Lighting module and carrier system

Abstract

The present application discloses a light-emitting module and a carrier system, which relates to the field of laser technology. The light-emitting module includes: a base plate, an insulating outer frame, a light-emitting element, a first lead, a second lead, and a light window; the light-emitting element is fixed on the base plate, the insulating outer frame surrounds the base plate, and is sealed and connected to the base plate, including a first end face and a second end face that are arranged oppositely; the light window is connected to the first end face of the insulating outer frame, and the light window, the insulating outer frame, and the base plate jointly define a sealed accommodation space, and the accommodation space accommodates the light-emitting element; the first lead and the second lead are both fixed to the connecting side of the insulating outer frame outside the accommodation space, and the connecting side is not the second end face; the first circuit and the second circuit are arranged inside the insulating outer frame, one end of the first lead is connected to the positive electrode of the light-emitting element through the first circuit, and one end of the second lead is connected to the negative electrode of the light-emitting element through the second circuit. The heat spreader of the present application does not require additional circuit layout, which can reduce costs.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and more specifically, to a light-emitting module and a carrier system. Background Art

[0002] In the field of laser technology, semiconductor lasers are the core components of light sources. Although some lasers have been designed, the manufacturing costs of existing lasers are relatively high. Utility Model Content

[0003] The present application proposes a light emitting module and a carrier system to improve the above-mentioned defects.

[0004] In a first aspect, the present application provides a light-emitting module, which includes: a base plate, an insulating frame, a light-emitting element, a first lead, a second lead and a light window; the light-emitting element is fixed on the base plate, the insulating frame surrounds the base plate and is sealed and connected to the base plate, the insulating frame includes a first end face and a second end face arranged opposite to each other, and the second end face is used to be connected to a heat spreader; the light window is connected to the first end face of the insulating frame, the light window, the insulating frame and the base plate jointly define a sealed accommodation space, the accommodation space accommodates the light-emitting element, the light-emitting element is used to emit light, and the light is used to be emitted from the perspective area of ​​the light window; the first lead and the second lead are both fixed to a connecting side surface of the insulating frame located outside the accommodation space, and the connecting side surface is not the second end surface; a first circuit and a second circuit are arranged inside the insulating frame, one end of the first lead is connected to the positive electrode of the light-emitting element through the first circuit, and the other end is used to be connected to the positive electrode on the substrate circuit, one end of the second lead is connected to the negative electrode of the light-emitting element through the second circuit, and the other end is used to be connected to the negative electrode on the substrate circuit.

[0005] Optionally, for a possible implementation, the connecting side is provided with a first hole and a third hole connected to the interior, and the side wall of the insulating outer frame located in the accommodating space is provided with a second hole and a fourth hole connected to the interior; one end of the first circuit is connected to one end of the first lead through the first hole, and the other end of the first circuit is connected to the positive electrode of the light-emitting element through the second hole, and the other end of the first lead is used to be connected to the positive electrode on the substrate circuit; one end of the second circuit is connected to one end of the second lead through the third hole, and the other end of the second circuit is connected to the negative electrode of the light-emitting element through the fourth hole, and the other end of the second lead is used to be connected to the negative electrode on the substrate circuit.

[0006] Optionally, in a possible implementation manner, both the first lead and the second lead extend out of the insulating outer frame.

[0007] Optionally, in a possible implementation manner, the first lead and the second lead are both fixed to the first end surface located outside the accommodating space.

[0008] Optionally, for a possible implementation, the connecting side has a third end face arranged opposite to the second end face, the distance between the third end face and the second end face is smaller than the distance between the first end face and the second end face, and the maximum distance between the third end face and the inner wall of the accommodating space is larger than the maximum distance between the first end face and the inner wall of the accommodating space; the first lead and the second lead are both fixed on the third end face.

[0009] Optionally, in a possible implementation manner, the base plate is a copper base plate, and the insulating outer frame is a ceramic outer frame.

[0010] Optionally, for a possible implementation, a reflective element; the reflective element is fixed on the base plate and is located in the accommodating space, and is used to change the direction of the light emitted by the light emitting element.

[0011] Optionally, in a possible implementation manner, the reflective element is disposed opposite to the plurality of light-emitting elements, so as to change the direction of the light emitted by the plurality of light-emitting elements.

