figure 2 to Figure 5 The utility model provides a CHIP LED two-in-one lamp bead, which includes a second insulating substrate 1, a first insulating substrate 2, a light-emitting chip 3 and a packaging adhesive layer 4 stacked in sequence. Among them, the front side of the first insulating substrate 2 is provided with a front functional area, and the back side of the second insulating substrate 1 is provided with a back functional area. The front functional area includes a first solid crystal area 21 provided in the middle of the first insulating substrate 2, two second solid crystal areas 22 symmetrically distributed on both sides of the first solid crystal area 21, a common polarity welding line area 23 provided between a second solid crystal area 22 and the first solid crystal area 21, a first welding line area 24 and a second welding line area 25 provided between another second solid crystal area 22 and the first solid crystal area 21, and two third welding line areas 26 symmetrically distributed on both sides of the first solid crystal area 21 and coaxially arranged with the second solid crystal area 22; the back functional area includes a common polarity pad area 11, a first pad area 12, a second pad area 13 and a third pad area 14, which are respectively provided and electrically connected to the common polarity welding line area 23, the first welding line area 24, the second welding line area 25 and the third welding line area 26. Among them, the number of the third welding line area 14 corresponds to the number of the third welding line area 26, both of which are two.

[0041] The light-emitting chips 3 include a red LED chip 31, a green LED chip 32, and a blue LED chip 33, which are respectively fixed in the first solid crystal area 21 and the second solid crystal area 22. Specifically, in the above-mentioned light-emitting chips, the number of any light-emitting chips 3 is two, the number of the remaining light-emitting chips is one, and the number of two light-emitting chips 3 is fixed in the second solid crystal area 22, and the remaining light-emitting chips 3 are fixed in the first solid crystal area 21.

[0042] Among them, a heat dissipation functional area 5 is also provided on the back side of the second insulating substrate 1 or the front side of the first insulating substrate 2; the heat dissipation functional area 5 includes a first heat dissipation area 51, a second heat dissipation area 52, a third heat dissipation area 53 and a fourth heat dissipation area 54 which are respectively arranged corresponding to the common polarity welding wire area 23, the first welding wire area 24, the second welding wire area 25, and the third welding wire area 26 and are interconnected.

[0043] Based on the above-mentioned CHIP LED two-in-one lamp bead, firstly, the number of light-emitting chips is reduced. Specifically, by setting any one of the RGB chips to two and the other chips to one, the number of light-emitting chips is reduced, that is, the light-emitting chips of number two share the other two light-emitting chips of number one to form a virtual pixel. Based on this scheme, the front leads are reduced and the reliability is improved. Secondly, through the layout positions of each solid crystal area and the welding wire area, the layout of the front functional area and the back functional area is further optimized, so there is no need to use green oil, which improves the air tightness of the two-in-one LED lamp bead, improves its reliability, and extends its service life. Thirdly, through the setting of the heat dissipation functional area 5, the heat dissipation performance of the two-in-one LED lamp bead is enhanced, and the reliability is further enhanced.

[0044] Specifically, in the present invention, the common polarity welding wire area 23, the first welding wire area 24, the second welding wire area 25, and the third welding wire area 26 can be electrically connected to the common polarity pad area 11, the first pad area 12, the second pad area 13, and the third pad area 14 through through holes and leads provided with conductive media, but are not limited thereto. Preferably, in one embodiment, the second solid crystal area 22, the first welding wire area 24, the second welding wire area 25, and the third welding wire area 26 are all provided with first through holes 27 penetrating the first insulating substrate 2; the first heat dissipation area 51, the second heat dissipation area 52, the third heat dissipation area 53, and the fourth heat dissipation area 54 are all provided with second through holes 15 penetrating the second insulating substrate 1; the second insulating substrate 1 is also provided with a third through hole 16 in the area corresponding to the third welding wire area 26, and the first through hole 27, the second through hole 15, and the third through hole 16 are all filled with conductive copper 8 to achieve electrical conduction between the front functional area and the back functional area.