[0012] Optionally, in a possible implementation manner, the light emitting module further includes: a lens, wherein the lens is fixed to the light window via a fixing member, and is used to allow the light reflected by the reflective element to pass through the lens.

[0013] In a second aspect, the present application further provides a carrier system, which includes: a main body and the aforementioned light-emitting module; the main body has a mounting position, and the mounting position is used to install at least one of the light-emitting modules.

[0014] The solution provided by the present application, the light-emitting module includes: a base plate, an insulating outer frame, a light-emitting element, a first lead, a second lead and a light window. The light-emitting element is fixed on the base plate, the insulating outer frame surrounds the base plate and is sealed and connected to the base plate, the insulating outer frame includes a first end face and a second end face arranged opposite to each other, and the second end face is used to connect to a heat spreader. The light window is connected to the first end face of the insulating outer frame, and the light window, the insulating outer frame and the base plate jointly define a sealed accommodation space, the accommodation space accommodates the light-emitting element, the light-emitting element is used to emit light, and the light is used to be emitted from the perspective area of ​​the light window. The first lead and the second lead are both fixed to the connection side of the insulating outer frame located outside the accommodation space, and the connection side is not the second end face. The first circuit and the second circuit are arranged inside the insulating outer frame, one end of the first lead is connected to the positive electrode of the light-emitting element through the first circuit, and the other end is used to connect to the positive electrode on the substrate circuit, one end of the second lead is connected to the negative electrode of the light-emitting element through the second circuit, and the other end is used to connect to the negative electrode on the substrate circuit.

[0015] The first lead and the second lead of the present application are both fixed on the connecting side surface, and the connecting side surface is not the second end surface and is located outside the accommodating space. The first lead is connected to the positive electrode of the light-emitting element through a first circuit arranged inside the insulating outer frame, and the second lead is connected to the negative electrode of the light-emitting element through a second circuit arranged inside the insulating outer frame. The first lead and the second lead can be respectively connected to the positive electrode and the negative electrode of the external circuit, that is, the connection between the light-emitting element in the accommodating space and the circuit outside the accommodating space is realized, and the connectivity of the light-emitting element circuit can be realized.

[0016] Compared with the existing method of connecting the leads to the heat spreader and connecting the circuit on the heat spreader to the circuit on the substrate, the first lead and the second lead of the present application can be directly connected to the circuit on the substrate, which can avoid laying circuits on the heat spreader, and the cost of laying circuits inside the insulating frame is lower than the cost of laying driving circuits on the heat spreader. Therefore, the present application can reduce the manufacturing cost of the light-emitting module.

[0017] Other features and advantages of the present application will be described in the following description, and partly become apparent from the description, or be understood by practicing the present application. The purpose and other advantages of the present application can be realized and obtained by the structures specifically pointed out in the written description, claims, and drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0019] Figure 1 A schematic diagram of the exploded structure of the light-emitting module provided in an embodiment of the present application is shown;

[0020] Figure 2 Shows Figure 1 Structural schematic diagram of the middle insulating outer frame;

[0021] Figure 3 A schematic diagram of the structure of the front side of the insulating outer frame provided in an embodiment of the present application is shown;

[0022] Figure 4 Shows Figure 3 A schematic diagram of the structure on the back of the middle insulating outer frame;

[0023] Figure 5 A schematic structural diagram of an insulating outer frame provided in another embodiment of the present application is shown;

[0024] Figure 6 Shows Figure 5 A schematic diagram of the structure on the back of the middle insulating outer frame;

[0025] Figure 7 A schematic diagram of the structure of a single-mode laser provided in an embodiment of the present application is shown;

[0026] Figure 8 A schematic diagram of the structure of a dual-mode laser provided in an embodiment of the present application is shown.

[0027] Description of reference numerals:

[0028] 1. Bottom plate; 2. Insulating frame; 21. First end face; 22. Second end face; 23. Connecting side face; 231. Third end face; 3. Light-emitting element; 31. Wire; 4. First lead wire; 5. Second lead wire; 6. Light window; 7. Reflecting element; 8. Lens; 9. Fixing piece; 101. Heat spreader; 102. Substrate. DETAILED DESCRIPTION

[0029] In order to make those skilled in the art better understand the present application scheme, the technical scheme in the present application embodiment will be clearly and completely described below in conjunction with the drawings in the present application embodiment. Obviously, the described embodiment is only a part of the present application embodiment, rather than all the embodiments. The components of the present application embodiment usually described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiment of the present application. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present application.

[0030] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. At the same time, in the description of this application, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0031] In the field of laser technology, semiconductor lasers are the core components of light sources. The performance of lasers is strongly related to their packaging methods. The packaging differences have a great impact on the brightness and life of lasers. The laser chip packaging needs to meet the requirements of heat dissipation and airtightness, etc. Although some lasers have been designed, the manufacturing cost of existing lasers is relatively high.

[0032] Therefore, in the embodiments of the present application, a light-emitting module and a carrier system are provided to solve or partially solve the above-mentioned problems.

[0033] See also Figure 1 , which shows an exploded structural schematic diagram of a light-emitting module 100 provided in an embodiment of the present application, wherein the light-emitting module includes: a base plate 1, an insulating frame 2, a light-emitting element 3, a first lead 4, a second lead 5 and a light window 6.

[0034] The light emitting element 3 is fixed on the base plate 1 , the insulating outer frame 2 surrounds the base plate 1 and is sealed to the base plate 1 , the insulating outer frame 2 includes a first end face 21 and a second end face 22 that are oppositely arranged, and the second end face 22 is used to connect to the heat spreader.

[0035] The light window 6 is connected to the first end surface 21 of the insulating outer frame 2. The light window 6, the insulating outer frame 2 and the base plate 1 jointly define a sealed accommodating space. The accommodating space accommodates the light emitting element 3. The light emitting element 3 is used to emit light. The light is used to be emitted from the perspective area of ​​the light window 6.

[0036] The first lead 4 and the second lead 5 are both fixed to a connecting side surface 23 of the insulating outer frame 2 outside the accommodation space, and the connecting side surface 23 is not the second end surface 22 .

[0037] The insulating outer frame 2 is provided with a first circuit and a second circuit inside, one end of the first lead 4 is connected to the positive electrode of the light-emitting element 3 through the first circuit, and the other end is used to connect to the positive electrode on the substrate circuit, one end of the second lead 5 is connected to the negative electrode of the light-emitting element 3 through the second circuit, and the other end is used to connect to the negative electrode on the substrate circuit.

[0038] The first lead 4 and the second lead 5 of the present application are both fixed on the connecting side surface 23, and the connecting side surface 23 is not the second end surface 22 and is located outside the accommodating space. The first lead 4 is connected to the positive electrode of the light-emitting element 3 through a first circuit arranged inside the insulating outer frame 2, and the second lead 5 is connected to the negative electrode of the light-emitting element 3 through a second circuit arranged inside the insulating outer frame 2. The first lead 4 and the second lead 5 can be connected to the positive electrode and the negative electrode of the external circuit respectively, that is, the connection between the light-emitting element 3 in the accommodating space and the circuit outside the accommodating space is realized, and the connectivity of the circuit of the light-emitting element 3 can be realized.

[0039] Compared with the existing method of connecting the leads to the heat spreader and connecting the circuit on the heat spreader to the circuit on the substrate, the first lead and the second lead of the present application can be directly connected to the circuit on the substrate, which can avoid laying circuits on the heat spreader, and the cost of laying circuits inside the insulating frame is lower than the cost of laying driving circuits on the heat spreader. Therefore, the present application can reduce the manufacturing cost of the light-emitting module.

[0040] Specifically, the light emitting element 3 may be a laser chip. When the light emitting element 3 is powered on, the light emitting element 3 may emit light.

[0041] It should be noted that the light emitting element 3 is fixed on the base plate 1 , and can be fixed to the base plate 1 by welding, or fixed to the base plate 1 by bonding.

[0042] Furthermore, the present application may include multiple light-emitting elements, which are connected together as needed and have a common positive electrode and a common negative electrode. The common positive and negative electrodes are connected to corresponding leads to form a power supply circuit for the light-emitting elements.