[0045] Specifically, the first through hole 27, the second through hole 15, and the third through hole 16 are cylindrical holes, and their apertures are ≤0.08 mm, preferably 0.01-0.07 mm, but not limited thereto. More preferably, in one embodiment, the apertures of the three are ≤0.02 mm, more specifically 0.01-0.02 mm. Based on such apertures, conductive copper 8 can be formed by copper deposition process. In the utility model, the current distribution is optimized by setting the heat dissipation functional area, and the aperture of the through hole can be greatly reduced.

[0046] Specifically, in one embodiment, the second through holes 15 located in the first heat dissipation area 51, the second heat dissipation area 52, the third heat dissipation area 53, and the fourth heat dissipation area 54 are coaxially arranged with the first through holes 27 located in the second die-bonding area 22, the first wire bonding area 24, and the second wire bonding area 25 (two), respectively; the first through hole 27 located in the third wire bonding area 26 is coaxially arranged with the third through hole 16. Based on the above arrangement, the first through hole 27, the second through hole 15, or the first through hole 27 and the third through hole 16 can be formed by a drilling process.

[0047] Specifically, in the present invention, the number of any light-emitting chips 3 can be 2, and there is no specific restriction on the structure of the light-emitting chip 3, which can be a light-emitting chip with a face-up structure (horizontal structure), a flip-chip or a vertical structure. Correspondingly, the connection method between the light-emitting chip 3 and the first solid crystal area 21 and the second solid crystal area 22 can also be bonding, insulating adhesive bonding, conductive adhesive bonding, etc., but not limited to this. The light-emitting chip 3 and the common polarity wire bonding area 23, the first wire bonding area 24, the second wire bonding area 25, and the third wire bonding area 26 can be electrically connected by metal bonding, welding wires, conductive adhesive bonding, etc., but not limited to this.

[0048] Preferably, in one embodiment, the CHIP LED two-in-one lamp bead includes two red LED chips 31, and it is a vertical structure. Based on this structure, the layout of the front functional area can be further simplified. Specifically, in this embodiment, one electrode of the red LED chip 31 is fixed in the second solid crystal area 22 by a conductive glue, and the other electrode is electrically connected to the third wire bonding area 26 by a welding wire 6, and one of the second solid crystal areas 22 is electrically connected to the common polarity wire bonding area 23. Specifically, the common polarity wire bonding area 23 can be connected to a second solid crystal area 22 into a piece, and the two can also be electrically connected by a lead. Preferably, in one embodiment, the second solid crystal area 22 and the common polarity wire bonding area 23 are separated, and the two are coaxially arranged and connected by a lead 7.

[0049] Specifically, the first solid crystal area 21 can be an integral block structure or can be separated. Preferably, in one embodiment, the first solid crystal area 21 includes a first solid crystal sub-area 211 and a second solid crystal sub-area 212 that are separated from each other and coaxially arranged. The separated arrangement can reduce the mixing of glue during the glue dispensing process and improve the yield rate of the lamp beads.

[0050] Correspondingly, the common polarity bonding wire area 23 may also be an integral sheet structure or may be separately arranged. Preferably, in one embodiment, the common polarity bonding wire area 23 includes a first common polarity bonding wire sub-area 231 and a second common polarity bonding wire sub-area 232 which are coaxially arranged with the first die-bonding sub-area 211 and the second die-bonding sub-area 212, respectively, and the two are electrically connected through the lead 7.

[0051] Correspondingly, in one embodiment, the first welding wire area 24 and the second welding wire area 25 are coaxially arranged with the first solid crystal sub-area 211 and the second solid crystal sub-area 212, respectively. Based on this arrangement, the wire welding process of the light-emitting chip 3 located in the first solid crystal sub-area 211 and the second solid crystal sub-area 212 can be facilitated, thereby improving the yield rate of the lamp beads.