[0043] It should be noted that the bottom plate 1 can be a metal bottom plate, which can quickly transfer the heat generated by the light-emitting element to the heat spreader, thereby improving the heat dissipation efficiency of the light-emitting element. Obviously, the higher the thermal conductivity of the metal bottom plate, the higher the heat dissipation efficiency of the light-emitting element. The heat spreader is a heat dissipation plate, which is used to dissipate heat from the bottom plate so that the light-emitting element meets the heat dissipation requirements.

[0044] Preferably, the bottom plate may be a copper bottom plate, and the material of the heat spreader may be oxygen-free copper or red copper.

[0045] Specifically, the insulating outer frame 2 surrounds the base plate 1 and is sealed and connected to the base plate 1, the light window 6 is connected to the first end face 21 of the insulating outer frame 2, and the light window 6, the insulating outer frame 2 and the base plate 1 together define a sealed accommodating space, which can meet the airtightness requirements of the laser packaging.

[0046] It should be noted that the insulating outer frame 2 is made of insulating material, which may be ceramic or glass.

[0047] Furthermore, the perspective area of ​​the light window 6 is made of a see-through material, and the light window 6 can be made of metal or glass.

[0048] When the light window 6 is made of glass, the light window 6 is sealed and welded to the first end surface 21 so that the accommodating space meets the airtightness requirement.

[0049] When the light window 6 is made of metal, the light window 6 is sealed and sintered with the first end face 21, a via is provided in the perspective area of ​​the light window 6, the via is connected to the accommodation space, and the perspective glass is sealed and connected to the via, so that the accommodation space meets the airtightness requirement. In actual application, different anti-reflection films can be plated on the perspective glass according to the laser beams of different wavelengths generated by the light-emitting element to ensure the transmittance requirement.

[0050] Furthermore, the connecting side surface 23 is provided with a first hole and a third hole communicating with the interior, and the side wall of the insulating outer frame 2 located in the accommodating space is provided with a second hole and a fourth hole communicating with the interior.

[0051] One end of the first circuit is connected to one end of the first lead 4 through the first hole, the other end of the first circuit is connected to the positive electrode of the light-emitting element 3 through the second hole, and the other end of the first lead 4 is used to connect to the positive electrode on the substrate circuit.

[0052] One end of the second circuit is connected to one end of the second lead 5 through the third hole, the other end of the second circuit is connected to the cathode of the light-emitting element 3 through the fourth hole, and the other end of the second lead 5 is used to connect to the cathode on the substrate circuit.

[0053] The present application can achieve the connection between the lead and the light-emitting element by laying out the circuit inside the insulating outer frame, which is simple and easy to implement. The lead can be directly connected to the circuit of the substrate, which can avoid laying out the circuit on the heat spreader, and can reduce the manufacturing cost of the product using the light-emitting module. For example, using the light-emitting module to manufacture a laser can reduce the manufacturing cost of the laser.

[0054] In an exemplary embodiment, the first lead is sealed and connected to the first hole, the second lead is sealed and connected to the third hole, the positive electrode of the light-emitting element is connected to the first circuit through the first wire, the first wire is sealed and connected to the second hole, the negative electrode of the light-emitting element is connected to the second circuit through the second wire, and the second wire is sealed and connected to the fourth hole, which can meet the airtightness requirements of the accommodation space. The welding of the first lead and the second lead to the insulating frame meets the circuit connection and pull-out force requirements.

[0055] Furthermore, there can be various positional relationships between the bottom plate and the insulating outer frame, and the positions of the bottom plate and the insulating outer frame can be designed according to different structural requirements.

[0056] For an exemplary example, see Figure 2-Figure 4 The end of the bottom plate 1 facing away from the light emitting element 3 extends out of the second end surface 22 .

[0057] For another example, see Figure 5-Figure 6 The surface of the bottom plate 1 facing away from the light-emitting element 3 is located in the same plane as the second end surface 22. The bottom plate 1 and the insulating outer frame 2 can be fixed together on the heat spreader. The insulating outer frame 2 is welded around the bottom plate 1 to increase the strength of the insulating outer frame 2, and porcelain cracks can be avoided during the sintering process of the insulating outer frame 2 and the bottom plate 1, thereby meeting the airtightness requirements of the accommodating space.

[0058] Furthermore, the first lead and the second lead both extend out of the insulating outer frame. The first lead and the second lead can be directly connected to the circuit on the substrate without the need for additional connecting wires.

[0059] For further information, see Figure 1-Figure 2 The first lead 4 and the second lead 5 are both fixed to the first end surface 21 located outside the accommodating space.

[0060] For further information, see Figure 3-Figure 6 The connecting side surface has a third end surface 231 arranged opposite to the second end surface 22, the distance between the third end surface 231 and the second end surface 22 is smaller than the distance between the first end surface 21 and the second end surface 22, and the maximum distance between the third end surface 231 and the inner wall of the accommodating space is greater than the maximum distance between the first end surface 21 and the inner wall of the accommodating space.

[0061] The first lead wire 4 and the second lead wire 5 are both fixed to the third end surface 231 .

[0062] Furthermore, both the first lead 4 and the second lead 5 may have bending portions, and the number of the bending portions depends on actual needs and is not limited here.

[0063] The first lead 4 and the second lead 5 of the present application are both fixed on the third end surface 231, which can avoid solder short circuit during the welding process of the light window and the insulating frame. The first lead 4 and the second lead 5 can be bent to match a variety of structural designs.

[0064] Furthermore, the light emitting module further comprises: a reflective element 7;

[0065] The reflective element 7 is fixed on the bottom plate 1 and is located in the accommodation space, and is used to change the direction of the light emitted by the light emitting element 3 .

[0066] It should be noted that the reflective element 7 is fixed to the base plate 1 and can be fixed to the base plate 1 by welding. During the welding process, it is necessary to ensure that the relative position and angle of the light-emitting element 3 and the reflective element 7 meet the requirements. It can also be fixed to the base plate 1 by bonding. During the bonding process, it is also necessary to ensure that the relative position and angle of the light-emitting element 3 and the reflective element 7 meet the requirements.

[0067] Preferably, the reflective element 7 can convert the light emitted by the light emitting element 3 and parallel to the first end surface 21 into light perpendicular to the first end surface 21 .

[0068] Preferably, the light reflected by the reflective element 7 is perpendicular to the first end surface 21 .

[0069] Furthermore, the reflective element 7 is arranged opposite to the plurality of light emitting elements 3 to change the direction of the light emitted by the plurality of light emitting elements 3. The present application has a small number of materials, which can reduce the number of patches of the reflective element, thereby reducing the cost of the light emitting module.

[0070] Furthermore, the light emitting module further includes: a lens 8 , which is fixed to the light window 6 via a fixing member 9 , and is used to allow the light reflected by the reflecting element 7 to pass through the lens 8 .

[0071] The lens 8 is used to collimate the light reflected by the reflective element 7 , that is, by adjusting the lens 8 , the light reflected by the reflective element 7 can be made parallel.

[0072] After the relative positions of the lens 8 and the light window 6 are adjusted as required, the lens 8 can be bonded to the light window 6 or welded to the light window 6 to ensure that the lens 8 can collimate the light reflected by the reflective element 7 during use.

[0073] In an exemplary embodiment, the insulating outer frame is a ceramic outer frame, one end of the first lead is connected to the positive electrode of the light-emitting element through a first circuit arranged inside the ceramic outer frame, and one end of the second lead is connected to the negative electrode of the light-emitting element through a second circuit arranged inside the ceramic outer frame, and the airtightness requirement of the accommodating space is met, the first lead and the second lead are both fixed on the connecting side surface that is not the second end surface, and the first lead and the second lead can be connected to an external circuit to energize the light-emitting element and make the light-emitting element work.

[0074] The traditional power supply method of light-emitting elements is generally to weld ceramics to the heat spreader, wire on the surface of the heat spreader, make pads or sockets on the heat spreader to realize external power supply, and lay out the driving circuit of the light-emitting element on the heat spreader. The process is complicated and costly. This application directly welds the leads on the ceramic frame, and there is no need to lay out the lines on the heat spreader. In the application scenario, the leads can be directly welded to the pads on the external substrate, which can save conductors and other materials, making the driving circuit of the light-emitting element simpler and lower in cost.