[0052] Based on the above-mentioned arrangement of the front functional areas, in one embodiment, the light-emitting chip 3 includes two red LED chips 31, one green LED chip 32 and one blue LED chip 33; the red LED chip 31 is a vertical structure, one electrode of which is fixed in the second solid crystal area 22 by a conductive glue, and the other electrode is electrically connected to the third wire bonding area 26 by a welding wire; and a second solid crystal area 22 is electrically connected to the common polarity pad area 23; the green LED chip 32 is a horizontal structure, which is fixed to the first solid crystal sub-area 211 by an insulating glue, one electrode of which is electrically connected to the first common polarity wire bonding sub-area 231 by a welding wire 6, and the other electrode is electrically connected to the first wire bonding area 24 by a welding wire 6; the blue LED chip 33 is a horizontal structure, which is fixed to the second solid crystal sub-area 212 by an insulating glue, one electrode of which is electrically connected to the second common polarity wire bonding sub-area 232 by a welding wire 6, and the other electrode is electrically connected to the second wire bonding area 25 by a welding wire 6.

[0053] Specifically, in one embodiment, the third heat dissipation area 53 and the fourth heat dissipation area 54 are connected by a wire, and the two third through holes 16 located in the area corresponding to the second insulating substrate 1 and the third wire bonding area 26 are connected by a wire.

[0054] In summary, the CHIP LED two-in-one lamp bead of the utility model includes a first insulating substrate, a second insulating substrate, a light-emitting chip and a packaging adhesive layer, wherein the front of the first insulating substrate is provided with a first solid crystal area, a second solid crystal area, a common polarity welding wire area, a first welding wire area, a second welding wire area and a third welding wire area in a specific arrangement, which can effectively reduce the use of the front lead wires, optimize the use of the front graphic area, reduce the size of the insulating substrate, and do not need to use green oil, thereby improving the air tightness of the two-in-one LED lamp bead, improving its reliability and extending its service life. In addition, the CHIP LED two-in-one lamp bead of the utility model also reduces the number of light-emitting chips. Specifically, by setting any one of the RGB chips to 2 and the other chips to 1, the number of light-emitting chips is reduced, that is, the number of light-emitting chips is 2 and the number of other two light-emitting chips is 1 to form a virtual pixel. Based on this solution, the front leads are reduced and the reliability is improved. Furthermore, in the CHIP LED two-in-one lamp bead of the present invention, a heat dissipation functional area is introduced at the junction of the first insulating substrate and the second insulating substrate, which can improve the heat dissipation performance of the two-in-one LED lamp bead and further improve its reliability.

[0055] The above is a preferred embodiment of the utility model. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the utility model. These improvements and modifications are also considered to be within the scope of protection of the utility model.

Claims

1. A CHIP LED two-in-one lamp bead, characterized in that: include: A first insulating substrate, wherein a front functional area is provided on the front side of the first insulating substrate, wherein the front functional area includes a first crystal bonding area provided in the middle of the front side of the first insulating substrate, two second crystal bonding areas symmetrically distributed on both sides of the first crystal bonding area, a common polarity welding line area provided between one second crystal bonding area and the first crystal bonding area, a first welding line area and a second welding line area provided between another second crystal bonding area and the first crystal bonding area, and two third welding line areas symmetrically distributed on both sides of the first crystal bonding area and coaxially arranged with the second crystal bonding area; A second insulating substrate is disposed below the first insulating substrate; a back functional area is disposed on the back of the second insulating substrate; the back functional area includes a common polarity pad area, a first pad area, a second pad area and a third pad area which are respectively disposed corresponding to and electrically connected to the common polarity bonding wire area, the first bonding wire area, the second bonding wire area and the third bonding wire area; A light-emitting chip is fixed in the first solid crystal area and the second solid crystal area; the light-emitting chip includes a red light LED chip, a green light LED chip and a blue light LED chip; and A packaging adhesive layer, disposed above the first insulating substrate and the light-emitting chip; Wherein, the number of any one of the light-emitting chips is two, the number of the other light-emitting chips is one, and the two light-emitting chips are fixed to the second crystal-bonding area, and the other light-emitting chips are fixed to the first crystal-bonding area; A heat dissipation functional area is also provided on the front side of the first insulating substrate or the back side of the second insulating substrate; the heat dissipation functional area includes a first heat dissipation area, a second heat dissipation area, a third heat dissipation area and a fourth heat dissipation area which are respectively arranged corresponding to the common polarity welding wire area, the first welding wire area, the second welding wire area and the third welding wire area.