[0075] See also Figure 7 A single light emitting module 100 is fixed on a heat spreader 101, and a first lead and a second lead are respectively connected to a circuit on a substrate 102 to form a single module laser 200. Please refer to Figure 8 Two light-emitting modules 100 are fixed on a heat spreader 101. The first lead and the second lead of each light-emitting module 100 are respectively connected to the circuit on the substrate 102 to form a dual-module laser 300. The light-emitting module of the present application can be used as a standard module and can be mass-produced. When used, a single module, a dual module, a multi-module, etc. can be selected according to needs to match the needs of different products, with high flexibility.

[0076] An embodiment of the present application provides a carrier system, which includes: a main body and the aforementioned light-emitting module.

[0077] The main body has an installation position, and the installation position is used to install at least one of the light-emitting modules.

[0078] The carrier system may be a laser radar, a laser projector, a laser engraving machine, etc., which is not specifically limited here.

[0079] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A light emitting module, characterized in that: The light emitting module comprises: A base plate, an insulating frame, a light emitting element, a first lead, a second lead and a light window; The light emitting element is fixed on the bottom plate, the insulating outer frame surrounds the bottom plate and is sealed and connected to the bottom plate, the insulating outer frame includes a first end face and a second end face that are oppositely arranged, and the second end face is used to be connected to the heat spreader; The light window is connected to the first end surface of the insulating outer frame, and the light window, the insulating outer frame and the bottom plate jointly define a sealed accommodation space, and the accommodation space accommodates the light emitting element, and the light emitting element is used to emit light, and the light is used to be emitted from the perspective area of ​​the light window; The first lead and the second lead are both fixed to a connection side surface of the insulating outer frame located outside the accommodation space, and the connection side surface is not the second end surface; A first circuit and a second circuit are arranged inside the insulating outer frame, one end of the first lead is connected to the positive electrode of the light-emitting element through the first circuit, and the other end is used to connect to the positive electrode on the substrate circuit, one end of the second lead is connected to the negative electrode of the light-emitting element through the second circuit, and the other end is used to connect to the negative electrode on the substrate circuit.

2. The light emitting module according to claim 1, characterized in that: The connecting side surface is provided with a first hole and a third hole communicating with the interior, and the side wall of the insulating outer frame located in the accommodating space is provided with a second hole and a fourth hole communicating with the interior; One end of the first circuit is connected to one end of the first lead through the first hole, the other end of the first circuit is connected to the positive electrode of the light-emitting element through the second hole, and the other end of the first lead is used to connect to the positive electrode on the substrate circuit; One end of the second circuit is connected to one end of the second lead through the third hole, the other end of the second circuit is connected to the cathode of the light-emitting element through the fourth hole, and the other end of the second lead is used to connect to the cathode on the substrate circuit.

3. The light emitting module according to claim 1, characterized in that: The first lead and the second lead both extend out of the insulating outer frame.

4. The light emitting module according to claim 3, characterized in that: The first lead and the second lead are both fixed to the first end surface outside the accommodation space.

5. The light emitting module according to claim 3, characterized in that: The connecting side surface has a third end surface arranged opposite to the second end surface, the distance between the third end surface and the second end surface is smaller than the distance between the first end surface and the second end surface, and the maximum distance between the third end surface and the inner wall of the accommodation space is greater than the maximum distance between the first end surface and the inner wall of the accommodation space; The first lead and the second lead are both fixed to the third end surface.

6. The light emitting module according to claim 1, characterized in that: The bottom plate is a copper bottom plate, and the insulating outer frame is a ceramic outer frame.

7. The light emitting module according to claim 1, characterized in that: The light emitting module further comprises: Reflective element; The reflective element is fixed on the bottom plate, located in the accommodating space, and is used to change the direction of the light emitted by the light emitting element.

8. The light emitting module according to claim 7, characterized in that: The reflective element is arranged opposite to the plurality of light emitting elements and is used for changing the directions of the light emitted by the plurality of light emitting elements.

9. The light emitting module according to claim 7, characterized in that: The light emitting module further comprises: A lens is fixed on the light window through a fixing member, and is used to allow the light reflected by the reflecting element to pass through the lens.

10. A carrier system, characterized in that: The carrier system comprises: A main body and a light-emitting module as described in any one of claims 1 to 9; The main body has an installation position, and the installation position is used to install at least one of the light-emitting modules.

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