2. The CHIP LED two-in-one lamp bead as claimed in claim 1, characterized in that: The second crystal-fixing area, the first wire bonding area, the second wire bonding area, and the third wire bonding area are all provided with a first through hole penetrating through the first insulating substrate; The first heat dissipation area, the second heat dissipation area, the third heat dissipation area, and the fourth heat dissipation area are all provided with a second through hole penetrating through the second insulating substrate; A third through hole is further provided in the area of ​​the second insulating substrate corresponding to the third wire bonding area; The first through hole, the second through hole and the third through hole are all filled with conductive copper.

3. The CHIP LED two-in-one lamp bead as claimed in claim 2, characterized in that: The apertures of the first through hole, the second through hole and the third through hole are all ≤0.02 mm, so as to form solid conductive copper through a copper deposition process.

4. The CHIP LED two-in-one lamp bead as claimed in claim 2, characterized in that: The second through holes located in the first heat dissipation area, the second heat dissipation area, the third heat dissipation area, and the fourth heat dissipation area are coaxially arranged with the first through holes located in the second crystal bonding area, the first bonding wire area, and the second bonding wire area respectively; The first through hole and the third through hole located in the third wire bonding area are coaxially arranged.

5. The CHIP LED two-in-one lamp bead as claimed in claim 1, characterized in that: It includes two red LED chips, which are of vertical structure, one electrode of which is fixed in the second solid crystal area by conductive glue, and the other electrode is electrically connected to the third wire bonding area by a welding wire; Wherein, a second solid crystal region is electrically connected to the common polarity bonding wire region.

6. The CHIP LED two-in-one lamp bead as claimed in claim 1, characterized in that: The first crystal-bonding region comprises a first crystal-bonding sub-region and a second crystal-bonding sub-region separated and coaxially arranged; The common polarity bonding wire area includes a first common polarity bonding wire sub-area and a second common polarity bonding wire sub-area which are coaxially arranged with the first crystal bonding sub-area and the second crystal bonding sub-area, respectively, and the two are electrically connected; The first bonding wire area and the second bonding wire area are coaxially arranged with the first die-bonding sub-area and the second die-bonding sub-area respectively.

7. The CHIP LED two-in-one lamp bead as claimed in claim 6, characterized in that: Includes 2 red LED chips, 1 green LED chip and 1 blue LED chip; The red LED chip is a vertical structure, one electrode of which is fixed in the second solid crystal area by a conductive adhesive, and the other electrode is electrically connected to the third wire bonding area by a wire bonding; and a second solid crystal area is electrically connected to the common polarity pad area; The green LED chip is a horizontal structure, fixed to the first die-bonding sub-region by an insulating adhesive, one electrode of which is electrically connected to the first common-polarity bonding sub-region by a bonding wire, and the other electrode of which is electrically connected to the first bonding region by a bonding wire; The blue LED chip is a horizontal structure, fixed to the second die-bonding sub-region by insulating glue, one electrode of which is electrically connected to the second common polarity bonding sub-region by a bonding wire, and the other electrode of which is electrically connected to the second bonding region by a bonding wire.

8. The CHIP LED two-in-one lamp bead as claimed in claim 2, characterized in that: The third heat dissipation area and the fourth heat dissipation area are connected through a lead.

9. The CHIP LED two-in-one lamp bead as claimed in claim 2, characterized in that: Two third through holes located in a region of the second insulating substrate corresponding to the third wire bonding region are connected via a lead wire.

10. A display screen, characterized in that: It comprises the CHIP LED two-in-one lamp bead as described in any one of claims 1 to 8.

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